EP2684202A2 - Composant électrique comportant au moins une source de dissipation de puissance électrique disposée dans un matériau d'enrobage et un dispositif de refroidissement - Google Patents

Composant électrique comportant au moins une source de dissipation de puissance électrique disposée dans un matériau d'enrobage et un dispositif de refroidissement

Info

Publication number
EP2684202A2
EP2684202A2 EP12715608.1A EP12715608A EP2684202A2 EP 2684202 A2 EP2684202 A2 EP 2684202A2 EP 12715608 A EP12715608 A EP 12715608A EP 2684202 A2 EP2684202 A2 EP 2684202A2
Authority
EP
European Patent Office
Prior art keywords
heat
component according
potting compound
winding
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP12715608.1A
Other languages
German (de)
English (en)
Inventor
Sven Reimann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Reo Train Technologies GmbH
Original Assignee
Reo Train Technologies GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Reo Train Technologies GmbH filed Critical Reo Train Technologies GmbH
Publication of EP2684202A2 publication Critical patent/EP2684202A2/fr
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/02—Casings
    • H01F27/022—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/08—Cooling; Ventilating
    • H01F27/10—Liquid cooling
    • H01F27/16—Water cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/08—Cooling; Ventilating
    • H01F27/10—Liquid cooling
    • H01F27/18—Liquid cooling by evaporating liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/08—Cooling; Ventilating
    • H01F27/22—Cooling by heat conduction through solid or powdered fillings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/32—Insulating of coils, windings, or parts thereof
    • H01F27/322—Insulating of coils, windings, or parts thereof the insulation forming channels for circulation of the fluid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/32—Insulating of coils, windings, or parts thereof
    • H01F27/327—Encapsulating or impregnating
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J9/00—Circuit arrangements for emergency or stand-by power supply, e.g. for emergency lighting
    • H02J9/04—Circuit arrangements for emergency or stand-by power supply, e.g. for emergency lighting in which the distribution system is disconnected from the normal source and connected to a standby source
    • H02J9/06—Circuit arrangements for emergency or stand-by power supply, e.g. for emergency lighting in which the distribution system is disconnected from the normal source and connected to a standby source with automatic change-over, e.g. UPS systems
    • H02J9/062—Circuit arrangements for emergency or stand-by power supply, e.g. for emergency lighting in which the distribution system is disconnected from the normal source and connected to a standby source with automatic change-over, e.g. UPS systems for AC powered loads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F30/00—Fixed transformers not covered by group H01F19/00
    • H01F30/06—Fixed transformers not covered by group H01F19/00 characterised by the structure
    • H01F30/12—Two-phase, three-phase or polyphase transformers

