CN100583470C - 发光二极管散热装置组合 - Google Patents

发光二极管散热装置组合 Download PDF

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CN100583470C
CN100583470C CN200610157531A CN200610157531A CN100583470C CN 100583470 C CN100583470 C CN 100583470C CN 200610157531 A CN200610157531 A CN 200610157531A CN 200610157531 A CN200610157531 A CN 200610157531A CN 100583470 C CN100583470 C CN 100583470C
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circuit board
heat
light
emitting diode
heat pipe
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CN101202317A (zh
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张长生
刘睿凯
王肇浩
白先声
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Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
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Fuzhun Precision Industry Shenzhen Co Ltd
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    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
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    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
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    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
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    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/777—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having directions perpendicular to the light emitting axis
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    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
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    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
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    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • F21V29/89—Metals
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    • F21Y2115/10—Light-emitting diodes [LED]
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Abstract

一种发光二极管散热装置组合，包括一电路板，电连接于该电路板上的至少一发光二极管及置于电路板另一侧的散热器，电路板上设有贯穿的若干通孔，该通孔内填充有由纳米材料与高分子材料制成的第一热界面材料，该第一热界面材料将发光二极管和散热器热性连接，该散热器包括一柱状热管，该柱状热管的轴向的一端或者径向的一侧形成为平整的端面，该至少一发光二极管设置于该热管的端面上，利用该由纳米材料与高分子材料制成的第一热界面材料的高热传导性能迅速将该发光二极管所产生的热量传递至散热器，从而达到减小热阻的功效，有效解决高发热量发光二极管的散热问题。

