EP2684202A2

EP2684202A2 - Electrical component comprising at least one electrical power loss source arranged in a casting compound and a cooling device

Info

Publication number: EP2684202A2
Application number: EP12715608.1A
Authority: EP
Inventors: Sven Reimann
Original assignee: Reo Train Technologies GmbH
Current assignee: Reo Train Technologies GmbH
Priority date: 2011-03-11
Filing date: 2012-03-08
Publication date: 2014-01-15
Also published as: WO2012123341A2; DE102011013684B4; WO2012123341A3; DE202011110749U1; DE102011013684A1

Abstract

The present invention relates to an electronic component comprising at least one electrical power loss source (16) arranged in a casting compound (14). According to the invention, a cooling device, preferably at least one thermally conductive part (21) which is arranged with a subregion (22) directly on or at least in the vicinity of the power loss source (16) and with at least one further subregion (23) passes beneath a surface region (20) of the surface (18) of the casting compound (14), is provided in said casting compound (14).

Description

Electrical component with at least one in one

Potting compound arranged electrical power loss source

and a cooling device

The present invention relates to an electrical component with at least one arranged in a potting electrical loss power source and a cooling device according to the preamble of claim 1,

Electrical components, eg. B. in the form of throttles or

Transformers, generate both in the core and in the winding high heat losses, so that a

Liquid cooling or forced air cooling for

Dissipation of these heat losses is required. If a choke or a transformer to achieve higher

Protective property part is potted, the heat dissipation automatically deteriorates to the environment, since the thermal conductivity of the potting compounds is usually too low to be able to forward the loss of energy quickly enough to the environment. In the transition region between the winding and the core also occur in the potting compound high

Temperature gradient on. The resulting

Temperature stresses in turn lead to strong mechanical stresses in the potting compound, which can lead to cracking or bursting of the potting compound. In the worst case, this results in that the electrical device their

Protective properties loses or even becomes inoperable. FIG. 26 shows a schematic cross-section through a perspective view of an electrical component in the form of a known potted and water-cooled,

three-phase mains choke. In this case, a winding 4, 5, 6 is arranged on a respective core 1, 2, 3. The cores 1, 2, 3 are connected to each other via a total of two yokes 7. The

only schematically indicated flat terminals of

Windings 4, 5, 6 are designated 8, 9 and 10. There are heat sink 11, 12, 13 provided, which extend between the windings 4, 5, 6 and the cores 1, 2, 3 in the manner shown. This besit zen the heat sink 11, 12, 13th

Metal pipes through which a cooling medium flows.

The entire, so far explained electrical component is arranged in a potting compound 14.

In the operation of this known electronic compo les a large part of the energy loss is removed via the cooling medium. However, much of the winding temperature can not be dissipated effectively by the liquid cooling. Since very high temperatures prevail, some of the energy lost tries to penetrate through the potting compound 14 to the outside. Because of the relatively poor thermal conductivity of the Vergs mass (eg., 0.6 to 1.2 W / m / K), the heat loss distributed only very poorly in the potting compound, so that at the transition between winding and yoke, a very high temperature gradient which leads to the already mentioned high temperature stresses. Due to a

existing glass transition temperature of the potting compound

thus arise high mechanical stresses in the

Potting compound. The potting compound can therefore quickly crack or burst, resulting in the loss of protective properties, under Circumstances even to the failure of the entire electrical

Device can lead.

Since, as described above, higher power losses due to the poor thermal conductivity of the casting compounds can not be dissipated to the extent that would be required to a more homogeneous temperature distribution within the

To achieve potting compound, many manufacturers are known to completely dispense with potting their products because they can not reduce the thermal stresses to a necessary level.

The object of the present invention is dahe in electrical components with at least one

Loss power source, which is potted in a potting compound to derive the resulting in the operation of the electrical component heat losses better and more evenly,

preferably distributed within the potting compound and / or specifically divert to a cooling medium. In other words, according to the object, the thermal management and the heat conduction in the present component are to be optimized.

This object is achieved by an electrical component having at least one arranged in a potting compound

dissolved electrical power loss source, wherein at least one cooling device is provided, which for optimizing the heat management heat from the range of

Derived loss power source. Particularly advantageous is an embodiment of the invention in which the power loss source comprises at least one arranged on a core winding or three cores, which are interconnected by a yoke, wherein on each core at least one winding is arranged.

