EP2949469B1 - Siebdruckvorrichtung - Google Patents

Siebdruckvorrichtung Download PDF

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Publication number
EP2949469B1
EP2949469B1 EP15001642.6A EP15001642A EP2949469B1 EP 2949469 B1 EP2949469 B1 EP 2949469B1 EP 15001642 A EP15001642 A EP 15001642A EP 2949469 B1 EP2949469 B1 EP 2949469B1
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EP
European Patent Office
Prior art keywords
substrate
printing
substrate support
printing apparatus
mask
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP15001642.6A
Other languages
English (en)
French (fr)
Other versions
EP2949469A1 (de
Inventor
Toshimichi Satou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Motor Co Ltd
Original Assignee
Yamaha Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaha Motor Co Ltd filed Critical Yamaha Motor Co Ltd
Priority to EP15001642.6A priority Critical patent/EP2949469B1/de
Publication of EP2949469A1 publication Critical patent/EP2949469A1/de
Application granted granted Critical
Publication of EP2949469B1 publication Critical patent/EP2949469B1/de
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/08—Machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/08—Machines
    • B41F15/0881—Machines for printing on polyhedral articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/16—Printing tables
    • B41F15/18—Supports for workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/16—Printing tables
    • B41F15/18—Supports for workpieces
    • B41F15/26—Supports for workpieces for articles with flat surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/34—Screens, Frames; Holders therefor
    • B41F15/36—Screens, Frames; Holders therefor flat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/40—Inking units
    • B41F15/42—Inking units comprising squeegees or doctors
    • B41F15/423—Driving means for reciprocating squeegees
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41P—INDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
    • B41P2215/00—Screen printing machines
    • B41P2215/10—Screen printing machines characterised by their constructional features
    • B41P2215/11—Registering devices
    • B41P2215/114—Registering devices with means for displacing the article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41P—INDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
    • B41P2215/00—Screen printing machines
    • B41P2215/50—Screen printing machines for particular purposes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Definitions

  • the present invention relates to a screen printing apparatus which prints solder cream, conductive paste or the like on a substrate such as a printed wiring board (PWB) or the like, as pre-processing for mounting components on the substrate.
  • a screen printing apparatus which prints solder cream, conductive paste or the like on a substrate such as a printed wiring board (PWB) or the like, as pre-processing for mounting components on the substrate.
  • PWB printed wiring board
  • a screen printing apparatus is built into the manufacturing line of a printed circuit board (PCB), and prints conductive paste or the like on a substrate that is transferred from the upstream side and delivers the substrate to the component mounting device on the downstream side.
  • PCB printed circuit board
  • 2008-272964 in which one apparatus is provided with two transfer lines and with one screen mask formed with two printing patterns each corresponding to the respective transfer lines, so that the apparatus individually receives each substrate along the respective transfer lines, conducts printing process using a different printing pattern for each transfer line, and subsequently delivers the substrates individually to the component mounting device.
  • the manufacturing line of a printed circuit board will be configured in various forms in order to increase the production efficiency.
  • a screen printing apparatus between a device of single transfer-type (hereinafter referred to as the "device of a single system") having one substrate transfer line, and a dual transfer-type component mounting device comprising two substrate transfer lines in parallel or a single transfer-type two component mounting devices (hereinafter collectively referred to as the "device of a dual system”), or conversely installing a screen printing apparatus between the upstream-side device of a dual system and the single system component mounting device.
  • the screen printing apparatus is installed between an upstream-side device of a dual system and a component mounting device of a dual system thereby configuring two substrate transfer lines from the upstream-side device to component mounting device, there may also be demand for performing printing process to a substrate which is transferred from the upstream-side device along the substrate transfer line on one side and, thereafter, for transferring the printed substrate to the component mounting device belonging to the substrate transfer line on the other side.
  • an apparatus in Japanese Patent Laid-Open Publication No. H7-205399 is to be applied as a screen printing apparatus in a case where the upstream side is a device of dual transfer-type and the downstream side is the device (supposed to be a component mounting device) of single transfer-type, a switching device for switching the source for receiving the substrates is disposed between the upstream-side device and the screen printing apparatus.
  • a similar switching device is disposed between the screen printing apparatus and the component mounting device.
  • the device of Japanese Patent Laid-Open Publications Nos. 2009-70867 and 2008-272964 is applied as a screen printing apparatus to be installed between an upstream-side device of a dual system and a component mounting device of a dual system where the substrate is transferred along the substrate transfer line on one side of the two substrate transfer lines, the substrate is then subjected to printing process and thereafter the substrate is transferred to the component mounting device belonging to the substrate transfer line on the other side, a similar switching device would be disposed between the screen printing apparatus and the component mounting device.
  • WO 2009/035136 A1 discloses a screen printing apparatus which includes two screen printers each including a substrate introduction portion by which a substrate is introduced from the upstream side of a component mounting line, a printing portion which performs a screen printing to the introduced substrate, a substrate discharge portion by which the substrate subjected to the screen printing is discharged to the downstream side, and a substrate moving stage which receives the introduced substrate so as to position the substrate with respect to the printing portion and to move the substrate subjected to the screen printing to the substrate discharge portion.
  • the present invention was devised in view of the foregoing circumstances, and an object of this invention is to provide a screen printing apparatus that enables solely to install between a device of a single system and a device of a dual system, or between an upstream-side device of a dual system and a downstream-side device of a dual system having mutually different substrate transfer line pitches, without any supplemental equipment such as a sorting device.
  • the screen printing apparatus of the present invention comprises features as defined in claim 1 or 3.
  • the foregoing screen printing apparatus it is enable to install solely the screen printing apparatus between a device of a single system and a device of a dual system, or between an upstream-side device of a dual system and a downstream-side device of a dual system, without incidental equipment such as a sorting device, and perform printing process to a substrate that is transferred from the upstream side and unload the substrate to the downstream side.
  • Fig. 1 and Fig. 2 show the first example of the screen printing apparatus according to the present invention, wherein Fig. 1 is a plan view and Fig. 2 is a front view schematically showing the screen printing apparatus, respectively.
  • the screen printing apparatus 1 is built into the manufacturing line of a printed circuit board (PCB) being disposed between an upstream-side device of a dual system and a downstream-side device of a single system.
  • the screen printing apparatus 1 (hereinafter abbreviated as the "printing apparatus 1") is installed between two loaders L1, L2 (first loader L1 and second loader L2) disposed in parallel, and one component mounting device M, thereby printing to substrates W that are sent out from the respective loaders L1, L2 on the upstream side, and then forwarding the substrates W to the component mounting device M on the downstream side.
  • the ensuing explanation refers to the transfer direction of the substrate W in the manufacturing line as the X axis direction, the direction that is orthogonal to the X axis direction on the horizontal plane as the Y axis direction, and the direction (vertical direction) that is orthogonal to both the X axis direction and the Y axis direction as the Z axis direction for the explanation of the printing apparatus 1.
  • the printing apparatus 1 is provided on its foundation 2 with two substrate support tables 10A, 10B for supporting the substrates W, and two print executing parts 20A, 20B for performing printing individually to the substrates W supported by the substrate support tables 10A, 10B in a state where the substrate support tables 10A, 10B have respectively stopped at predetermined positions in the Y axis direction.
  • two substrate loading parts En1, En2 are set in correspondence with the positions of the loaders L1, L2 at one side end (upstream end in the substrate transfer direction) with respect to the X axis direction, and one substrate unloading part Ex set in correspondence with the position of the component mounting device M at the other side end (downstream end in the substrate transfer direction).
  • the printing apparatus 1 loads the substrate W sent out from the first loader L1 from the first substrate loading part En1 or loads the substrate W sent out from the second loader L2 from the second substrate loading part En2, respectively.
  • the printing apparatus 1 then unloads the printed substrate W from the common substrate unloading part Ex to the component mounting device M.
  • the respective substrate loading parts En1, En2 are placed at positions across a predetermined interval in the Y axis direction, and the substrate unloading part Ex is placed at a position between the respective substrate loading parts En1, En2 with respect to the Y axis direction.
  • reference numerals CL1, CL2, CM designate belt conveyer pairs, respectively mounted on the loaders L1, L2 and the component mounting device M.
  • the substrate W is transferred along these belt conveyer pairs CL1, CL2, CM (hereinafter abbreviated as the "conveyer pairs CL1, CL2, CM").
  • the substrate loading parts En1, En2 and the substrate unloading parts Ex respectively refer to specific positions on the foundation 2, and the positions of the substrate loading parts En1, En2 and the substrate unloading parts Ex are set by a control machine 8 described later according to the respective loaders L1, L2 placed on the upstream side and the component mounting device M disposed on the downstream side. That is, the positions of the substrate loading parts En1, En2 in this example are the substrate loading positions of the present invention, and the positions of the substrate unloading parts Ex are the substrate unloading positions (same in the respective examples and embodiments described later).
  • the substrate support tables 10A, 10B receive the substrates W loaded from the loaders L1, L2 in the substrate loading parts En1, En2 and support the substrates W to enable printing on the substrates W, and send the printed substrates W to the component mounting device M in the substrate unloading part Ex.
  • the first substrate support table 10A receives the substrate W loaded from the loader L1 in the first substrate loading part En1 and supports the substrate W to enable printing on the substrates W by the first print executing part 20A.
  • the second substrate support table 10B receives the substrate W loaded from the loader L2 in the second substrate loading part En2 and supports the substrate W to enable printing on the substrates W by the second print executing part 20B.
  • the respective substrate support tables 10A, 10B have a substantial rectangular shape in a plan view that is elongated in the X axis direction as shown in Fig. 3 , and are configured to move individually in the Y axis direction by the table drive mechanism.
  • the table drive mechanism is configured from a screw feeding mechanism. That is, the respective substrate support tables 10A, 10B are respectively configured to be supported movably on a common fixed rail 3 provided on the foundation 2 and extending in the Y axis direction, and to be driven by motors 4A, 4B via screw axes 5A, 5B.
  • the first substrate support table 10A is adapted to move between a receiving position (position shown in Figs.
  • first receiving position where the first substrate support table 10A can receive the substrate W loaded from the loader L1 in the first substrate loading part En1
  • sending position where the first substrate support table 10A can unload the substrate W to the component mounting device M in the substrate unloading part Ex.
  • the second substrate support table 10B is adapted to move between a receiving position (position shown in Figs 1 and 3 ; second receiving position) where the second substrate support table 10B can receive the substrate W loaded from the loader L2 in the second substrate loading part En2, and the sending position.
  • the first substrate support table 10A can move between the first receiving position and the sending position defined as its movable area
  • the second substrate support table 10B can move between the second receiving position and the sending position defined as its movable area.
  • the sending position is positioned within a common area where a part of the movable area of the first substrate support table 10A and a part of the movable area of the second substrate support table 10B overlap with each other.
  • the second substrate support table 10B When the first substrate support table 10A is positioned at the sending position, the second substrate support table 10B will be positioned at the first receiving position which avoids the first substrate support table 10A within its movable area, and when the second substrate support table 10B is positioned at the sending position, the first substrate support table 10A will be disposed at the second receiving position which avoids the second substrate support table 10B within its movable area.
  • the substrate support tables 10A, 10B respectively comprise a conveyer pair 12 for receiving the loaded substrate W and sending the printed substrate W to the substrate unloading part Ex, a conveyer width variable mechanism, a clamp unit 14 for supporting and fixing the substrate W on the conveyer pair 12 to perform printing can be performed thereon, a clamp unit drive mechanism for moving the clamp unit 14 in the X axis direction along the conveyer pair 12, and a cleaning unit 18 for cleaning a screen mask 21 described later.
  • the conveyer pair 12 comprises a belt conveyer, and, in a state of supporting either end of the substrate W in the Y axis direction with a belt 121 which rotates by being driven by a motor 120 (shown in Fig. 10 ), transfers the substrate W in the X axis direction pursuant to the movement of the belt (see Fig. 5A ).
  • the conveyer width variable mechanism changes the interval (that is, the conveyer width) of the two conveyers configuring the conveyer pair 12 according to the size of the substrate W.
  • the conveyer width variable mechanism comprises a screw feeding mechanism, for example.
  • one of the two conveyers is a fixed conveyer that is fixed on the substrate support tables 10A, 10B
  • the other conveyer is a movable conveyer which is movably supported by a fixed rail on the substrate support tables 10A, 10B so that the movable conveyer can move toward and away from the one conveyer (move in the Y axis direction).
  • the interval of the two conveyers is changed by the other conveyer being driven along the fixed rail via a screw axis that is driven by the motor 123 (shown in Fig. 10 ).
  • the conveyer pair 12 is a variable stroke-type conveyer capable of changing the interval according to the size of the substrate W.
  • the conveyer width variable mechanism is configured such that the back side of the conveyer pair 12 is a fixed conveyer and the front side is the movable conveyer, and the interval of the conveyers is changed with the back-side conveyer as a reference.
  • the second substrate support table 10B positioned on the device's back side the front side of the conveyer pair 12 is a fixed conveyer and the back side is the movable conveyer, and the interval of the conveyers is changed with the front-side conveyer as a reference.
  • the other conveyer is moved with the conveyer on the mutually adjacent side as a reference; in other words, the interval of the conveyers of the respective conveyer pairs 12 is changed with the device's inner side in the Y axis direction as a reference, and with the printing apparatus 1.
  • the foregoing configuration contributes to the downsizing of the apparatus and the improvement of the throughput. This point will be explained in detail later.
  • the clamp unit 14 includes a base member 140 which is supported movably in the X axis direction along the fixed rail 141 provided on the substrate support tables 10A, 10B.
  • the clamp unit 14 comprises a backup mechanism for raising and supporting the substrate W from the conveyer pair 12, and a clamp mechanism for fixing the substrate W that was raised by the backup mechanism.
  • the backup mechanism comprises a plurality of backup pins 151 (hereinafter abbreviated as the "pins 151") of a predetermined arrangement.
  • the backup mechanism further includes a backup table 150 (BU table 150) which is elevatably supported on the base member 140 via a link mechanism or the like, and a drive motor 152.
  • the backup mechanism is configured so that the BU table 150 is displaced between a predetermined withdrawal position and an operating position raised therefrom by the drive of the motor 152.
  • the withdrawal position is a position (position shown in Fig.
  • the backup mechanism raises the substrate W from the conveyer pair 12 when the BU table 150 is placed at the operating position as shown in Fig. 5B .
  • the clamp mechanism includes a pair of clamp members 160 disposed at a position above the conveyer 12 and extending parallel to each other with respect to the X axis direction, an arm member 161 to which the clamp members 160 are mounted, and an actuator for driving the clamp members; for instance, a bi-directional air cylinder 162.
  • One of the two clamp members 160 (left side in Figs. 4 and 5A ) is mounted on the arm member 161 so that it can be displaced in the Y axis direction, and is displaced between the withdrawal position indicated in the Figure and the forward position indicated in Fig. 5B by the drive of the air cylinder 162. That is, with the clamp mechanism as shown in Fig. 5B , one clamp member 160 sandwiches and clamps the substrate W, which was raised by the backup mechanism, with the other clamp member 160 in the Y axis direction as a result of the one clamp member 160 being displaced from the withdrawal position to the forward position.
  • the respective arm members 161 of the clamp mechanism are formed so as to embrace the conveyer pair 12 from the outside (outside in the Y axis direction), and are respectively slidably coupled to a fixed rail 122 mounted on the respective conveyer pairs 12 in the X axis direction. Since the respective arm members 161 are so configured to be guided by being coupled to the conveyer pair 12 (fixed rail 122), in a foregoing manner, the relative position between the conveyer pair 12 and the respective clamp members 160 with respect to the Y axis direction can be maintained to be constant despite the clamp unit 14 being moved in the X axis direction as explained later.
