EP3333530B1 - Parallel heat-pipes type heat sink and manufacturing method thereof - Google Patents

Parallel heat-pipes type heat sink and manufacturing method thereof Download PDF

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Publication number
EP3333530B1
EP3333530B1 EP17174961.7A EP17174961A EP3333530B1 EP 3333530 B1 EP3333530 B1 EP 3333530B1 EP 17174961 A EP17174961 A EP 17174961A EP 3333530 B1 EP3333530 B1 EP 3333530B1
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EP
European Patent Office
Prior art keywords
heat
pipes
base
parallel
heated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP17174961.7A
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German (de)
English (en)
French (fr)
Other versions
EP3333530A1 (en
Inventor
Yu-Te Wei
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cooler Master Technology Inc
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Cooler Master Technology Inc
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Filing date
Publication date
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Publication of EP3333530A1 publication Critical patent/EP3333530A1/en
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Publication of EP3333530B1 publication Critical patent/EP3333530B1/en
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F28F21/081—Heat exchange elements made from metals or metal alloys
    • F28F21/084—Heat exchange elements made from metals or metal alloys from aluminium or aluminium alloys
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P2700/00—Indexing scheme relating to the articles being treated, e.g. manufactured, repaired, assembled, connected or other operations covered in the subgroups
    • B23P2700/09—Heat pipes