An inventive component is preferred and effective with regard to thermal management, in which at least one heat-conducting part is provided in the potting compound as a cooling device, which is arranged with a partial region directly on or at least in the vicinity of the power loss source and with at least one further partial region below

Surface surface area of the surface of the potting compound extends. In this case, the heat conducting part particularly advantageously in the form of a Wärmeleitbleches, which preferably consists of aluminum or copper. For effective anchoring in the

Potting compound, the heat conduction profiled or

be at least partially provided with holes. The

Wärmeleitblech may be formed strip or plate-shaped. It may in a preferred embodiment) with its partial area on one side of a winding lie directly or be arranged in the vicinity thereof, wherein at least one further portion of the Wärmeleitbleches starting from the portion through the potting compound and below a surface region of the surface

Potting compound runs.

The potting compound preferably has a rectangular

Cross-section, wherein on opposite sides of the

Loss power source is arranged in each case a heat conduction, wherein in each case a heat conducting two extending from the partial area on both sides of the same comprises further subregions, one of which extends below a surface area of the surface of the Vergussraasse. The potting compound possesses another

Embodiment of the invention advantageously a rectangular cross section, wherein three cores are provided and to

opposite soaps each winding of a core each have a heat conduction. is arranged, wherein the Wärmeleitbleche the outer cores have on the outer sides of a Wärmeleitblech comprising two further portions, each of which extends below a surface area of the surface of one side of a corner region of the rectangular cross section of the potting compound, wherein the Wärmeleitbleche the outer cores the inner sides each having a Wärmeleitblech comprising two further portions, one of which in the potting compound on the inner core side facing parallel to the opposite further portion of the Wärmeleitbleches the adjacent outer core, and wherein the Wärmeleitbleche the inner core j in each case have two further subregions, one of which runs parallel to the other subregions of the adjacent outer cores. In this case, the ends of the other sections for particularly effective

Heat dissipation by 90 ⁰ bent bends have, the oak under a Oberflächenbe the other side of the

Surface of the rectangular cross-section of the potting compound extend.

The heat conducting plates can completely or partially cover the side of the winding facing them. In particular, a heat conducting sheet can cover the sides of three windings facing it, and preferably below at least one of them

Winding secured to the core of the winding, preferably screwed. For better thermal management, the cooling device comprises at least one, preferably two, opposite one another with respect to the core, between the winding and the core

arranged heat sink, the at least one, by a

Having coolant through-flow cooling channel. For even better thermal management, the cooling device includes

at least one, preferably two, with respect to the core opposite, another heat sink, which are arranged in the winding and. have at least one, can be flowed through by a cooling medium further cooling channel. The cooling passage of the heat sink and / or the further cooling passage of the further heat sink are in this case with a supply line extending from the casting compound for supplying the cooling medium and a discharge leading out of the casting compound

Deriving the cooling medium connected. A particularly effective heat dissipation is achieved when the heat sink and / or the further heat sink is thermally conductively connected to a heat conduction plate. The heat conducting plate preferably has a U-shaped profile, wherein the legs and the transverse part of the □ -shaped profile of the Wärmeleitbleches one side of the

Winding cap-shaped overlap and wherein starting from the transverse part, a tab-shaped portion of the heat conducting plate extends to the heat sink or the other heat sink. To further optimize heat dissipation, the cross portions of two ^¬ check with respect are, in a further embodiment of the invention located on the core from

Wärmeleitbleche thermally conductively connected by a voltage applied to the core base area. It can the

Base area integrally formed with the heat meleitblechen be. A further advantageous embodiment of the invention relates to a component in which the cooling device has at least one heat pipe, is derived from the cooling zone heat to a heat sink and / or another heat sink, wherein the cooling zone with the heat sink and / or with the

another heat sink is thermally conductive in connection. For heat dissipation from the winding, the heat zone .der

Heatpipe be arranged in the winding. Alternatively or additionally, the heat zone of a heat pipe embedded in the potting compound can be arranged at or in the vicinity of the winding, and the cooling zone of the heat pipe is in heat-conducting connection with a heat sink.