  • one of the respective arm members 161 specifically, the arm member 161 (right-side arm member in Fig. 4 ) on the one side that is coupled to the fixed conveyer of the conveyer pair 12 is fixed to the base member 140, and the arm member 161 (left-side arm member in Fig. 4 ) on the other side that is coupled to the movable conveyer is supported movably in the Y axis direction along the fixed rail 164 provided on the base member 140. Accordingly, when the interval of the conveyer pair 12 is changed, one arm member 161 will move in the Y axis direction integrally with the movable conveyer, and the interval of both clamp members 160 will thereby be automatically adjusted.
  • each of the clamp members 160 is configured so that the clamp member mounted on the movable conveyer side is driven. With this configuration, the substrate W is clamped with respect to a reference defined by the fixed conveyer side. Accordingly, with the clamp unit 14 of the first substrate support table 10A, the substrate W is clamped with respect to a reference defined by the device's back side, and with the clamp unit 14 of the second substrate support table 10B, the substrate W is clamped with respect to a reference defined by the device's front side.
  • the clamp unit drive mechanism is configured from a screw feeding mechanism. That is, the base member 140 of the clamp unit 14 is configured to be movably supported on the fixed rail 141 provided on the foundation 2 and extending in the X axis direction, and to be driven by the motor 144 via the screw axis 142. With respect to respective substrate support tables 10A, 10B, the position near the substrate loading parts En1, En2 is set as a substrate standby position, and a predetermined position that is downstream thereof is set as a print executing position. Then, the clamp unit 14 moves between the substrate standby position (position indicated with a two-dot chain line in Fig. 2 ) and the print executing position (position indicated with a solid line in Fig. 2 ) in accordance with the motor control of the control machine described later.
  • the configuration of the second substrate support table 10B is basically similar with the first substrate support table 10A excluding the point that the substrate W is clamped with respect to a reference defined by the device's front side.
  • the cleaning unit 18 comprises a cleaning head including pad that is slidable on the lower face of the screen mask 21 described later, and a suction nozzle for sucking the screen mask 21 by negative pressure via the pad.
  • the cleaning unit 18 slide contacts the cleaning head with the lower face of the mask 21 to remove the paste remaining on the lower face of the mask and in the pattern holes.
  • the cleaning head is configured to be elevatable relatively to the substrate support tables 10A, 10B, to be placed at the operating position that is slidable on the screen mask 21 only during the cleaning process, and otherwise to be placed at the withdrawal position lowered from the operating position.
  • Reference numeral 15 in Fig. 1 to Fig. 3 designates a stopper mechanism of the conveyer pair 12, which is used for causing the substrate W received on the conveyer pair 12 to stand by at the substrate standby position.
  • the stopper mechanism 15 includes a stopper axis that is driven forward or backward by an actuator such as an air cylinder so that the stopper mechanism 15 is configured to enable switching between an activated state of restricting the movement of the substrate W by moving the stopper axis forward in the transfer path of the substrate W by the conveyer pair 12, and a stopped state of withdrawing the stopper axis outside the transfer path and allowing the movement of the substrate W.
  • reference numeral 16 in the Figure designates the mask recognition camera mounted on the clamp unit 14.
  • the mask recognition camera 16 is a camera comprising a CCD area sensor or the like, and is adapted for imaging, from the lower side, signs such as marks or symbols indicated on the lower face of the screen mask in order to recognize the relative position between the screen mask 21 described later and the substrate W.
  • the first print executing part 20A is provided above the first substrate support table when the first substrate support table is placed at the first receiving position for receiving the substrate
  • the second print executing part 20B is provided above the second substrate support table when the second substrate support table is placed at the second receiving position for receiving the substrate.
  • Fig. 6 is a perspective view showing a state where only the print executing parts 20A, 20B are extracted from the printing apparatus 1.
  • the print executing parts 20A, 20B are juxtaposed in the Y axis direction, and respectively include a mask holding mechanism for holding the mask 21, a squeegee unit 40 disposed in the X axis direction, a squeegee drive mechanism disposed in the Y axis direction and moving the squeegee unit 40 in the Y axis direction, and the like.
  • Each mechanism that configures the print executing parts 20A, 20B is mounted on a pair of apparatus frames 6 each of which is formed in a gate shape and is installed on the foundation 2 with a predetermined interval with respect to the X axis direction.
  • the pair of apparatus frames 6 are adapted to straddle the substrate W that moves from the substrate standby position to the print executing position on the first substrate support table 10A, the substrate W that moves from the substrate standby position to the print executing position on the second substrate support table 10B, and the substrate W that moves from the print executing position P2 to the substrate unloading part Ex on the substrate support tables 10A, 10B positioned at the sending positions.
  • each mask holding mechanism includes a mask fixing member 22 of a rectangular shape to which the screen mask 21 (hereinafter abbreviated as the "mask 21") is mounted detachably, an elevating drive mechanism for elevating the mask fixing member 22, a rotating drive mechanism for rotating the fixing member 22 around the Z axis together with the elevating drive mechanism, and a Y axis drive mechanism for moving the fixing member 22 in the Y axis direction together with the elevating drive mechanism.
  • the mask fixing member 22 has a rectangular shape formed at the center thereof with an opening 22a for printing, and the opening 22a is configured to be covered by the mask 21 which is previously mounted on a frame.
  • Each driving mechanism of the mask fixing member 22 is configured as follows.
  • Each apparatus frame 6 is provided with fixed rails 25 extending in the Y axis direction.
  • a mask support member 24 for elevatably supporting the mask fixing member 22 is movably supported by the fixed rails 25.
  • the mask support member 24 has a U-shape in a plan view, which is consisting of a pair of Y axis plate parts 24a extending along the fixed rail 25 and an X axis plate part 24b which connects the ends of the Y axis plate parts 24a, so that the mask support member 24 can move in the Y axis direction as a result of the respective Y axis plate parts 24a being coupled to sliders 26a to 26c mounted on each of the fixed rails 25.
  • a pair of guide axes 251 extending in the Z axis direction penetrates the each of Y axis plate parts 24a of the mask support member 24 so that the mask fixing member 22 is fixed to the bottom end of the guide axes 251.
  • a connecting member 252 is fixed to the upper ends of the pair of guide axes 251.
  • a pair of pulley nuts 256 is placed between the guide axes 251 on the respective Y axis plate parts 24a of the mask support member 24 and mounted rotatably on the respective Y axis plate parts 24a but fixed with respect to the Z axis direction.
  • Screw axes 254 are screwed and inserted into the respective pulley nuts 256 in the Z axis direction and ends of the screw axes 254 are fixedly supported by the mask fixing member 22 and the connecting member 252. Moreover, the motor 260 is fixed to the mask support member 24. A drive pulley not shown is mounted on an output axis of the motor 260. A drive belt 258 is placed across the drive pulley, a plurality of idle pulleys 257 mounted on the mask support member 24, and the pulley nuts 256.
  • the mask support member 24 is coupled to the sliders 26a to 26c mounted on the respective fixed rails 25 as described above. Specifically, the respective Y axis plate parts 24a are coupled to the sliders 26a to 26c via the link members 28a to 28c so as to allow the displacement of the mask support member 24 around the Z axis with a specific position as the fulcrum.
  • Fig. 9A is a Figure schematically showing the mask support member 24 and the like for facilitating the understanding of the foregoing structure. As shown in this Figure, in the mask support member 24, the middle position of the Y axis plate part 24a on one side (left side in the Figure) is coupled to the slider 26b via the pin 29.
  • End positions in the Y direction of the Y axis plate part 24a on one side are respectively coupled with the sliders 26a, 26c via the link members 28a, 28c which are a pin-coupling on both ends.
  • three portions or both ends in the Y axis direction and intermediate portion therebetween in the Y axis plate part 24a on the other side of the mask support member 24 are similarly coupled with the sliders 26a to 26c via the link members 28a to 28c of the pin coupling on either end.
  • the nut member 33 is fixed to the respective sliders 26b which is in the middle among the three sliders 26a to 26c which are respectively coupled to the respective Y axis plate parts 24a of the mask support member 24.
  • a screw axis 32 extending in the Y axis direction is screwed and inserted into the nut member 33.
  • the screw axis 32 is integrated with the output axis of the motor 30 fixed to the apparatus frame 6.
  • the mask support member 24 moves in the Y axis direction while maintaining its state. Meanwhile, as shown in Fig. 9B , for example, when one of the motors 30 is solely driven, the mask support member 24 rotates around the Z axis with the pin 29 as the fulcrum.
  • the squeegee unit 40 is respectively disposed above the mask holding mechanism.
  • the squeegee unit 40 is for spreading paste such as solder cream or conductive paste on the mask 21 via rolling (kneading), and includes a single squeegee 42, a squeegee angle variable mechanism not shown for changing a inclination direction and the inclination angle of the squeegee 42 relative to the mask 21, a squeegee elevating mechanism not shown for elevating the squeegee 42 between a printing work height position where the squeegee 42 slidably contacts with the mask 21 and a withdrawal position (position indicated in Fig. 2 and Fig. 6 ) that is higher than the foregoing position, and other elements.
  • the squeegee drive mechanism for driving the squeegee unit 40 in the Y axis direction is configured from a screw feeding mechanism. That is, as shown in Figs. 6 and 7 , each squeegee unit 40 of the respective print executing parts 20A, 20B is movably supported on the common fixed rails 44 provided on the apparatus frame 6 and extending in the Y axis direction, and is respectively configured to be independently driven by the motors 46A, 46B via the screw axes 47A, 47B, respectively.
  • reference numeral 50 designates a substrate recognition camera that is used from the upper side for imaging signs such as marks and symbols of the substrate W to recognize the relative position between the substrate W supported by each of the substrate support tables 10A, 10B and the print executing parts 20A, 20B.
  • the substrate recognition camera 50 is a camera comprising a CCD area sensor or the like, and the substrate recognition camera 50 is fixed at positions corresponding to the respective print executing parts 20A, 20B on the side of the substrate loading parts En1, En2 among the apparatus frames 6.
  • the printing apparatus 1 comprises a control machine 8 (corresponds to the control means of the present invention) having a CPU and the like as its constituent elements.
  • the control machine 8 as shown in Fig. 10 , comprises a main control unit 81 for governing the control of the operation of the overall printing apparatus 1, a storage unit 82 for storing various processing programs and various data, a drive control unit 83 for controlling the drive of the substrate support tables 10A, 10B and the print executing parts 20A, 20B, and an image processing unit 84 for performing predetermined image processing to the image data from each of the recognition cameras 16, 50A, 50B.
  • These elements such as main control unit 81 and the like are mutually connected via a bus to enable the exchange of signals.
  • the main control unit 81 governs the control of the series of printing operations to be performed by the substrate support tables 10A, 10B and the print executing parts 20A, 20B based on the print execution programs or the like given by an external host computer; that is, the series of printing operations including the interval adjustment of the conveyer 12 corresponding to the substrate W to be printed, the reception of the substrate W loaded from the loaders L1, L2 in the substrate loading parts En1, En2, the printing process to be performed by the print executing parts 20A, 20B, and the unloading of the substrate W to the component mounting device M in the substrate unloading part Ex.
  • the print execution programs and the like given from the host computer to the printing apparatus 1 contain data related to the positions of the conveyer pairs CL1, CL2 of the respective loaders L1, L2 and the positions of the conveyer pairs CM1, CM2 of the component mounting device M, coupled to the printing apparatus 1, and data related to the size (dimension) of the substrate W to be printed.
  • the main control unit 81 Based on the foregoing print execution programs and the like, the main control unit 81 performs the initialization including the setting of the positions of the substrate loading parts En1, En2 and the substrate unloading parts En1, En2.
  • the main control unit 81 controls the series of printing operations based on the positions of substrate loading Ex and the substrate unloading Ex set in the foregoing initialization.
  • the host computer governs the control of the manufacturing line of a printed circuit board to which the printing apparatus 1 is built therein. All devices (loaders L1, L2 and component mounting device M), including the printing apparatus 1, to be built into the manufacturing line are connected online so as to enable intercommunication with the host computer. The print execution program and various data are thus given to the respective devices of the printing apparatus 1 form the host computer.
  • Fig. 11A schematically shows a state of a specific timing in the printing operation that is being performed continuously in the printing apparatus 1. Specifically, Fig. 11A shows the state immediately after the completion of printing of the substrate W supported by the second substrate support table 10B.
  • the state of the substrate support tables 10A, 10B and the print executing parts 20A, 20B at this timing is as follows.
  • the second substrate support table 10B is being placed at the second receiving position where the conveyer pair 12 aligns with the second substrate loading part En2.
  • the clamp unit 14 is being placed at the print executing position in a state of clamping the substrate W, and a subsequent substrate W is standing by at the substrate standby position.
  • the second print executing part 20B is thus being a predetermined standing by state where the mask 21 is detached from the substrate W by placing the mask support member 24 at the withdrawal position, and the squeegee 42 is placed at the standby position above one end of the mask.
  • the first substrate support table 10A is being placed at the sending position where the conveyer pair 12 aligns with the substrate unloading part Ex.
  • the first substrate support table 10A is just unloaded the substrate W previously subjected to printing, from the substrate unloading part Ex to the component mounting device M, and the clamp unit 14 is in a state of being placed at the substrate standby position and clamping the subsequent substrate W.
  • the clamping of the substrate W is performed, after the clamp unit 14 is moved to the substrate standby position, by lifting the substrate W from the conveyer pair 12 by the BU table 150, as shown in Fig. 5 , and further sandwiching the substrate W by a pair of the clamp members 160 from both sides in the Y axis direction.
  • the first substrate support table 10A moves initially toward the first receiving position, or a position where the conveyer pair 12 aligns with the first substrate loading part En1.
  • the substrate W will be transferred from the substrate standby position to the print executing position by the movement of the clamp unit 14, and during the foregoing transfer, the position of the substrate W on the clamp unit 14 is subjected to capture recognition by capturing a plurality of signs on the substrate W by the substrate recognition camera 50 at a position corresponding to the first print executing part 20A.
  • a relative position between the mask 21 and the clamp unit 14 is subjected to capture recognition by capturing a plurality of signs of the mask 21 of the first print executing part 20A by the mask recognition camera 16 mounted on the clamp unit 14. Based on the recognition results, a position gap between the mask 21 and the substrate W at the print executing position is obtained, and the correction values ( ⁇ X, ⁇ Y, ⁇ R) of the X axis, Y axis, and R axis (around Z axis) directions of the mask 21 according to the obtained position gap are obtained.
  • the foregoing recognition processing and calculation of correction values are performed by the control machine based on the images that were captured by the substrate recognition camera 50 and the mask recognition camera 16.
  • the second substrate support table 10B moves from the second receiving position to the sending position in a manner of following the movement of the first substrate support table 10A.
  • the first substrate support table 10A is placed at the first receiving position and the second substrate support table 10B is placed at the sending position, respectively.
  • the first substrate support table 10A When the first substrate support table 10A is placed at the first receiving position, printing to the substrate W is performed by the first print executing part 20A. During that time, the subsequent substrate W is transferred from the loader L1 to the first substrate support table 10A and placed at the substrate standby position in the first substrate loading part En1. At this moment, since the substrate W at the print executing position is clamped by the clamp unit 14 in a state of being raised from the conveyer pair 12, a position gap will not occur despite the transfer of the subsequent substrate W by the drive of the conveyer pair 12.
