EP2635099A3 - Elektronische Vorrichtung und Verbindungsverfahren für Leiterplatte - Google Patents

Elektronische Vorrichtung und Verbindungsverfahren für Leiterplatte Download PDF

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Publication number
EP2635099A3
EP2635099A3 EP12194577.8A EP12194577A EP2635099A3 EP 2635099 A3 EP2635099 A3 EP 2635099A3 EP 12194577 A EP12194577 A EP 12194577A EP 2635099 A3 EP2635099 A3 EP 2635099A3
Authority
EP
European Patent Office
Prior art keywords
connector
circuit board
printed circuit
electronic device
connection method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP12194577.8A
Other languages
English (en)
French (fr)
Other versions
EP2635099A2 (de
EP2635099B1 (de
Inventor
Shohei HASHIMOTO
Takeshi Nishiyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of EP2635099A2 publication Critical patent/EP2635099A2/de
Publication of EP2635099A3 publication Critical patent/EP2635099A3/de
Application granted granted Critical
Publication of EP2635099B1 publication Critical patent/EP2635099B1/de
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0015—Orientation; Alignment; Positioning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H05K7/1418—Card guides, e.g. grooves
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1424—Card cages
    • H05K7/1425—Card cages of standardised dimensions, e.g. 19"-subrack
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
EP12194577.8A 2012-02-29 2012-11-28 Elektronische Vorrichtung und Verbindungsverfahren für Leiterplatte Not-in-force EP2635099B1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012044591A JP5924028B2 (ja) 2012-02-29 2012-02-29 電子機器、及びプリント基板の接続方法

Publications (3)

Publication Number Publication Date
EP2635099A2 EP2635099A2 (de) 2013-09-04
EP2635099A3 true EP2635099A3 (de) 2017-08-02
EP2635099B1 EP2635099B1 (de) 2018-10-31

Family

ID=47562984

Family Applications (1)

Application Number Title Priority Date Filing Date
EP12194577.8A Not-in-force EP2635099B1 (de) 2012-02-29 2012-11-28 Elektronische Vorrichtung und Verbindungsverfahren für Leiterplatte

Country Status (5)

Country Link
US (1) US9113566B2 (de)
EP (1) EP2635099B1 (de)
JP (1) JP5924028B2 (de)
KR (1) KR101408543B1 (de)
CN (1) CN103298308B (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9652000B1 (en) * 2015-11-05 2017-05-16 Super Micro Computer Inc. Converter
JP6308694B2 (ja) * 2016-01-29 2018-04-11 太陽誘電株式会社 テーピング装置、並びに、テーピング装置用部品供給ユニット
JP6848587B2 (ja) * 2017-03-27 2021-03-24 日本電気株式会社 挿抜装置、交換ユニット、および、情報処理システム
CN107592731A (zh) * 2017-09-19 2018-01-16 广东欧珀移动通信有限公司 一种电路板的制备方法、电路板拼板及电子设备
CN108463082B (zh) * 2018-04-25 2024-01-16 咸宁职业技术学院 一种电路板组件
TWI745951B (zh) * 2020-05-06 2021-11-11 佳世達科技股份有限公司 電路板的固定結構

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6317329B1 (en) * 1998-11-13 2001-11-13 Hewlett-Packard Company Data storage module alignment system and method
JP2006237487A (ja) * 2005-02-28 2006-09-07 Yaskawa Electric Corp ユニット位置決め装置

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3899721A (en) * 1974-03-20 1975-08-12 Bell Telephone Labor Inc Printed circuit card guide
JPS61173188U (de) 1985-04-16 1986-10-28
JPH0731596Y2 (ja) * 1986-09-18 1995-07-19 トヨタ自動車株式会社 プリント基板収納ケース
JPH0234991A (ja) 1988-07-25 1990-02-05 Matsushita Electric Ind Co Ltd プリント基板取付装置
JPH0227790U (de) * 1988-08-11 1990-02-22
JPH0719188Y2 (ja) * 1989-06-02 1995-05-01 富士通株式会社 プリント基板の挿脱構造
US5019948A (en) * 1989-11-10 1991-05-28 Hewlett-Packard Company T-rail printed circuit board guide and support
JPH0518081U (ja) * 1991-08-13 1993-03-05 富士通株式会社 プリント板
GB9205087D0 (en) * 1992-03-09 1992-04-22 Amp Holland Sheilded back plane connector
SE503000C2 (sv) * 1994-06-10 1996-03-11 Ericsson Telefon Ab L M Skenarrangemang
KR19990007707U (ko) * 1997-07-31 1999-02-25 윤종용 오디오/비디오의 인쇄회로기판 록킹구조
JP3432712B2 (ja) * 1997-08-28 2003-08-04 富士通株式会社 シェルフユニットのガイドプレート構造
US6359788B1 (en) * 1998-07-02 2002-03-19 Ap Labs Circuit board card cage with one-piece, integral card guide units
TW455819B (en) * 1998-08-05 2001-09-21 Matsushita Electric Ind Co Ltd IC card read/write apparatus
JP3732727B2 (ja) * 2000-08-15 2006-01-11 ヒロセ電機株式会社 電気コネクタ
JP2005019861A (ja) * 2003-06-27 2005-01-20 Kyocera Corp プラグイン式電子機器
US7324349B2 (en) * 2005-04-26 2008-01-29 Dell Products L.P. Method and apparatus for coupling a modular component to a chassis
CN2809949Y (zh) * 2005-06-10 2006-08-23 富士康(昆山)电脑接插件有限公司 背板连接器
US7679924B2 (en) * 2005-10-17 2010-03-16 Alcatel Lucent Configurable chassis guidance system and method
JP5146278B2 (ja) * 2008-11-18 2013-02-20 富士通株式会社 プリント基板およびプリント基板搭載構造
WO2011050277A2 (en) * 2009-10-23 2011-04-28 Molex Incorporated Right angle adaptor
US8062075B2 (en) * 2009-11-24 2011-11-22 Delta Electronics, Inc. Power connector having a signal detecting terminal on a separation member
JP2011155163A (ja) * 2010-01-28 2011-08-11 Hitachi Kokusai Electric Inc 通信機器の配線基板実装構造
JP2011254052A (ja) * 2010-06-04 2011-12-15 Fujitsu Ltd 基板ユニットの挿入緩衝構造

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6317329B1 (en) * 1998-11-13 2001-11-13 Hewlett-Packard Company Data storage module alignment system and method
JP2006237487A (ja) * 2005-02-28 2006-09-07 Yaskawa Electric Corp ユニット位置決め装置

Also Published As

Publication number Publication date
EP2635099A2 (de) 2013-09-04
CN103298308B (zh) 2016-02-24
KR101408543B1 (ko) 2014-06-17
JP5924028B2 (ja) 2016-05-25
US20130223027A1 (en) 2013-08-29
KR20130100043A (ko) 2013-09-09
US9113566B2 (en) 2015-08-18
CN103298308A (zh) 2013-09-11
EP2635099B1 (de) 2018-10-31
JP2013182953A (ja) 2013-09-12

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