A development of the component according to the invention comprises a cooling device which comprises at least one cooling tube arranged in the potting compound, which is provided with one of the

Pouring out led supply line for supplying a cooling medium and connected to a guided out of the potting compound drainage for discharging the cooling medium. The cooling tube can advantageously laterally next to the winding or laterally adjacent to the windings, preferably serpentine, run. For better heat dissipation from the region of the winding, the cooling device can at least one in the winding, preferably screw or

spiral, wrapped cooling tube, which is connected to a guided out of the potting compound supply line for supplying a cooling medium and a led out of the potting compound drainage for discharging the cooling medium.

The cooling device may also take the form of one of

Coolant flowed through, sheet-like cooling element have, which is arranged in the potting compound arranged laterally at or in the vicinity of the winding. In this case, a heat conducting plate can be arranged on the outside in the vicinity of said winding for effective heat dissipation and with the

Cooling element be thermally conductively connected.

Particularly preferably, in a component according to the invention, the cuboid casting compound has a rectangular cross section, wherein the power loss source is arranged approximately in the middle of the cross section.

In the following, the invention and its embodiments will be explained in more detail in connection with the figures. Show it:

Figures la and ib schematic representations to explain the transport of the heat loss of a

Power loss source of a known electrical component to the surface of a potting compound,

Figure 2 the removal of the heat loss of

Power loss source at a corresponding

inventive electrical component,

3 shows a section through a cast in a potting thigh or core of a throttle or a

Transformer, wherein according to the invention on the outside of the winding mounted on the core optimally angled

Wärmeleitbleche are provided FIG. 4 shows a section through the cores of a three-phase choke or a three-phase transformer arranged in a potting compound,

Figure 5 shows a schematic, three-dimensional representation of the embodiment of an electrical component according to the invention according to Figure 26 with Wärmeleitblechen and heat sinks;

FIG. 6 shows a section through the electrical component of FIG. 5,

Figures 7 to 25 ^' developments of the invention and

FIG. 26 shows a known electronic component for explaining the prior art and the advantages of the present invention

Invention,

The following considerations led to the invention. In an electrical component dnet in a potting compound, the transport of heat loss in the potting compound with the help of good thermal conductivity Wärmeleitteilen or sheets can be improved by the fact that these parts or sheets on the one hand or in the immediate vicinity of one in the potting compound arranged heat source attached, attached or placed on the other hand

Run surface portions of the potting compound to transport the heat loss to the outside. Optimally, the Wärmeleitbleche be made of a metal with a thermal conductivity Leitf, such. As aluminum or copper produced. In the case of an electrical component in the form of a transformer or a throttle, the

Wärmeleitbleche outside of the winding and / or the core

be attached. The heat conducting plates must be in their

Design be designed so that they fill the largest possible area under the potting compound in the vicinity of the surface thereof in order to dissipate the heat loss and distribute evenly in the potting compound can. In this way, high, destructive temperature stresses can be avoided and also electrical components with higher power dissipation can be cast. Since the heat conducting sheets run within the potting compound and below the surface of the potting compound, the protective property, which is the

Casting compound should actually provide, advantageously not impaired. The Wärmeleitbleche need not be mounted directly on the winding or on the core, but can only run in the immediate vicinity of the winding or the core, so that a derivative of currents or a voltage setting can be avoided. For better stability, the heat conducting plates may be partially perforated with holes or profiled to ensure better anchoring within the potting compound. The

Wärmeleitbleche should be designed so that they have the largest possible area directly below the surface of the

Cover casting compound so that the heat loss can be distributed evenly. The heat conducting plates can also

angled or bent out.

Furthermore, it is conceivable for improved thermal management

Heat sink between a core and the winding of a

electronic components or to provide in the winding of a component, wherein the heat sink of a cooling medium

be flowed through. It can also be in the winding of a electronic components or in the potting compound of the same so-called heat pipes are provided for heat dissipation.

In this case, the cooling zones of the heat pipes can be connected to heat sinks which are arranged, for example, between the core of a power loss source and a winding surrounding the core. This way, in the

Heatpipes heat dissipated through the heat sink to the outside. Finally, areally formed cooling elements can also be provided on the outer surfaces of the winding or the windings of electronic components, which can be connected for optimized thermal management with Wärmeleitblechen, which are arranged in the potting compound.