Definitions

  • This disclosure relates generally to a heat dissipation technology, and more particularly to a parallel heat-pipes type heat sink and its manufacturing method.
  • a component such as a heat pipe is added to the bottom of a heat sink to improve the thermal conduction effect.
  • a groove is concavely formed on a base of the heat sink, and then the heat pipe with an appropriate length is embedded into the groove, so that the heat pipe is contacted directly with a heat source such as a central processing unit (CPU) to achieve a better thermal conduction effect.
  • CPU central processing unit
  • the quantity of heat pipes will determine the thermal conduction effect, so that the quantity of heat pipes is increased according to size of the contact area with the heat source.
  • the bonding strength is insufficient.
  • additional structures are added between the heat pipes, and such arrangement reduces the thermal conduction effect significantly.
  • P.R.C. Pat. No. CN201750660U has disclosed a "Heat-pipe heat sink" comprising a plurality of grooves formed on a base of a heat sink, partially coupled next to one another, and provided for installing a plurality of heat pipes. Since the grooves are arranged adjacent to one another, therefore the grooves lose its function of fixing the heat comprising a plurality of grooves formed on a base of a heat sink, partially coupled next to one another, and provided for installing a plurality of heat pipes. Since the grooves are arranged adjacent to one another, therefore the grooves lose its function of fixing the heat pipes significantly, and it is necessary to solder the heat pipes into the grooves by a solder such as a solder paste. As a result, the heat pipes may fall out easily or have poor thermal conduction due to poor soldering, and the complicated manufacturing process may lower the yield rate of the product.
  • a solder such as a solder paste
  • P.R.C. Pat. No. CN202032928U has disclosed a "Thermally conducting base assembly for arranging heat pipes closely" and the assembly comprises a plurality of spaced grooves formed on a thermally conducting base, a supporting rib formed between the grooves, and each supporting rib has a protruding rib disposed at the top edge and protruding towards the inner side of the groove, and the protruding rib will be embedded into a deformation portion of the heat pipe after the heat pipe is compressed and deformed, so as to achieve the effect of fixing each heat pipe.
  • most bases are formed by aluminum extrusion, so that the uniformity of the rib at the top edge of the supporting rib cannot be controlled easily.
  • US 2007/215327 A1 discloses a further parallel heat pipes type heat sink comprising a base having a bottom surface, a plurality of parallel heated areas concavely formed on the bottom surface, two protrusions disposed between any two heated areas and protruding in a direction towards the bottom surface.
  • the base comprises an opening between the protrusions, which extends into the two heated areas.
  • US 7,520,316 discloses a further heat sink with heat pipes.
  • US 2007/0215327 A1 discloses a heat dissipation device including a heat sink and heat pipes thermally attached to the heat sink.
  • the heat sink includes a base having grooves for fittingly receiving first heat-conducting portions of the heat pipes.
  • this disclosure provides a parallel heat-pipes type heat sink, comprising : a base, having a bottom surface, a plurality of parallel heated areas concavely formed on the bottom surface, a protrusion disposed between any two heated areas and protruding in a direction towards the bottom surface, and a notch formed at any one section of each protrusion, each protrusion comprising a first top portion and a second top portion which have a height difference therebetween, side surfaces of the first top portion and an upper surface of the second top portion, which are located between and connected to two upper edges of the adjacent heated areas, together form the notch; and a plurality of heat pipes, embedded into the heated areas respectively in the lengthwise direction of each heat pipe, wherein each of the heat pipes has at least one deformation portion, the deformation portions of the heat pipes which are adjacent to each other are in contact with each other so as to fill the notches.
  • this disclosure further provides a manufacturing method of a parallel heat-pipes type heat sink according to claim 1, comprising the steps of
  • this disclosure provides a parallel heat-pipes type heat sink and its manufacturing method, and the heat sink comprises a base 1, and a plurality of heat pipes 2.
  • the base 1 is a thermally conducting base made of a good thermal conductor such as copper or aluminum, or formed by stacking a plurality of fins (as shown in FIG. 10 ), and may be attached onto a heat source (not shown in the figure) like a heat sink.
  • the base 1 has a bottom surface 10, and a top surface 11 opposite to the bottom surface 10 (in other words, the top surface 11 is disposed on the opposite side of the bottom surface 10), and the bottom surface 10 of the base 1 may be used to attach the aforementioned heat source, and the top surface 11 of the base 1 further comprises a plurality of spaced fins 3.
  • This disclosure primarily forms a plurality of long-strip heated area 100 on the bottom surface 10 of the base 1 for embedding the heat pipes 2 into the heated areas 100 respectively.
  • the heated areas 100 are arranged parallel to one another, and a protrusion 101 is disposed between any two heated areas 100 and protrudes in a direction towards the bottom surface, and the protrusion 101 is extended in the lengthwise direction along the heated areas 100, and at least one notch 102 is formed at any section of each protrusion 101, and a first top portion 103 is formed at the highest position of the protrusion 101 other than the position of the notch, and a second top portion 104 is formed at the highest position of the notch 102 of the protrusion 101, and there is a height difference H between the protrusion 101, and a first top portion 103 is formed at the highest position of the protrusion 101 other than the position of the notch, and a second top portion 104 is formed at the highest position of the notch 102 of the protrusion 101, and there is
  • the first top portion 103 has side surfaces 1031
  • the second top portion 104 has an upper surface 1041; in each protrusion 101, the side surfaces 1031 of the first top portion 103 and the upper surface 1041 of the second top portion 104 are located between and connected to upper edges 1001 of the adjacent heated areas 100 and together form the notch 102.
