Classifications

• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
  • C23F1/00—Etching metallic material by chemical means
  • C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
  • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
  • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
  • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
  • B05B13/04—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
  • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
  • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
  • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
  • B05B13/04—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation
  • B05B13/0447—Installation or apparatus for applying liquid or other fluent material to conveyed separate articles
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
  • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Definitions

• the invention relates to an apparatus and a method for spraying a substrate.
• the surface treatment such as spraying a substrate with a fluid
• high demands are placed on the achievable accuracy of the treatment on the one hand, on the other hand, the duration of treatment should be as short as possible for reasons of economy.
• the surface treatment may include cleaning or rinsing, film winding, copper etching, resist stripping or the like.
• the person skilled in the art chooses a compromise of achievable accuracy of the printed conductors and duration of treatment. In practice, good results can be achieved with it. With increasing reduction of the dimensions of interconnect widths and interconnect distances to each other, however, creates the difficulty that the areas between the interconnects are not completely freed from copper, so that between the tracks an electrical short circuit can occur. By reducing the intensity of the etching treatment, it is possible that even in narrow areas between printed conductors a sufficient mass transfer succeeds. However, the treatment time increases considerably. Furthermore, with relatively small dimensions of the interconnect distances, an error pattern is added to one another, which does not occur with larger distances between the interconnects. This
• CONFIRMATION COPY Error pattern can be described as follows: It is common for a printed circuit board base material to be roughened on its surface. The subsequently applied by lamination copper layer can be in the recesses on the surface of the Leiterplattenbasismateri- as well anchored mechanically, so that not only a copper layer with an average thickness, but also fine ramifications of copper in the surface edge of the printed circuit board base material arise. If the etching is carried out by spraying by means of an etching fluid onto the surface of the printed circuit board, it is usually possible for the copper to be removed down to the surface of the printed circuit board base material from interconnects which are adjacent to one another and relatively close to one another.
• the device according to the invention for spraying a surface of a substrate has at least one first spray nozzle for the supply of a fluid to the surface of the substrate to be treated, wherein the first spray nozzle is arranged at a first distance from the substrate.
• the device has at least one second spray nozzle, which is arranged at a second distance from the substrate, wherein a ratio of the second distance to the first distance in a range of 0.1 to 0.8.
• at least a first volume flow of the fluid is passable through the at least one first spray nozzle, wherein at least a second volume flow of the fluid is passable through the at least one second spray nozzle and the ratio of second volume flow to first volume flow in a range from 0.005 to 0.5 is.
• the at least one first spray nozzle at a first distance from the surface of the substrate a surface treatment of the substrate can take place in the usual way.
• the at least one second spray nozzle at a second distance is achieved that it is arranged closer to the surface of the substrate and thus another mass transfer between the fluid and the surface of the substrate can be achieved than with the first spaced first spray nozzle.
• According to the invention passes through the second spray nozzle only a fluid volume flow, which is 0.005 to 0.5 times the first fluid volume flow.
• the copper in the fine pits on the surface of the board base material can be well achieved.
• the smaller fluid volume flow through the second spray nozzle is sufficient to attack and dissolve the small amounts of copper in the recesses, so that a higher accuracy of the structures to be produced on the surface of the substrate is achieved with a short processing time.
• At least one first spray nozzle with a first fluid volume flow and first distance to the substrate and at least one second spray nozzle with a smaller fluid volume flow at a closer distance to the surface of the substrate than the first spray nozzle is provided, so that in the inventive Device combines intense and "coarse" etching with a weaker and finer etch.
• the lower fluid volume flow of the second spray nozzle can be achieved, for example, by another type of nozzle in which a fine atomization of the fluid occurs and thus very many and fine fluid droplets emerge from the spray nozzle. This increases the surface area of the fluid which is effective for a chemical reaction and which is advantageous for etching off fine deposits of copper in the surface area of the printed circuit board base material.
• the substrate can be individually inserted into the device, then sprayed and removed from the device after completing the spraying.
• the device is preferably designed such that the substrate can be transported through the device from an input side with an inlet opening to an outlet side with an outlet opening.
• the device can be used as a continuous system in which simultaneously with the surface treatment, the substrate to be treated at a predetermined constant speed is transported through the device.
• the device is also suitable as a module in a production line.
• the device may be designed in such a way that the substrate to be treated is sprayable first of all by the at least one first spray nozzle, then by the at least one second spray nozzle and then by at least one third spray nozzle, the third spray nozzle being at a third distance from the first spray nozzle Substrate and the third distance is equal to the second distance or greater than the second distance.
• the usual spraying of the surface of the substrate takes place with the first spray nozzle.
• the second spray nozzle which is arranged closer to the substrate than the first spray nozzle, a finer treatment of the surface of the substrate can take place.
• the third spray nozzle is intended to remove as completely as possible the reaction products produced by the treatment by the second spray nozzle.
• the third spray nozzle can be arranged at the same distance or preferably at a greater distance than the second spray nozzle.
• the fluid volume flow through the third spray nozzle is preferably higher than through the second spray nozzle, so that the reaction products can be removed in a short time.
• the device has a first half with the input side and a second half with the output side, wherein the at least one second spray nozzle is arranged only in the second half of the device.
• the at least one second spray nozzle is arranged only in the second half of the device.