  • the mask support member 24 is initially lowered from the withdrawal position to the overlapping height position, and the mask 21 is fit atop the substrate W.
  • the relative position between the mask 21 and the substrate W are corrected by the motors 30, 144 which are controlled based on the correction values ( ⁇ X, ⁇ Y, ⁇ R).
  • the mask 21 is appropriately fit atop the substrate W by respectively exerting the position corrections (correction value ⁇ X) of the substrate W with respect to the X axis direction being performed based on the drive of the motor 144, and the position corrections (correction value ⁇ Y) of the mask 21 with respect to the Y axis direction and the position corrections (correction value ⁇ R) of the mask 21 with respect to the R axis direction being performed based on the drive of the two motors 30.
  • the squeegee 42 When overlapping of the mask 21 with the substrate W is completed, the squeegee 42 is lowered from the withdrawal position to the printing work height position, and the overall squeegee unit 40 including the squeegee 42 is thereafter moved in the Y axis direction so as to perform printing on the substrate W.
  • the clamped state of the substrate W by the clamp unit 14 is released and, as shown in Fig. 12A , the printed substrate W is unloaded to the component mounting device M through the substrate unloading part Ex, the clamp unit 14 moves to the substrate standby position and clamps the subsequent substrate W in a standby state. While the conveyer pair 12 is driven in order to unload the printed substrate W at that timing, the subsequent substrate W in standby at the substrate standby position is in a transfer stopped state caused by the activation of the stopper mechanism 15, so that the clamping of the substrate W by the clamp unit 14 is enabled.
  • the first print executing part 20A is reset to a standby state. That is, the substrate W is detached from the mask 21 as a result of the mask support member 24 being placed at the withdrawal position, and the squeegee 42 is raised to the standby position above one end of the mask at the Y axis direction destination and thereafter stopped and retained, and the first substrate support table 10A is thereafter moved to the sending position.
  • the second substrate support table 10B moves to the second receiving position.
  • the substrate W is then transferred from the substrate standby position to the print executing position with the movement of the clamp unit 14, and, during the foregoing transfer, the relative position between the mask 21 and the substrate W are subjected to capture recognition by capturing a plurality of signs on the substrate W by the substrate recognition camera 50 at a position corresponding to the second print executing part 20B, or by the sign of the mark 21 of the second print executing part 20B captured by the mask recognition camera 16.
  • the correction values ( ⁇ X, ⁇ Y, ⁇ R) are obtained based on the foregoing recognition results.
  • Fig. 12B when the first substrate support table 10A is placed at the sending position and the second substrate support table 10B is placed at the second receiving position, respectively, position corrections based on the correction values ( ⁇ X, ⁇ Y, ⁇ R) is performed.
  • the mask 21 is appropriately fit atop the substrate W, and the second print executing part 20B performs printing on the substrate W placed at the print executing position of the second substrate support table 10B, while the subsequent substrate W is received by the second substrate support table 10B, as shown in the Figure.
  • the clamping of the substrate W by the clamp unit 14 is released and the printed substrate W is unloaded from the print executing position to the substrate unloading part Ex on the unloading side end, and further unloaded to the component mounting device M in the substrate unloading part Ex.
  • the substrate W loaded from the loader L1 to the first substrate loading part En1 is received by the first substrate support table 10A
  • the substrate W loaded from the loader L2 to the second substrate loading part En2 is received by the second substrate support table 10B, respectively, while alternately printing to the substrates W in the respective print executing parts 20A, 20B.
  • the printed substrates W are unloaded from the common substrate unloading part Ex to the component mounting device M.
  • printing of the substrate W can be efficiently performed because the printing process (mainly loading of the substrate W to the standby position, substrate clamping, movement of the substrate W from the standby position to the print executing position, printing, substrate unclamping, substrate unloading) using the first substrate support table 10A, and the printing process (mainly loading of the substrate W to the standby position, substrate clamping, movement of the substrate W from the standby position to the print executing position, printing, substrate unclamping, substrate unloading) using the second substrate support table 10B are performed in parallel by delaying the timing.
  • the printing apparatus can independently receive the substrate W from an upstream-side device of a dual system or two loaders L1, L2 and perform printing on the substrate, and unload the printed substrate W to a downstream-side device of a single system or one component mounting device M.
  • the manufacturing line can be downsized despite the printing apparatus 1 being disposed between the upstream-side device of a dual system and the downstream-side device of a single system.
  • the printing apparatus 1 comprises, as a print executing part, the first print executing part 20A for performing printing to the substrate W loaded from the loader L1 in the first substrate loading part En1 and the second print executing part 20B for performing printing on the substrate W loaded from the loader L2 in the second substrate loading part En2, there is an advantage in that mutually different patterns can be printed on the substrates W that are respectively sent out from the two loaders L1, L2, and the printed substrates W can be simultaneously set to the component mounting device M.
  • the clamp unit 14 in the respective substrate support tables 10A, 10B is movably provided between the print executing position and the substrate standby position. Therefore, as described above, the printing apparatus 1 is configured so that the clamp unit 14 moves to the substrate standby position and clamps the subsequent substrate W in a standby state, in the midst of unloading the preceding substrate W (printed substrate W) clamping of which is being released after the printing has been completed. That is, printing of the preceding substrate W by the print executing parts 20A, 20B can be enabled substantially simultaneously with the substrate support tables 10A, 10B being reset to the receiving position (first receiving position, second receiving position). Accordingly, after the preceding substrate W is unloaded, the printing of the subsequent substrate W can be performed as soon as possible. Thus, there is an advantage in that the printing of the substrates W can be performed efficiently in both cases of printing the same pattern and printing mutually different patterns on the substrates W that are respectively sent out from the two loaders L1, L2.
  • the conveyer width variable mechanism of the substrate support tables 10A, 10B is a configuration which changes the interval of the conveyer pair 12 with the device's inner side as a reference, as described above, there is an advantage in particular in that this configuration will contribute to the improvement in the throughput and the downsizing of the printing apparatus 1, in relation to the component mounting device M to be disposed downstream. This point is now explained.
  • the component mounting device M side is also provided with a conveyer width variable mechanism for changing the interval of the conveyer pair CM, and the interval of the conveyer pair CM is changed according to the size of the substrate W to be produced.
  • the throughput and structure of the printing apparatus 1 are considered to be influenced depending on whether the conveyer variable mechanism on the component mounting device M side changes the interval of the conveyer pair CM with the device's front side or the device's back side as a reference, and whether the conveyer width variable mechanism on the printing apparatus 1 side (substrate support tables 10A, 10B) changes the interval of the conveyer pair 12 with the device's inner side or the device's outer side as a reference.
  • Figs. 13 and 14 respectively show a moving distance, or the like, of the first substrate support table 10A between the first receiving position and a sending position classified in accordance with a reference of each conveyer width variable mechanism on the component mounting device M side and the printing apparatus 1 side (substrate support tables 10A, 10B).
  • Fig. 13 is a schematic diagram showing a case where the conveyer width variable mechanism of the printing apparatus 1 (substrate support tables 10A, 10B) uses the device's inner side as a reference (example shown in Fig. 1 to Fig. 4 ), wherein Fig. 13A shows a case where the conveyer width variable mechanism on the component mounting device M side uses the device's back side as a reference; that is, a case where the conveyer positioned on the device's back side is a fixed conveyer, and Fig. 13B shows a case where the conveyer width variable mechanism on the component mounting device M side uses the device's front side as a reference.
  • Fig. 13A shows a case where the conveyer width variable mechanism on the component mounting device M side uses the device's back side as a reference; that is, a case where the conveyer positioned on the device's back side is a fixed conveyer
  • Fig. 13B shows a case where the conveyer width variable mechanism on the component mounting device M side uses the
  • FIG. 14 is a schematic diagram showing a case where the conveyer width variable mechanism of the printing apparatus 1 (substrate support tables 10A, 10B) uses the device's outer side as a reference; that is, a case where the conveyer positioned on the device's front side is a fixed conveyer regarding the first substrate support table 10A, and the conveyer positioned on the device's back side is a fixed conveyer regarding the second substrate support table 10B (configuration that is opposite to the example shown in Fig. 1 to Fig. 4 ), wherein Fig. 14A shows a case where the conveyer width variable mechanism on the component mounting device M side uses the device's back side as a reference, and Fig.
  • FIG. 14B shows a case where the conveyer width variable mechanism on the component mounting device M side uses the device's front side as a reference.
  • the fixed conveyers are illustrated with hatching.
  • the conveyer pair 12 is illustrated with a solid line in a state when the interval of the conveyer pair 12 is a minimum.
  • the sending position of the first substrate support table 10A that is, the position where the substrate W is unloaded to the component mounting device M is the same place regardless of the interval of the conveyer pair 12 (or size of the substrate W). Accordingly, the moving distance D of the first substrate support table 10A between the first receiving position and the sending position is always constant, regardless of the size of the substrate W.
  • the sending position of the first substrate support table 10A is equivalent to the example of Fig. 13A .
  • the sending position of the first substrate support table 10A will be closer to the first receiving position side. Accordingly, the moving distance D of the first substrate support table 10A is equivalent to the example of Fig. 13A when the substrate W is of a maximum size, and decreases as the size of the substrate W decreases.
  • the sending position of the first substrate support table 10A is equivalent to the examples of Figs. 13A and 13B .
  • the sending position of the first substrate support table 10A will be farther from the first receiving position. Accordingly, the moving distance D of the first substrate support table 10A is equivalent to the examples of Figs. 13A and 13B when the substrate W is of a maximum size, and increases as the size of the substrate W decreases.
  • the first substrate support table 10A is considerably offset to the device's back side relative to the conveyer pair CM of the component mounting device M.
  • the size L of the printing apparatus 1 in the front-back direction needs to be increased in comparison to the example of Fig. 13 by that much.
  • the sending position of the first substrate support table 10A is constant regardless of the interval of the conveyer pair 12. Accordingly, the moving distance D of the first substrate support table 10A between the first receiving position and the sending position is constant regardless of the size of the substrate W.
  • the relation of the second substrate support table 10B and the component mounting device M becomes a relation that is equivalent to the relation of the first substrate support table 10A and the component mounting device M of Fig. 14A . That is, when the substrate W is of a minimum size, when the second substrate support table 10B is placed at the sending position, the second substrate support table 10B is considerably offset to the device's front side relative to the conveyer pair CM of the component mounting device M.
  • the size L of the printing apparatus 1 in the front-back direction needs to be increased in comparison to the example of Fig. 13 .
  • the sending position thereof With respect to the first substrate support table 10A, the sending position thereof will become farther from the first receiving position by that much and, consequently, the moving distance D of the first substrate support table 10A will increase in comparison to the example shown in Fig. 13 .
  • the moving distance D of the substrate support tables 10A, 10B can be made to be relatively short (in comparison to a case of using the device's outer side as a reference), and the enlargement of the printing apparatus 1 in the Y axis direction can also be prevented.
  • the conveyer width variable mechanism on the printing apparatus 1 (substrate support tables 10A, 10B) side uses the device's inner side as a reference, it is possible to contribute to the improvement in the throughput and the downsizing of the printing apparatus 1.
  • Fig. 15A is a schematic plan view showing the screen printing apparatus 1A (hereinafter abbreviated as the "printing apparatus 1A") according to the second example.
  • the printing apparatus 1A according to the second example is configured differently from the printing apparatus 1 according to the first example with respect to the following points.
  • a conveyer pair Cn1 for receiving the substrate W from the first loader L1 and a conveyer pair Cn2 for receiving the substrate W from the second loader L2 are installed on the foundation 2. Positions where the conveyer pairs Cn1, Cn2 are respectively installed are the counterpart of the substrate loading parts En1, En2. Also, a conveyer pair Cx for unloading the substrate W to the component mounting device M1 is installed. A position where the conveyer pair Cx is installed is the counterpart of the substrate loading part En.
  • the positions of the substrate loading parts En1, En2 and the substrate unloading part Ex on the foundation 2 are fixed, and a mounting line is formed by the loaders L1, L2 and the component mounting device M being disposed in correspondence with the foregoing positions. That is, unlike the first example, the positions of the substrate loading parts En1, En2 are not set in correspondence with the positions of the loaders L1, L2, and the position of the substrate unloading part Ex is not set in correspondence with the position of the component mounting device M according to the print execution program and the like given from the host computer.
  • the conveyer pairs Cn1, Cn2, and Cx the interval of the respective conveyers is changed based on the conveyer width variable mechanism according to the size of the substrate W, as with the conveyer pair 12 of the substrate support tables 10A, 10B.
  • the respective substrate support tables 10A, 10B do not have a space (substrate standby position) for causing the subsequent substrate W to stand by.
  • the substrate W that is transferred from the loaders L1, L2 to the substrate support tables 10A, 10B via the substrate loading parts En1, En2 is therefore transferred directly to the lower position (print executing position) of the print executing parts 20A, 20B, and clamped by the clamp unit 14 at the foregoing position.
  • the clamp unit 14 is likewise movable in the X axis direction as with the first example, the movable range thereof is limited to a range in which the relative position between the mask 21 and the substrate W can be corrected during the overlapping of the mask.
  • the mask recognition camera 16 and the substrate recognition camera 50 are coupled with a moving mechanism with a motor or the like as the driving source.
  • the mask recognition camera 16 and the substrate recognition camera 50 can move across a position (imaging position) disposed between the mask 21 and the substrate W, and a position (withdrawal position) withdrawn outside from a position between the mask 21 and the substrate W.
  • the printing apparatus 1A is configured such that the mask recognition camera 16 and the substrate recognition camera 50 capture the respective signs of the mask 21 and the substrate W by being interposed therebetween after the clamping of the substrate W and before the overlapping of the mask 21 so as to recognize the relative position between the mask 21 and the substrate W, and the printing apparatus 1A obtains correction values ( ⁇ X, ⁇ Y, ⁇ R) during the overlapping of the mask based on the foregoing recognition results.
  • the mask 21 is provided fixedly on the foundation 2 side.
  • the clamp unit 14 is movably provided in the X axis direction, the Z axis direction, and the R axis direction around the Z axis relative to a movable base of the substrate support tables 10A, 10B.
  • the electrical configuration of the printing apparatus 1A is basically the same as the first example (see Fig. 10 ) excluding that there is only one print executing part, the moving mechanism for moving the mask recognition camera 16 or the like and the moving mechanism for moving the clamp unit 14 in the X axis direction, the Z axis direction, and the R axis direction are controlled by the main control unit 81 via the drive control unit 83, and other points.
  • the substrate W is transferred from the first substrate loading part En1 to the first substrate support table 10A ( Fig. 15A ), the substrate W is clamped by the clamp unit 14, the substrate W is thereafter overlapped with the mask 21 from the underside of the mask 21 by raising the clamp unit 14 in the Z axis direction, and then the substrate W is subjected to printing ( Fig. 15B ).
  • the substrate W is properly overlapped with the mask 21 as a result of position corrections being performed, respectively, to the clamp unit 14 with respect to the X axis direction and the R axis direction, and to the first substrate support table 10A with respect to the Y axis direction, based on the correction values ( ⁇ X, ⁇ Y, ⁇ R).)
  • plate releasing is performed by the clamp unit 14 by being lowered in the Z axis direction. Meanwhile, the clamp unit 14 moves in the X axis direction by the amount of - ⁇ X, and in the R axis direction by the amount of - ⁇ R.
  • the movement of the movable base of the first substrate support table 10A in the Y axis direction causes the first substrate support table 10A to be placed at the sending position, and the printed substrate W is thereby unloaded to the component mounting device M from above the first substrate support table 10A via the substrate unloading part Ex ( Fig. 15C ).