The previously described measures for improved

Heat dissipation and optimized thermal management can be done individually or in combination depending on specific requirements and configurations of the electrical components.

The principle of the present invention will be described below with reference to the schematic comparison of the representations of a cast according to the prior art in a potting compound power loss and arranged according to the present invention in a potting compound, provided with Wärmeleitblechen power loss source

explained.

In the apparent manner is according to Figure la a

Power loss source 16, which is for example a winding or a choke, potted in a potting compound 14. If during operation of the electronic component Heat is generated in the region of the power loss source 16 according to FIG. 1b, this increases in the direction of the arrows 17

Transports areas of potting compound 14, which are directly adjacent to the power loss source 16. This means that according to FIG. 1b, surface 18 of potting compound 14 only heats up in surface areas 19 adjacent to power loss source 16, while those further away from power loss source 16

Surface regions 20 of the potting compound 14 is not heated.

According to FIG. 2, according to the invention, heat-conducting sheets 21 are arranged in the potting compound 14, via which a removal of the heat generated by the power loss source 16 also takes place in regions of the potting compound 14 further from this. This means that the temperature is distributed more uniformly over the potting compound 14 and over the surface 18 thereof. As a result, the internal temperature of the potting compound 14

lowered.

In the recognizable manner, the heat conducting plates 21 are designed so that they are each arranged with a portion 22 directly to the power loss source 16 or in the vicinity thereof and that each with at least one further portion 23 as large a surface area below the surface of the potting compound 14th cover. In the case of FIG. 2, the power loss source 16 is approximately in the region of the intersecting diagonals of the cross section of the electronic component or potting compound 14 of the same, ie. H. arranged approximately in the center of the cross section. Accordingly, the Wärmeleitbleche 21 are designed so that they with their

middle portion 22 directly to the loss of power source 16 abut or are arranged in the vicinity thereof and that they each with other portions 23 from the central portion 22 preferably to opposite sides thereof arcuately away from the power loss source 16 into the potting compound 14 and outwards and with the largest possible area below the surface 18 of the

Casting compound »Expediently are

opposite to both sides of the power loss source 16 such Wärmeleitbleche 21 arranged.

FIG. 3 shows an electrical device corresponding to that of FIG. 2, wherein the power loss source 16 comprises a core 24 and a winding 27 surrounding the core 24. The middle portions 22 of the Wärmeleitbleche 21 are arranged on s ch opposite sides of the winding 27 and in the vicinity thereof, while the other outer portions 23 of the Wärmeleitbleche 21, as already explained, below the surface portions 20 of the surface 18, preferably up to the respective corners of the

Potting compound 14 run.

FIG. 4 shows a section through the cores 24, 25, 26 of a three-phase choke or a three-phase choke

Transformers, wherein the windings 27, 28, 29 are arranged on the cores 24, 25, 26.

According to FIG. 4, the heat conducting sheets 21 formed corresponding to the heat-extractable sheets 21 with the partial areas 22 and 23 of FIG. 3 can each have angled portions 30 which are angled away from the partial areas 23 by 90 °, so that they are below for improved heat dissipation further surface areas 20 of the surface 18 of the

Potting compound 14 run. In particular, be there

Covered surface areas 20 different sides of the potting compound.

According to the figures 5 and 6, a three-dimensional

Representation and a section of the present electrical component show, which corresponds approximately to that of Figure 4, between the cores 24, 25, 26 and the corresponding windings 27, 28, 29 and in connection with the

Be mentioned above the prior art and the figure 26 already explained heat sink 12 may be provided. FIG. 5 also shows the yoke 15 connecting the cores 24 and 25 and the yoke 15 connecting the cores 25 and 26. The heat conducting plates 21 are in this embodiment

Preferably formed U-shaped, wherein the transverse part of the egg-shaped Wärmeleitbleche 21 respectively the central portion 22 and spaced therefrom, the further portions 23 of the heat conducting plates 21 comprises in one plane. The preferably bent by 90 ° legs of the U-shaped Wärmeleitbleche 21 correspond de outer bends 30 of the Wärmeleitbleche 21st