  • the notch 102 is situated at the middle section of each protrusion 101, but the invention is not just limited to such arrangement only. In the press process, a displacement at the position of each heat pipe 2 with respect to the position of the protrusion 101 without the notch 102 can be prevented. In the meantime, the position of each heat pipe 2 with respect to the notch 102 is attached and contacted properly due to compression and deformation, so as to provide good thermal conduction and bonding strength.
  • each heat pipe 2 at a position with respect to each heated area 100 is limited by the shape of each heated area 100, so that each heat pipe 2 is combined closely with each heated area 100 in the pressing and embedding processes.
  • each heat pipe 2 at the position with respect to the notch 102 is laterally communicated with one another since the height of the second top portion 104 of the notch 102 is lower than the first top portion 103 of the protrusion 101 and the heated area 100 can communicate with one another.
  • a deformation portion 23 is formed at the top of the second top portion 104 of the notch 102 in the process of pressing and embedding each heat pipe 2 to fill the notch 102, and any two adjacent heat pipes 2 are attached and contacted with each other (as shown in FIG. 4 ), and each heat pipe 2 can have a good bonding strength with the base 1 and a good thermal conduction.
  • each heat pipe 2 when each heat pipe 2 is pressed and embedded into the heated area 100, each heat pipe 2 has a heated surface 20 formed thereon and aligned exactly with the bottom surface 10 of the base 1 or slightly protruded.
  • each heat pipe 2 with respect to the position of the protrusion 101 without the notch 102 may be deformed along the protrusion 101 since the height of the protrusion 101 is slightly lower than each heat pipe 2, and a connecting portion 21 is extended from the heat pipe and abutted with another connecting portion 21, so that the heated surfaces 20 form a common plane.
  • FIG. 4 when each heat pipe 2 is pressed and embedded into the heated area 100, each heat pipe 2 has a heated surface 20 formed thereon and aligned exactly with the bottom surface 10 of the base 1 or slightly protruded.
  • FIG. 5 each heat pipe 2 with respect to the position of the protrusion 101 without the notch 102 may be deformed along the protrusion 101 since the height of the protrusion 101 is slightly lower than each heat pipe 2, and a connecting portion 21 is extended
  • each heat pipe 2 with respect to the position of the notch 102 has a smaller spacer since the second top portion 104 of the notch 102 is lower than the first top portion 103 of the protrusion 101, so that each heat pipe 2 pressed and deformed between the deformation portions 23 is substantially limited by an external pressing force and an irregular deformation occurs. Therefore, the area of the contact surface 22 is increased, and the heat pipes 2 have better thermal conduction and bonding strength.
  • the protrusion 101 may be aligned exactly with the bottom surface 10 of the base 1, so that the heat pipes 2 are contacted with each other at the position with respect to the notch 102 only to form the contact surface 22 but not the connecting portion 21.
  • the heated surface 20 of each heat pipe 2 is protruded out from the bottom surface 10 of the base 1.
  • the manufacturing method in accordance with this preferred embodiment is described below.
  • Components such as the base 1 and the heat pipes 2 with the aforementioned technical characteristics are prepared first, and then the limiting fixture 4 is prepared, wherein the limiting fixture 4 is positioned on the bottom surface 10 of the base 1 to define a press plane P and a deformation limiting area A, and the width D of the deformation limiting area A arranged in the side-by-side direction of each heat pipe is greater than or equal to the sum of distances d of all heat pipes 2 arranged parallel to one another in the heated area 100, and then a press process of each heat pipe 2 is carried out by a press mold 5, and the press process may be a stamping, extrusion, or rolling process conducted by a press mold 5, so that a press plane P defined by the heated surface 20 of each heat pipe 2 as well as the limiting fixture 4 is pressed and formed by the press mold 5, and
  • this disclosure allows the plurality of heat pipes to be embedded into the base of the heat sink to provide a good bonding strength and a direct contact for each heat pipe, particularly for the position corresponding to the major heated area. More specifically, this disclosure includes the notch 102 formed on each protrusion 101, so that after each heat pipe 2 is pressed, the notch 102 is provided to form the deformation portion 23, so that the irregular contact surface 22 can be formed on the top of the second top portion 104 of the notch 102 of the protrusion 101 due to the deformation portion 23 of the heat pipe 2, the soldering is no longer required.
  • This disclosure achieves the bonding effect and lowers the level of difficulty of the manufacturing process, and further prevents damages to the heat pipe 2 or difficulties of forming the base 1.
  • This disclosure also provides a larger area of the heated surface 20 to improve the thermal conduction efficiency.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Theoretical Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Human Computer Interaction (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
EP17174961.7A 2016-12-09 2017-06-08 Parallel heat-pipes type heat sink and manufacturing method thereof Active EP3333530B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW105140952A TWI604782B (zh) 2016-12-09 2016-12-09 Heat pipe side-by-side heat sink and its production method

Publications (2)

Publication Number Publication Date
EP3333530A1 EP3333530A1 (en) 2018-06-13
EP3333530B1 true EP3333530B1 (en) 2020-01-29

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US (1) US10772235B2 (zh)
EP (1) EP3333530B1 (zh)
CN (1) CN108617138B (zh)
TW (1) TWI604782B (zh)

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DE112021002263T9 (de) * 2020-05-28 2023-04-06 Shin-Etsu Polymer Co., Ltd. Wärmeabstrahlungsstruktur und batterie, die mit der gleichen wärmeableitungsstruktur bereitgestellt ist
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TWI604782B (zh) 2017-11-01
EP3333530A1 (en) 2018-06-13
TW201822621A (zh) 2018-06-16
CN108617138A (zh) 2018-10-02
CN108617138B (zh) 2020-02-07
US20180168069A1 (en) 2018-06-14
US10772235B2 (en) 2020-09-08

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