  • the first substrate support table 10A can move between the first receiving position and the sending position
  • the second substrate support table 10B can move between the second receiving position and the sending position.
  • the sending position is positioned within a common area in which the respective movable areas of the first substrate support table 10A and the second substrate support table 10B overlap with each other.
  • the first substrate support table 10A is positioned at the sending position
  • the second substrate support table 10B is placed at the first receiving position that avoids the first substrate support table 10A within the movable area.
  • the first substrate support table 10A is positioned at the second receiving position that avoids the second substrate support table 10B within the movable area.
  • printing of the substrate W can also be efficiently performed since the printing process(mainly substrate loading, substrate clamping, printing, substrate unclamping, substrate unloading) using the first substrate support table 10A and the printing process(mainly substrate loading, substrate clamping, printing, substrate unclamping, substrate unloading) using the second substrate support table 10B are performed in parallel by delaying the timing.
  • the printing apparatus 1A can independently receive the substrate W from two loaders L1, L2 and perform printing on the substrate, and unload the printed substrate W to one component mounting device M.
  • the printing apparatus 1A is useful for downsizing the manufacturing line as well as the printing apparatus 1 of the first example.
  • the substrate support tables 10A, 10B since the respective substrate support tables 10A, 10B do not have a space (substrate standby position) for standing by the substrate W, the substrate support tables 10A, 10B can be downsized in the X axis direction by that much.
  • the manufacturing line can be downsized in the substrate transfer direction (X axis direction).
  • Fig. 16A is a schematic plan view showing the screen printing apparatus 1B (hereinafter abbreviated as the "printing apparatus 1B") according to the third example.
  • the printing apparatus 1B according to the third example is a modified example of the printing apparatus 1A (see Fig. 15 ) of the second example described above, and is configured differently from the printing apparatus 1A of the second example with respect to the following points.
  • a common print executing part 20 for performing printing on the substrate W on the respective substrate support tables 10A, 10B is provided.
  • the print executing part 20 is disposed at a position above the sending position for unloading the substrate W.
  • the substrate recognition camera 50 is disposed fixedly at the respective positions above the first and second receiving positions for receiving the substrate W on the substrate support tables 10A, 10B.
  • Each camera 50 captures, respectively, at the first and second receiving positions, the plurality of signs of the substrate W on the substrate support tables 10A, 10B clamped by the clamp unit 14.
  • the mask recognition camera 16 is fixedly provided to the clamp unit 14 as with the first example.
  • the mask recognition camera 16 is configured to capture a plurality of signs on the mask 21 while the substrate support tables 10A, 10B are moving from the first and second receiving positions to the sending position for performing the printing on the substrate W.
  • the substrate W is transferred from the loader L1 disposed aligning with the conveyer pair Cn1 provided on the foundation 2 to the first substrate support table 10A via the first substrate loading part En1 ( Fig. 16A ), the substrate W is clamped by the clamp unit 14, and the substrate W is thereafter disposed below the print executing part 20 as a result of the first substrate support table 10A moving from the first receiving position to the sending position.
  • the substrate W is overlapped with the mask 21 and the substrate is subjected to printing, and, after the completion of printing, plate releasing of the substrate W being separated from the mask 21 is performed after the clamping of the substrate W is released, and, based on the drive of the conveyer pair 12, the substrate W is unloaded directly from the first substrate support table 10A, via the substrate unloading part Ex, to the component mounting device M disposed in correspondence with the conveyer pair Cx provided on the foundation 2.
  • the first substrate support table 10A can move between the first receiving position and the sending position
  • the second substrate support table 10B can move between the second receiving position and the sending position.
  • the sending position is positioned at the same position as the print executing part, and this position is positioned within a common area in which the respective movable areas of the first substrate support table 10A and the second substrate support table 10B overlap with each other.
  • the second substrate support table 10B is placed at the first receiving position that avoids the first substrate support table 10A within the movable area, and, when the second substrate support table 10B is positioned at the sending position, the first substrate support table 10A is positioned at the second receiving position that avoids the second substrate support table 10B within the movable area.
  • printing of the substrate W can also be efficiently performed since the printing process(mainly substrate loading, substrate clamping, printing, substrate unclamping, substrate unloading) using the first substrate support table 10A and the printing process(mainly substrate loading, substrate clamping, printing, substrate unclamping, substrate unloading) using the second substrate support table 10B are performed in parallel by delaying the timing. Accordingly, it is quite useful when printing a common pattern on the substrates W that are respectively sent out from the respective loaders L1, L2.
  • the printing can be efficiently performed with a simple configuration comprising one print executing part 20.
  • Fig. 17A is a schematic plan view showing the screen printing apparatus 1C (hereinafter abbreviated as the "printing apparatus 1C") according to the fourth example.
  • the printing apparatus 1C according to the fourth example is disposed between an upstream-side device of a single system and a downstream-side device of a dual system, and is configured differently from the printing apparatus 1 of the first example with respect to the following points, but the remainder of the configuration is basically common with the printing apparatus 1 of the first example.
  • one substrate loading part En and two substrate unloading parts Ex1, Ex2 are respectively set in association with the arrangement of the loader L and the component mounting devices M1, M2.
  • the printing apparatus 1C is disposed between the one loader L and the two component mounting devices M1, M2 (first component mounting device M1, and second component mounting device M2).
  • the printing apparatus 1C loads the substrate W, which was sent out from the loader L, from the substrate loading part En into the apparatus, and unloads the printed substrate W from the first substrate unloading part Ex1 to the first component mounting device M1 or from the second substrate unloading part Ex2 to the second component mounting device M2.
  • the respective substrate unloading parts Ex1, Ex2 are set at positions across a predetermined interval in the Y axis direction.
  • the substrate loading part En is set at a position between the respective substrate unloading parts Ex1, Ex2 with respect to the Y axis direction.
  • reference numerals CL, CM1, CM2 designate respectively belt conveyer pairs to be mounted on the loader L and the component mounting devices M1, M2.
  • the printing apparatus 1C comprises a common print executing part 20 for performing printing on the substrate W on the respective substrate support tables 10A, 10B, and a common substrate recognition camera 50 for imaging the signs of the substrate W.
  • the first substrate support table 10A is configured to move between a receiving position where the substrate W loaded from the loader L in the substrate loading part En can be received, and a position (first sending position) where the printed substrate W can be unloaded to the component mounting device M1 in the first substrate unloading part Ex1.
  • the second substrate support table 10B is configured to move between the receiving position and a position (second sending position) where the printed substrate W can be unloaded to the component mounting device M2 in the second substrate unloading part Ex2.
  • the print executing part 20 and the substrate recognition camera 50 are provided at positions above the substrate support tables 10A, 10B in a state of being placed at the receiving position.
  • the first substrate support table 10A can move between the receiving position and the first sending position.
  • the second substrate support table 10B can move between the receiving position and the second sending position.
  • the receiving position is the same position as the print executing part, and this position is positioned within a common area in which the movable area of the first substrate support table 10A and the movable area of the second substrate support table 10B overlap with each other.
  • the first substrate support table 10A is positioned at the receiving position
  • the second substrate support table 10B is positioned at the first sending position which avoids the first substrate support table 10A within its movable area.
  • the first substrate support table 10A is placed at the second sending position which avoids the second substrate support table 10B within its movable area.
  • the first substrate support table 10A is placed at the receiving position, and the clamp unit 14 clamping the substrate W is placed at the print executing position so that the print executing part 20 can perform printing on the substrate W.
  • the subsequent substrate W sent out from the loader L is transferred from the loader L to the first substrate support table 10A in the substrate loading part En, and caused to stand by at the substrate standby position.
  • the first substrate support table 10A moves from the receiving position to the first sending position, as shown in Fig. 17B .
  • the clamping of the substrate W is released and the printed substrate W is unloaded from the first substrate unloading part Ex1 to the first component mounting device M1 by the conveyer pair 12 being driven.
  • the clamp unit 14 moves then to the substrate standby position and clamps the subsequent substrate W.
  • the first substrate support table 10A moves from the first sending position to the receiving position.
  • the clamp unit 14 moves from the substrate standby position to the print executing position so as to prepare for the printing of the substrate W.
  • the unloading of the print-processed substrate W to the second component mounting device M2 the movement of the clamp unit 14 to the substrate standby position, and the clamping of the subsequent substrate W are performed.
  • movement of the clamp unit 14 from the substrate standby position to the print executing position in the first substrate support table 10A, and the movement of the second substrate support table 10B to the receiving position are performed.
  • the printing of the substrate W, the reception of the subsequent substrate W, and the unloading operation of the substrate W from the first substrate unloading part Ex1 in the first substrate support table 10A, and the printing of the substrate W, the reception of the subsequent substrate W, and the unloading of the substrate W from the second substrate unloading part Ex2 in the second substrate support table 10B are performed with a given time difference.
  • the printing is alternately performed by the print executing part 20 on the substrates W loaded from the common substrate loading part En while the substrates W are received by the substrate support tables 10A, 10B, and the substrates W are then unloaded from the substrate unloading parts Ex1, Ex2 to the component mounting devices M1, M2.
  • printing of the substrate W can be efficiently performed since the printing process using the first substrate support table 10A (mainly loading of the substrate W to the standby position, substrate clamping, movement of the substrate W from the standby position to the printing position, printing, substrate unclamping, substrate unloading) and the printing process using the second substrate support table 10B (mainly loading of the substrate W to the standby position, substrate clamping, movement of the substrate W from the standby position to the printing position, printing, substrate unclamping, and substrate unloading) are performed in parallel by delaying the timing.
  • the first substrate support table 10A mainly loading of the substrate W to the standby position, substrate clamping, movement of the substrate W from the standby position to the printing position, printing, substrate unclamping, and substrate unloading
  • the printing apparatus can independently receive the substrate W from an upstream-side device of a single system or one loader L and perform printing on the substrate, and the printing apparatus can independently unload the printed substrate W to a downstream-side device of a dual system or to two component mounting devices M1, M2.
  • the manufacturing line can be downsized despite the printing apparatus 1C being disposed between the upstream-side device of a single system and the downstream-side device of a dual system.
  • the printing apparatus 1C of the fourth example is useful when printing a common pattern on the substrates W that are respectively sent out from one loader L1, and sending the printed substrates W to the respective component mounting devices M1, M2, so that printing can be performed efficiently with one print executing part 20.
  • the printing apparatus 1C is configured such that the clamp unit 14 is movably provided between the print executing position and the substrate standby position in the respective substrate support tables 10A, 10B.
  • the printing apparatus 1C is configured such that, while the preceding substrate W (printed substrate W) is being unloaded after the completion of printing, the clamp unit 14 moves to the substrate standby position and clamps the subsequent substrate W in standby. The substrate W is then placed at the print executing position while the substrate support tables 10A, 10B are reset to the receiving position.
  • printing by the print executing part 20 is enabled substantially simultaneously with the substrate support tables 10A, 10B being reset to the receiving position. Accordingly, there is also an advantage in that, after the preceding substrate W is unloaded, the printing of the subsequent substrate W can be performed as soon as practicable, so that the printing of the substrates W can be performed efficiently.
  • Fig. 18A is a schematic plan view showing the screen printing apparatus 1D (hereinafter abbreviated as the "printing apparatus 1D") according to the fifth example.
  • the printing apparatus 1D according to the fifth example is a modified example of the printing apparatus 1C (see Fig. 17 ) of the fourth example.
  • the printing apparatus 1D is configured differently from the printing apparatus 1C of the fourth example with respect to the following points.
  • a conveyer pair Cn for receiving the substrate W from the loader L is installed on the foundation 2, and the position where the conveyer pair Cn is installed corresponds to the substrate loading part En.
  • a conveyer pair Cx1 for unloading the substrate W to the first component mounting device M1 and a conveyer pair Cx2 for unloading the substrate W to the second component mounting device M2 are also installed, and the positions where the conveyer pairs Cx1, Cx2 are installed correspond to the substrate loading parts En1, En2. Accordingly, with the printing apparatus 1D, the positions of the substrate loading part En and the substrate unloading parts Ex1, Ex2 on the foundation 2 are fixed, and the loader L and the component mounting devices M1, M2 are disposed to be aligned with the foregoing positions.
  • the position of the substrate loading part En is not set in correspondence with the position of the loader L and the positions of the substrate unloading parts Ex1, Ex2 are not set in correspondence with the positions of the component mounting devices M1, M2 according to the print execution program and the like given from the host computer.
  • the interval of the respective conveyers is changed based on the conveyer width variable mechanism according to the size of the substrate W.
  • the respective substrate support tables 10A, 10B do not have a space (substrate standby position) for causing the subsequent substrate W to stand by.
  • the clamp unit 14 is likewise movable in the X axis direction, the movable range thereof is limited to a range in which the relative position between the mask 21 and the substrate W can be corrected during the overlapping of the mask.
  • the mask recognition camera 16 and the substrate recognition camera 50 are coupled with a moving mechanism with a motor or the like as the driving source.
  • the mask recognition camera 16 and the substrate recognition camera 50 can move across a position (imaging position) disposed between the mask 21 and the substrate W, and a position (withdrawal position) withdrawn outside from a position between the mask 21 and the substrate W.
  • the printing apparatus 1D is configured such that the mask recognition camera 16 and the substrate recognition camera 50 capture the respective signs of the mask 21 and the substrate W by being interposed therebetween after the clamping of the substrate W and before the overlapping of the mask 21 so as to recognize the relative position between the mask 21 and the substrate W, and the printing apparatus 1D obtains correction values ( ⁇ X, ⁇ Y, ⁇ R) during the overlapping of the mask based on the foregoing recognition results.
  • the mask 21 is provided fixedly on the foundation 2 side, and the clamp unit 14 is movably provided in the X axis direction, the Z axis direction and the R axis direction around the Z axis relative to the movable base of the substrate support tables 10A, 10B.
  • the electrical configuration of the printing apparatus 1A is basically the same as the first example (see Fig. 10 ) excluding the points that there is only one print executing part, the moving mechanism for moving the mask recognition camera 16 or the like and the moving mechanism for moving the clamp unit 14 in the X axis direction, the Z axis direction, and the R axis direction are controlled by the main control unit 81 via the drive control unit 83, and the other points.
  • the substrate W is transferred from the substrate loading part En to the first substrate support table 10A and the second substrate support table 10B, the substrate W is clamped by the clamp unit 14, the substrate W is thereafter overlapped with the mask 21 from the underside thereof by raising the clamp unit 14 in the Z axis direction, and then the substrate W is subjected to printing ( Figs. 18A, 18B ).
  • the substrate W is properly overlapped with the mask 21 as a result of position corrections being performed, respectively, to the clamp unit 14 with respect to the X axis direction and the R axis direction, and to the first substrate support table 10A with respect to the Y axis direction, based on the correction values ( ⁇ X, ⁇ Y, ⁇ R).
  • the first substrate support table 10A moves to the first sending position and the second substrate support table 10B moves to the second unloading position, and the printed substrate W is consequently unloaded from the first substrate unloading part Ex1 to the first component mounting device M1 and unloaded from the second substrate unloading part Ex2 to the first component mounting device M1 ( Fig. 18B, Fig. 18A ).
  • the printing apparatus 1D can independently receive the substrate W from one loader L and perform printing on the substrate, and unload the printed substrate W to two component mounting devices M1, M2.
  • the printing apparatus 1D is useful for downsizing the manufacturing line as with the printing apparatus 1C of the fourth example.
  • the substrate support tables 10A, 10B since the respective substrate support tables 10A, 10B do not have a space (substrate standby position) for standing by the substrate W, the substrate support tables 10A, 10B can be downsized in the X axis direction by that much.
