WO2008011870A1 - Verfahren und vorrichtung zum beschleunigten nasschemischen behandeln von oberflächen - Google Patents
Verfahren und vorrichtung zum beschleunigten nasschemischen behandeln von oberflächen Download PDFInfo
- Publication number
- WO2008011870A1 WO2008011870A1 PCT/DE2007/001306 DE2007001306W WO2008011870A1 WO 2008011870 A1 WO2008011870 A1 WO 2008011870A1 DE 2007001306 W DE2007001306 W DE 2007001306W WO 2008011870 A1 WO2008011870 A1 WO 2008011870A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- treatment liquid
- spray jet
- nozzle
- treatment
- interrupting means
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/068—Apparatus for etching printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0736—Methods for applying liquids, e.g. spraying
- H05K2203/0746—Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1492—Periodical treatments, e.g. pulse plating of through-holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1509—Horizontally held PCB
Definitions
- the invention relates to the wet-chemical treatment of the surface of goods by means of sprayed or sprayed treatment liquid.
- the equipment required for this purpose may be immersion bath systems or continuous flow systems. From stationary, moving or oscillating nozzles or nozzle sticks, the treatment liquid flows against the surface of the material to be treated. It is the goal that with the smallest possible treatment time a precise treatment result is achieved. This is a contradiction in the practice of surface treatment. With increasing treatment intensity, ie shorter treatment time, the precision of the result decreases.
- Typical application examples for surface treatment exist in printed circuit board technology. There are several processes in which the invention can be used to advantage. By way of example cleaning or rinsing, film or resist development, copper etching, film or resist stripping and metal resist etching are mentioned.
- the document DE 31 04 522 A1 describes an inhibitor which is added to the etching solution.
- the inhibitor forms a protective skin as a flank protection on the ⁇ tzflanken of the structures, whereby the lateral ⁇ tzangriff should be reduced.
- This method requires individual inhibitors for the respective processes, which is contrary to a general distribution.
- Another method for etching layers of different thicknesses on the two sides of a flat carrier article describes the document DE 199 08 960 C2.
- the individual treatment time on each side of the Carrier object is set in proportion to the thickness of the layer to be etched. This is done by time interruptions of the treatment when a smaller time compared to the longest required treatment time is needed. For the maximum layer thickness to be processed, the duration of the interruptions can be zero.
- a method for reducing the edge attack during etching describes the document DE 101 54 886 A1.
- the metal removal takes place in two process steps. First, the metal is electrolytically removed by applying a pulsed electric field. This etching preferably takes place in the depth of the etching channel. The flanks are less attacked. For the complete electrolytic etching of the channels, the electrical connection of individual structures is lost when a certain depth of the etch channels is reached. Therefore, the areas at the bottom of the etch channels must be chemically etched in a further process, which requires additional technical effort.
- the object of the invention is to propose a method and a device which enable wet-chemical processes for the precise treatment of structures on surfaces with simultaneously small treatment time.
- FIG. 1 schematically shows the basic principle for the accelerated wet-chemical treatment of surfaces. - A -
- Figure 2 a shows a detail of a first embodiment with a rotating
- FIG. 2 b shows the interruption means of FIG. 2 a in detail.
- FIG. 3 shows a further exemplary embodiment in two views with a rotating cylinder as interrupting means.
- FIG. 4 shows the development of the rotating cylinder of FIG. 3 in two
- Figure 5 shows an embodiment of the invention with a vibrating interrupting means in two positions thereof.
- Figure 1 flows from an opening or nozzle 1, a jet 2 of the treatment liquid, which chops from a moving and provided with openings interruption means 3, that is interrupted regularly recurring.
- the cyclically interrupted jet passes as active ray 4 hydrodynamically pulsating to the surface 5 of the material 6 to be treated.
- This liquid is referred to below as the active liquid 8.
- the unused treatment liquid arising in the pauses between pauses at the interruption means 3 should be referred to as dummy liquid 9.
- This blind liquid 9 is largely kept away from the interrupting means 3 by the surface 5 of the material 6 to be treated. This reduces adhering treatment liquid on the surface 5 of the material 6.
