Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
  • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
  • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
  • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
  • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/0001—Technical content checked by a classifier
  • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/01—Dielectrics
  • H05K2201/0104—Properties and characteristics in general
  • H05K2201/0133—Elastomeric or compliant polymer
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/09—Shape and layout
  • H05K2201/09009—Substrate related
  • H05K2201/09118—Moulded substrate
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10007—Types of components
  • H05K2201/10151—Sensor
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10227—Other objects, e.g. metallic pieces
  • H05K2201/10378—Interposers
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
  • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
  • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T29/00—Metal working
  • Y10T29/49—Method of mechanical manufacture
  • Y10T29/49002—Electrical device making
  • Y10T29/49117—Conductor or circuit manufacturing
  • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
  • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
  • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

Definitions

• Coupling device arrangement with a coupling device, method for producing a device with a coupling device
• the invention relates to a coupling device for connecting an electrical / electronic component, in particular sensor, with a substrate, in particular printed circuit board, wherein the coupling device for electrical contacting comprises at least one electrical connection and for movement decoupling at least one damper element.
• the invention relates to an arrangement with at least one on a substrate, in particular printed circuit board, arrangeable electrical / electronic component, in particular sensor, and with a coupling device for connecting the component to the substrate, wherein the coupling device for electrical
• Contacting at least one electrical connection and for movement decoupling comprises at least one damper element.
• the invention relates to a method for producing an arrangement, in particular as described above, wherein the arrangement comprises at least one on a substrate, in particular printed circuit board, arrangeable electrical / electronic component, in particular sensor, and a coupling device for connecting the component to the substrate , wherein the coupling device for electrical contacting comprises at least one electrical connection and for movement decoupling at least one damper element.
• vibration sensitive Components such as in sensors and in particular in micromechanical sensors known to attach them by means of a motion-decoupling coupling device to a substrate.
• motion decoupling is to be understood as meaning a mechanical decoupling which primarily serves for the decoupling of occurring vibrations (vibration decoupling), but can also serve to compensate for tolerances, in particular to compensate for stresses occurring during operation.
• tensions occur between the component and the substrate, which arise for example as a result of different coefficients of thermal expansion, such that upon heating
• An inertial sensor arrangement is known from DE 10 2006 002 350 A1, in which a sensor module is arranged on a carrier substrate with the interposition of an elastically deformable coupling element, wherein the material of the damper frame-like around the sensor module in a present between the sensor module and the carrier substrate Gap is injected. through
• the sensor module is then connected to a circuit arranged on the carrier substrate.
• the coupling device is therefore known to be formed in two parts. Disclosure of the invention
• the electrical connection is formed by a stamped grid and the stamped grid is at least partially encapsulated by a damping mass as a damping element. It is therefore provided that the electrical connection of the coupling device between the substrate and the component is formed by a stamped grid.
• Punching grids are well known to those skilled in the art and allow in a simple manner a stable electrical connection.
• the stamped grid is at least partially encapsulated by a damping mass such that the damper element is formed. Punching grid and damper element thereby form a unit or a compact, quasi one-piece coupling device.
• the stamped grid By overmolding the stamped grid with the damping mass receives on the one hand the lead frame a higher stability and on the other hand, a damping effect is provided.
• the stamped grid itself by the surrounding damping mass acts damping
• the damping mass itself which is shaped as a damping element, so preferably at least partially even in direct contact with the substrate and the component causes a movement decoupling between substrate and component ,
• the stamped grid at least partially forms at least one spring element.
• the stamped grid to at least partially a three-dimensional structure.
• the spring element may be formed for example by an obliquely extending to the rest of the lead frame web or by a bent, one-end exposed spring tongue.
• the advantageous embodiment of a spring-mass system is offered with damping, which can be arranged between the substrate and the component.
• the stamped grid has contact plates which are exposed on at least one side. At least the contact plates are therefore not encapsulated by the damping mass on all sides. Rather, the contact surfaces are on the damping element or on the damping mass, wherein a
• the damping mass is silicone or another material having similar properties.
• the arrangement according to the invention is characterized by a coupling device as described above.
• the arrangement comprises a coupling device by means of which the component can be arranged on the substrate.
• a particularly favorable motion decoupling is provided, which permanently ensures the functional capability of the arrangement.
• the component has a housing, in particular an LGA housing (land grid area housing) with at least one electrical contact, which rests on the contact plate or on the contact surface of the stamped grid. By resting of the electrical contact on the contact surface of the stamped grid, the electrical connection between the component and the substrate is made.
• LGA housing laand grid area housing
• the contact is soldered to the contact surface.
• the component is soldered to the coupling element and firmly connected.
• the coupling device is expediently also connected to the substrate, in particular to the printed circuit board, preferably by soldering. Due to the advantageous coupling device occurring oscillations and / or stresses are compensated or invalidated, whereby the forces acting on the solder joint (s) forces do not lead to the destruction of the solder joint.
• the coupling device is thus no longer provided as an independent component of the arrangement, but rather as an integrated / integral element.
• the damper element of the coupling device serves as a carrier for a component of the component and thus forms a part of the component.
• the direct arrangement of the component on the damper element a particularly compact arrangement is provided.
• the component is electrically connected or operatively connected to the contact surface / contact pad of the stamped grid by means of at least one bonding connection.
• the electrical contact with the component is no longer produced via a housing of the component, but can be produced directly from the corresponding component of the component to the stamped grid.
• a plurality of contact plates are provided.
• the coupling device is at least partially integrated with the component and the contact plate in a mold housing.
• the housing of the component is applied directly to the coupling device or to the damping element and / or the component, for example by encapsulation and / or encapsulation.
• the method according to the invention is characterized in that the electrical connection is formed by a stamped grid, and the stamped grid for forming the damping element is at least partially encapsulated with a damping mass.
• the stamped grid is punched out of a base material by a punching process and brought into the desired shape at the same time or subsequently by an embossing and / or bending process. Subsequently, the stamped grid is arranged in a form which forms the negative of the damper element to be created. In the mold, the damping mass is sprayed around the stamped grid at least in some areas.
• a housing of the component is soldered to the stamped grid.