Definitions

  • the present invention relates to an electrical component with at least one arranged in a potting electrical loss power source and a cooling device according to the preamble of claim 1,
  • Protective property part is potted, the heat dissipation automatically deteriorates to the environment, since the thermal conductivity of the potting compounds is usually too low to be able to forward the loss of energy quickly enough to the environment. In the transition region between the winding and the core also occur in the potting compound high
  • FIG. 26 shows a schematic cross-section through a perspective view of an electrical component in the form of a known potted and water-cooled
  • a winding 4, 5, 6 is arranged on a respective core 1, 2, 3.
  • the cores 1, 2, 3 are connected to each other via a total of two yokes 7.
  • Windings 4, 5, 6 are designated 8, 9 and 10.
  • the potting compound can therefore quickly crack or burst, resulting in the loss of protective properties, under Circumstances even to the failure of the entire electrical
  • the object of the present invention is dahe in electrical components with at least one
  • Loss power source which is potted in a potting compound to derive the resulting in the operation of the electrical component heat losses better and more evenly,
  • the thermal management and the heat conduction in the present component are to be optimized.
  • dissolved electrical power loss source wherein at least one cooling device is provided, which for optimizing the heat management heat from the range of
  • the power loss source comprises at least one arranged on a core winding or three cores, which are interconnected by a yoke, wherein on each core at least one winding is arranged.
  • An inventive component is preferred and effective with regard to thermal management, in which at least one heat-conducting part is provided in the potting compound as a cooling device, which is arranged with a partial region directly on or at least in the vicinity of the power loss source and with at least one further partial region below
  • the heat conducting part particularly advantageously in the form of a plantetary ammonium, which preferably consists of aluminum or copper.
  • the skilletleitblech may be formed strip or plate-shaped. It may in a preferred embodiment) with its partial area on one side of a winding lie directly or be arranged in the vicinity thereof, wherein at least one further portion of theillonleitbleches starting from the portion through the potting compound and below a surface region of the surface
  • the potting compound preferably has a rectangular
  • Loss power source is arranged in each case a heat conduction, wherein in each case a heat conducting two extending from the partial area on both sides of the same comprises further subregions, one of which extends below a surface area of the surface of the Vergussraasse.
  • the potting compound possesses another
  • Embodiment of the invention advantageously a rectangular cross section, wherein three cores are provided and to
  • the opposite soaps each winding of a core each have a heat conduction.
  • the clutchleitbleche the outer cores have on the outer sides of a planteleitblech comprising two further portions, each of which extends below a surface area of the surface of one side of a corner region of the rectangular cross section of the potting compound, wherein the facedleitbleche the outer cores the inner sides each having a bathleitblech comprising two further portions, one of which in the potting compound on the inner core side facing parallel to the opposite further portion of the bathleitbleches the adjacent outer core, and wherein the facedleitbleche the inner core j in each case have two further subregions, one of which runs parallel to the other subregions of the adjacent outer cores.
  • the ends of the other sections for particularly effective
  • the heat conducting plates can completely or partially cover the side of the winding facing them.
  • a heat conducting sheet can cover the sides of three windings facing it, and preferably below at least one of them
  • the cooling device comprises at least one, preferably two, opposite one another with respect to the core, between the winding and the core
  • the cooling device includes
  • the cooling passage of the heat sink and / or the further cooling passage of the further heat sink are in this case with a supply line extending from the casting compound for supplying the cooling medium and a discharge leading out of the casting compound
  • the heat conducting plate preferably has a U-shaped profile, wherein the legs and the transverse part of the ⁇ -shaped profile of the plantetbleches one side of the
  • the cross portions of two ⁇ check with respect are, in a further embodiment of the invention located on the core from
  • a further advantageous embodiment of the invention relates to a component in which the cooling device has at least one heat pipe, is derived from the cooling zone heat to a heat sink and / or another heat sink, wherein the cooling zone with the heat sink and / or with the
  • Heatpipe be arranged in the winding.
  • the heat zone of a heat pipe embedded in the potting compound can be arranged at or in the vicinity of the winding, and the cooling zone of the heat pipe is in heat-conducting connection with a heat sink.
  • a development of the component according to the invention comprises a cooling device which comprises at least one cooling tube arranged in the potting compound, which is provided with one of the
  • the cooling tube can advantageously laterally next to the winding or laterally adjacent to the windings, preferably serpentine, run.
  • the cooling device can at least one in the winding, preferably screw or
  • the cooling device may also take the form of one of
  • Coolant flowed through, sheet-like cooling element have, which is arranged in the potting compound arranged laterally at or in the vicinity of the winding.
  • a heat conducting plate can be arranged on the outside in the vicinity of said winding for effective heat dissipation and with the
  • Cooling element be thermally conductively connected.
  • the cuboid casting compound has a rectangular cross section, wherein the power loss source is arranged approximately in the middle of the cross section.
  • FIG. 3 shows a section through a cast in a potting thigh or core of a throttle or a
  • FIG. 4 shows a section through the cores of a three-phase choke or a three-phase transformer arranged in a potting compound
  • Figure 5 shows a schematic, three-dimensional representation of the embodiment of an electrical component according to the invention according to Figure 26 with primallleitblechen and heat sinks;
  • FIG. 6 shows a section through the electrical component of FIG. 5
  • FIG. 26 shows a known electronic component for explaining the prior art and the advantages of the present invention
  • the bathleitbleche be made of a metal with a thermal conductivity Leitf, such. As aluminum or copper produced.
  • the thermal conductivity Leitf As aluminum or copper produced.
  • the heat conducting plates must be in their
  • the skilletleitbleche need not be mounted directly on the winding or on the core, but can only run in the immediate vicinity of the winding or the core, so that a derivative of currents or a voltage setting can be avoided.
  • the heat conducting plates may be partially perforated with holes or profiled to ensure better anchoring within the potting compound.
  • leitbleche should be designed so that they have the largest possible area directly below the surface of the
  • the heat conducting plates can also be made from
  • the cooling zones of the heat pipes can be connected to heat sinks which are arranged, for example, between the core of a power loss source and a winding surrounding the core.
  • Coolpipes heat dissipated through the heat sink to the outside.
  • areally formed cooling elements can also be provided on the outer surfaces of the winding or the windings of electronic components, which can be connected for optimized thermal management with planteleitblechen, which are arranged in the potting compound.
  • Heat dissipation and optimized thermal management can be done individually or in combination depending on specific requirements and configurations of the electrical components.