  • the manufacturing line can be downsized in the substrate transfer direction (X axis direction).
  • Fig. 19A is a schematic plan view showing the screen printing apparatus 1E (hereinafter abbreviated as the "printing apparatus IE") according to the sixth example.
  • the printing apparatus 1E according to the sixth example is a modified example of the printing apparatus 1D (see Fig. 15 ) of the fifth example described above, and is configured differently from the printing apparatus 1D of the fifth example with respect to the following points.
  • the printing apparatus 1E is provided with two print executing parts 20A, 20B. These print executing parts 20A, 20B are disposed at positions above the first and second sending positions for unloading the substrates W on the respective substrate support tables 10A, 10B.
  • the substrate recognition camera 50 is disposed fixedly at the positions above the receiving positions for receiving the substrate W on the substrate support tables 10A, 10B.
  • the substrate recognition camera 50 is configured to capture, at the respective receiving positions, the signs of the substrate W on the substrate support tables 10A, 10B clamped by the clamp unit 14.
  • the mask recognition camera 16 is fixedly provided to the clamp unit 14.
  • the mask recognition camera 16 is configured to capture the signs on the mask 21 while the substrate support tables 10A, 10B are moving from the receiving position to the first or second sending position for performing the printing on the substrate W.
  • the substrate W is transferred, for example, from the substrate loading part En to the first substrate support table 10A in a state where the first substrate support table 10A is placed at the receiving position, and the substrate W is clamped by the clamp unit 14 and then the substrate W is subjected to substrate recognition ( Fig. 19A ). Subsequently, the first substrate support table 10A moves to the first sending position by being driven by the respective motors. The mask recognition is simultaneously performed.
  • the clamp unit 14 After movements of the clamp unit 14 with respect to the X axis direction and the R axis direction, and the movement of the movable base of the first substrate support table 10A with respect to the Y axis direction by respective correction amounts which are based on the foregoing recognition results, the clamp unit 14 is raised in the Z axis direction, and the substrate W is overlapped with the mask 21 and subjected to printing. After the printing, the substrate W is unloaded from the first substrate unloading part Ex to the first component mounting device M1 ( Fig. 19B ).
  • printing of the substrate W can be efficiently performed since the printing process (mainly substrate W loading, substrate clamping, printing, substrate unclamping, and substrate unloading) using the first substrate support table 10A and the printing process (mainly substrate W loading, substrate clamping, printing, substrate unclamping, and substrate unloading) using the second substrate support table 10B are performed in parallel by delaying the timing.
  • the printing process mainly substrate W loading, substrate clamping, printing, substrate unclamping, and substrate unloading
  • the printing apparatus 1E is useful when printing different patterns on the substrates W that are respectively sent out from one loader L1, and simultaneously sending the substrates W to the component mounting devices M1, M2.
  • Fig. 20A is a schematic plan view showing the screen printing apparatus IF (hereinafter abbreviated as the "printing apparatus IF") according to the seventh example.
  • the printing apparatus IF is disposed between an upstream-side device of a dual system and a downstream-side device of a dual system, and is configured differently from the printing apparatus 1B of the second example with respect to the following points, but the remainder of the configuration is basically common with the printing apparatus 1B of the second example.
  • the printing apparatus IF includes conveyer pairs Cn1, Cn2 corresponding to two substrate loading parts En1, En2 (first substrate loading part En1, second substrate loading part En2) provided at positions across a predetermined interval with respect to the Y axis direction on the foundation 2, and conveyer pairs Cx1, Cx2 corresponding to two substrate unloading parts Ex1, Ex2 (first substrate unloading part Ex1, second substrate unloading part Ex2) provided similarly at positions across a predetermined interval in the Y axis direction.
  • the interval between the first substrate unloading part Ex1 and the second substrate unloading part Ex2 is set to be narrower.
  • the first substrate support table 10A is movably supported on a rail 3.
  • the first substrate support table 10A moves between a second sending position where the printed substrate W can be unloaded from the second substrate unloading part Ex2, and a first withdrawal position Tes1 that is displaced more toward the front side with respect to the Y direction than a first receiving position where the substrate W loaded from the first substrate loading part En1 can be received.
  • the second substrate support table 10B is movably supported on the rail 3.
  • the second substrate support table 10B moves between a first sending position where the printed substrate W can be unloaded from the first substrate unloading part Ex1, and a second withdrawal position Tes2 that is displaced more toward the back side with respect to the Y direction than a second receiving position where the substrate W loaded from the second substrate loading part En2 can be received.
  • the area between the first sending position and the second sending position is thus defined as a common area in which the movable area of the first substrate support table 10A and the movable area of the second substrate support table 10B overlap with each other.
  • the substrate W transferred from the first substrate loading part En1 to the first substrate support table 10A of the first receiving position is clamped by the clamp unit 14. Based on mask recognition and substrate recognition, position corrections are performed to the mask 21 at the printing position (same position as the first receiving position) below the first print executing part 20A. The printing is thereafter performed. Moreover, substantially at the same timing, the substrate W transferred from the first substrate loading part En2 to the second substrate support table 10B of the second receiving position is clamped by the clamp unit 14. Based on mask recognition and substrate recognition, position corrections are performed to the mask 21 at the printing position (same position as the second receiving position) below the second print executing part 20B. The printing is thereafter performed ( Fig. 20A ).
  • the first substrate support table 10A moves to the second sending position,[[,]] and at the same time,[[,]] the second substrate support table 10B moves to a second withdrawal position Tes2 that is farther back than the second receiving position.
  • the clamping of the clamp unit 14 is released at the first substrate support table 10A, and the substrate W is unloaded from the second substrate unloading part Ex2 to the second component mounting device M2 ( Fig. 20B ).
  • the first substrate support table 10A passes through from the second sending position to the first sending position and moves to the front-side first withdrawal position Tes1, and the second substrate support table 10B moves from the second withdrawal position Tes2 to the first sending position.
  • the clamping of the clamp unit 14 is released at the second substrate support table 10B, and the printed substrate W is unloaded from the first substrate unloading part Ex1 to the first component mounting device M1 ( Fig. 20C ).
  • the second substrate support table 10B is placed at the second withdrawal position Tes2 that avoids the first substrate support table 10A within its movable area.
  • the first substrate support table 10A is placed at the first withdrawal position Tes1 that avoids the second substrate support table 10B within its movable area.
  • printing of the substrate W can be efficiently performed since the printing process(substrate loading, substrate clamping, printing, substrate unclamping, substrate unloading) using the first substrate support table 10A and the printing process(substrate loading, substrate clamping, printing, substrate unclamping, substrate unloading) using the second substrate support table 10B are performed in parallel by delaying the timing of the mutual substrate unloading processes.
  • a common pattern or different patterns can be efficiently printed on the substrates W that are respectively sent out from the respective loaders L1, L2 with a simple configuration of comprising two print executing parts 20A, 20B.
  • the unloading destination of the print-processed substrate W can be easily switched between the component mounting devices M2, M1.
  • the cross transfer operation is a printing operation where, on one hand, the substrate W is transferred from the first loader L1 to the first substrate support table 10A, and subsequently printing is performed on the substrate W, and the printed substrate W is unloaded to the second component mounting device M2, and on the other hand, the substrate W is transferred from the second loader L2 to the second substrate support table 10B, and subsequently printing is performed on the substrate W, and the printed substrate W is unloaded to the second component mounting device M2.
  • the forward transfer operation is a printing operation where, on one hand, the substrate W is transferred from the first loader L1 to the first substrate support table 10A, and subsequently printing is performed on the substrate W, and the printed substrate W is unloaded to the first component mounting device M1, and on the other hand, the substrate W is transferred from the second loader L2 to the second substrate support table 10B, and subsequently printing is performed on the substrate W, and the printed substrate W is unloaded to the second component mounting device M2.
  • the conveyer width variable mechanism of the respective substrate support tables 10A, 10B in the printing apparatus IF is also configured to change the interval of the conveyer pair 12 with the device's inner side as a reference, as with the printing apparatus 1 of the first example, there is an advantage in the foregoing case that this configuration will contribute to the improvement in the throughput and the downsizing of the printing apparatus 1, with respect to the component mounting devices M1, M2 to be disposed downstream. This point is now explained.
  • Figs. 21 to 24 respectively show a moving distance, or the like, of the first substrate support table 10A between the receiving position and sending position, classified in accordance with a reference of each conveyer width variable mechanism on the component mounting device M side and the printing apparatus 1 side (substrate support tables 10A, 10B), wherein Figs.21 to 22 respectively show the moving distance and the like of the first substrate support table 10A in a case of the forward transfer operation, and Figs. 23 and 24 respectively show the required moving distance and the like of the first substrate support table 10A in a case of the cross transfer operation.
  • Figs. 21 and 23 are schematic diagrams of a case where the conveyer width variable mechanism of the printing apparatus 1 (substrate support tables 10A, 10B) uses the device's inner side as a reference, wherein Figs. 21A and 23A show a case where the conveyer width variable mechanism on the side of the component mounting devices M1, M2 is the inner reference, in which the conveyer on the device's back side is a fixed conveyer regarding the first component mounting device M1 and the conveyer on the device's front side is a fixed conveyer regarding the second component mounting device M2. Figs.
  • 21B and 23B show a case where the conveyer width variable mechanism of the component mounting devices M1, M2 is an outer reference, in which the conveyer on the device's front side is a fixed conveyer regarding the first component mounting device M1 and the conveyer on the device's back side is a fixed conveyer regarding the second component mounting device M2.
  • Figs. 22 and 24 are schematic diagrams of a case where the conveyer width variable mechanism of the printing apparatus 1 (substrate support tables 10A, 10B) uses the device's outer side as a reference, or a schematic diagram showing a case where the conveyer positioned on the device's front side is a fixed conveyer regarding the first substrate support table 10A, and the conveyer positioned on the device's back side is a fixed conveyer regarding the second substrate support table 10B.
  • Figs. 22A and 24A show a case where the conveyer width variable mechanism on the side of the component mounting devices M1, M2 is an inner reference.
  • Figs. 22B and 24B show a case where the conveyer width variable mechanism on the side of the component mounting devices M1, M2 is an outer reference.
  • Figs. 21 to 24 the fixed conveyers are illustrated with hatching.
  • the conveyer pair 12 is illustrated with a solid line in a state when the interval of the conveyer pair 12 is a minimum.
  • the first sending position of the first substrate support table 10A or the position where the substrate W can be unloaded to the component mounting device M is constant regardless of the interval of the conveyer pair 12 (that is, size of the substrate W). Accordingly, regardless of the size of the substrate W, the moving distance D of the first substrate support table 10A between the first receiving position and the first sending position is always constant.
  • the first sending position of the first substrate support table 10A is equivalent to the example of Fig. 21A .
  • the first sending position of the first substrate support table 10A becomes closer to the first receiving position side. Accordingly, the moving distance D of the first substrate support table 10A is equivalent to the example of Fig. 21A when the substrate W is of a maximum size, and decreases as the size of the substrate W decreases.
  • the first sending position of the first substrate support table 10A is equivalent to the examples of Figs. 21A and 21B .
  • the first sending position of the first substrate support table 10A becomes farther from the first receiving position. Accordingly, the moving distance D of the first substrate support table 10A is equivalent to the examples of Figs. 21A and 21B when the substrate W is of a maximum size, and increases as the size of the substrate W decreases.
  • the first sending position of the first substrate support table 10A is constant regardless of the interval of the conveyer pair 12, and the position thereof is equivalent to that in the example of Fig. 21A . Accordingly, the moving distance D of the first substrate support table 10A is constant regardless of the size of the substrate W, and equivalent to the example of Fig. 21A .
  • the moving distance D of the substrate support tables 10A, 10B relating to the forward transfer operation can be made to be relatively short (in comparison to a case in which the conveyer width variable mechanism of the printing apparatus 1F uses the device's outer side as a reference), regardless of whether the conveyer width variable mechanism on the side of the component mounting devices M1, M2 uses the front or back of the device as a reference.
  • the second sending position of the first substrate support table 10A or the position where the substrate W can be unloaded from the first substrate support table 10A to the second component mounting device M2 will be farthest from the first receiving position.
  • the second sending position of the first substrate support table 10A will be closer to the first receiving position side as the interval of the conveyer pair 12 decreases. Accordingly, the moving distance D of the first substrate support table 10A will be the greatest when the substrate W is of a maximum size, and becomes smaller as the size of the substrate W decreases.
  • the second sending position of the first substrate support table 10A is constant regardless of the interval of the conveyer pair 12, and the position thereof is equivalent to the second sending position of the first substrate support table 10A when the interval of the conveyer pair 12 is maximum in the example of Fig. 23A .
  • the moving distance D of the first substrate support table 10A is constant regardless of the size of the substrate W, and equivalent to the moving distance D when the substrate W is of a maximum size in the example of Fig. 23A .
  • the second sending position of the first substrate support table 10A is equivalent to the examples of Figs. 23B and 24A .
  • the second sending position of the first substrate support table 10A becomes farther from the first receiving position.
  • the moving distance D of the first substrate support table 10A will be equivalent to the examples of Fig. 23B and Fig. 24A when the substrate W is of a maximum size, and becomes greater as the size of the substrate W decreases.
  • the size L of the printing apparatus IF in the front-back direction needs to be increased in comparison to the examples of Figs. 23A, 23B and Fig. 24A by that much.
  • the moving distance D of the substrate support tables 10A, 10B relating to the forward transfer operation can be made to be relatively short (in comparison to a case in which the conveyer width variable mechanism of the printing apparatus 1F uses the device's outer side as a reference), and the enlargement of the printing apparatus IF in the Y axis direction can also be prevented, regardless of whether the conveyer width variable mechanism on the side of the component mounting devices M1, M2 uses the front or back of the device as a reference.
  • the conveyer width variable mechanism of the substrate support tables 10A, 10B uses the device's inner side as a reference, in both the forward transfer operation and the cross transfer operation, the moving distance D of the substrate support tables 10A, 10B can be made to be relatively short, and the enlargement of the printing apparatus 1 in the Y axis direction can also be prevented. Consequently, according to the printing apparatus 1 in which the conveyer width variable mechanism of the printing apparatus IF (substrate support tables 10A, 10B) uses the device's inner side as a reference, it is possible to contribute to the improvement in the throughput and the downsizing of the printing apparatus 1.
  • Fig. 25 to Fig. 27 are schematic plan views showing the screen printing apparatus 1G (hereinafter abbreviated as the "printing apparatus 1G") according to the first embodiment, wherein Fig. 25 is a schematic plan view and Figs. 26 and 27 are cross sections showing the printing apparatus 1G, respectively.
  • the screen printing apparatus 1G is disposed between two loaders L1, L2 and a component mounting device M.
  • the screen printing apparatus 1G performs printing on the substrates W that are respectively sent out from the respective loaders L1, L2 on the upstream side and sends the printed substrates W to the component mounting device M on the downstream side.
  • the screen printing apparatus 1G resembles to the printing apparatus 1A of the second example.
  • the printing apparatus 1G as described later, performs printing process to the substrates W by using a single mask comprising two printing patterns.
  • members that are the equivalent to those of the printing apparatus 1A of the second example are given the common reference numeral and the explanation thereof is omitted, and only the differences are mainly explained in detail.
  • the respective substrate loading parts En1, En2 are juxtaposed in the Y axis direction, and the substrate unloading part Ex is provided at a position that is substantially intermediate of both substrate loading parts En1, En2 in the Y axis direction.