• the second spray nozzle is arranged in the device in the last quarter of the second half relative to the treatment path, so that the substrate is treated by the at least one second spray nozzle after passing through about 75% of the width of the device.
• the spraying of the substrate is particularly effective if one of the at least one first spray nozzle and one of the at least one second spray nozzle are adjacent to one another and spaced apart such that a spray area of the first spray nozzle does not touch a spray area of the second spray nozzle.
• the invention also relates to a method for spraying a surface of a substrate, wherein a fluid, which preferably has an ozone-enriched etching medium or a liquid activating the surface of the substrate, is conveyed by at least one first spray nozzle onto the surface of the substrate to be sprayed the at least one first spray nozzle is disposed at a first distance from the substrate, and fluid is conveyed through at least one second spray nozzle at a second distance from the substrate, wherein a ratio of the second distance to the first distance is in a range of 0.1 to 0 8, wherein at least a first volume flow of the fluid passes through the at least one first spray nozzle, and at least a second volume flow of the fluid passes through the at least one second spray nozzle, the ratio of the second volume flow to the first volume flow in a range of 0.005 to 0 , 5 lies.
• the substrate can be transported through the device from an input side with an inlet opening to an outlet side with an outlet opening, wherein the substrate viewed in the transport direction first by means of the at least one first spray nozzle, then by means of the at least one second spray nozzle and thereafter by means of at least one third spray nozzle, which has a third distance from the substrate, are sprayed, wherein the third distance is equal to or preferably greater than the second distance.
• the device can be used in a continuous line at a constant transport speed, wherein the third spray nozzle causes the reaction products, which are caused by the use of the second spray nozzle, are effectively removed.
• FIG. 1 shows a schematic illustration of a first embodiment of the device according to the invention
• FIG. 1 shows a schematic representation of a first embodiment of the device 50 according to the invention.
• the device comprises a container 1 with support elements 2, on which a flat substrate 3 to be treated, such as a printed circuit board, is arranged.
• a fluid 4 for etching the substrate 3 wherein the fluid 4 can be conveyed by means of a line 5 to a pump 6.
• the fluid 4 can be passed through an additional line 7 to an ozone generator 8, where it is enriched with ozone to spray tubes 9 and 10 transported.
• the spray pipes 9 and 10 are provided with spray nozzles, from which the fluid 4 can be sprayed in the direction of the substrate 3.
• the spray tube 9 at least a first spray nozzle 90, which is arranged at a distance 91 to the substrate.
• the second spray tube 10 has at least one second spray nozzle 100, which is arranged at a distance 101 from the substrate 3. In the embodiment shown in Fig. 1, the ratio of the distance 101 to the distance 91 is about 0.5. If the substrate 3 is transported in the form of a printed circuit board in the container 1 from left to right, see arrow 20, first a spray treatment of the circuit board by the at least one first spray nozzle 90. In a further movement in the direction of arrow 20, the circuit board enters the Spray area of the at least one second spray nozzle 100, which is arranged at a distance 101 closer to the surface of the substrate 3. According to a development of the invention, 9 further spray tubes 9 can be provided with further spray nozzles 90 at the same distance 91 to the circuit board 3 adjacent to the spray tube.
• the first spray nozzle 90 may preferably be a fan jet nozzle with a spray angle of 30 to 90 degrees, which allows a maximum fluid flow rate of 1 to 5 liters per minute at a fluid pressure of 2 bar.
• the second spray nozzle 100 may be a cone jet nozzle with a spray angle of 120 degrees and a maximum fluid flow rate of 0.3 to 0.9 liters per minute at a fluid pressure of 2 bar.
• the second spray nozzle may also be a fan jet nozzle with a maximum fluid flow rate of 0.05 to 0.1 liters per minute at a fluid pressure of 2 bar.
• the second spray nozzle is designed in such a way that the spray jet forms a finely atomized spray with fine spray droplets.
• FIG. 2 shows a second embodiment of a device 51 according to the invention, wherein, unlike the first embodiment shown in FIG. 1, a plurality of first spray tubes 9 with first spray nozzles 90 arranged parallel to one another and a third spray tube 11 with at least one third spray nozzle 110 are provided.
• the second device 51 has an input side 30 with an inlet opening 31 in the container 1 and an output side 32 with an output port 33.
• the substrate 3 to be treated can thus be transported from an inlet side 30 through the inlet opening 31 into the container 1 and transported on the outlet side 32 through the outlet opening 33, so that the device 51 can form a module in a conveyor system with a constant transport speed.
• the substrate 3 is first sprayed on entering the container 1 by first spray nozzles 90. Only after passing through about 75% of the container width 40, the substrate 3 passes under the spray region of the second spray nozzle 10, which is arranged closer to the substrate 3.
• a third spray nozzle 110 is placed at a distance 11 1 away from the substrate 3, wherein the distance 111 is greater than the distance 101.
• the area previously sprayed by the second spray nozzle 90 can be well rinsed away so that reaction products, for example, are carried away in the interstices of printed conductors.
• the container 1 has a first half, see in Fig. 2 in phantom line 41, with the input side 30 and a second half, see in Fig. 2 dash-dotted line 42, with the output side 32, wherein the at least one second spray nozzle 10 only in the second half 42 of the device 51 is arranged.
• This ensures that the fine treatment of the substrate surface does not take place at the beginning, but only in the second half of the treatment time.
• this fine treatment of the substrate surface takes place only towards the end of the treatment time in a last quarter of the second half 42.
• FIG. 3 shows a cross section in the upper view and a plan view of a substrate 3 in the lower view.
• the substrate 3 has a base material 60, with a printed circuit board, for example FR 4, with a laminated copper layer 61.
• the copper layer 61 is also contained in recesses 63 of the surface of the base material 60.
• a resist material 62 is applied on individual areas of the copper layer 61.
• the etching treatment of the circuit board 3 by means of the first spray nozzles 90 the areas adjacent to the resist 62 are etched until a channel 64 is formed to the surface of the circuit board, see the cross-sectional view in FIG. 4.
• the copper in the recesses 63 is then still present and forms fine branches 65, as can be seen in the plan view of Fig. 4.
• These ramifications 65 can extend from one printed conductor 66 to the adjacent printed conductor 67, so that an electrical short circuit between the two printed conductors 66 and 67 is possible.
• the copper residues in the recesses 63 can be removed so far by the method according to the invention that no branches 65 occur, see reference numeral 68. This makes it possible to produce electrical short circuits or a spark generated due to the blurred edge width of the printed circuit Avoid high signal noise during charge transport through a trace.