Figures 7 to 9 show developments of the invention, details of Figures 7 to 9, which have already been explained in connection with the other figures are in the

designated corresponding way. According to Figure 7, the

Wärmeleitblech 21 have the shape of a profile sheet or a profile plate, which is fixed with its lower side on the core 24 of the loss Leistungsquelie 21 forming throttle or a ransformators, for example with a screw 31 or the like. In this case, according to FIG. 8 the heat guide plate 21 extend over only a portion of one side of the winding 27. FIG. 9 shows an embodiment in which the heat-conducting sheet 21 extends over the entire surface of the side of three windings of the cores 24, 25, 26.

It should be noted that the heat conducting plates 21 may also include the partial region 22 and the further partial regions 23 in one plane, in which case both the partial region 22 and the partial regions 23 extend below the surface of the casting compound 14. According to FIG. Section along the line X-X of Figure 6, the two can with respect to the core 24 opposite

Wärmeleitblechen 21, 21 on the bottom side by a base portion 32 may be connected to each other, wherein the base portion 32 for further optimization of the heat dissipation from the core 24 to the Wärmeleitblechen 21 is used. The heat conducting plates 21 and the base region 32 are preferably formed in one piece. The base region can run inside or outside the potting compound 14.

In connection with FIG

Development of the invention explained in the than

Cooling device heat sink 12 are provided, wherein the heat generated by the power loss source 16 via

Wärmeleitbleche 21 is passed directly to the heat sinks 12. Details of Figure 11, which have already been explained in connection with the preceding figures are in the

designated corresponding way. The power loss source 16 is shown in FIG 11 from a core 24 on which a

Winding 27 is arranged. The heat sink 12 is preferably between the core 24 and the winding 27th arranged. Preferably, two are opposite each other. Side of the core 24 heat sink 12 provided in this way. The heatsink 12 consist in the manner shown in each case of a thermally conductive part, which consists for example of copper or another heat-conducting metal, in which at least one of a. Cooling medium durchxömter cooling passage 33 is arranged. The said cooling medium is, for example, water.

The Wärmeleitbleche 21 preferably have a U-shaped profile, wherein the legs 34 and the cross member 35 of the U-shaped profile of the Wärmeleitbleches 21 one side of

Winding 27 cap-shaped overlap and wherein starting from the cross member 35, a flap-shaped region 36 each extends directly to the adjacent heat sink 12. In this way, the heat generated on the outside of the winding 27 on the

Leg 34, the cross member 35 and the flap-shaped portion 3, passed to the heat sink 12. Preferably, they are

opposite to the winding 27 two such

Wärmeleitbleche 21 and heat sink 12 is arranged. On the bottom side, the cross members 35 according to FIG. 10 can be replaced by a

Base region 32 may be interconnected, is dissipated via the heat generated at the core 24 to the heat conducting plates 21. In this case, the base portion 32 in one piece with the

Wärmeleitblechen 21 may be formed.

FIG. 12 shows a development of the component of FIG

Figures 10 and 11, but wherein in the potting compound 14, a power loss source 16 is provided, which side by side comprises three cores 24, 25, 26, each corresponding to the. Core 24 of Figure 11 are configured. Accordingly, each core 24, 25, 26 each have a winding 27, 28 and 29, respectively. The Cooling bodies 12 provided on each core 24, 25, 26 are designed in accordance with the cooling body 12 of FIG. 11.

Likewise, at each core 24, 25, 26 Wärmeleitbleche 21 are provided which correspond to those of the component of Figure 11

correspond .

The cooling medium, which is preferably water

is the cooling channels 33 is preferably supplied to the upper side of the heat sink 12 via a feed line 37. After flowing through the cooling channels 33, the heated

Cooling medium, preferably via a drain 38 also on the upper side of the heat sink 12 removed from the cooling system. In this case, the cooling channels 33 of the heat sink 12 are preferably connected to one another on the lower sides of the heat sink 12. FIG. 13 shows the arrangement of FIG. 12 in one

perspective view, the aforementioned

Compounds of the heat sink 12 with the lead 37 and the lead 38 are clearly visible.