  • the printing apparatus 1G comprises, on its foundation 2, one substrate support device 10 for supporting the substrate W, and one print executing part 20 for performing printing on the substrate W supported by the substrate support device 10.
  • the substrate support device 10 corresponds to the substrate support means of the present invention.
  • the substrate support device 10 receives the substrate W loaded from the substrate loading parts En1, En2 and supports the substrate W so as to enable printing thereon by the print executing part 20, and sends the printed substrate W from the substrate unloading part Ex.
  • the substrate support device 10 is movably provided in the Y axis direction along a fixed rail 3 installed on the foundation 2.
  • the substrate support device 10 is configured to be driven by a screw feeding mechanism or the like having a motor as its driving source. Based on the motor control of the control machine described later, the substrate support device 10 moves among a first receiving position where the substrate W loaded from the first substrate loading part En1 can be received, a sending position where the substrate W can be unloaded from the substrate unloading part Ex, and a second receiving position where the substrate W loaded from the second substrate loading part En2 can be received.
  • the substrate support device 10 includes a conveyer pair 12, a moving mechanism for moving the conveyer pair 12 in the X axis direction, the Y axis direction, the Z axis direction and the R axis direction (around the Z axis), a clamp unit 14, and the like.
  • the clamp unit 14 is supported by and fixed on the elevating table 108 described later.
  • the moving mechanism of the conveyer pair 12 includes an X axis table 106 provided on the base 105 of the substrate support device 10 and the X axis table 106 being movably supported in the X axis direction, a rotating table 107 provided on the X axis table 106 and the rotating table 107 being movably supported in the R axis direction (rotatably supported around the Z axis), an elevating table 108 provided on the rotating table 107 and the elevating table 108 being movably (elevatably) supported in the Z axis direction, and a drive mechanism for individually driving the respective tables 106 to 108 having a motor as the driving source.
  • the moving mechanism moves the conveyer pair 12 in each of the foregoing directions based on the motor control of the control machine.
  • the print executing part 20 is provided above the substrate support device 10 configured as described above.
  • the print executing part 20 is supported by an apparatus frame, not shown, installed on the foundation 2.
  • the print executing part 20 includes, as its constituent elements, a mask fixing member 22, two squeegee units 40A, 40B (first squeegee unit 40A, second squeegee unit 40B), an imaging unit 60, and the like.
  • the mask fixing member 22 of the printing apparatus 1G fixedly holds the mask 21 in a state of being stretched horizontally at a predetermined height position.
  • the mask 21 used in the printing apparatus 1G is an element which is a single mask on which two mutually different types of printing patterns 211, 212 (first pattern 211, second pattern 212) are formed.
  • the mask fixing member 22 is held so that the printing patterns 211, 212 are juxtaposed in the Y axis direction. Specifically, the mask fixing member 22 is held so that the printing patterns 211, 212 are arranged equally along the Y axis direction relative to the substrate unloading part Ex.
  • the substrate loading parts En1, En2 are disposed so that the first substrate loading part En1 is aligned substantially in the X axis direction relative to the first pattern 211, and the second substrate loading part En2 is aligned substantially in the X axis direction relative to the second pattern 212.
  • the first squeegee unit 40A is disposed above the first printing pattern 211 of the mask 21 retained by the mask fixing member 22, and the second squeegee unit 40B is disposed above the second printing pattern 211, respectively. That is, the first squeegee unit 40A is used when printing is to be performed using the first printing pattern 211 of the mask 21, and the second squeegee unit 40B is used when printing is to be performed using the second pattern 212.
  • the squeegee units 40A, 40B are respectively supported on an apparatus frame, not shown, so that they are movable in the X axis direction indicated with a solid line and a virtual line of Fig. 27 , and can be individually driven by a driving means such as a screw feeding mechanism having a motor as its driving source.
  • the squeegee units 40A, 40B respectively include a single squeegee 42 that is elongated in the Y axis direction, a squeegee angle variable mechanism not shown for changing the inclination direction and the inclination angle (see Fig. 27 ) of the squeegee 42 relative to the mask 21, a squeegee elevating mechanism not shown for elevating the squeegee 42 between the printing work height position where the squeegee 42 slidably contacts the mask 21 and the withdrawal position that is higher than the foregoing position, and the like.
  • the squeegee 42 of the first squeegee unit 40A is set at a predetermined angle relative to the surface (horizontal plane) of the substrate W and placed at the printing working position, and the first squeegee unit 40A is driven in the X axis direction in the foregoing state.
  • the squeegee 42 of the second squeegee unit 40B is set at a predetermined angle relative to the surface of the substrate W and placed at the printing working position, and the second squeegee unit 40B is driven in the X axis direction in the foregoing state.
  • the imaging unit 60 is used for image-recognizing the relative positional relationship of the mask 21 and the substrate W.
  • the imaging unit 60 comprises a mask recognition camera 60a for imaging, from the lower side, a plurality of signs such as marks and symbols indicated on the lower face of the mask 21, and a mask recognition camera 60b for imaging, from the upper side, a plurality of signs such as marks and symbols of the substrate W supported by the substrate support device 10.
  • the imaging unit 60 is movably provided , two-dimensionally, in a horizontal direction by being coupled to an X-Y robot not shown, and captures each of the signs by being disposed between the mask 21 before printing (before overlapping the mask) and the substrate W in accordance with the control of the X-Y robot by the control machine described later.
  • the printing apparatus 1G comprises a control machine that is equivalent to the control machine 8.
  • the control machine can govern the control of the series of printing process operations of the substrate support device 10, the squeegee units 40A, 40B and the imaging unit 60. That is, the control machine can govern the series of operations including the reception of the substrate W loaded from the substrate loading parts En1, En2, the printing of the substrate W, and the unloading of the substrate W from the substrate unloading part Ex.
  • Fig. 25 schematically shows a state of a specific timing of the printing operation that is being performed continuously in the printing apparatus 1G. Specifically Fig. 25 shows a state immediately after the completion of printing of the substrate W using the second pattern 212 of the two printing patterns 211, 212 of the mask 21.
  • the substrate support device 10 moves to the sending position or a position where the conveyer pair 12 aligns with the substrate unloading part Ex.
  • the printed substrate W is sent from the substrate support device 10 and unloaded from the substrate unloading part Ex to the component mounting device M by the drive of the conveyer pair 12, the conveyer pair on the foundation 2, and the conveyer CM ( Fig. 28A ).
  • the substrate support device 10 moves the first or second receiving position in order to receive the subsequent substrate W. That is, the substrate support device 10 moves the position where the conveyer pair 12 aligns with the first substrate loading part En1 or the second substrate loading part En2. Consequently, the substrate W loaded from the first substrate loading part En1 or the second substrate loading part En2 can be received by the conveyer pair 12 of the substrate support device 10. For example, as shown in Fig. 28B , the substrate W loaded from the first substrate loading part En1 will be received by the conveyer pair 12, and clamped at a predetermined position.
  • the substrate W When the clamping of the substrate W is completed, the substrate W is placed, as shown in Fig. 28C , at a position below the printing pattern to be printed among the two printing patterns 211, 212 of the mask 21.
  • the substrate W can be placed at the lower position of either of the printing patterns 211, 212 of the mark 21 by moving the substrate support device 10 in the Y axis direction, the substrate W is placed at the lower position of the first pattern 211, in the illustrated example.
  • the imaging unit 60 moves from a predetermined withdrawal position (position indicated in Fig. 27 ) to a space between the substrate W and the mask 21.
  • the imaging unit 60 captures the respective signs of the substrate W and the mask 21, and thereafter moves to the withdrawal position. Consequently, the respective positions of the substrate W and the mask 21 are subjected to capture recognition. Based on the recognition results, the position gap between the mask 21 and the substrate W is obtained.
  • the correction values ( ⁇ X, ⁇ Y, ⁇ R) of the X axis, Y axis and R axis directions according to the obtained position gap are also obtained.
  • the foregoing recognition processing and calculation of correction values are performed by the control machine based on the images captured by the respective cameras 60a, 60b.
  • the substrate W is overlapped with the mask 21.
  • the mask 21 is appropriately fit atop the substrate W as a result of the substrate support device 10 being driven in the Y axis direction and the conveyer 12 being driven in the X axis and R axis directions with the moving mechanism based on the correction values ( ⁇ X, ⁇ Y, ⁇ R).
  • one of the two squeegee units 40A, 40B corresponding to the printing patterns 211, 212 to be printed is activated, and printing is thereby performed on the substrate W.
  • the entire squeegee unit 40 including the squeegee 42 moves in the X axis direction so as to perform the printing on the substrate W.
  • the conveyer pair 12 When the printing is completed, the conveyer pair 12 is reset to a predetermined home position. That is, as a result of the movement of the conveyer pair 12 in the respective directions of the X axis, Y axis and R axis, caused by the drive of the moving mechanism of the conveyer pair 12, the substrate W clamped by the clamp unit 14 is detached from the mask 21, the clamping of the clamp unit 14 is released, the substrate W is mounted on the conveyer pair 12 due to the lowering of the backup mechanism, and the conveyer pair 12 is placed at a position where it enables to transfer the substrate W among each of the conveyer pairs CL1, CL2 and CM.
  • the substrate support device 10 moves to the sending position. Based on the drive of the conveyer pair 12, the printed substrate W is sent from the substrate support device 10 and unloaded from the substrate unloading part Ex to the component mounting device M. Subsequently, the substrate W loaded from the first substrate loading part En1 or the second substrate loading part En2 is received by the substrate support device 10, the substrate W is subjected to printing by using one of the two printing patterns 211, 212 of the mask 21, and the substrate W is unloaded from the substrate unloading part Ex to the component mounting device M.
  • the printing apparatus 1G it is possible not only to perform printing using one mask 21 including two printing patterns 211, 212, but also to independently receive the substrate W from the dual system loaders L1, L2, to perform printing on the substrate, and to unload the printed substrate W to the single system component mounting device M. Accordingly, conventional incidental equipment (switching device) is no longer required and it is possible to downsize the manufacturing line despite the printing apparatus 1G is disposed between an upstream-side device of a dual system (loaders L1, L2) and a downstream-side device of a single system (component mounting device M).
  • the printing patterns 211, 212 may also be the same type of pattern (hereinafter the same in the second and third embodiments and eighth to tenth examples).
  • Fig. 29 is a schematic plan view showing the screen printing apparatus 1H (hereinafter abbreviated as the "printing apparatus 1H") according to the second embodiment.
  • the printing apparatus 1H according to the second embodiment is a modified example of the printing apparatus 1G of the first embodiment, and also resembles to the printing apparatus 1D of the fifth example.
  • the printing apparatus 1H is configured differently from the printing apparatus 1G of the first embodiment with respect to the following points.
  • the printing apparatus 1H is configured so that it can load the substrate W, which is sent out from one loader L, from the substrate loading part En into the apparatus, and the printing apparatus 1H can selectively unload the printed substrate W from the first substrate unloading part Ex1 to the first component mounting device M1 or the printing apparatus 1H can unload the printed substrate W from the printed second substrate unloading part Ex2 to the second component mounting device M2.
  • the substrate support device 10 is movably provided in the Y axis direction from the receiving position where the substrate W loaded from the substrate loading part En can be received, the first sending position where the printed substrate W can be unloaded from the first substrate unloading part Ex1, and the second sending position where the printed substrate W can be unloaded from the second substrate unloading part Ex2.
  • the printing apparatus 1H thus differs from the configuration of the printing apparatus 1G of the first example with respect to the foregoing points.
  • the substrate support device 10 While the timing chart is omitted, with the printing apparatus 1H, by the substrate support device 10 initially being placed at the receiving position, the substrate W loaded from the substrate loading part En is received by the substrate support device 10 (conveyer pair 12). Subsequently, after the substrate W is clamped, the substrate support device 10 is placed so as to correspond to the pattern to be printed on the substrate of either the first printing pattern 211 or the second printing pattern 212 of the mask 21, and the mask 21 is fit atop the substrate W in the foregoing state, and printing is thereby performed.
  • the substrate W is unloaded from the first substrate unloading part Ex1 to the first component mounting device M1, or unloaded from the second substrate unloading part Ex2 to the component mounting device M2.
  • the printing apparatus 1H of the second embodiment described above it is possible not only to perform printing using the mask 21 including two printing patterns 211, 212, but also to independently receive the substrates W from the single system loader L, to perform printing on the substrate, and to unload the substrates W to the component mounting device of a dual systems M1, M2.
  • conventional incidental equipment sorting device
  • sorting device is no longer required and it is possible to downsize the manufacturing line despite the printing apparatus 1H being disposed between an upstream-side device of a single system (loader L1) and a downstream-side device of a dual system (component mounting devices M1, M2).
  • Fig. 30 is a schematic plan view showing the screen printing apparatus 1I (hereinafter abbreviated as the "printing apparatus II") according to the third embodiment.
  • the printing apparatus 1I according to the third embodiment is a modified example of the printing apparatus 1G of the first embodiment, and also resembles to the printing apparatus IF of the seventh example.
  • the printing apparatus 1I is configured differently from the printing apparatus 1G of the first embodiment with respect to the following points.
  • the printing apparatus 1I is configured so that it can load the substrate W, which is sent out from the first loader L1, from the first substrate loading part En1 into the apparatus and load the substrate W, which is sent out from the second loader L2, from the second substrate loading part En2 into the apparatus, respectively.
  • the printing apparatus 1I is also configured so that it selectively unloads the printed substrate W from the first substrate unloading part Ex1 to the first component mounting device M1 or unload the printed substrate W from the printed second substrate unloading part Ex2 to the second component mounting device M2.
  • the substrate support device 10 is movably provided between the first sending position where the printed substrate W can be unloaded from the first substrate unloading part Ex1 and the second sending position where the printed substrate W can be unloaded from the second substrate unloading part Ex2.
  • the printing apparatus 1I differs from the configuration of the printing apparatus 1G of the first example with respect to the foregoing points.
  • the respective substrate unloading parts Ex1, Ex2 are provided at a position between both substrate loading parts En1, En2 with respect to the Y axis direction.
  • the substrate unloading parts Ex1, Ex2 are provided at an array pitch Pt2 which is different from an array pitch Pt1 of the substrate loading parts En1, En2 (Pt2 ⁇ Pt1).
  • the substrate support device 10 by the substrate support device 10 initially being disposed at the first receiving position or the second receiving position, the substrate W loaded from the substrate loading part En1 or En2 is received by the substrate support device 10 (conveyer pair 12). Subsequently, after the substrate W is clamped, the substrate support device 10 is placed so as to correspond to the pattern to be printed on the substrate W of either the first printing pattern 211 or the second printing pattern 212 of the mask 21, and the mask 21 is fit atop the substrate W in the foregoing state, and printing is thereby performed.
  • the substrate W is unloaded from the first substrate unloading part Ex1 to the first component mounting device M1, or unloaded from the second substrate unloading part Ex2 to the component mounting device M2.
  • the printing apparatus 1I of the third embodiment described above it is possible not only to perform printing using the mask 21 including two printing patterns 211, 212, but also to independently receive the substrates W from the dual system loaders L1, L2, to perform printing on the substrate, and to unload the substrates W to the conveyer pairs CM1, CM2 of the component mounting devices M1, M2 installed at a pitch (Pt2) that is different than a pitch (Pt1) of the conveyer pairs CL1, CL2 of the loaders L1, L2.
  • the printing apparatus 1I conventional incidental equipment (relay device) is no longer required and it is possible to downsize the manufacturing line despite the printing apparatus 1I is disposed between an upstream-side device of a dual system (loaders L1, L2) and a downstream-side device of a dual system (component mounting devices M1, M2), and the line pitch of the respective substrate transfer lines of the upstream-side device and the line pitch of the respective substrate transfer lines of the downstream apparatus are different.
