EP2664692A3 - Plating apparatus and plating solution management method - Google Patents

Plating apparatus and plating solution management method Download PDF

Info

Publication number
EP2664692A3
EP2664692A3 EP13020015.7A EP13020015A EP2664692A3 EP 2664692 A3 EP2664692 A3 EP 2664692A3 EP 13020015 A EP13020015 A EP 13020015A EP 2664692 A3 EP2664692 A3 EP 2664692A3
Authority
EP
European Patent Office
Prior art keywords
plating solution
plating
free acid
dialysis
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP13020015.7A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP2664692A2 (en
Inventor
Yuji Araki
Masashi Shimoyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of EP2664692A2 publication Critical patent/EP2664692A2/en
Publication of EP2664692A3 publication Critical patent/EP2664692A3/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/22—Regeneration of process solutions by ion-exchange
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
EP13020015.7A 2012-05-15 2013-05-14 Plating apparatus and plating solution management method Withdrawn EP2664692A3 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012111115A JP5876767B2 (ja) 2012-05-15 2012-05-15 めっき装置及びめっき液管理方法

Publications (2)

Publication Number Publication Date
EP2664692A2 EP2664692A2 (en) 2013-11-20
EP2664692A3 true EP2664692A3 (en) 2017-02-15

Family

ID=48463682

Family Applications (1)

Application Number Title Priority Date Filing Date
EP13020015.7A Withdrawn EP2664692A3 (en) 2012-05-15 2013-05-14 Plating apparatus and plating solution management method

Country Status (6)

Country Link
US (1) US20130306483A1 (ja)
EP (1) EP2664692A3 (ja)
JP (1) JP5876767B2 (ja)
KR (2) KR20130127921A (ja)
CN (1) CN103422140A (ja)
TW (1) TW201350625A (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6022922B2 (ja) * 2012-12-13 2016-11-09 株式会社荏原製作所 Ｓｎ合金めっき装置及び方法
US20150247251A1 (en) * 2014-02-28 2015-09-03 Applied Materials, Inc. Methods for electrochemical deposition of multi-component solder using cation permeable barrier
KR101631484B1 (ko) 2014-12-19 2016-06-17 주식회사 포스코 니켈도금용액 관리 장치
CN105177646B (zh) * 2015-08-27 2017-12-08 江苏智光创业投资有限公司 一种用于生产无氰镀铜溶液的装置
KR102002342B1 (ko) * 2018-06-28 2019-07-23 김대범 도금액 교반 및 공급 장치
JP7293765B2 (ja) * 2018-07-24 2023-06-20 富士フイルムビジネスイノベーション株式会社 めっき装置
CN110161306A (zh) * 2019-05-31 2019-08-23 苏州迅鹏仪器仪表有限公司 多回路安培小时总计量仪表和电镀控制系统及方法
CN110318090B (zh) * 2019-08-08 2021-08-31 湖南金康电路板有限公司 一种印刷电路板电镀装置及电镀方法
CN111663172A (zh) * 2020-05-28 2020-09-15 甬矽电子(宁波)股份有限公司 电镀化学品监控方法、系统和装置
KR102192890B1 (ko) * 2020-07-10 2020-12-18 김춘옥 유전체 세라믹 필터 디핑 방법
JP7484865B2 (ja) * 2021-10-14 2024-05-16 トヨタ自動車株式会社 金属皮膜の成膜装置および金属皮膜の成膜方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5729600A (en) * 1980-07-26 1982-02-17 Sumitomo Metal Ind Ltd Method for adjusting ph value of electroplating bath
GB2111080A (en) * 1981-12-08 1983-06-29 Ppg Industries Inc Electrodeposition bath treatment
US5312539A (en) * 1993-06-15 1994-05-17 Learonal Inc. Electrolytic tin plating method
JP2002241991A (ja) * 2001-02-14 2002-08-28 Canon Inc 酸化亜鉛膜の成膜方法及び成膜装置
JP2005139474A (ja) * 2003-11-04 2005-06-02 Ishihara Chem Co Ltd 電気スズ合金メッキ方法