  • Power loss source 16 which is for example a winding or a choke, potted in a potting compound 14. If during operation of the electronic component Heat is generated in the region of the power loss source 16 according to FIG. 1b, this increases in the direction of the arrows 17
  • heat-conducting sheets 21 are arranged in the potting compound 14, via which a removal of the heat generated by the power loss source 16 also takes place in regions of the potting compound 14 further from this. This means that the temperature is distributed more uniformly over the potting compound 14 and over the surface 18 thereof. As a result, the internal temperature of the potting compound 14
  • the heat conducting plates 21 are designed so that they are each arranged with a portion 22 directly to the power loss source 16 or in the vicinity thereof and that each with at least one further portion 23 as large a surface area below the surface of the potting compound 14th cover.
  • the power loss source 16 is approximately in the region of the intersecting diagonals of the cross section of the electronic component or potting compound 14 of the same, ie. H. arranged approximately in the center of the cross section.
  • the politicians are designed so that they with their
  • middle portion 22 directly to the loss of power source 16 abut or are arranged in the vicinity thereof and that they each with other portions 23 from the central portion 22 preferably to opposite sides thereof arcuately away from the power loss source 16 into the potting compound 14 and outwards and with the largest possible area below the surface 18 of the
  • FIG. 3 shows an electrical device corresponding to that of FIG. 2, wherein the power loss source 16 comprises a core 24 and a winding 27 surrounding the core 24.
  • the middle portions 22 of the are arranged on s ch opposite sides of the winding 27 and in the vicinity thereof, while the other outer portions 23 of the shallleitbleche 21, as already explained, below the surface portions 20 of the surface 18, preferably up to the respective corners of the
  • FIG. 4 shows a section through the cores 24, 25, 26 of a three-phase choke or a three-phase choke
  • Transformers wherein the windings 27, 28, 29 are arranged on the cores 24, 25, 26.
  • the heat conducting sheets 21 formed corresponding to the heat-extractable sheets 21 with the partial areas 22 and 23 of FIG. 3 can each have angled portions 30 which are angled away from the partial areas 23 by 90 °, so that they are below for improved heat dissipation further surface areas 20 of the surface 18 of the
  • Potting compound 14 run. In particular, be there
  • FIG. 5 also shows the yoke 15 connecting the cores 24 and 25 and the yoke 15 connecting the cores 25 and 26.
  • the heat conducting plates 21 are in this embodiment
  • FIG. 8 shows an embodiment in which the heat-conducting sheet 21 extends over the entire surface of the side of three windings of the cores 24, 25, 26.
  • the heat conducting plates 21 may also include the partial region 22 and the further partial regions 23 in one plane, in which case both the partial region 22 and the partial regions 23 extend below the surface of the casting compound 14. According to FIG. Section along the line X-X of Figure 6, the two can with respect to the core 24 opposite
  • the heat conducting plates 21 and the base region 32 are preferably formed in one piece.
  • the base region can run inside or outside the potting compound 14.
  • Cooling device heat sink 12 are provided, wherein the heat generated by the power loss source 16 via
  • the power loss source 16 is shown in FIG 11 from a core 24 on which a
  • Winding 27 is arranged.
  • the heat sink 12 is preferably between the core 24 and the winding 27th arranged. Preferably, two are opposite each other. Side of the core 24 heat sink 12 provided in this way.
  • the heatsink 12 consist in the manner shown in each case of a thermally conductive part, which consists for example of copper or another heat-conducting metal, in which at least one of a. Cooling mediumtechnikxömter cooling passage 33 is arranged.
  • the said cooling medium is, for example, water.
  • the blanketleitbleche 21 preferably have a U-shaped profile, wherein the legs 34 and the cross member 35 of the U-shaped profile of the michleitbleches 21 one side of
  • Base region 32 may be interconnected, is dissipated via the heat generated at the core 24 to the heat conducting plates 21.
  • the base portion 32 in one piece with the
  • FIG. 12 shows a development of the component of FIG
  • each core 24, 25, 26 each have a winding 27, 28 and 29, respectively.
  • the Cooling bodies 12 provided on each core 24, 25, 26 are designed in accordance with the cooling body 12 of FIG. 11.
  • the cooling medium which is preferably water
  • cooling channels 33 is preferably supplied to the upper side of the heat sink 12 via a feed line 37. After flowing through the cooling channels 33, the heated
  • Cooling medium preferably via a drain 38 also on the upper side of the heat sink 12 removed from the cooling system.
  • the cooling channels 33 of the heat sink 12 are preferably connected to one another on the lower sides of the heat sink 12.
  • FIG. 13 shows the arrangement of FIG. 12 in one
  • FIGs 14 to 16 show embodiments of the present invention, in which so-called heat pipes are provided, which are used to improve the thermal management of the
  • Embodiment of Figure 14 includes the
  • Loss power source 16 a core 24 and a winding 27, while in the embodiment of Figures 15 and 16, three cores 24, 25, 26 and accordingly three windings 27, 28, 29 has.
  • there are heat sinks 12 in the embodiment of FIG. 14, between the winding 27 and the core 24 of the power loss source 16 according to FIG. 11, there are heat sinks 12
  • heatsinks 12 are also arranged in the embodiment of Figure 15 between the cores 24, 25, 26 and the windings 27, 28, 29.
  • a known heat pipe is a
  • Cooling zones of the heat pipes 39 are derived to the heat sinks 12.
  • the cooling zones of the heatpipes 39 physically communicate with the heat sinks 12, while the heat zones of the heatpipes 39 arranged in the windings 27, 28, 29 correspond to the heat areas thereof.
  • FIGS. 17 and 18 in which, in the potting compound 14 according to FIG. 17, outside the windings 27, 28, 29 of the cores 24, 25, 26 a cooling device in the form of a cooling tube 41 is arranged to heat from the
  • cooling tubes 41 are preferably serpentine and in the
  • Potting compound 14 electronically insulated on opposite sides (FIG. 18) of the windings 27, 28, 29.
  • the connections of the cooling pipe 41 are designated by 42 and 43.
  • FIGS. 19 and 20 it is also conceivable to respectively wind cooling tubes 44 directly into the windings 27, 28, 29 in order to dissipate heat generated by the windings 27, 28, 29.
  • the cooling tubes 44 extend in each case
  • Figures 21 to 23 show embodiments of the present invention, in which for improving the thermal management in addition to the heat sinks 12, which are each arranged between a core and the associated winding, further heat sinks 13 are provided, each in the windings 27, 28, 29 are wrapped. Details of Figures 21 to 23, which have already been explained in connection with Figures 11 to 13 and 14 to 16, are in the corresponding manner
  • the power loss source 16 comprises a core 24 and a winding 27, while in the embodiment of FIGS. 22 and 23 it has three cores 24, 25, 26 and accordingly three windings 27, 28, 29.
  • the apparent manner are in the ⁇ us Insertsform of Figure 21 between the winding 27 and the core 24 of the
  • Loss power source 16 heat sink 12 is provided.
  • sheet-like cooling element 47 may be arranged and potted in the potting compound 14, via the heat generated by the windings 27, 28, 29 can be dissipated to the outside. It is conceivable to provide the already mentioned skilletleitbleche 21 on the outside in the vicinity of said windings and physically connect with the cooling elements 47 in order to improve the heat transfer from the windings 27, 28, 29 to the cooling elements 47.
  • Winding Winding Winding Winding Unwind Screw Base section Cooling channel Leg Cross section Area Inlet Discharge Heatpipe Heatpipe Cooling pipe Connection Connection Cooling tube Connection connection cooling element