Description

发光二极管散热装置组合
技术领域
本发明涉及发光源装置，特别是关于具有高散热效率的发光二极管散热装置组合。
背景技术
发光二极管(LED，Light-emitting Diode)作为发光源由于具有高效益的特性，而在汽车、交通信号灯指示、屏幕显示，甚至照明等领域得到广泛应用。随着高功率、高亮度发光二极管的发展，发光二极管的应用范围也越来越广，但是由于目前发光二极管的输入功率只有15-20％转换成光，近80-85％转换成热，因为随着发光二极管界面温度(Junction Temperature)的升高，发光二极管的发光效益将显著下降，而它所散发出的热量能否及时导出或散发出去，将成为影响发光二极管发光品质与寿命的关键因素，严重影响其发光亮度及缩短其使用寿命。
现有发光二极管的散热结构，基本构成为发光二极管通过导热膏等导热介质贴于一电路板上，并将一散热器设于电路板下方，通常该散热器包括一底座及形成于该底座上的若干散热片。由于该PCB的材料一般为高分子材料，其导热性能差，且发光二极管与电路板、电路板与散热器之间均形成接触界面，通常在这些界面中涂布导热膏等导热介质，以填充这些界面中的空气间隙，然而导热膏的热传导系数一般在2～5W/(m.K)左右，严重影响发光二极管至散热器之间热量的传递，导致发光二极管的热量无法及时传递至散热器上进行散发，
为了提高传热效果，业界亦有同时采用在PCB板上设置上下贯穿的穿孔(Through holes)，作为热传渠道(Thermal vias)增加热传递，虽然以这些穿孔作为热传渠道可以增强热传效果，但改善效果有限，且受PCB板放置方向性的影响较大，在水平及垂直应用时均会受到方向性的影响，而在水平热传递效果较差，主要是热源即LED产生的热量位于上方，而散热器位于下方，穿孔内的空气对流效果较差，达到降低热阻的效果有限。因而需要降低发光二极管至散热器之间的热阻，以期达到提升发光二极管与散热器之间的热传递效率。
发明内容
有鉴于此，在此实有必要提供一种具较高散热效率的发光二极管散热装置组合。
一种发光二极管散热装置组合，包括一电路板，电连接于该电路板上的至少一发光二极管及置于电路板另一侧的散热器，电路板上设有贯穿的若干通孔，该通孔内填充有由纳米材料与高分子材料制成的第一热界面材料，该第一热界面材料将发光二极管和散热器热性连接，该散热器包括一柱状热管，该柱状热管的轴向的一端或者径向的一侧形成为平整的端面，该至少一发光二极管设置于该热管的端面上。
与现有技术相比，本发明利用该由纳米材料与高分子材料制成的第一热界面材料的高热传导性能将该发光二极管所产生的热量传递至散热器，从而达到减小热阻的功效，有效解决高发热量发光二极管的散热问题。
附图说明
下面参考附图，结合实施例对本发明作进一步描述。
图1是本发明发光二极管散热装置组合第一实施例的轴向剖视图。
图2是本发明发光二极管散热装置组合第二实施例的轴向剖视图。
图3是图2沿III-III线的径向剖视图。
图4是本发明发光二极管散热装置组合第三实施例的轴向剖视图。
图5是图4沿V-V线的径向剖视图。
图6是本发明发光二极管散热装置组合第四实施例的剖视图。
图7是图6沿VII-VII线的剖视图。
具体实施方式
如图1所示，为本发明发光二极管散热装置组合的第一实施例，其包括一可绕性材料构成的电路板10、设于该电路板10下方的发光二极管20及设于该电路板10上方并与该发光二极管20热性连接的一散热器40。
该电路板10上设有铜线路12，发光二极管20贴设于电路板10具有铜线路12的一面上，并通过两接触脚20a、20b分别与该电路板10上的铜线路12电连接。该电路板10上对应于发光二极管20的地方设有贯穿电路板10上下表面的多个通孔102。本实施例中仅示出4个通孔102，实际上该通孔102的数量和位置可根据每一发光二极管20的大小而设置，使发光二极管20的热量能快速均匀地透过通孔102传递出去。
该散热器40包括设于该电路板10下方的一铝基板41及与该铝基板41连接的一柱型热管42。该电路板10上的多个通孔102内填充有由具高热传导系数的纳米碳管(Carbon Nanotubes)制成的第一热界面材料140，该发光二极管20与电路板10之间填充有由具高热传导系数的纳米碳管制成的第二热界面材料142，该电路板10与基板41之间填充有由具高热传导系数的纳米碳管制成的第三热界面材料143。该第一、第二、第三热界面材料140、142、143均由纳米材料如纳米颗粒、纳米碳管与高分子材料(MacromolecularMaterial)如石蜡(Paraffin)、聚丙烯(polypropylene)等组成的纳米碳管热界面材料，本实施例中，该纳米材料选自纳米碳管。
以石蜡为例，制作一非阵列式石蜡相变的纳米碳管热界面材料，包括将石蜡、纳米碳管及N-N二甲基甲酰胺(C3H7NO)以100∶3∶100的比例混合，加热至70～80℃后，放置于行星球磨机进行球磨混合约1个小时，使纳米碳管均匀分布在石蜡溶液中。然后将球磨后的混合物用滤纸过滤，并将滤净的混合物风干，再将风干后的混合物加热熔融后放至一切片模具中，熔融的混合物均匀分布于切片模具中后，待其自然冷却，最后将该冷却后的初胚样品置于10℃以下的低温环境中冷藏约20分钟，使其凝固、容易脱模，并将脱模后的石蜡纳米碳管切削成所需厚度和形状，若切割后的卷曲了，可置于40℃左右的温水中，即可恢复平坦。
同样，以石蜡为例，制作一阵列式石蜡相变的纳米碳管热界面材料包括采用化学气相沉积法(Chemical Vapor Deposition CVD)在基板，如硅片上生长纳米碳管阵列，然后将带有纳米碳管阵列的硅片置入熔融的石蜡溶液中，并共同置于一可抽中空的容器中进行抽真空，使纳米碳管阵列中的空气排出而由石蜡溶液填充，取出后冷却、切削形成。
目前，业界制备纳米碳管热界面材料的技术亦有采用多种不同的方式，比如清华大学专利申请公开第200410027249.8号揭露的一种大量制造均一长度纳米碳管的方法，包括以下步骤：提供一纳米碳管阵列；将纳米碳管阵列浸润于液相高分子体系；使液相高分子体系转化为固相，生成分布有纳米碳管的高分子复合材料；在纳米碳管阵列预定高度，沿垂直于纳米碳管阵列轴向切割该高分子复合材料，去除纳米碳管阵列顶端的高分子材料并使得纳米碳管尖端开口；按照预定厚度切割上述高分子复合材料，形成厚度均匀的高分子复合材料薄膜；去除高分子复合材料薄膜中的高分子材料，得到大量长度均一的纳米碳管。清华大学专利申请公开第200410026846.9号揭露之一种热界面材料及其制造方法，步骤为先生长纳米碳管阵列，接着放入至由高分子材料组成的溶剂中，待固化后形成载体，最后经由裁切成适当高度并同时于每一纳米碳管两端形成折弯，即得到该纳米碳管阵列嵌入至该载体中的热界面材料。清华大学专利申请公开第200410026778.6号揭露之一种热界面材料及其制造方法，步骤为先生长纳米碳管阵列，接着放入至由高分子材料组成的溶剂中，待固化后形成载体，最后经由裁切成适当高度，即得到该纳米碳管阵列嵌入至该载体中的热界面材料(TIM)。又如Intel之美国专利第6965513号揭示之一种纳米碳管热界面材料，包括至少一纳米碳管束(at leastone carbon nanotube bundle)及一填隙式材料(an interstitial material)，该纳米碳管束嵌入至该填隙式材料中。