- the dynamic influence of the interrupted and pulsating active jet 4 in the chemical treatment is substantially increased.
- this active jet 4 namely a constant impact and penetration of the wetted with treatment liquid surface 5 is achieved on the surface to be treated 5 of the product.
- This impact decisively promotes the actual wet chemical process by reducing the thickness of the diffusion layer.
- This hydrodynamic support is helpful for all of the above processes, including rinsing processes.
- the impact effect makes it possible to almost halve the treatment time.
- a significant advantage is that the precision in a structure treatment is not adversely affected. This is very surprising because previous methods for accelerating the wet-chemical processes adversely affect the quality of the treatment results.
- the cyclic interruption of the treatment beams is carried out at a frequency which is at least 0.5 Hz, preferably 10 Hz to 100 Hz or greater.
- the pulse / pause ratio is 10: 1 to 1:10, preferably 2: 1 to 1: 2.
- the drive of the interruption means electromotive, electromagnetically, pneumatically, hydraulically or by other Aktorbetuschistsmittel done.
- the invention can be combined in combination with other known measures for improving the wet-chemical treatment result, for example with inhibitors in the treatment liquid.
- the treatment liquid remaining in the etching channel is depressurized and the active ray 4 penetrates the thinner diffusion layer at a greater depth.
- the so-called HDI technique the required etching depth of the etching channels reaches the width of the conductor tracks. This represents a major challenge for all processes of printed circuit board technology.
- the pulsating treatment of the deep structural channels largely avoids the otherwise usual pressure build-up of the treatment liquid. As a result, the flanks of the structures are processed much less wet-chemically than the reason of the structural channels.
- the distance of the nozzles 1 to the surface 5 of the material 6 was in the etching tests with printed circuit boards 100 mm. At a pressure of 3 bar was the Flow rate of treatment liquid through each of the 30 ° cone nozzles 1.6 liters per minute.
- FIG. 2 a partially shows a tubular spray lance 10 which is equipped with at least 5 of a series of nozzles 1.
- nozzles In place of the nozzles, only holes with e.g. 0.5 mm to 3 mm diameter as nozzle openings.
- the treatment liquid flows through the inlet 7 under pressure into the nozzle 10 and from the nozzles 1 distributed under pressure again from.
- the pressure can vary within a wide range. Depending on the process, the structural dimensions and the positioning at the bottom or top of the goods to be transported, it can be 1, 1 to 100 bar.
- In front of the nozzles 1 there is a rotatably mounted interrupting means as perforated or slotted perforated disk 11.
- the perforated disk 11 is provided with erected drivers 12, against which a part of the jet 2 of the treatment liquid 5 is directed. As a result, the perforated disc is set in rotation.
- the perforated disc 11 chops the jet 2, so that the treatment liquid reaches the surface 5 of the material 6 in the form of a pulse in the form of an effective jet 4.
- Shown is a perforated disc 11 for each two nozzles 1.
- the two nozzles 1 are according to the direction of rotation of the perforated disc 11 different 0 inclined arranged on the nozzle 10 so that both contribute to drive the perforated disc.
- openings 13 as holes or slots. Details of the perforated disc 11, the figure 2 b in two views.
- the interruption means may also be provided as a perforated or slotted strip axially in front of the nozzles or holes over the entire length of a nozzle
- the strip is moved in the axial direction cyclically to interrupt the beam 2.
- the nozzle sticks 10 may be e.g. in a continuous system with horizontal or vertical transport of the goods 6 stationary at a distance of e.g. 100 mm are arranged in the transport direction. You can, however, also move
- FIG. 3 shows in detail a further nozzle assembly 10 with nozzle holes 14, which, however, could also be equipped with nozzles.
- a cylinder 15 is rotatably mounted, which is provided with slots 16 or holes. The holes in the cylinder 15 are arranged on the circumference congruent to the holes in the nozzle 10.
- the slots 16 or holes are provided on both sides within the cylinder 15 with a collar 17.
- These collars 17 serve as a contact surface for the slightly obliquely directed beams 2, whereby the cylinder is set in rotation.