  • Fig. 31 is a schematic plan view showing the screen printing apparatus 1J (hereinafter abbreviated as the "printing apparatus 1J") according to the eighth example.
  • the printing apparatus 1J according to the eighth example is a modified example of the printing apparatus 1G of the first embodiment, and is configured differently from the printing apparatus 1G of the first embodiment with respect to the following points.
  • the printing apparatus 1J includes two substrate support devices 10A, 10B (first substrate support device 10A, second substrate support device 10B) as a substrate support device.
  • the substrate support devices 10A, 10B are configured the same and supported on a common fixed rail 3 installed on the foundation 2.
  • the substrate support devices 10A, 10B can be individually driven in the Y axis direction based on a screw feeding mechanism or the like with a motor as the driving source.
  • the first substrate support device 10A moves between a receiving position (first receiving position) where the substrate W loaded from the first substrate loading part En1 can be received, and the sending position.
  • the second substrate support device 10B moves between a receiving position (second receiving position) where the substrate W loaded from the second substrate loading part En2 can be received and the sending position.
  • only the printing of the first pattern 221 of the two printing patterns 211, 212 of the mask 21 can be performed on the substrate W supported by the first substrate support device 10A, and only the printing of the second pattern 212 can be performed on the substrate W supported by the second substrate support device 10B.
  • both substrate loading parts En1, En2 in the printing apparatus 1J are disposed at positions outside of the mask 21 with respect to the Y axis, as shown in the Figures, for example.
  • the first substrate support device 10A is placed at a lower position of the mask 21, and the substrate W is overlapped with the mask 21 and the substrate is subjected to printing in a state where the substrate W supported by the first substrate support device 10A is positioned relative to the first pattern 211.
  • the substrate W on the conveyer pair CL2 is transferred from the second substrate loading part En2 to the second substrate support device 10B of the first receiving position, and then clamped.
  • the first substrate support device 10A is placed at the sending position and the printed substrate W is sent from the substrate support device 10 and unloaded from the substrate unloading part Ex to the component mounting device M, as shown in Fig. 32A .
  • the first substrate support device 10A When the unloading of the substrate W is completed, the first substrate support device 10A is placed at the first receiving position, and the substrate W loaded from the first substrate loading part En1 is received by the conveyer pair 12 of the first substrate support device 10A, and then clamped, as shown in Fig. 32B . Meanwhile, the second substrate support device 10B is placed at a lower position of the mask 21, and the substrate W is overlapped with the mask 21 and is subjected to printing in a state where the substrate W supported by the second substrate support device 10B is positioned relative to the second pattern 212.
  • the first substrate support device 10A performs sequentially the processes of moving among the first receiving position, the lower position of the mask 21 (first pattern 211), and the sending position, printing of the substrate W supported by the first substrate support device 10A, unloading the substrate W, and receiving the subsequent substrate W, in this order.
  • the second substrate support device 10B sequentially performs the processes of moving among the second receiving position, the lower position of the mask 21 (second pattern 212), and the sending position, printing of the substrate W supported by the second substrate support device 10B ( Fig. 32B ), unloading of the substrate W, and receiving the subsequent substrate W ( Fig. 31 , Fig. 32A ), in this order.
  • the printing apparatus 1J can also independently receive the substrate W from an upstream-side device of a dual system (loaders L1, L2), perform printing on the substrate, and unload the substrate W to a downstream-side device of a single system (component mounting device M).
  • loaders L1, L2 perform printing on the substrate
  • unload the substrate W to a downstream-side device of a single system (component mounting device M).
  • this printing apparatus 1J since the substrates W are alternately received by the two substrate support devices 10A, 10B and the substrates W are simultaneously subjected to printing and unloaded, it is possible to start printing of the subsequent substrate W in a shorter period of time after the preceding printed substrate W is unloaded, in comparison to the printing apparatus 1G of the first embodiment.
  • the printing apparatus 1J of the eighth example in addition to the same operation and effect of the first embodiment, that it is possible to downsize the manufacturing line despite the printing apparatus 1 being disposed between an upstream-side device of a dual system and a downstream-side device of a single system of the printing apparatus 1G, the operation and effect of being able to improve the throughput can also be enjoyed.
  • the imaging unit 60 is common in both substrate support devices 10A, 10B.
  • the imaging unit 60 captures the respective signs by being disposed between the substrate W and the mask 21 (first pattern 211 or second pattern 212).
  • the other substrate support device 10B (or 10A) is moved at the receiving position. Therefore, the other substrate support device 10B (or 10A) will not interfere with the sign capturing operation by the imaging unit 60.
  • Fig. 33 is a schematic plan view showing the screen printing apparatus 1K (hereinafter abbreviated as the "printing apparatus 1K") according to the ninth example.
  • the printing apparatus 1K according to the ninth example is a modified example of the printing apparatus 1J of the eighth example, and is configured differently from the printing apparatus 1J of the eighth example with respect to the following points.
  • the printing apparatus 1K includes one substrate loading part En and two substrate unloading parts Ex1, Ex2 (first substrate unloading part Ex1, second substrate unloading part Ex2).
  • the printing apparatus 1K is configured to load the substrate W, which is sent out from one loader L, from the substrate loading part En into the apparatus, and unloading the printed substrate W from the first substrate unloading part Ex1 to the first component mounting device M1, and from the second substrate unloading part Ex2 to the second component mounting device M2, respectively.
  • the substrate loading part En is provided to be aligned in one row in the X axis direction relative to the first substrate unloading part Ex1. In other words, the substrate loading part En is provided at the same position as the first substrate unloading part Ex1 with respect to the Y axis direction.
  • first substrate support device 10A is movably provided between a working position (position indicated in the Figure; corresponds to the receiving position and the first sending position of the present invention) where the substrate W loaded from the substrate loading part En can be received and where the printed substrate W can be unloaded from the first substrate unloading part Ex1, and a standby position that is positioned more toward the device's front side (downward in the Figure) than the foregoing working position.
  • the second substrate support device 10B is movably provided between a receiving position (corresponds to the receiving position of the present invention) where the substrate W loaded from the substrate loading part En can be received, and a sending position (corresponds to the second sending position of the present invention) where the printed substrate W can be sent to the second substrate unloading part Ex2. While the working position in the first substrate support device 10A and the receiving position in the second substrate support device 10B are the same position, these terms are distinguished in words in the explanation of this embodiment.
  • the mask 21 is retained so that the first pattern 211 of the two printing patterns 211, 212 is positioned at the working position (receiving position). Moreover, in order to perform the printing simultaneously to the substrates W in a state where these substrates W are positioned to the respective printing patterns 211, 212, an interval of the respective printing patterns 211, 212 with respect to the Y axis direction is set in relation to the configuration of the respective substrate support devices 10A, 10B.
  • the printing of the substrate W and the unloading of the printed substrate W are performed substantially simultaneously by the respective substrate support devices 10A, 10B. That is, with the printing apparatus 1K, as shown in the Figure, the substrate W loaded from the substrate loading part En is received by the first substrate support device 10A in a state where the first substrate support device 10A is placed at the working position (receiving position and first sending position). At this timing, the preceding printed substrate W is sent from the first substrate support device 10A, and unloaded from the first substrate unloading part Ex1 to the first component mounting device M1. Moreover, at almost the same time as above, the preceding printed substrate W is sent from the second substrate support device 10B and unloaded from the second substrate unloading part Ex2 to the second component mounting device M2.
  • the first substrate support device 10A When the reception of the substrate W by the first substrate support device 10A is completed and the sending of the preceding substrate W is completed, the first substrate support device 10A is placed at the standby position and the second substrate support device 10B is placed at the receiving position, as shown in Fig. 34A . In the foregoing state, the substrate W is received by the second substrate support device 10B.
  • the second substrate support device 10B When the reception of the substrate W by the second substrate support device 10B is completed, the second substrate support device 10B is placed at a lower position of the mask 21 (second pattern 212).
  • the first substrate support device 10A is placed at a lower position of the mask 21 (first pattern 211).
  • the substrate W of the first substrate support device 10A is thus positioned relative to the first pattern 211 and the substrate W of the second substrate support device 10B is positioned relative to the second pattern 212, respectively.
  • the imaging unit 60 performs capturing of the respective signs. Position corrections of the respective substrates are performed based on the calculated correction amounts. After the above operations, the respective substrates W are overlapped with the mask 21 and printings of both substrates W are performed substantially at the same time.
  • Capturing of the respective signs by the imaging unit 60 is simultaneously performed for the respective substrates W. That is, the imaging unit 60 continuously captures the signs of the respective substrates W and the signs of the mask 21 (printing patterns 211, 212) by continuously moving between the substrate W of the first substrate support device 10A and the mask 21 (first pattern 211), and between the substrate W of the second substrate support device 10B and the mask 21 (second pattern 212).
  • the first substrate support device 10A is placed at the working position and the printed substrate W is sent to the first substrate unloading part Ex1 and the subsequent substrate W is simultaneously transferred from the substrate unloading part Ex to the first substrate support device 10A.
  • the second substrate support device 10B is placed at the sending position so that the printed substrate W is sent to the second substrate unloading part Ex2 (see Fig. 33 ).
  • the printing of the substrate W and the unloading of the printed substrate W are performed substantially in parallel regarding the respective substrate support devices 10A, 10B.
  • the printing apparatus 1K can independently receive the substrate W from the upstream-side device of a single system (loader L), and the printing apparatus 1K can perform printing thereof and unload the printed substrate W to the downstream-side device of a dual system (component mounting devices M1, M2), it is possible to yield the same operation and effect as the printing apparatus 1H (see Fig. 29 ) of the second embodiment of being able to downsize the manufacturing line despite the printing apparatus 1 is disposed between the upstream-side device of a dual system and the downstream-side device of a single system.
  • the printing apparatus 1K is configured, as described above, such that the substrate W is received by the two substrate support devices 10A, 10B, simultaneously subject to printing and then unloaded, as well as configured such that the printing of the substrate W and the unloading of the printed substrate W are performed substantially in parallel regarding the respective substrate support devices 10A, 10B, there is an advantage in that the throughput of the substrate W can be improved in comparison to the printing apparatus 1H of the second embodiment which transfers one substrate W at a time into the apparatus and then prints and unloads the substrate W.
  • Fig. 35 is a schematic plan view showing the screen printing apparatus 1L (hereinafter abbreviated as the "printing apparatus 1L") according to the tenth example.
  • the printing apparatus 1L according to the tenth example is a modified example of the printing apparatus 1J of the eighth example, and is configured differently from the printing apparatus 1J of the eighth example with respect to the following points.
  • the printing apparatus 1L includes two substrate unloading parts Ex1, Ex2 (first substrate unloading part Ex1 and second substrate unloading part Ex2) as the substrate unloading parts.
  • the printing apparatus 1L is configured so that it can load the substrate W, which is sent out from the first loader L1, from the first substrate loading part En1 into the apparatus and load the substrate W, which is sent out from the second loader L2, from the second substrate loading part En2 into the apparatus, respectively, and unload the printed substrate W from the first substrate unloading part Ex1 to the first component mounting device M1 and unload the printed substrate W from the printed second substrate unloading part Ex2 to the second component mounting device M2, respectively.
  • the respective substrate unloading parts Ex1, Ex2 are provided at a position between both substrate loading parts En1, En2 in the Y axis direction. That is, the substrate unloading parts Ex1, Ex2 are provided at an array pitch Pt2 which is different from an array pitch Pt1 of the substrate loading parts En1, En2 (Pt2 ⁇ Pt1).
  • first substrate support device 10A moves across the first receiving position and a first sending position where the printed substrate W can be unloaded from the first substrate unloading part Ex1.
  • the second substrate support device 10B is movably provided between the second receiving position and a second sending position where the printed substrate W can be unloaded from the second substrate unloading part Ex2.
  • the printing apparatus 1L differs from the configuration of the printing apparatus 1J of the eighth example with respect to the foregoing points.
  • the first substrate support device 10A is placed at the lower position of the mask 21, and the substrate W is overlapped with the mask 21 and the substrate W is subjected to printing in a state where the substrate W supported by the first substrate support device 10A is positioned relative to the first pattern 211.
  • the first substrate support device 10A When the printing is finished, as shown in Fig. 36A , the first substrate support device 10A is placed at the first sending position.
  • the printed substrate W is sent from the first substrate support device 10A and unloaded from the first substrate unloading part Ex1 to the first component mounting device M1.
  • the first substrate support device 10A When the unloading of the substrate W is completed, as shown in Fig. 36B , the first substrate support device 10A is placed at the first receiving position, and the substrate W loaded from the first substrate loading part En1 is received on the conveyer pair 12 of the first substrate support device 10A and then clamped.
  • the first substrate support device 10A sequentially moves from the first receiving position to the lower position of the mask 21 (first pattern 211) and the first sending position.
  • the printing of the substrate W supported by the first substrate support device 10A, the unloading of the substrate W and the receiving operation of the subsequent substrate W are sequentially performed.
  • the second substrate support device 10B sequentially moves from the second receiving position to the lower position of the mask 21 (second pattern 212) and the sending position.
  • the printing of the substrate W supported by the second substrate support device 10B ( Fig. 36B ), the unloading of the substrate W and the receiving operation of the subsequent substrate W ( Fig. 35 ) are sequentially performed.
  • the printing apparatus 1L can independently receive the substrates W from the dual system loaders L1, L2 and simultaneously perform printing on the substrates W and unload the substrates W to the conveyer pairs CM1, CM2 of the component mounting devices M1, M2 installed at a pitch (Pt2) that is different than a pitch (Pt1) of the conveyer pairs CL1, CL2 of the loaders L1, L2.
  • Pt2 a pitch that is different than a pitch (Pt1) of the conveyer pairs CL1, CL2 of the loaders L1, L2.
  • the third embodiment of being able to downsize the manufacturing line despite the printing apparatus 1L being disposed between an upstream-side device of a dual system (loaders L1, L2) and a downstream-side device of a dual system (component mounting devices M1, M2), and the line pitch of the respective substrate transfer lines of the upstream-side device and the line pitch of the respective substrate transfer lines of the downstream apparatus are different.
  • the printing apparatus 1L since the substrates W are alternately received by the two substrate support devices 10A, 10B and simultaneously subject to printing and then unloaded as described above, there is an advantage in that the throughput of the substrate W can be improved in comparison to the printing apparatus 1I of the third embodiment.
  • screen printing apparatuses 1, 1A to 1L described above are illustrations of the preferred embodiments of the screen printing apparatus according to the present invention, and the specific configuration thereof may be modified.
  • the specific supporting structure of the substrate W in the substrate support tables 10A, 10B, the specific holding structure of the mask 21 in the print executing parts 20A, 20B, or the specific structure of the squeegee unit 40 of the first example are not necessarily limited to those of the screen printing apparatus 1 of the first example, and may be modified as needed.
  • the print executing parts 20A, 20B may be disposed at a position that is closer to the sending position or farther from the sending position to the extent that they will not interfere with the substrate support table that is in the midst of sending the substrate.
  • the print executing part 20 may be disposed at a position that is closer to the second receiving position or at a position that is closer to the second receiving position than the sending position. Moreover, in each of the fourth and fifth examples, the print executing part 20 may be disposed at a position that is closer to the first sending position or at a position that is closer to the first sending position than the receiving position.
  • first substrate support table 10A and the second substrate support table 10B were respectively supported movably on the common rail 3, but they may also be movably supported on separate rails, respectively.