Figures 14 to 16 show embodiments of the present invention, in which so-called heat pipes are provided, which are used to improve the thermal management of the

Transferred heat source 16 generated heat to the heat sink 12, details of Figures 14 to 16, which have already been explained in connection with Figures 11 to 13, are designated in the corresponding manner. In the

Embodiment of Figure 14 includes the

Loss power source 16 a core 24 and a winding 27, while in the embodiment of Figures 15 and 16, three cores 24, 25, 26 and accordingly three windings 27, 28, 29 has. In the manner shown, in the embodiment of FIG. 14, between the winding 27 and the core 24 of the power loss source 16 according to FIG. 11, there are heat sinks 12

intended. Accordingly, such heatsinks 12 are also arranged in the embodiment of Figure 15 between the cores 24, 25, 26 and the windings 27, 28, 29.

According to FIGS. 14 to 16, it is conceivable to use the already mentioned heatpipes in or in the windings 24 or 24, 25, 26

39 to order. A known heat pipe is a

tubular heat exchanger, the use of the

Heat of vaporization of a liquid medium in. A

closed circuit a large amount of heat between a heat zone in which the medium evaporates, and ei ner cooling zone in which the medium condenses, can transport. In this case, the liquid, condensed medium via capillaries for

Heat zone returned. To optimize the heat management can therefore in the application of such heat pipes in the

Windings 27, 28, 29 resulting heat directly from the

Cooling zones of the heat pipes 39 are derived to the heat sinks 12. For this purpose, the cooling zones of the heatpipes 39 physically communicate with the heat sinks 12, while the heat zones of the heatpipes 39 arranged in the windings 27, 28, 29 correspond to the heat areas thereof.

According to FIG. 15, it is also conceivable to arrange heatpipes 40 in the potting compound 14 laterally next to the windings 27, 28, 29, as shown by the example of the winding 27. According to Figure 16 are the cooling zones of the heat pipes

40 physically connected to heat sinks 12, while the arranged in the potting compound 14 areas of the heat pipes 40 corresponding to the heat zones thereof. In the following, an embodiment of the invention will be explained in connection with FIGS. 17 and 18, in which, in the potting compound 14 according to FIG. 17, outside the windings 27, 28, 29 of the cores 24, 25, 26 a cooling device in the form of a cooling tube 41 is arranged to heat from the

Windings 27, 28, 20 dissipate. In this case, such cooling tubes 41 are preferably serpentine and in the

Potting compound 14 electronically insulated on opposite sides (FIG. 18) of the windings 27, 28, 29. The connections of the cooling pipe 41 are designated by 42 and 43.

According to FIGS. 19 and 20, it is also conceivable to respectively wind cooling tubes 44 directly into the windings 27, 28, 29 in order to dissipate heat generated by the windings 27, 28, 29.

Preferably, the cooling tubes 44 extend in each case

helically in the windings 27, 28, 29.

Figures 21 to 23 show embodiments of the present invention, in which for improving the thermal management in addition to the heat sinks 12, which are each arranged between a core and the associated winding, further heat sinks 13 are provided, each in the windings 27, 28, 29 are wrapped. Details of Figures 21 to 23, which have already been explained in connection with Figures 11 to 13 and 14 to 16, are in the corresponding manner

designated. In the embodiment of FIG. 21, the power loss source 16 comprises a core 24 and a winding 27, while in the embodiment of FIGS. 22 and 23 it has three cores 24, 25, 26 and accordingly three windings 27, 28, 29. In the apparent manner are in the Äusführungsform of Figure 21 between the winding 27 and the core 24 of the

Loss power source 16 heat sink 12 is provided.

Accordingly, such heatsink 12 are also in the

Embodiment of Figures 22 and 23 between the cores 24, 25, 26 and the windings 27, 28, 29 are arranged.

