EP2747411A1 - Module d'élément d'imagerie et son procédé de fabrication - Google Patents

Module d'élément d'imagerie et son procédé de fabrication Download PDF

Info

Publication number
EP2747411A1
EP2747411A1 EP12825092.5A EP12825092A EP2747411A1 EP 2747411 A1 EP2747411 A1 EP 2747411A1 EP 12825092 A EP12825092 A EP 12825092A EP 2747411 A1 EP2747411 A1 EP 2747411A1
Authority
EP
European Patent Office
Prior art keywords
imaging element
wiring substrate
resin
rear face
element module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP12825092.5A
Other languages
German (de)
English (en)
Other versions
EP2747411A4 (fr
Inventor
Shu Hamada
Hitoshi Shimamura
Yoshiyuki Takase
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of EP2747411A1 publication Critical patent/EP2747411A1/fr
Publication of EP2747411A4 publication Critical patent/EP2747411A4/fr
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
EP12825092.5A 2011-08-19 2012-06-07 Module d'élément d'imagerie et son procédé de fabrication Withdrawn EP2747411A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011179853 2011-08-19
PCT/JP2012/064703 WO2013027464A1 (fr) 2011-08-19 2012-06-07 Module d'élément d'imagerie et son procédé de fabrication

Publications (2)

Publication Number Publication Date
EP2747411A1 true EP2747411A1 (fr) 2014-06-25
EP2747411A4 EP2747411A4 (fr) 2015-04-15

Family

ID=47746219

Family Applications (1)

Application Number Title Priority Date Filing Date
EP12825092.5A Withdrawn EP2747411A4 (fr) 2011-08-19 2012-06-07 Module d'élément d'imagerie et son procédé de fabrication

Country Status (5)

Country Link
US (1) US20140168510A1 (fr)
EP (1) EP2747411A4 (fr)
JP (1) JP5982380B2 (fr)
CN (1) CN103765865A (fr)
WO (1) WO2013027464A1 (fr)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6425382B2 (ja) * 2014-01-08 2018-11-21 デクセリアルズ株式会社 接続方法、及び接合体
CN106558525A (zh) * 2015-09-25 2017-04-05 精材科技股份有限公司 晶片封装体及其制造方法
US10451863B2 (en) * 2016-08-05 2019-10-22 Verily Life Sciences Llc Interposer for integration of multiple image sensors
CN108243298B (zh) * 2016-12-23 2022-10-14 宁波舜宇光电信息有限公司 摄像模组及其模塑电路板组件和制造方法以及带有摄像模组的电子设备
JP2018125672A (ja) * 2017-01-31 2018-08-09 ソニーセミコンダクタソリューションズ株式会社 電子部品、カメラモジュール及び電子部品の製造方法
TWI656632B (zh) * 2017-05-12 2019-04-11 海華科技股份有限公司 可攜式電子裝置及其影像擷取模組與承載組件
TWI639048B (zh) 2017-05-22 2018-10-21 海華科技股份有限公司 可攜式電子裝置及其影像擷取模組與承載組件
CN111108744B (zh) * 2017-10-20 2022-09-23 松下知识产权经营株式会社 固体摄像装置
TW201942615A (zh) 2018-04-04 2019-11-01 日商索尼半導體解決方案公司 攝像裝置
JP7083039B2 (ja) * 2018-10-16 2022-06-09 株式会社Fuji 回路形成方法
TWI685125B (zh) * 2018-12-05 2020-02-11 海華科技股份有限公司 影像擷取模組及可攜式電子裝置
JP2021036575A (ja) * 2018-12-17 2021-03-04 東芝ホクト電子株式会社 発光装置、接合部の保護方法、発光装置の製造方法、及び、車両用灯具
EP3785897B1 (fr) 2019-08-29 2021-12-29 SHPP Global Technologies B.V. Film multicouche transparent, flexible et résistant aux impacts comprenant des copolymères de polycarbonate
TWI809408B (zh) * 2021-06-01 2023-07-21 國立屏東科技大學 加熱輔助覆晶接合裝置
CN113471153B (zh) * 2021-06-30 2022-11-11 上海中航光电子有限公司 封装结构及封装方法、摄像头模组及电子设备
WO2024058037A1 (fr) * 2022-09-13 2024-03-21 株式会社村田製作所 Module de capteur infrarouge