  • conveyer pairs Cn (or Cn1, Cn2) and Cx (or Cx1, Cx2) are provided on the foundation 2, and the positions of the substrate loading part En and the substrate unloading part Ex are fixed.
  • the flexibility of disposing the loader L (or L1, L2) and the component mounting device M (or M1, M2) can be improved.
  • the position (substrate loading position) of the substrate loading part En (or En1, En2) and the position (substrate unloading position) of the substrate unloading part Ex (or Ex1, Ex2) are respectively set according to the print execution program or the like provided from the host computer in accordance with the arrangement of the loader L (or L1, L2) and the component mounting device M (or M1, M2) that was decided in advance.
  • the print executing parts 20A, 20B are respectively set to align with the positions of the substrate loading parts En1, En2 with respect to the Y direction.
  • the interference of the substrate support tables 10A, 10B can be avoided by disposing the print executing part 20A at an outside position that will be the device's front side of the substrate loading part En1, and disposing the print executing part 20B at an outside position that will be the device's back side of the substrate loading part En2, respectively.
  • the print executing parts 20A, 20B are respectively set to align with the positions of the substrate unloading parts Ex1, Ex2 in the Y direction, in cases where the interval between the substrate unloading part Ex1 and the substrate unloading part Ex2 is narrow, the interference of the substrate support tables 10A, 10B can be avoided by disposing the print executing part 20A at an outside position that will be the device's front side of the substrate unloading part Ex1, and disposing the print executing part 20B at an outside position that will be the device's back side of the substrate unloading part Ex2, respectively.
  • respective arrangements of the fixed conveyer and the movable conveyer with respect to the Y direction may be the same.
  • alignment can be maintained between the positions of the print executing part 20A and the substrate unloading part Ex1, or between the positions of the print executing part 20B and the substrate unloading part Ex2.
  • the printing apparatuses 1J to 1L of the eleventh to tenth examples are configured such that printing is performed using the first pattern 211 of the two printing patterns 211, 212 of the mask 21 with respect to the substrate W supported by the first substrate support device 10A, and printing is performed using the second pattern 212 with respect to the substrate W supported by the second substrate support device 10B.
  • the second substrate support device 10B may withdraw to the position on the outside (upper side in Fig.
  • the first substrate support device 10A may withdraw to the position on the outside (lower side in Fig. 31 ) of the print executing part 20 when the second substrate support device 10B is positioned at the first pattern 211.
  • the configuration may be such that printing is enabled simultaneously when the respective substrates W supported by both substrate support devices 10A, 10B are positioned relative to the respective printing patterns 211, 212. That is, the arrangement pitch of both printing patterns 211, 212 is increased to an extent where both substrate support devices 10A, 10B will not interfere with each other despite being positioned below the respective printing patterns 211, 212.
  • the printing apparatus 1L of the tenth example it is also possible to reduce, as much as possible, the arrangement pitch (Pt2) of the component mounting devices M1, M2 (for instance, to be the same as or smaller than the arrangement pitch of both printing patterns 211, 212).
  • the simultaneous implementation of printing and substrate unloading as illustrated in Fig. 36A is not possible.
  • the screen printing apparatus comprises: a print executing part positioned between a substrate loading position and a substrate unloading position, both of which are juxtaposed in a certain direction, the print executing part being configured to perform screen printing to a substrate; substrate support means that receives a substrate loaded from the substrate loading position, supports the substrate so that the print executing part enables printing on the substrate, and unloads the printed substrate from the substrate unloading position; and the control means that drive-controls the substrate support means, wherein a first substrate loading position and a second substrate loading position, both of which are aligned in a Y axis direction which is orthogonal to an X axis direction under the presumption that the X axis is defined as the certain direction, are defined as the substrate loading position, wherein the print executing part includes one screen mask on which two printing patterns are aligned in the Y axis direction, wherein the substrate support means is movably provided in the Y axis direction across a first receiving position
  • the substrate support means by moving the substrate support means at the first or second receiving position, the substrate is received by the substrate support means alternatively from the first or second substrate unloading position, and printing is performed in a state where the substrate is supported by the substrate support means.
  • the substrate support means by moving the substrate support means to the print executing part so that printing is performed by using one of the two printing patterns of the screen mask, a pattern according to the type or substrate or the like is printed on the substrate.
  • the printed substrate is unloaded from the substrate unloading position by placing the substrate support means at the sending position and sending the substrate from the substrate support means.
  • the screen printing apparatus in addition to being able to perform printing using a screen mask including two printing patterns as with a conventional apparatus (a screen printing apparatus disclosed in Japanese Patent Laid-Open Publication No. 2008-272964 ; hereinafter the same in this section), for instance, even in cases where the screen printing apparatus is disposed between an upstream-side device of a dual system and a downstream-side device of a single system, the screen printing apparatus can independently receive a substrate from an upstream-side device of a dual system, simultaneously perform printing on the substrate, and unload the substrate to a downstream-side device of a single system without having to use incidental equipment (switching device) as with conventional screen printing apparatuses.
  • incidental equipment switching device
  • first substrate unloading position and a second substrate unloading position are defined as the substrate unloading position
  • the substrate support means is movably provided to a first sending position where a substrate from the first substrate unloading position can be sent and a second sending position where a substrate from the second substrate unloading position can be sent, both of which are defined as the sending position
  • the control means places the substrate support means at the first sending position or the second sending position in order to unload a printed substrate.
  • printing is performed while the substrates are received from the first and second substrate loading positions, and the substrates are unloaded from the first and second substrate unloading positions provided at a pitch that is different from that of the first and second substrate loading positions.
  • the screen printing apparatus can independently receive a substrate from the upstream-side device, the screen printing apparatus can simultaneously perform printing on the substrate, and the screen printing apparatus can unload the substrate to the downstream apparatus without having to use incidental equipment (relay device) as with conventional screen printing apparatuses.
  • the screen printing apparatus comprises: a print executing part positioned between a substrate loading position and a substrate unloading position, both of which are juxtaposed in a certain direction, the print executing part being configured to perform screen printing to a substrate; substrate support means that receives a substrate loaded from the substrate loading position, supports the substrate so that the print executing part enables printing on the substrate, and unloads the printed substrate from the substrate unloading position; and the control means that drive-controls the substrate support means, wherein a first substrate unloading position and a second substrate unloading position, both of which are aligned in a Y axis direction which is orthogonal to an X axis direction under the presumption that the X axis is defined as the certain direction, are defined as the substrate unloading position, wherein the print executing part includes one screen mask on which two printing patterns are aligned in the Y axis direction, wherein the substrate support means is movably provided in the Y
  • the substrate support means by placing the substrate support means at the receiving position, the substrate is received by the substrate support member, and printing is performed in a state where the substrate is supported by the substrate support means.
  • the operation by moving the substrate support means to the print executing part so that printing is performed by using one of the two printing patterns of the screen mask, a pattern according to the type or substrate or the like is printed on the substrate.
  • the printed substrate is selectively unloaded from the first or second substrate unloading position by sending the substrate from the substrate support means in a state where the substrate support means is placed at the first or second sending position.
  • the screen printing apparatus in addition to being able to perform printing using a screen mask including two printing patterns as with a conventional apparatus, even in cases where the screen printing apparatus is disposed between an upstream-side device of a single system and a downstream-side device of a dual system, for instance, the screen printing apparatus can independently receive a substrate from an upstream-side device of a single system, simultaneously perform printing on the substrate, and unload the substrate to a downstream-side device of a dual system without having to use incidental equipment (sorting device) as with conventional screen printing apparatuses.
  • incidental equipment sorting device
  • the screen printing apparatus according to the present invention can be installed between a device of single transfer-type and a device of dual transfer-type or the like without incidental equipment such as a sorting device, and is useful in the field of manufacturing component mounted substrates.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Screen Printers (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Claims (3)

  1. Siebdruckvorrichtung, die umfasst:
    einen Druckausführungsteil (20), der zwischen einer Substratladeposition und einer Substratentladeposition angeordnet ist, die beide in einer gewissen Richtung (X) nebeneinandergestellt sind, wobei der Druckausführungsteil (20) aufgebaut ist, um Siebdrucken auf einem Substrat (W) durchzuführen;
    ein Substrathaltemittel (10), das ein Substrat (W), das von der Substratladeposition geladen wird, empfängt, das Substrat (W) hält, so dass der Druckausführungsteil (20) ermöglicht, das Drucken auf dem Substrat (W) durchzuführen, und das bedruckte Substrat (W) von der Substratentladeposition entlädt; und
    ein Steuermittel (8), welches das eine Substrathaltemittel (10) antriebssteuert,
    wobei eine erste Substratladeposition und eine zweite Substratladeposition, die beide in einer Y-Achsenrichtung, die orthogonal zu einer X-Achsenrichtung ist, ausgerichtet sind, unter der Annahme, dass die X-Achse als die gewisse Richtung (X) definiert ist, als die Substratladeposition definiert sind,
    wobei der Druckausführungsteil (20) eine Siebmaske (21) umfasst, auf der zwei Druckmuster (211, 212) in der Y-Achsenrichtung ausgerichtet sind,
    dadurch gekennzeichnet, dass
    das eine Substrathaltemittel (10) in der Y-Achsenrichtung quer zu einer ersten Empfangsposition, in der ein von der Substratladeposition geladenes Substrat (W) empfangen werden kann, einer zweiten Empfangsposition, in der ein von der zweiten Substratladeposition geladenes Substrat (W) empfangen werden kann, und einer Förderposition, in der ein Substrat (W) zu der Substratentladeposition befördert werden kann, beweglich bereitgestellt ist, so dass das Substrat (W) an der tieferen Position einer der zwei Druckmuster (211, 212) der Siebmaske (21) bereitgestellt werden kann, indem das eine Substrathaltemittel (10) in der Y-Achsenrichtung bewegt wird, und
    das Steuermittel (8) das eine Substrathaltemittel (10) an der ersten Empfangsposition oder der zweiten Empfangsposition anordnet, um Substrate (W), die von den ersten und zweiten Substratladepositionen geladen wurden, zu empfangen, wobei das Steuermittel (8) das eine Substrathaltemittel (10) an dem Druckausführungsteil (20) derart anordnet, dass das Drucken auf den empfangen Substraten (W) unter Verwendung eines der zwei Druckmuster (211, 212) der Siebmaske (21) durchgeführt wird und das Steuermittel (8) das eine Substrathaltemittel (10) an der Förderposition anordnet, um das bedruckte Substrat (W) zu der Substratentladeposition zu befördern.
  2. Siebdruckvorrichtung nach Anspruch 1,
    wobei eine erste Substratentladeposition und eine zweite Substratentladeposition, die beide mit einem Zwischenraum (Pt2), der verschieden von einem Anordnungszwischenraum (Pt1) der ersten und zweiten Substratladepositionen ist, in der Y-Achsenrichtung ausgerichtet sind, als die Substratentladeposition definiert sind,
    wobei das eine Substrathaltemittel (10) beweglich zu einer ersten Förderposition, in der ein Substrat (W) von der ersten Substratentladeposition befördert werden kann, und einer zweiten Förderposition, in der ein Substrat (W) von der zweiten Substratentladeposition befördert werden kann, bereitgestellt ist, welche beide als die Förderposition definiert sind, und
    wobei das Steuermittel (8) das eine Substrathaltemittel (10) an der ersten Förderposition oder der zweiten Förderposition anordnet, um ein bedrucktes Substrat zu entladen.
  3. Siebdruckvorrichtung, die umfasst:
    einen Druckausführungsteil (20), der zwischen einer Substratladeposition und einer Substratentladeposition angeordnet ist, die beide in einer gewissen Richtung (X) nebeneinandergestellt sind, wobei der Druckausführungsteil (20) aufgebaut ist, um Siebdrucken auf einem Substrat (W) durchzuführen;
    ein Substrathaltemittel (10), das ein Substrat (W), das von der Substratladeposition geladen wird, empfängt, das Substrat (W) hält, so dass der Druckausführungsteil (20) ermöglicht, das Drucken auf dem Substrat (W) durchzuführen, und das bedruckte Substrat (W) von der Substratentladeposition entlädt; und
    ein Steuermittel (8), welches das eine Substrathaltemittel (10) antriebssteuert,
    wobei eine erste Substratentladeposition und eine zweite Substratentladeposition, die beide in einer Y-Achsenrichtung, die orthogonal zu einer X-Achsenrichtung ist, ausgerichtet sind, unter der Annahme, dass die X-Achse als die gewisse Richtung (X) definiert ist, als die Substratentladeposition definiert sind,
    wobei der Druckausführungsteil (20) eine Siebmaske (21) umfasst, auf der zwei Druckmuster (211, 212) in der Y-Achsenrichtung ausgerichtet sind,
    dadurch gekennzeichnet, dass
    das eine Substrathaltemittel (10) in der Y-Achsenrichtung quer zu einer Empfangsposition, in der ein von der Substratladeposition geladenes Substrat (W) empfangen werden kann, einer ersten Förderposition, in der ein Substrat (W) von der ersten Substratentladeposition befördert werden kann, und einer zweiten Förderposition, in der ein Substrat (W) von der zweiten Substratentladeposition befördert werden kann, beweglich bereitgestellt ist, so dass das Substrat (W) an der tieferen Position eines der zwei Druckmuster (211, 212) der Siebmaske (21) bereitgestellt werden kann, indem das eine Substrathaltemittel (10) in der Y-Achsenrichtung bewegt wird, und
    das Steuermittel (8) das eine Substrathaltemittel (10) an der Empfangsposition anordnet, die ein von der Substratladeposition geladenes Substrat (W) empfängt, wobei das Steuermittel (8) das eine Substrathaltemittel (10) an dem Druckausführungsteil (20) derart anordnet, dass das Drucken auf dem empfangen Substrat (W) unter Verwendung eines der zwei Druckmuster (211, 212) der Siebmaske (21) durchgeführt wird und das Steuermittel (8) das eine Substrathaltemittel (10) an der ersten Förderposition oder der zweiten Förderposition anordnet, um das bedruckte Substrat (W) von einer der ersten oder zweiten Substratentladeposition zu entladen.
EP15001642.6A 2011-06-21 2011-06-21 Siebdruckvorrichtung Active EP2949469B1 (de)

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Application Number Priority Date Filing Date Title
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PCT/JP2011/003524 WO2012176229A1 (ja) 2011-06-21 2011-06-21 スクリーン印刷装置
EP11868168.3A EP2724863B1 (de) 2011-06-21 2011-06-21 Siebdruckvorrichtung
EP15001642.6A EP2949469B1 (de) 2011-06-21 2011-06-21 Siebdruckvorrichtung

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CN108674010A (zh) * 2018-06-28 2018-10-19 无锡奥特维科技股份有限公司 丝网印刷设备、叠片机及丝网印刷方法
JP7113989B2 (ja) * 2020-02-06 2022-08-05 株式会社Fuji 対基板作業装置
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CN111619212B (zh) * 2020-06-11 2021-12-14 浦江县颐硕科技开发有限公司 一种瓷碗内底批量印花设备

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Also Published As

Publication number Publication date
EP2724863B1 (de) 2016-11-30
US9688064B2 (en) 2017-06-27
EP2724863A4 (de) 2014-11-12
EP2949469A1 (de) 2015-12-02
US9475275B2 (en) 2016-10-25
WO2012176229A1 (ja) 2012-12-27
EP2724863A1 (de) 2014-04-30
US20160347049A1 (en) 2016-12-01
CN103619594B (zh) 2016-08-17
CN103619594A (zh) 2014-03-05
US20140190361A1 (en) 2014-07-10

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