DE69610763T2 - Flüssigkeitenabgabevorrichtung und -verfahren - Google Patents

Flüssigkeitenabgabevorrichtung und -verfahren

Info

Publication number
DE69610763T2
DE69610763T2 DE69610763T DE69610763T DE69610763T2 DE 69610763 T2 DE69610763 T2 DE 69610763T2 DE 69610763 T DE69610763 T DE 69610763T DE 69610763 T DE69610763 T DE 69610763T DE 69610763 T2 DE69610763 T2 DE 69610763T2
Authority
DE
Germany
Prior art keywords
dispensing device
liquid dispensing
liquid
dispensing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69610763T
Other languages
English (en)
Other versions
DE69610763D1 (de
Inventor
A Himes
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech USA LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech USA LLC filed Critical Atotech USA LLC
Publication of DE69610763D1 publication Critical patent/DE69610763D1/de
Application granted granted Critical
Publication of DE69610763T2 publication Critical patent/DE69610763T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/022—Cleaning travelling work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
    • B08B5/023—Cleaning travelling work
    • B08B5/026—Cleaning moving webs
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
    • F26B21/004—Nozzle assemblies; Air knives; Air distributors; Blow boxes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/227—Drying of printed circuits
DE69610763T 1995-08-11 1996-07-08 Flüssigkeitenabgabevorrichtung und -verfahren Expired - Fee Related DE69610763T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/514,313 US5614264A (en) 1995-08-11 1995-08-11 Fluid delivery apparatus and method
PCT/US1996/011410 WO1997006895A1 (en) 1995-08-11 1996-07-08 Fluid delivery apparatus and method

Publications (2)

Publication Number Publication Date
DE69610763D1 DE69610763D1 (de) 2000-11-30
DE69610763T2 true DE69610763T2 (de) 2001-05-31

Family

ID=24046664

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69610763T Expired - Fee Related DE69610763T2 (de) 1995-08-11 1996-07-08 Flüssigkeitenabgabevorrichtung und -verfahren

Country Status (7)

Country Link
US (1) US5614264A (de)
EP (1) EP0820351B1 (de)
JP (1) JPH11510734A (de)
CA (1) CA2218883A1 (de)
DE (1) DE69610763T2 (de)
ES (1) ES2152033T3 (de)
WO (1) WO1997006895A1 (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10358149B3 (de) * 2003-12-10 2005-05-12 Höllmüller Maschinenbau GmbH Verfahren und Vorrichtung zum berührungslosen Behandeln von ebenem Gut in Durchlaufanlagen
DE10358147B3 (de) * 2003-12-10 2005-05-19 Höllmüller Maschinenbau GmbH Verfahren und Vorrichtung zum Behandeln von ebenem Gut in Durchlaufanlagen
DE102006003141A1 (de) * 2006-01-24 2007-07-26 Airmatic Gmbh Vorrichtung zur Bandreinigung mit Hochdruck-Vakuum-Technik und Bandniederhaltung

