DE69610763D1 - Flüssigkeitenabgabevorrichtung und -verfahren - Google Patents
Flüssigkeitenabgabevorrichtung und -verfahrenInfo
- Publication number
- DE69610763D1 DE69610763D1 DE69610763T DE69610763T DE69610763D1 DE 69610763 D1 DE69610763 D1 DE 69610763D1 DE 69610763 T DE69610763 T DE 69610763T DE 69610763 T DE69610763 T DE 69610763T DE 69610763 D1 DE69610763 D1 DE 69610763D1
- Authority
- DE
- Germany
- Prior art keywords
- dispensing device
- liquid dispensing
- liquid
- dispensing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
- H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
- B08B5/023—Cleaning travelling work
- B08B5/026—Cleaning moving webs
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
- F26B21/004—Nozzle assemblies; Air knives; Air distributors; Blow boxes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/227—Drying of printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Nozzles (AREA)
- Coating Apparatus (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/514,313 US5614264A (en) | 1995-08-11 | 1995-08-11 | Fluid delivery apparatus and method |
PCT/US1996/011410 WO1997006895A1 (en) | 1995-08-11 | 1996-07-08 | Fluid delivery apparatus and method |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69610763D1 true DE69610763D1 (de) | 2000-11-30 |
DE69610763T2 DE69610763T2 (de) | 2001-05-31 |
Family
ID=24046664
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69610763T Expired - Fee Related DE69610763T2 (de) | 1995-08-11 | 1996-07-08 | Flüssigkeitenabgabevorrichtung und -verfahren |
Country Status (7)
Country | Link |
---|---|
US (1) | US5614264A (de) |
EP (1) | EP0820351B1 (de) |
JP (1) | JPH11510734A (de) |
CA (1) | CA2218883A1 (de) |
DE (1) | DE69610763T2 (de) |
ES (1) | ES2152033T3 (de) |
WO (1) | WO1997006895A1 (de) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5876499A (en) * | 1991-05-08 | 1999-03-02 | Lymn; Peter P. | Solder spray leveller |
US5720813A (en) | 1995-06-07 | 1998-02-24 | Eamon P. McDonald | Thin sheet handling system |
US5904773A (en) * | 1995-08-11 | 1999-05-18 | Atotech Usa, Inc. | Fluid delivery apparatus |
US5824157A (en) * | 1995-09-06 | 1998-10-20 | International Business Machines Corporation | Fluid jet impregnation |
JP3317477B2 (ja) * | 1996-09-27 | 2002-08-26 | 本田技研工業株式会社 | ブランク材洗浄ブース及びブランク材洗浄装置 |
US6436471B1 (en) * | 1997-05-28 | 2002-08-20 | Rockwool International A/S | Plant and process for coating a multi-sided mineral fiber element |
DE69903507T2 (de) * | 1998-03-11 | 2003-06-26 | Mitsubishi Heavy Ind Ltd | Beizvorrichtung |
TW391895B (en) * | 1998-10-02 | 2000-06-01 | Ultra Clean Technology Asia Pt | Method and apparatus for washing and drying semi-conductor devices |
FI108993B (fi) * | 1999-06-30 | 2002-05-15 | Metso Paper Inc | Menetelmä ja sovitelma käsittelyaineen levittämiseksi liikkuvalle pinnalle |
US6539963B1 (en) | 1999-07-14 | 2003-04-01 | Micron Technology, Inc. | Pressurized liquid diffuser |
DE19934487B4 (de) * | 1999-07-22 | 2004-04-29 | Systronic Systemlösungen für die Elektronikindustrie GmbH | Durchlauftrockner für Platten oder Bahnen |
US6265020B1 (en) * | 1999-09-01 | 2001-07-24 | Shipley Company, L.L.C. | Fluid delivery systems for electronic device manufacture |
DE10039558B4 (de) * | 2000-08-12 | 2005-09-08 | Pill E.K. | Vorrichtung zur Sprühbehandlung von Leiterplatten |
JP2002075947A (ja) * | 2000-08-30 | 2002-03-15 | Alps Electric Co Ltd | ウェット処理装置 |
US6990989B2 (en) * | 2001-08-06 | 2006-01-31 | Amersham Biosciences (Sv) Corp | Instrument treatment station |
US20050015050A1 (en) * | 2003-07-15 | 2005-01-20 | Kimberly-Clark Worldwide, Inc. | Apparatus for depositing fluid material onto a substrate |
DE10358147C5 (de) * | 2003-12-10 | 2007-11-22 | Höllmüller Maschinenbau GmbH | Verfahren und Vorrichtung zum Behandeln von ebenem Gut in Durchlaufanlagen |
DE10358149B3 (de) * | 2003-12-10 | 2005-05-12 | Höllmüller Maschinenbau GmbH | Verfahren und Vorrichtung zum berührungslosen Behandeln von ebenem Gut in Durchlaufanlagen |
DE102006003141A1 (de) * | 2006-01-24 | 2007-07-26 | Airmatic Gmbh | Vorrichtung zur Bandreinigung mit Hochdruck-Vakuum-Technik und Bandniederhaltung |