- the collars 17 very advantageously catch the treatment liquid, which should not reach the surface 5 of the material 6 during the pauses in the pulse. It would disadvantageously increase the wetting of the surface of the material there.
- the treatment liquid is discharged laterally out of the cylinder. By slight inclination of the nozzle 10 and the cylinder 15, the lateral flow of this treatment liquid can be accelerated. Thus, this treatment liquid does not reach the surface of the material. As a result, the wetting of the surface to be treated is minimized, which enhances the impact described.
- This device is particularly advantageous for wet-chemical treatment of the top of Good, if this is transported horizontally through a continuous system. Unnecessary treatment liquid is kept away from the top of the product.
- the cylinder can be stored at the ends of the nozzle.
- each can serve a roller bearing 18 which is chemically resistant in the treatment liquid used in each case. Suitable are eg ball bearings made of plastic or ceramic.
- the cylindrical interrupting means as well as other interrupting means can be set in motion by an electric, pneumatic or hydrodynamic drive.
- the speed is independent of the physical properties of the beams 2.
- the active jet at high pressure of the inlet 7 is in a rapid sequence of highly accelerated Drop the treatment liquid over. This is particularly effective for the wet chemical process.
- engines are suitable because of the harsh atmosphere especially air-cooled engines or appropriately protected electric motors.
- Electrical and electronic control means of the wet chemical plant adjust the process parameters depending on the required treatment of the material, including the choice of the interruption frequency and the pulse / pause ratio of the active ray 4th
- FIG. 4 shows the development of the cylinder 15 in two views.
- webs 19 can be arranged between nozzle positions such that the beams 2 are not obstructed.
- an elastic material may be inserted as damper 20 on the bottom. This damper 20 reduces uncontrolled spraying of the treatment liquid upon impact with the inner wall of the cylinder. This simultaneously accelerates the lateral outflow of the treatment liquid from the cylinder 15.
- FIGS. 5a and 5b show a nozzle 1 with an interrupting means 3 as a vibrating plate 21. This elastic constructional element is clamped in a fixed point 23. It is arranged in front of the nozzle 1 that the jet 2 hits the upper end of the plate 21.
- the beam is deflected.
- the plate is bent in the beam direction, whereby a passage 22 in the plate 21 passes in the beam direction.
- FIG. 5 b This situation is shown in FIG. 5 b.
- the passage 22 releases the way to the surface of the goods 6.
- the material is suddenly reached by the treatment liquid as active ray.
- the dynamic pressure on the plate 21 is lost. It is thus abruptly back to the starting position, as shown in Figure 5 a.
- the jet 2 of the treatment liquid is deflected as a blind jet and collected by a collecting channel 24.
- the gutter 24 directs the treatment liquid, which should not reach the surface of the material laterally and transversely to the nozzle.
- this embodiment of the invention is also suitable for the treatment of goods on both sides horizontal transport of the same.
- the elastic properties and dimensions of the platelet as well as the hydrodynamic conditions of the treatment liquid determine the optimum frequency of the pulse-shaped wet-chemical treatment.
- This interruption means is mutatis mutandis with correspondingly small dimensions for installation in the nozzle itself.
- these special nozzles are also suitable for placement on the top of the horizontally transported goods.