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Business, Economics & Management (AREA)
  • Emergency Management (AREA)
  • Coils Of Transformers For General Uses (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne un composant électronique comportant au moins une source de dissipation de puissance (16) électrique disposée dans un matériau d'enrobage (14). Selon l'invention, un dispositif de refroidissement, de préférence au moins un élément thermoconducteur (21), est disposé dans le matériau d'enrobage (14), une zone partielle (22) de cet élément étant placée directement contre la source de dissipation de puissance (16) ou au moins à proximité de celle-ci, et une autre zone partielle (23) s'étendant sous une zone (20) de la surface (18) du matériau d'enrobage (14).
EP12715608.1A 2011-03-11 2012-03-08 Composant électrique comportant au moins une source de dissipation de puissance électrique disposée dans un matériau d'enrobage et un dispositif de refroidissement Ceased EP2684202A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102011013684.3A DE102011013684B4 (de) 2011-03-11 2011-03-11 Elektrisches Bauteil mit wenigstens einer in einer Vergussmasse angeordneten elektrischen Verlustleistungsquelle und einer Kühleinrichtung
PCT/EP2012/054055 WO2012123341A2 (fr) 2011-03-11 2012-03-08 Composant électrique comportant au moins une source de dissipation de puissance électrique disposée dans un matériau d'enrobage et un dispositif de refroidissement