WO2008084224A2 (en) * | 2007-01-11 | 2008-07-17 | Peter Philip Andrew Lymn | Liquid treatment apparatus |
ES2704032T3 (es) * | 2009-12-22 | 2019-03-13 | 3M Innovative Properties Co | Aparato y métodos para hacer impactar fluidos en sustratos |
US9126224B2 (en) * | 2011-02-17 | 2015-09-08 | 3M Innovative Properties Company | Apparatus and methods for impinging fluids on substrates |
TWI831852B (zh) * | 2019-10-24 | 2024-02-11 | 香港商亞洲電鍍器材有限公司 | 流體輸送系統及電鍍工件的方法 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3734109A (en) * | 1971-03-08 | 1973-05-22 | P Hebner | Spray cleaning system |
US3935041A (en) * | 1971-10-18 | 1976-01-27 | Chemcut Corporation | Method for treatment fluid application and removal |
US3871914A (en) * | 1971-10-18 | 1975-03-18 | Chemcut Corp | Etchant rinse apparatus |
US3905827A (en) * | 1971-10-18 | 1975-09-16 | Chemcut Corp | Etchant rinse method |
US4015706A (en) | 1971-11-15 | 1977-04-05 | Chemcut Corporation | Connecting modules for an etching system |
US3776800A (en) * | 1971-12-06 | 1973-12-04 | Chemut Corp | Etching apparatus |
US4046248A (en) | 1974-01-15 | 1977-09-06 | Chemcut Corporation | Connecting and alignment means for modular chemical treatment system |
US4017982A (en) * | 1975-07-28 | 1977-04-19 | Chemcut Corporation | Drying apparatus |
FR2355697A1 (fr) * | 1976-06-25 | 1978-01-20 | Bertin & Cie | Procede pour etancher l'intervalle entre une paroi et une surface en regard, dispositifs de mise en oeuvre du procede et applications |
US4174261A (en) * | 1976-07-16 | 1979-11-13 | Pellegrino Peter P | Apparatus for electroplating, deplating or etching |
US4202073A (en) * | 1978-07-25 | 1980-05-13 | Research Technology Inc. | Moisture stripping device for film cleaning apparatus |
US4270317A (en) * | 1978-10-10 | 1981-06-02 | Midland-Ross Corporation | Apparatus used in the treatment of a continuous strip of metal and method of use thereof |
US4425869A (en) * | 1982-09-07 | 1984-01-17 | Advanced Systems Incorporated | Fluid flow control mechanism for circuit board processing apparatus |
JPS609129A (ja) * | 1983-06-29 | 1985-01-18 | Fujitsu Ltd | ウエツト処理装置 |
US4576685A (en) * | 1985-04-23 | 1986-03-18 | Schering Ag | Process and apparatus for plating onto articles |
DE3528575A1 (de) * | 1985-08-06 | 1987-02-19 | Schering Ag | Verfahren und einrichtung zur reinigung, aktivierung und/oder metallisierung von bohrloechern in horizontal gefuehrten leiterplatten |
US4938257A (en) * | 1986-11-21 | 1990-07-03 | Teledyne Industries, Inc. | Printed circuit cleaning apparatus |
US4854004A (en) * | 1987-12-28 | 1989-08-08 | Orc Manufacturing Co., Ltd. | Device for clearing the hole blockage of a liquid resist substrate |
US5063951A (en) * | 1990-07-19 | 1991-11-12 | International Business Machines Corporation | Fluid treatment device |
US5289639A (en) * | 1992-07-10 | 1994-03-01 | International Business Machines Corp. | Fluid treatment apparatus and method |
-
1995
- 1995-08-11 US US08/514,313 patent/US5614264A/en not_active Expired - Fee Related
-
1996
- 1996-07-08 JP JP9509269A patent/JPH11510734A/ja active Pending
- 1996-07-08 DE DE69610763T patent/DE69610763T2/de not_active Expired - Fee Related
- 1996-07-08 ES ES96924389T patent/ES2152033T3/es not_active Expired - Lifetime
- 1996-07-08 WO PCT/US1996/011410 patent/WO1997006895A1/en active IP Right Grant
- 1996-07-08 CA CA002218883A patent/CA2218883A1/en not_active Abandoned
- 1996-07-08 EP EP96924389A patent/EP0820351B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0820351A4 (de) | 1999-06-16 |
CA2218883A1 (en) | 1997-02-27 |
JPH11510734A (ja) | 1999-09-21 |
WO1997006895A1 (en) | 1997-02-27 |
EP0820351A1 (de) | 1998-01-28 |
DE69610763T2 (de) | 2001-05-31 |
EP0820351B1 (de) | 2000-10-25 |
US5614264A (en) | 1997-03-25 |
ES2152033T3 (es) | 2001-01-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: CHEMCUT CORP., STATE COLLEGE, PA., US |
|
8327 | Change in the person/name/address of the patent owner |
Owner name: ATOTECH USA, INC., STATE COLLEGE, PA., US |
|
8327 | Change in the person/name/address of the patent owner |
Owner name: ATOTECH DEUTSCHLAND GMBH, 10553 BERLIN, DE |
|
8339 | Ceased/non-payment of the annual fee |