- an additional suction device is provided for sucking off the treatment liquid which is reflected by the surface 5 of the material 6 during the jet application. This prevents a build-up of liquid on the surface of the material and avoids unnecessary residues of fluid, so that undercutting can be even better prevented.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/374,889 US20090179006A1 (en) | 2006-07-25 | 2007-07-21 | Method and Device for a Forced Wet-Chemical Treatment of Surfaces |
JP2009521103A JP5284957B2 (ja) | 2006-07-25 | 2007-07-21 | 表面の湿式化学処理を増進させる方法および装置 |
CN2007800312571A CN101573474B (zh) | 2006-07-25 | 2007-07-21 | 用于加速表面湿化学处理的方法和装置 |
KR1020097003813A KR101096326B1 (ko) | 2006-07-25 | 2007-07-21 | 가속 습식-화학 표면처리를 위한 방법 및 장치 |
GB0901297A GB2453482B (en) | 2006-07-25 | 2007-07-21 | Method of, and apparatus for, the accelerated wet-chemical treatment of surfaces |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102006035523 | 2006-07-25 | ||
DE102006035523.7 | 2006-07-25 | ||
DE102006059046A DE102006059046B4 (de) | 2006-07-25 | 2006-12-14 | Vorrichtung zum beschleunigten nasschemischen Behandeln von Oberflächen |
DE102006059046.5 | 2006-12-14 |
Publications (1)
Publication Number | Publication Date |
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WO2008011870A1 true WO2008011870A1 (de) | 2008-01-31 |
Family
ID=38610994
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2007/001306 WO2008011870A1 (de) | 2006-07-25 | 2007-07-21 | Verfahren und vorrichtung zum beschleunigten nasschemischen behandeln von oberflächen |
Country Status (1)
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WO (1) | WO2008011870A1 (de) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009221596A (ja) * | 2008-02-20 | 2009-10-01 | Mec Kk | エッチング液及びこれを用いた銅配線の形成方法 |
WO2012048720A1 (de) | 2010-10-14 | 2012-04-19 | Rena Gmbh | Vorrichtung und verfahren zur sprühbehandlung von leiterplatten oder leiterfolien |
WO2015063080A1 (de) * | 2013-10-31 | 2015-05-07 | Schmid, Holger Manfred | Vorrichtung und verfahren zur bearbeitung von metallischen oberflächen mit einer ätzflüssigkeit |
CN108139717A (zh) * | 2015-09-11 | 2018-06-08 | 汉高知识产权控股有限责任公司 | 粘合剂的远程监控系统 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2461121A1 (de) * | 1973-12-26 | 1975-07-10 | Hoechst Co American | Verfahren zum automatischen aufspruehen einer fluessigkeit auf die oberflaeche eines sich bewegenden gegenstandes |
JPH01142091A (ja) * | 1987-11-30 | 1989-06-02 | Hitachi Ltd | エッチング方法および装置 |
DE4416747A1 (de) * | 1994-05-12 | 1995-11-16 | Schmid Gmbh & Co Geb | Vorrichtung zum Behandeln von Gegenständen mit Flüssigkeit in Naßprozessen |
US6307240B1 (en) * | 2000-12-22 | 2001-10-23 | Visteon Global Technologies, Inc. | Pulsed etching manufacturing method and system |
-
2007
- 2007-07-21 WO PCT/DE2007/001306 patent/WO2008011870A1/de active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2461121A1 (de) * | 1973-12-26 | 1975-07-10 | Hoechst Co American | Verfahren zum automatischen aufspruehen einer fluessigkeit auf die oberflaeche eines sich bewegenden gegenstandes |
JPH01142091A (ja) * | 1987-11-30 | 1989-06-02 | Hitachi Ltd | エッチング方法および装置 |
DE4416747A1 (de) * | 1994-05-12 | 1995-11-16 | Schmid Gmbh & Co Geb | Vorrichtung zum Behandeln von Gegenständen mit Flüssigkeit in Naßprozessen |
US6307240B1 (en) * | 2000-12-22 | 2001-10-23 | Visteon Global Technologies, Inc. | Pulsed etching manufacturing method and system |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009221596A (ja) * | 2008-02-20 | 2009-10-01 | Mec Kk | エッチング液及びこれを用いた銅配線の形成方法 |
WO2012048720A1 (de) | 2010-10-14 | 2012-04-19 | Rena Gmbh | Vorrichtung und verfahren zur sprühbehandlung von leiterplatten oder leiterfolien |
WO2015063080A1 (de) * | 2013-10-31 | 2015-05-07 | Schmid, Holger Manfred | Vorrichtung und verfahren zur bearbeitung von metallischen oberflächen mit einer ätzflüssigkeit |
CN108139717A (zh) * | 2015-09-11 | 2018-06-08 | 汉高知识产权控股有限责任公司 | 粘合剂的远程监控系统 |
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