填充于通孔102内的第一热界面材料140一般采用生长较高的纳米碳管，本实施例中第一热界面材料140采用的纳米碳管高为1mm，且外形为圆柱型。而填充于该发光二极管20与电路板10之间以及该电路板10与基板41之间的第二、第三热界面材料142、143则采用较薄片状的纳米碳管，其高度一般在0.05mm～1mm之间变化，本实施例中第二、第三热界面材料142、143均采用的纳米碳管厚度约为0.05mm的纳米材料薄层，并与第一热界面材料140的上、下端连接。纳米碳管的热传导系数为3000～6600W/m℃，利用纳米碳管形成的第一、第二、第三热界面材料140、142、143填充于发光二极管20与基板41之间形成高效的传热路径，大大减小了热量从发光二极管20传递至基板41间的热阻。
该基板41的顶面与发光二极管20相对设有一凹口412，该热管42包括一连接端426，该连接端426收容于基板41的凹口412内，且与基板41铝硬焊结合，该连接端426具有一平整的端面。该热管42管外设有若干散热片424，热管42内呈真空状态且填充有低沸点的冷媒425，如氨(NH3)、甲醇(CH4O)、乙醇(C2H6O)等用于传热的工作流体，利用该工作流体受热和冷却在气、液两态间转变时，吸收或放出大量的热量而使热量均布于整个热管42，并通过该热管42外表的散热片424将热量散发出去，热管42的内侧壁上经烧结、或铺设金属丝网目或者纤维网目而形成毛细结构422，通过该毛细结构422可产生毛细作用力驱动冷却后的液体回流。该热管42以冷媒425为工作流体，因而该热管42不会因冻结而造成涨管及管裂，可适应在纬度偏北区域的发光二极管照明应用。
工作时，该发光二极管20产生的热量经由该第二、第一、第三热界面材料142、140、143快速有效地传递至基板41及与该基板41结合的热管42上，该热管42内的冷媒425吸热沸腾产生相变化而将吸收的热量快速均匀的分布于热管42的壁面，并通过管外的散热片424散发出去。利用该第一、第二、第三热界面材料140、142、143中纳米材料的高热传导性，可将发光二极管20的热量快速有效地传递至基板41及散热器40上，相比现有技术中通过涂布一般导热膏等导热介质的方式而言，极大程度上减小了热量从发光二极管20传导至散热器40上的热阻，且在实际运用过程中不受方向性的影响，再利用热管42相变传热的快速输送大量热能、温度分布均匀、远距传输的特性将热量快速地分布于热管42并通过散热片424散发，达到快速且充分传导热量的目的，减小热量从热管42内到管外散热片424从而散发出去这一过程中的热阻，确保发光二极管20正常工作并维持最大发光亮度。
为了降低热量从基板41传递至热管42的热阻，亦可直接将发光二极管20设于热管42上而省去基板41，如图2所示为本发明发光二极管散热装置组合的第二实施例，发光二极管20直接贴设于热管42a的连接端426a的平整的端面上，本实施例中的散热器40a由热管42a及设于热管42a外围的若干散热片424a构成，如图3所示为该散热器40沿III-III的剖面图，本实施例中，该热管42a由铝材通过挤压一体成型，于管外一体形成若干散热片424a，同时于热管42a的内侧壁铝挤产生微细沟槽421，通过该内侧壁上的沟槽421可产生毛细作用力驱动冷却后的液体回流，而热管42a的连接端426a的端面内壁上则采用由网目、纤维、多孔隙或复合毛细结构422。该第二实施例中，发光二极管20的热量直接传导至热管42a上，省去了上述第一实施例中的铝基板41，节省了生产成本及组装步骤，而且发光二极管20热量的热传路径进一步简化，更进一步减少了热阻的产生，特别适应于单个高功率发光二极管的散热情况。本实施例中的沟槽421亦可由网目、纤维、多孔隙或复合毛细结构替代。
如图4所示为本发明发光二极管散热装置组合的第三实施例，其与上述实施例的区别在于该散热器40b中的热管42b由原来的轴向散热方式改采用径向散热方式，可同时针对一发光二极管阵列进行散热，即将多颗发光二极管20置于热管42b的轴向平面上进行散热。与上述实施例相同，电路板10对应每一发光二极管20设有若干贯穿的通孔102，每一电路板10上布有铜线路12，该发光二极管20贴设于电路板10上，并通过两接触脚20a、20b分别与电路板10上的铜线路12形成电连接。请一并参照图5，本实施例中，该热管42b由铝材一体挤压制成，该铝制热管42b沿轴向铝挤形成，并于铝挤过程中于一侧形成一平面428，用以承载该多个发光二极管20，热管42b的内侧壁铝挤产生微细沟槽421，热管42b外铝挤形成若干散热片424b。该多个通孔102内填充有由具高热传导系数的纳米碳管制成的第一热界面材料140，该发光二极管20与电路板10之间以及该电路板10与热管42b的平面428之间分别填充有由具高热传导系数的纳米碳管制成的第二、第三热界面材料142、143。该实施例中，多个发光二极管20的热量可直接传导至热管42b上，简化了热传路径，并适应于对多个高功率发光二极管进行散热的情况，提高了发光亮度及散热效率。本实施例中的沟槽421亦可由网目、纤维、多孔隙或复合毛细结构替代。
本发明上述实施方式中的热管42、42a、42b也可为其它内部设置有工作流体的传热元件。如图6揭示为本发明发光二极管散热装置组合的第四实施例，该实施方式中的散热器40c是采用具有较大接触平面的平板状蒸发腔42c(Vapor Chamber)对一发光二极管阵列进行散热，该蒸发腔42c的底面形成平整的表面供多颗发光二极管20贴设，该蒸发腔42c内亦填充有工作流体，利用工作流体的蒸发吸热达到均热的目的，并通过设于蒸发腔42c上的若干散热片424c而将蒸汽冷凝并将热量及时散发出去。图7为图6沿VII-VII线的剖视图，该蒸发腔42c内还设置有若干肋状结构426c，该肋状结构426c可加强该蒸发腔42c结构的稳固性，且可起到加强散热的效果，该散热片424c及肋状结构426c与蒸发腔42c的腔体均为铝挤一体成型。