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3244620A (en) * 1964-11-02 1966-04-05 Dow Chemical Co Separation of acid from polymers by dialysis with anion-exchange membranes
DE2729387A1 (de) * 1977-06-27 1979-01-18 Schering Ag Verfahren zur kontinuierlichen aufbereitung eines galvanischen nickelbades sowie vorrichtung zur durchfuehrung des verfahrens
FI71573C (fi) * 1979-06-15 1987-01-19 Akzo Nv Foerfarande och anordning foer minskning av jaesta dryckers alkoholhalt genom dialys.
JPS5928584A (ja) 1982-08-10 1984-02-15 Asahi Glass Co Ltd 電解槽又は透析槽への液の供給方法
JPS5967387A (ja) * 1982-10-08 1984-04-17 Hiyougoken すず、鉛及びすず―鉛合金メッキ浴
US4816407A (en) * 1985-10-11 1989-03-28 Sepracor Inc. Production of low-ethanol beverages by membrane extraction
JPH01312099A (ja) 1988-06-10 1989-12-15 Asahi Glass Co Ltd 電気メッキ浴の管理方法
DE4106080A1 (de) * 1991-02-27 1991-06-20 Volker Dipl Ing Teuchert Verfahren zur automatischen regelung der konzentration eines stoffes in der aus einem zur reduzierung der konzentration dieses stoffes eingesetzten dialysators austretenden fluessigkeit
JP2559935B2 (ja) * 1991-12-20 1996-12-04 日本リーロナール株式会社 不溶性陽極を用いた錫又は錫ー鉛合金電気めっきの方法及び装置
JP2888001B2 (ja) * 1992-01-09 1999-05-10 日本電気株式会社 金属メッキ装置
JP3066675B2 (ja) * 1992-04-20 2000-07-17 富士写真フイルム株式会社 印刷版用アルミニウム板の表面処理方法
JP3213113B2 (ja) * 1993-03-15 2001-10-02 株式会社荏原製作所 はんだめっき液自動管理装置
JP3437600B2 (ja) * 1993-03-15 2003-08-18 株式会社荏原製作所 はんだめっき液自動分析方法及び装置
DE4344387C2 (de) * 1993-12-24 1996-09-05 Atotech Deutschland Gmbh Verfahren zur elektrolytischen Abscheidung von Kupfer und Anordnung zur Durchführung des Verfahrens
JP3241227B2 (ja) * 1995-02-14 2001-12-25 株式会社東芝 メッキ液自動管理装置
JPH08271497A (ja) * 1995-03-29 1996-10-18 C Uyemura & Co Ltd 電気銅めっき浴中の電解生成物濃度の測定方法
JPH0975681A (ja) 1995-09-13 1997-03-25 Japan Nuclear Fuel Co Ltd<Jnf> 拡散透析装置及び方法
US6562220B2 (en) * 1999-03-19 2003-05-13 Technic, Inc. Metal alloy sulfate electroplating baths
JP4698904B2 (ja) 2001-09-20 2011-06-08 株式会社大和化成研究所 錫又は錫系合金めっき浴、該めっき浴の建浴用又は維持・補給用の錫塩及び酸又は錯化剤溶液並びに該めっき浴を用いて製作した電気・電子部品
US7012333B2 (en) * 2002-12-26 2006-03-14 Ebara Corporation Lead free bump and method of forming the same
KR20060043958A (ko) * 2004-11-11 2006-05-16 주식회사 팬택 이동통신단말기를 이용한 설문조사 방법
CN101184870A (zh) * 2005-05-25 2008-05-21 株式会社新克 凹版滚筒用铜镀敷方法及装置
JP4812365B2 (ja) * 2005-08-19 2011-11-09 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 錫電気めっき液および錫電気めっき方法
JP4957906B2 (ja) * 2007-07-27 2012-06-20 上村工業株式会社 連続電気銅めっき方法
EP2194165A1 (en) * 2008-10-21 2010-06-09 Rohm and Haas Electronic Materials LLC Method for replenishing tin and its alloying metals in electrolyte solutions
JP5458604B2 (ja) * 2009-03-04 2014-04-02 三菱マテリアル株式会社 Ｓｎ合金めっき装置及びそのＳｎ成分補給方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5729600A (en) * 1980-07-26 1982-02-17 Sumitomo Metal Ind Ltd Method for adjusting ph value of electroplating bath
GB2111080A (en) * 1981-12-08 1983-06-29 Ppg Industries Inc Electrodeposition bath treatment
US5312539A (en) * 1993-06-15 1994-05-17 Learonal Inc. Electrolytic tin plating method
JP2002241991A (ja) * 2001-02-14 2002-08-28 Canon Inc 酸化亜鉛膜の成膜方法及び成膜装置
JP2005139474A (ja) * 2003-11-04 2005-06-02 Ishihara Chem Co Ltd 電気スズ合金メッキ方法