• corresponding to the housing provided electrical contacts with the stamped grid and in particular with exposed contact pads of the stamped grid is soldered.
• the stamped grid is soldered to the substrate at another location, expediently with corresponding mating contacts of the substrate, whereby a load-bearing connection between the component and the substrate is produced.
• At least one electrical / electronic component of the component is arranged on the damper element and electrically connected to the stamped grid. Bonding is preferably carried out for bonding. In this case, it is expedient to dispense with an electrical connection between the housing and the stamped grid, since now the component is electrically connected directly to the stamped grid / is.
• a housing is preferably finally produced by a molding process, so that at least the component and the bonding connections and expediently also a wide area of the damping element or the coupling device are enclosed.
• the Component having side of the coupling device completely covered by the mold housing.
• the coupling device preferably forms an integral part of the component or is manufactured as such.
• FIGS. 1 A to 1 D show steps for producing an advantageous coupling device
• FIGS. 2A and 2B show the coupling device with an electrical / electronic component in different views
• FIG. 3 shows an alternative embodiment of the coupling device
• Figure 4 shows the coupling device as an integral part of the component and Figure 5 shows the component with the advantageous coupling device in a perspective view.
• FIGS. 1A to 1 D show different steps for producing an advantageous coupling device 1.
• a stamped grid 3 is produced by punching out of a copper sheet 2.
• the lead frame 3 has in the present embodiment, a substantially square frame 4, within which a plurality of square shaped contact plates 5 and arranged over almost the entire width of the lead frame 3 extending web 6 and connected to the frame 4 by means of connecting webs 7. they are.
• the web 6 is arranged centrally, while the contact plates 5 extend on both sides of the web 6 in each case in two rows parallel to the web. are arranged, wherein the respective lying closer to the web row of contact plates 5 hereinafter generally with 8 and the respective outer row of contact plates 5 is denoted by 9.
• the stamped grid 3 according to FIG. 1B is so shaped by a bending process that the outer rows 9 of the contact plates 5 lie in a plane spaced from the inner rows 8 and the web 6.
• the stamped grid 1 is taught in the present embodiment, a substantially U-shaped cross-section.
• the U-shape of the stamped grid 3 has no legs perpendicular to each other, but obliquely extending legs extending from the connecting webs 7 between the row 9 of the outer contact plates and the row 8 of the inner contact plates 5.
• the stamped grid 3 obtains spring properties, the connecting webs 7 between the rows 8 and 9 respectively forming spring elements 10 of the stamped grid 3.
• the lead frame 3 is partially encapsulated by a damping mass 1 1 such that the damping mass 1 1 forms a damper element 12.
• the spring elements 10 are at least substantially completely encapsulated.
• the damper element 12 also has a square contour.
• the contact plates 5 of the outer rows 9 rest on an upper side 13 of the damper element 12 so that their respective exposed side pointing away from the damper element forms a contact surface 14. Accordingly, it behaves on the underside 15 of the damper element 12, on which the web 6 and the contact pads 5 of the inner rows 8 rest.
• the damper element 12 or the damping mass 1 1 at least substantially made of silicone.
• the connecting webs 7 extending in the parallel planes as well as the frame 4 are separated and the stamped grid 3 is thereby singled out. Only the spring elements 10 forming connecting webs 7 are retained. These later form the electrical Connection 25 from an arranged on the upper side 13 electrical / electronic component to a substrate on which the coupling device 1 can be arranged by means of the bottom 15.
• the advantageous coupling device 1, as shown in Figure 1 D provides a simple way both an electrical connection and a spring-mass system with damper.
• the singling of the stamped grid 3 is expediently carried out by one or more punching operations.
• a punching tool is preferably moved substantially perpendicular to the upper side 13 or the underside 15, whereby a force is applied to the connecting webs to be separated respectively in the direction of the damping mass. Since the contact plates 5 and thus the connecting webs to be separated are each arranged outside the damping mass 11, the punching tool acts on the connecting webs directly with a force in the direction of the damping mass 11.
• the force and the feed rate of the punching tool is chosen such that the damping mass is only elastically deformed during the punching process.
• the separate connecting webs can then be particularly easy to remove from the damping mass 1 1 or they dissolve by themselves.
• the force and / or feed rate are selected such that the connecting webs are driven into the damping mass 1 1 during the punching process so that the damping mass 11 is also plastically deformed.
• the dissolved connecting webs can then remain in the damping mass 1 1.
• the damping characteristic of the coupling device can be changed or influenced as a whole again.
• the lying in the damping mass 1 1 electrical connections 25 should persist and thus need not be taken into account in the stamping process.
• a plurality of punched grid 3 forming a punched grid matrix are provided, which are preferably held by a common frame and separated by a separate punching operation or during the punching operation described above, which is used to singulate the respective punched grid 3 single punched grid 3, as in the figure
• solder paste is advantageously applied to the contact surfaces 14 in each case. As a result, a quick assembly of a corresponding component is ensured on the coupling device.
• Figures 2A and 2B show the coupling device 1 in a side view in the direction of the longitudinal extension of the web 6 (Figure 2A) and perpendicular thereto ( Figure 2B).
• an electrical / electronic component 16 which is designed as a sensor 17 with movement-sensitive micromechanics, is applied to the coupling device 1 known from FIG.
• a housing 18 is shown that is designed as a mold housing 19 is formed and on its coupling device 1 side facing electrical
• the housing 18 is advantageously glued to the damper element 12.
• the arrangement 20 formed thereby, consisting of coupling device 1 and component 16, can now be soldered onto a substrate, for example on a printed circuit board, for example, wherein in the same step also the
• connection between the coupling device 1 and the housing 18 by means of the solder paste 21 is made by soldering. Due to the advantageous connection of the component 16 to the printed circuit board via the coupling device 1, the component 16 is vibration-decoupled, so that the sensitive micromechanics of the sensor 17 is not unintentionally influenced by vibrations. In addition, the
• FIG. 3 shows a further exemplary embodiment of the coupling device 1 prior to singulation of the stamped grid 3.
• the stamped grid 3 has no web 6. Rather, several rows of five contact plates are provided, which extend over the width of the stamped grid 3 and are connected to one another via connecting webs 7 only in the respective row.
• any number of different designs of the lead frame 3 are conceivable.
• the coupling device 1 forms an integral part of the component 16 and the sensor 17.
• two components 22, 23 of the sensor 17 (on the top 13) between the outer rows 9 of the contact plate 5 is arranged.
• the components 22 and 23 are advantageously electrically contacted or connected by means of bonding connections with the contact surfaces 14 of the stamped grid 3.
• the coupling device 1 and the components 22, 23 thereon and the contact plates 5 are enclosed by a molding process, whereby a mold housing 24 is formed.
• the unwanted connecting webs 7 are removed and the lead frame 3 separated and the frame 4 removed.
• the mold housing 24 is formed directly on the coupling device 1, by a spraying and / or casting process, the coupling device 1 is integrated into the assembly 20.
• the arrangement 20 designed in this way now only has to be mounted on a substrate, not shown here, for example by means of soldering.
• the circuit board or the substrate also forms part of the assembly 20, so that the assembly 20 can be prepared and offered by means of a printed circuit board as a structural unit.