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• Chemical & Material Sciences (AREA)
• Engineering & Computer Science (AREA)
• Materials Engineering (AREA)
• Chemical Kinetics & Catalysis (AREA)
• General Chemical & Material Sciences (AREA)
• Mechanical Engineering (AREA)
• Metallurgy (AREA)
• Organic Chemistry (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Manufacturing & Machinery (AREA)
• Manufacturing Of Printed Circuit Boards (AREA)
• Weting (AREA)
• Cleaning By Liquid Or Steam (AREA)
• ing And Chemical Polishing (AREA)

Applications Claiming Priority (2)

Publications (1)

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• 2010
  • 2010-04-01 DE DE102010013909A patent/DE102010013909A1/de not_active Ceased
• 2011
  • 2011-03-31 JP JP2013501631A patent/JP2013524007A/ja active Pending
  • 2011-03-31 CN CN2011800177824A patent/CN103097584A/zh active Pending
  • 2011-03-31 EP EP11722992A patent/EP2553146A1/de not_active Withdrawn
  • 2011-03-31 KR KR1020127028821A patent/KR20130018842A/ko not_active Withdrawn
  • 2011-03-31 WO PCT/DE2011/000350 patent/WO2011120509A1/de active Application Filing
  • 2011-03-31 US US13/638,162 patent/US20130011568A1/en not_active Abandoned

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