According to FIGS. 24 and 25, on the outside of the

Loss power source 16 and, the winding 24 and the windings 27, 28, 29 as Kühleinrichtu g of a

Coolant flowed through, sheet-like cooling element 47 may be arranged and potted in the potting compound 14, via the heat generated by the windings 27, 28, 29 can be dissipated to the outside. It is conceivable to provide the already mentioned Wärmeleitbleche 21 on the outside in the vicinity of said windings and physically connect with the cooling elements 47 in order to improve the heat transfer from the windings 27, 28, 29 to the cooling elements 47.

reference numeral

1 core

2 core

3 core

4 winding

5 winding

6 winding

7 yoke

8 flat connection

9 flat connection

10 flat connection

11 cooling channel

12 heat sinks

13 heat sink

14 potting compound

15 yoke

16 power loss source

17 arrow

18 surface

19 surface area

20 surface area

21 heat conducting sheet Subarea subarea core

core

Winding Winding Winding Unwind Screw Base section Cooling channel Leg Cross section Area Inlet Discharge Heatpipe Heatpipe Cooling pipe Connection Connection Cooling tube Connection connection cooling element

Claims

claims

1. Electrical component with at least one in one

Potting compound (14) arranged electrical

Power loss source (16), characterized in that at least one cooling device is provided which derives heat for optimizing the heat management from the area of the power loss source (16).

2. Component according to Anspruc 1, characterized in that the power loss source (16) at least one on a core (24) arranged winding (27) urnfasst.

3. Component according to claim 1, characterized in that the power loss source (16) comprises three cores (24, 25, 26) which are interconnected by a yoke (7), wherein on each core (24, 25, 26} at least a winding (27, 28, 29) is arranged.

4. Component according to one of claims 1 to 3, characterized

characterized in that at least one heat-conducting part is provided in the potting compound (14) as a cooling device, which is connected directly to a partial region (22) or at least in the vicinity of

Loss power source (16) is arranged and extends with at least one further portion (23) below a surface region (20) of the surface (18) of the potting compound (14). Component according to Claim 4, characterized in that the heat-conducting part has the form of a heat conducting plate (21), which is preferably made of aluminum or

Copper exists.

6. Component according to claim 5, characterized in that the heat conduction plate (21) for effective anchoring in the potting compound (14) is profiled or at least partially provided with holes.

7. Component according to claim 5 or 6, characterized

characterized in that the heat-conducting sheet (21)

is formed strip or plate shape.

8. Component according to one of claims 4 to 7, characterized

characterized in that the heat conduction plate (21) with its subregion (22) directly abuts or is arranged in proximity to one side of a winding (27) and that at least one further subregion (23) of the heat conducting plate (21) originates from the subregion ( 22) passes through the potting compound (14) and below a surface region (20) of the surface (18) of the potting compound (14).

9, component according to claim 8, characterized in that the potting compound (14) has a rectangular cross section, wherein three cores (2, 25, 26) are provided and on opposite sides of

Power loss source (16) in each case

Wärmeleitblech (21) is arranged, wherein in each case a Wärmeleitblech (21) two starting from the Subarea (225 on both sides of the same

extending further subregions (23) umff, each of which extends below a surface region (20) of the surface (14) of the potting compound (14).

Component according to claim 9, in conjunction with claim 3, characterized in that the potting compound (14) has a rectangular. Has cross section, wherein on opposite sides of each winding (27, 28, 29) of a core (24, 25, 26) each have a heat conducting plate (21) is arranged, wherein the heat conducting plates (21) of the outer cores on the outer sides

Wärmeleitblech (21) on iron, the other two

Subareas (23) urafasst, each of which under a surface region (20) of the surface (14) of a side of a corner region of the rectangular cross section of the potting compound (14), wherein the Wärmeleitbleche (21) of the outer cores on the inner sides each one Have Wärmeleitblech (21) comprising two further portions (23), of which in each case one in the potting compound (14) on the inner core side facing

parallel to the other one

Partial region (23) of the Wärmeleitbleches (21) of the adjacent outer core extends, and wherein the Wärmeleitbleche (21) of the inner core each have two further portions (23), one of which in each case parallel to the other portions (23) of the adjacent outer cores runs, Component according to claim 9 or 10, characterized

characterized in that the ends of the v / eiteren

Partial regions (23) have bends (30) which are bent through 90 ° and extend below a surface area (20) of the other side of the surface (18) of the rectangular cross-section of the potting compound (14),

Component according to one of claims 4 to 11, characterized in that the Wärmeleitbleche (21) completely or partially cover the side facing them of the winding (27, 28, 29),

Component according to claim 11 or 12, characterized

in that a heat-conducting sheet (21) covers the sides of three windings (27, 28, 29) facing it.