Claims (6)

1.一种发光二极管散热装置组合，包括一电路板，电连接于该电路板上的至少一发光二极管及置于电路板另一侧的散热器，其特征在于：电路板上设有贯穿的若干通孔，该通孔内填充有由纳米材料与高分子材料制成的第一热界面材料，该第一热界面材料将发光二极管和散热器热性连接，该散热器包括一柱状热管，该柱状热管的轴向的一端或者径向的一侧形成为平整的端面，该至少一发光二极管设置于该热管的端面上。
2.如权利要求1所述的发光二极管散热装置组合，其特征在于：还包括填充于发光二极管与电路板之间由纳米材料与高分子材料制成的第二热界面材料以及填充于电路板与热管的端面之间由纳米材料与高分子材料制成的第三热界面材料。
3.如权利要求1或2所述的发光二极管散热装置组合，其特征在于：该纳米材料选自纳米碳管或纳米颗粒。
4.如权利要求2所述的发光二极管散热装置组合，其特征在于：该第一、第二、第三热界面材料分别为由石蜡、纳米碳管及N-N二甲基甲酰胺形成的非阵列式石蜡相变纳米碳管热界面材料。
5.如权利要求1所述的发光二极管散热装置组合，其特征在于：所述热管由铝材质经挤压一体制成，其管体外表面还一体铝挤成型有若干散热片。
6.如权利要求5所述的发光二极管散热装置组合，其特征在于：所述热管的内侧壁上还与管壁一体成型有若干微细的沟槽。
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