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5040069A (en) * 1989-06-16 1991-08-13 Fuji Photo Optical Co., Ltd. Electronic endoscope with a mask bump bonded to an image pick-up device
US5418566A (en) * 1990-09-10 1995-05-23 Kabushiki Kaisha Toshiba Compact imaging apparatus for electronic endoscope with improved optical characteristics
EP1081944A2 (fr) * 1999-09-03 2001-03-07 Sony Corporation Elément et dispositif de prise de vues, module de caméra et système
US20010050717A1 (en) * 2000-06-12 2001-12-13 Mitsubishi Denki Kabushiki Kaisha Semiconductor device constituting a CMOS camera system
US6384473B1 (en) * 2000-05-16 2002-05-07 Sandia Corporation Microelectronic device package with an integral window
US20050236685A1 (en) * 2004-04-26 2005-10-27 Matsushita Electric Industrial Co., Ltd. Optical device and method for fabricating the same
WO2011080952A1 (fr) * 2009-12-28 2011-07-07 三洋電機株式会社 Substrat de support d'élément, module semi-conducteur, module de caméra et procédé de fabrication du substrat de support d'élément

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04162378A (ja) * 1990-10-26 1992-06-05 Olympus Optical Co Ltd 固体撮像装置
DE69739582D1 (de) * 1996-07-23 2009-10-29 Seiko Epson Corp Verfahren zum montieren eines eingekapselten körpers auf montageplatten und optischer wandler
JP4890682B2 (ja) * 2000-03-30 2012-03-07 パナソニック株式会社 固体撮像装置およびその作製方法
JP4647851B2 (ja) 2001-08-07 2011-03-09 日立マクセル株式会社 カメラモジュール
JP4510403B2 (ja) 2003-05-08 2010-07-21 富士フイルム株式会社 カメラモジュール及びカメラモジュールの製造方法
JP4405208B2 (ja) * 2003-08-25 2010-01-27 株式会社ルネサステクノロジ 固体撮像装置の製造方法
JP2005244118A (ja) * 2004-02-27 2005-09-08 Toshiba Corp 半導体素子の製造方法およびカメラモジュールの製造方法
JP4142029B2 (ja) * 2004-05-07 2008-08-27 セイコーエプソン株式会社 電気光学装置および電子機器
JP4324081B2 (ja) * 2004-11-22 2009-09-02 パナソニック株式会社 光学デバイス
JP4196937B2 (ja) * 2004-11-22 2008-12-17 パナソニック株式会社 光学装置
WO2007013682A1 (fr) * 2005-07-29 2007-02-01 Dai Nippon Printing Co., Ltd. Dispositif d’affichage, son procédé de fabrication et support d’affichage
JP2007194272A (ja) 2006-01-17 2007-08-02 Olympus Imaging Corp 撮像モジュール
JP2007266070A (ja) * 2006-03-27 2007-10-11 Fujikura Ltd プリント回路基板及びプリント回路基板接続構造
JP2010098117A (ja) * 2008-10-16 2010-04-30 Nec Electronics Corp 電子装置および電子装置の製造方法
JP5315028B2 (ja) * 2008-12-04 2013-10-16 ルネサスエレクトロニクス株式会社 電子装置および電子装置の製造方法
JP2010252164A (ja) * 2009-04-17 2010-11-04 Panasonic Corp 固体撮像装置
JP4839392B2 (ja) * 2009-05-07 2011-12-21 ルネサスエレクトロニクス株式会社 固体撮像装置
TW201104850A (en) * 2009-07-29 2011-02-01 Kingpak Tech Inc Image sensor package structure with large air cavity