Component according to one of claims 4 to 13, characterized in that the heat-conducting sheet (21)

below at least one winding (27, 28, 29) at the core (24, 25, 26) of the winding (27, 28, 29)

fastened, preferably screwed.

Component according to one of claims 1 to 14, characterized in that the cooling device at least one, preferably two with respect to the core opposite, between the winding (27, 28, 29) and the core (24, 25, 26) arranged heat sink (12), which have at least one cooling channel (33) through which a cooling medium can flow. Component according to one of claims 1 to 15, characterized in that the cooling device comprises at least one, preferably two with respect to the core opposite, another heat sink (13) which are arranged in each case in a winding and at least one, by a cooling medium

have flow-through further cooling channel (11).

Component according to claim 15 or 16, characterized

characterized in that the cooling channel (33) of the

Heatsink (12) and / or the further cooling channel (11) of the further heat sink (13) with a from the potting compound (14) extending out lead (37) for supplying the cooling medium and one of the

Pouring compound (14) extending outgoing lead (38) are connected for discharging the cooling medium.

Component according to one of claims 15 to 17, characterized in that the cooling body (12) and / or de further heat sink (13) with a heat conducting plate (21 is thermally conductively connected.

Component according to claim 18, characterized in that the heat-conducting sheet (21) preferably has an egg-shaped profile, wherein the legs (34) and the transverse part (35) of the U-shaped profile of

Wärmeleitbleches (21) one side of the winding (27, 28, 29) overlap cap-shaped and of the Transverse part (35), starting a flap-shaped portion (36) of the Wärmeleitbleches (21) to the heat sink (12) or to the further heat sink (13) extends.

20. Component according to claim 19, characterized in that the transverse parts (35) of two with respect to the core (14, 25, 26) opposite heat conducting plates (21) by a core (24, 25, 26) adjacent the base region ( 32) are thermally conductively connected to each other.

21. Component according to claim 20, characterized in that the base region (32) integrally with the

Wärmeleitblechen (21) is formed.

22. Component according to one of claims 1 to 21, characterized in that the cooling device comprises at least one heat pipe (39) is derived from the cooling zone heat to a heat sink (12) and / or another heat sink (13), wherein the cooling zone with the heat sink (12) and / or with the further heat sink (13) is thermally conductive in connection.

23. Component according to claim 22, characterized in that the heat zone of the heat pipe (3) in the winding (27, 28, 29) is arranged.

24. Component according to claim 22, characterized in that the heat zone of the in the potting compound (14) embedded heat pipe (40) is arranged at or in the vicinity of the winding (27, 28, 29) and that the cooling zone of the heat pipe (40) with a heat sink (12) is thermally conductive in connection

Component according to one of claims 1 to 24, characterized in that the cooling device comprises at least one in the potting compound (14) arranged cooling tube (41) with an out of the potting compound (14) led out line (42) for supplying a cooling medium and one out of the potting compound (14) led out to derive the

Cooling medium is connected.

26. Component according to claim 25, characterized

in that the cooling tube (41) runs laterally next to the winding (27) or laterally next to the windings (27, 28, 29), preferably serpentine.

Component according to one of claims 1 to 26, characterized in that the cooling device comprises at least one in the winding (27, 28, 29), preferably helically or spirally wrapped cooling tube (44) with one of the potting compound (14) out guided supply line (44) for supplying a cooling medium as well as a out of the potting compound (14) led out lead (45) for discharging the cooling medium is connected. Component according to one of Claims 1 to 27, characterized in that the cooling device comprises a sheet-like cooling element (47), through which a cooling medium can flow, in the casting compound

(14) arranged laterally at or in the vicinity of the winding (27, 28, 29) is arranged.

Component according to claim 28, characterized in that a heat meleitblech (21) on the outside near said winding (2, 28, 29 and arranged with the cooling element (45) is thermally conductively connected

Component according to one of claims 1 to 29, characterized in that the cuboid-shaped potting compound (14) has a rectangular cross section, wherein the power loss source (16) is arranged approximately in the middle of the cross section.