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5876499A (en) * 1991-05-08 1999-03-02 Lymn; Peter P. Solder spray leveller
US5720813A (en) 1995-06-07 1998-02-24 Eamon P. McDonald Thin sheet handling system
US5904773A (en) * 1995-08-11 1999-05-18 Atotech Usa, Inc. Fluid delivery apparatus
US5824157A (en) * 1995-09-06 1998-10-20 International Business Machines Corporation Fluid jet impregnation
JP3317477B2 (ja) * 1996-09-27 2002-08-26 本田技研工業株式会社 ブランク材洗浄ブース及びブランク材洗浄装置
DK0986662T3 (da) * 1997-05-28 2001-11-19 Rockwool Int Anlæg og fremgangsmåde til coating af et flersidet mineralfiberelement
KR100331357B1 (ko) * 1998-03-11 2002-04-09 마스다 노부유키 산세척장치
TW391895B (en) * 1998-10-02 2000-06-01 Ultra Clean Technology Asia Pt Method and apparatus for washing and drying semi-conductor devices
FI108993B (fi) * 1999-06-30 2002-05-15 Metso Paper Inc Menetelmä ja sovitelma käsittelyaineen levittämiseksi liikkuvalle pinnalle
US6539963B1 (en) 1999-07-14 2003-04-01 Micron Technology, Inc. Pressurized liquid diffuser
DE19934487B4 (de) * 1999-07-22 2004-04-29 Systronic Systemlösungen für die Elektronikindustrie GmbH Durchlauftrockner für Platten oder Bahnen
US6265020B1 (en) * 1999-09-01 2001-07-24 Shipley Company, L.L.C. Fluid delivery systems for electronic device manufacture
DE10039558B4 (de) * 2000-08-12 2005-09-08 Pill E.K. Vorrichtung zur Sprühbehandlung von Leiterplatten
JP2002075947A (ja) * 2000-08-30 2002-03-15 Alps Electric Co Ltd ウェット処理装置
US6990989B2 (en) * 2001-08-06 2006-01-31 Amersham Biosciences (Sv) Corp Instrument treatment station
US20050015050A1 (en) * 2003-07-15 2005-01-20 Kimberly-Clark Worldwide, Inc. Apparatus for depositing fluid material onto a substrate
US9206514B2 (en) * 2007-01-11 2015-12-08 Peter Philip Andrew Lymn Liquid treatment apparatus
WO2011087750A2 (en) 2009-12-22 2011-07-21 3M Innovative Properties Company Apparatus and methods for impinging fluids on substrates
US9126224B2 (en) * 2011-02-17 2015-09-08 3M Innovative Properties Company Apparatus and methods for impinging fluids on substrates
CN112708920A (zh) * 2019-10-24 2021-04-27 亚洲电镀器材有限公司 流体输送系统及电镀工件的方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3734109A (en) * 1971-03-08 1973-05-22 P Hebner Spray cleaning system
US3871914A (en) * 1971-10-18 1975-03-18 Chemcut Corp Etchant rinse apparatus
US3905827A (en) * 1971-10-18 1975-09-16 Chemcut Corp Etchant rinse method
US3935041A (en) * 1971-10-18 1976-01-27 Chemcut Corporation Method for treatment fluid application and removal
US4015706A (en) 1971-11-15 1977-04-05 Chemcut Corporation Connecting modules for an etching system
US3776800A (en) * 1971-12-06 1973-12-04 Chemut Corp Etching apparatus
US4046248A (en) 1974-01-15 1977-09-06 Chemcut Corporation Connecting and alignment means for modular chemical treatment system
US4017982A (en) * 1975-07-28 1977-04-19 Chemcut Corporation Drying apparatus
FR2355697A1 (fr) * 1976-06-25 1978-01-20 Bertin & Cie Procede pour etancher l'intervalle entre une paroi et une surface en regard, dispositifs de mise en oeuvre du procede et applications
US4174261A (en) * 1976-07-16 1979-11-13 Pellegrino Peter P Apparatus for electroplating, deplating or etching
US4202073A (en) * 1978-07-25 1980-05-13 Research Technology Inc. Moisture stripping device for film cleaning apparatus
US4270317A (en) * 1978-10-10 1981-06-02 Midland-Ross Corporation Apparatus used in the treatment of a continuous strip of metal and method of use thereof
US4425869A (en) * 1982-09-07 1984-01-17 Advanced Systems Incorporated Fluid flow control mechanism for circuit board processing apparatus
JPS609129A (ja) * 1983-06-29 1985-01-18 Fujitsu Ltd ウエツト処理装置
US4576685A (en) * 1985-04-23 1986-03-18 Schering Ag Process and apparatus for plating onto articles
DE3528575A1 (de) * 1985-08-06 1987-02-19 Schering Ag Verfahren und einrichtung zur reinigung, aktivierung und/oder metallisierung von bohrloechern in horizontal gefuehrten leiterplatten
US4938257A (en) * 1986-11-21 1990-07-03 Teledyne Industries, Inc. Printed circuit cleaning apparatus
US4854004A (en) * 1987-12-28 1989-08-08 Orc Manufacturing Co., Ltd. Device for clearing the hole blockage of a liquid resist substrate
US5063951A (en) * 1990-07-19 1991-11-12 International Business Machines Corporation Fluid treatment device
US5289639A (en) * 1992-07-10 1994-03-01 International Business Machines Corp. Fluid treatment apparatus and method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10358149B3 (de) * 2003-12-10 2005-05-12 Höllmüller Maschinenbau GmbH Verfahren und Vorrichtung zum berührungslosen Behandeln von ebenem Gut in Durchlaufanlagen
DE10358147B3 (de) * 2003-12-10 2005-05-19 Höllmüller Maschinenbau GmbH Verfahren und Vorrichtung zum Behandeln von ebenem Gut in Durchlaufanlagen
DE10358147C5 (de) * 2003-12-10 2007-11-22 Höllmüller Maschinenbau GmbH Verfahren und Vorrichtung zum Behandeln von ebenem Gut in Durchlaufanlagen
DE102006003141A1 (de) * 2006-01-24 2007-07-26 Airmatic Gmbh Vorrichtung zur Bandreinigung mit Hochdruck-Vakuum-Technik und Bandniederhaltung

Also Published As

Publication number Publication date
CA2218883A1 (en) 1997-02-27
US5614264A (en) 1997-03-25
EP0820351A4 (de) 1999-06-16
EP0820351A1 (de) 1998-01-28
WO1997006895A1 (en) 1997-02-27
DE69610763D1 (de) 2000-11-30
ES2152033T3 (es) 2001-01-16
JPH11510734A (ja) 1999-09-21
EP0820351B1 (de) 2000-10-25

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: CHEMCUT CORP., STATE COLLEGE, PA., US

8327 Change in the person/name/address of the patent owner

Owner name: ATOTECH USA, INC., STATE COLLEGE, PA., US

8327 Change in the person/name/address of the patent owner

Owner name: ATOTECH DEUTSCHLAND GMBH, 10553 BERLIN, DE

8339 Ceased/non-payment of the annual fee