Also Published As

Publication number Publication date
JP2013237894A (ja) 2013-11-28
KR20130127921A (ko) 2013-11-25
CN103422140A (zh) 2013-12-04
TW201350625A (zh) 2013-12-16
US20130306483A1 (en) 2013-11-21
EP2664692A2 (en) 2013-11-20
JP5876767B2 (ja) 2016-03-02
TWI560325B (ja) 2016-12-01
KR20160098144A (ko) 2016-08-18

Similar Documents

Publication Publication Date Title
EP2664692A3 (en) Plating apparatus and plating solution management method
WO2014168778A3 (en) Cosolvent electrolytes for electrochemical devices
MX2016004824A (es) Metodo y aparato para medir estado de carga transitorio usando potenciales de entrada/salida.
Caprarescu et al. Separation of copper ions from synthetically prepared electroplating wastewater at different operating conditions using electrodialysis
EP2559666A3 (en) pH gradients controlled by electrolysis, and their use in isoelectric focusing
WO2016124921A3 (en) Electrolyte for electroplating
WO2014025926A3 (en) Controlling the location of product distribution and removal in a metal/oxygen cell
EP2169396A3 (en) Electrochemical method for detecting boron in water
WO2012028416A3 (en) Gallium and indium electrodeposition processes
CN202185260U (zh) 一种正向渗透设备
CN205253143U (zh) 易定容的容量瓶
CN203256358U (zh) 一种铂催化网的电镀设备
CN202626340U (zh) 一种柱状零件的局部电镀用设备
CN202671688U (zh) 一种电镀槽
CN204097586U (zh) 多功能电解槽装置
CN205275769U (zh) 一种pcb电镀药水自动添加装置
EP2600447A3 (en) Electrochemical device using magnesium element-containing negative electrode
CN204491011U (zh) 基板电镀系统
FR2960791B1 (fr) Dispositif ameliore de limitation des consequences d&#39;un incendie generalise dans un local
WO2009014165A1 (ja) コロイド分散液の濃縮方法
CN204086101U (zh) 海水中涂层耐阴极剥离性能测试仪
CN203890478U (zh) 一种可同时电镀四个样品的恒温电解池
CN203247323U (zh) 高克重电镀锌层装置
CN211955153U (zh) 一种电镀盐雾测试装置
WO2014076664A3 (fr) Procédé de traitement de surface, cuve et machine mettant en oeuvre le procédé

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

RIC1 Information provided on ipc code assigned before grant

Ipc: C25D 3/60 20060101ALI20160926BHEP

Ipc: C25D 17/00 20060101ALN20160926BHEP

Ipc: C25D 21/12 20060101ALI20160926BHEP

Ipc: C25D 21/14 20060101ALI20160926BHEP

Ipc: C25D 3/30 20060101AFI20160926BHEP

Ipc: C25D 21/22 20060101ALI20160926BHEP

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

AK Designated contracting states

Kind code of ref document: A3

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

RIC1 Information provided on ipc code assigned before grant

Ipc: C25D 3/30 20060101AFI20170106BHEP

Ipc: C25D 21/14 20060101ALI20170106BHEP

Ipc: C25D 21/22 20060101ALI20170106BHEP

Ipc: C25D 21/12 20060101ALI20170106BHEP

Ipc: C25D 3/60 20060101ALI20170106BHEP

Ipc: C25D 17/00 20060101ALN20170106BHEP

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION HAS BEEN PUBLISHED

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20170817