Publications (1)

Publication Number Publication Date
EP2684202A2 true EP2684202A2 (fr) 2014-01-15

Family

ID=45992180

Family Applications (1)

Application Number Title Priority Date Filing Date
EP12715608.1A Ceased EP2684202A2 (fr) 2011-03-11 2012-03-08 Composant électrique comportant au moins une source de dissipation de puissance électrique disposée dans un matériau d'enrobage et un dispositif de refroidissement

Country Status (3)

Country Link
EP (1) EP2684202A2 (fr)
DE (2) DE202011110749U1 (fr)
WO (1) WO2012123341A2 (fr)

Families Citing this family (8)

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Publication number Priority date Publication date Assignee Title
DE202011110749U1 (de) * 2011-03-11 2016-03-10 Reo Ag Elektrisches Bauteil mit wenigstens einer in einer Vergussmasse angeordneten elektrischen Verlustleistungsquelle und einer Kühleinrichtung und Kühlkanal
DE102013105120B4 (de) 2013-05-17 2019-09-26 Reo Inductive Components Ag Elektrische und induktive Bauteile
DE202013103599U1 (de) 2013-08-09 2014-11-13 Trafomodern Transformatorengesellschaft M.B.H. Elektrisches Bauteil
DE102015103359B4 (de) 2015-03-06 2019-10-17 Reo Inductive Components Ag Modulare Vergussform und deren Verwendung
CN106229129A (zh) * 2016-08-29 2016-12-14 苏州腾冉电气设备股份有限公司 一种新型软磁大功率三相耦合电抗器
DE102017221744A1 (de) 2017-12-03 2019-06-06 Audi Ag Elektrische Maschine
CN110993261A (zh) * 2019-12-31 2020-04-10 苏州腾冉电气设备股份有限公司 高频组合电性器件及辅助供电系统
GB2597470B (en) * 2020-07-22 2023-01-11 Murata Manufacturing Co Thermal management of transformer windings

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EP1772877A1 (fr) * 2005-06-02 2007-04-11 STS Spezial-Transformatoren-Stockach GmbH & Co. KG Transformateur MF avec meilleure dissipation thermique

Also Published As

Publication number Publication date
WO2012123341A3 (fr) 2012-12-20
DE102011013684A1 (de) 2012-09-13
DE102011013684B4 (de) 2019-09-12
WO2012123341A2 (fr) 2012-09-20
DE202011110749U1 (de) 2016-03-10

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