EP2698819A1 - Boîtier haute fréquence - Google Patents
Boîtier haute fréquence Download PDFInfo
- Publication number
- EP2698819A1 EP2698819A1 EP12771789.0A EP12771789A EP2698819A1 EP 2698819 A1 EP2698819 A1 EP 2698819A1 EP 12771789 A EP12771789 A EP 12771789A EP 2698819 A1 EP2698819 A1 EP 2698819A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- dielectric substrate
- frequency
- dielectric
- back side
- frequency element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 54
- 239000004020 conductor Substances 0.000 claims abstract description 47
- 238000002955 isolation Methods 0.000 description 11
- 239000002344 surface layer Substances 0.000 description 10
- 238000010586 diagram Methods 0.000 description 6
- 239000010410 layer Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000007423 decrease Effects 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/006—Casings specially adapted for signal processing applications, e.g. CATV, tuner, antennas amplifier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15192—Resurf arrangement of the internal vias
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
- H01L2924/15321—Connection portion the connection portion being formed on the die mounting surface of the substrate being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Signal Processing (AREA)
- Waveguides (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011090259 | 2011-04-14 | ||
PCT/JP2012/052117 WO2012140934A1 (fr) | 2011-04-14 | 2012-01-31 | Boîtier haute fréquence |
Publications (3)
Publication Number | Publication Date |
---|---|
EP2698819A1 true EP2698819A1 (fr) | 2014-02-19 |
EP2698819A4 EP2698819A4 (fr) | 2014-10-01 |
EP2698819B1 EP2698819B1 (fr) | 2019-08-14 |
Family
ID=47009120
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP12771789.0A Active EP2698819B1 (fr) | 2011-04-14 | 2012-01-31 | Emballage haute fréquence |
Country Status (5)
Country | Link |
---|---|
US (1) | US9693492B2 (fr) |
EP (1) | EP2698819B1 (fr) |
JP (1) | JP5693710B2 (fr) |
CN (1) | CN103460377B (fr) |
WO (1) | WO2012140934A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9508676B1 (en) | 2015-08-10 | 2016-11-29 | Chipbond Technology Corporation | Semiconductor package structure having hollow chamber and bottom substrate and package process thereof |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9070961B2 (en) | 2008-09-05 | 2015-06-30 | Mitsubishi Electric Corporation | High-frequency circuit package and sensor module |
JP6274917B2 (ja) * | 2014-03-11 | 2018-02-07 | 三菱電機株式会社 | 高周波パッケージ |
TWI663701B (zh) * | 2017-04-28 | 2019-06-21 | 矽品精密工業股份有限公司 | 電子封裝件及其製法 |
WO2024084556A1 (fr) * | 2022-10-18 | 2024-04-25 | 三菱電機株式会社 | Boîtier de semi-conducteur haute fréquence |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6137693A (en) * | 1998-07-31 | 2000-10-24 | Agilent Technologies Inc. | High-frequency electronic package with arbitrarily-shaped interconnects and integral shielding |
US20080067656A1 (en) * | 2006-09-15 | 2008-03-20 | Hong Kong Applied Science | Stacked multi-chip package with EMI shielding |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5869894A (en) | 1997-07-18 | 1999-02-09 | Lucent Technologies Inc. | RF IC package |
JP3609935B2 (ja) * | 1998-03-10 | 2005-01-12 | シャープ株式会社 | 高周波半導体装置 |
US6297551B1 (en) * | 1999-09-22 | 2001-10-02 | Agere Systems Guardian Corp. | Integrated circuit packages with improved EMI characteristics |
US6486534B1 (en) | 2001-02-16 | 2002-11-26 | Ashvattha Semiconductor, Inc. | Integrated circuit die having an interference shield |
JP2003163304A (ja) | 2001-11-29 | 2003-06-06 | Mitsubishi Electric Corp | 高周波パッケージ |
WO2003049149A2 (fr) * | 2001-11-30 | 2003-06-12 | Vitesse Semiconductor Corporation | Dispositif et procede de connexion inter-puces ou puce-substrat par l'intermediaire d'un support intermediaire |
JP3858854B2 (ja) * | 2003-06-24 | 2006-12-20 | 富士通株式会社 | 積層型半導体装置 |
US7613010B2 (en) * | 2004-02-02 | 2009-11-03 | Panasonic Corporation | Stereoscopic electronic circuit device, and relay board and relay frame used therein |
JP4403977B2 (ja) * | 2005-01-26 | 2010-01-27 | ソニー株式会社 | 機能素子体及びその製造方法並びに回路モジュール |
KR100998499B1 (ko) | 2005-11-16 | 2010-12-06 | 쿄세라 코포레이션 | 전자 부품 밀봉용 기판, 복수개 분할 형태의 전자 부품밀봉용 기판, 전자 부품 밀봉용 기판을 사용한 전자 장치,및 전자 장치의 제조 방법 |
JP4833192B2 (ja) * | 2007-12-27 | 2011-12-07 | 新光電気工業株式会社 | 電子装置 |
US9070961B2 (en) | 2008-09-05 | 2015-06-30 | Mitsubishi Electric Corporation | High-frequency circuit package and sensor module |
JP2010258137A (ja) | 2009-04-23 | 2010-11-11 | Panasonic Corp | 高周波モジュールおよびその製造方法 |
-
2012
- 2012-01-31 JP JP2013509810A patent/JP5693710B2/ja active Active
- 2012-01-31 EP EP12771789.0A patent/EP2698819B1/fr active Active
- 2012-01-31 CN CN201280017668.6A patent/CN103460377B/zh active Active
- 2012-01-31 US US14/111,107 patent/US9693492B2/en active Active
- 2012-01-31 WO PCT/JP2012/052117 patent/WO2012140934A1/fr active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6137693A (en) * | 1998-07-31 | 2000-10-24 | Agilent Technologies Inc. | High-frequency electronic package with arbitrarily-shaped interconnects and integral shielding |
US20080067656A1 (en) * | 2006-09-15 | 2008-03-20 | Hong Kong Applied Science | Stacked multi-chip package with EMI shielding |
Non-Patent Citations (1)
Title |
---|
See also references of WO2012140934A1 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9508676B1 (en) | 2015-08-10 | 2016-11-29 | Chipbond Technology Corporation | Semiconductor package structure having hollow chamber and bottom substrate and package process thereof |
Also Published As
Publication number | Publication date |
---|---|
JPWO2012140934A1 (ja) | 2014-07-28 |
EP2698819A4 (fr) | 2014-10-01 |
CN103460377B (zh) | 2017-09-22 |
EP2698819B1 (fr) | 2019-08-14 |
JP5693710B2 (ja) | 2015-04-01 |
CN103460377A (zh) | 2013-12-18 |
US20140085858A1 (en) | 2014-03-27 |
WO2012140934A1 (fr) | 2012-10-18 |
US9693492B2 (en) | 2017-06-27 |
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