Landscapes

• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Manufacturing & Machinery (AREA)
• Mechanical Engineering (AREA)
• Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
• Micromachines (AREA)
• Structure Of Printed Boards (AREA)
• Lead Frames For Integrated Circuits (AREA)
• Pressure Sensors (AREA)
• Casings For Electric Apparatus (AREA)
• Connector Housings Or Holding Contact Members (AREA)

Applications Claiming Priority (2)

Publications (1)

Family

ID=43416783

Family Applications (1)

Country Status (8)

Families Citing this family (4)

Citations (2)

Family Cites Families (26)

• 2009
  • 2009-10-22 DE DE102009045911A patent/DE102009045911A1/de not_active Withdrawn
• 2010
  • 2010-10-05 CN CN201080047705.9A patent/CN102577636B/zh not_active Expired - Fee Related
  • 2010-10-05 WO PCT/EP2010/064806 patent/WO2011047955A1/de active Application Filing
  • 2010-10-05 JP JP2012534613A patent/JP5372259B2/ja not_active Expired - Fee Related
  • 2010-10-05 KR KR1020127010265A patent/KR101811998B1/ko active IP Right Grant
  • 2010-10-05 EP EP10771047A patent/EP2491771A1/de not_active Ceased
  • 2010-10-05 US US13/503,581 patent/US20120267153A1/en not_active Abandoned
  • 2010-10-20 TW TW099135665A patent/TW201132259A/zh unknown

Patent Citations (2)

Non-Patent Citations (1)

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