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5040069A (en) * 1989-06-16 1991-08-13 Fuji Photo Optical Co., Ltd. Electronic endoscope with a mask bump bonded to an image pick-up device
US5418566A (en) * 1990-09-10 1995-05-23 Kabushiki Kaisha Toshiba Compact imaging apparatus for electronic endoscope with improved optical characteristics
EP1081944A2 (fr) * 1999-09-03 2001-03-07 Sony Corporation Elément et dispositif de prise de vues, module de caméra et système
US6384473B1 (en) * 2000-05-16 2002-05-07 Sandia Corporation Microelectronic device package with an integral window
US20010050717A1 (en) * 2000-06-12 2001-12-13 Mitsubishi Denki Kabushiki Kaisha Semiconductor device constituting a CMOS camera system
US20050236685A1 (en) * 2004-04-26 2005-10-27 Matsushita Electric Industrial Co., Ltd. Optical device and method for fabricating the same
WO2011080952A1 (fr) * 2009-12-28 2011-07-07 三洋電機株式会社 Substrat de support d'élément, module semi-conducteur, module de caméra et procédé de fabrication du substrat de support d'élément

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2013027464A1 *

Also Published As

Publication number Publication date
JPWO2013027464A1 (ja) 2015-03-19
EP2747411A4 (fr) 2015-04-15
US20140168510A1 (en) 2014-06-19
JP5982380B2 (ja) 2016-08-31
WO2013027464A1 (fr) 2013-02-28
CN103765865A (zh) 2014-04-30

Similar Documents

Publication Publication Date Title
EP2747411A1 (fr) Module d'élément d'imagerie et son procédé de fabrication
US7494292B2 (en) Image sensor module structure comprising wire bonding package and method of manufacturing the image sensor module structure
US20080252771A1 (en) Camera module with compact packaging of image sensor chip and method of manufacturing the same
US7796188B2 (en) Compact image sensor package and method of manufacturing the same
EP3148176A1 (fr) Module de caméra et système de caméra
EP2790218A1 (fr) Module d'imagerie et unité d'imagerie
EP2720454B1 (fr) Dispositif de capture d'image et appareil électronique employant celui-ci
US20100002107A1 (en) Solid-state image pickup apparatus and manufacturing method thereof
US20040256687A1 (en) Optical module, method of manufacturing the same, and electronic instrument
JP6251956B2 (ja) 光学素子収納用パッケージ、光学フィルターデバイス、光学モジュール、および電子機器
KR20050026491A (ko) 카메라 모듈, 카메라 모듈용 홀더, 카메라 시스템 및카메라 모듈 제조 방법
JP2008277593A (ja) 回路基板、それを用いた光学デバイス、カメラモジュール、およびその製造方法
KR101632343B1 (ko) 이중 인쇄회로기판을 이용한 카메라 모듈
US20180247962A1 (en) Image sensor package structure and packaging method thereof
KR20170089266A (ko) 이미지 센서 모듈 및 이를 포함하는 카메라 모듈
JP4174664B2 (ja) 光モジュール及びその製造方法並びに電子機器
CN109417081B (zh) 芯片封装结构、方法和电子设备
CN210075377U (zh) 一种摄像头封装模组
JP4314825B2 (ja) 光モジュール及びその製造方法、回路基板並びに電子機器
CN109672806B (zh) 摄像模组和感光组件及其封装方法
EP2500942A1 (fr) Dispositif de capture d'images à semi-conducteurs et son procédé de fabrication
JP2000332225A (ja) 撮像装置
KR100840153B1 (ko) 카메라 모듈
CN210040172U (zh) 芯片封装结构和电子设备
KR20080015257A (ko) 카메라 모듈 및 그 제조 방법

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20140219

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DAX Request for extension of the european patent (deleted)
RA4 Supplementary search report drawn up and despatched (corrected)

Effective date: 20150313

RIC1 Information provided on ipc code assigned before grant

Ipc: H04N 5/225 20060101AFI20150309BHEP

Ipc: H04N 5/369 20110101ALI20150309BHEP

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN

18W Application withdrawn

Effective date: 20160613