EP2463903A4 - HEAT SINK - Google Patents
HEAT SINKInfo
- Publication number
- EP2463903A4 EP2463903A4 EP10806221.7A EP10806221A EP2463903A4 EP 2463903 A4 EP2463903 A4 EP 2463903A4 EP 10806221 A EP10806221 A EP 10806221A EP 2463903 A4 EP2463903 A4 EP 2463903A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- heat sink
- sink
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009184687 | 2009-08-07 | ||
PCT/JP2010/004876 WO2011016221A1 (ja) | 2009-08-07 | 2010-08-03 | ヒートシンク |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2463903A1 EP2463903A1 (en) | 2012-06-13 |
EP2463903A4 true EP2463903A4 (en) | 2015-03-04 |
Family
ID=43544131
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP10806221.7A Withdrawn EP2463903A4 (en) | 2009-08-07 | 2010-08-03 | HEAT SINK |
Country Status (7)
Country | Link |
---|---|
US (1) | US20120132400A1 (ja) |
EP (1) | EP2463903A4 (ja) |
JP (1) | JP5718814B2 (ja) |
KR (1) | KR101729254B1 (ja) |
CN (1) | CN102473693B (ja) |
TW (1) | TW201111736A (ja) |
WO (1) | WO2011016221A1 (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5715352B2 (ja) * | 2010-07-20 | 2015-05-07 | 株式会社Uacj | ヒートシンク |
JP5839386B2 (ja) * | 2011-07-05 | 2016-01-06 | 株式会社Uacj | ヒートシンク |
US9184108B2 (en) * | 2011-12-08 | 2015-11-10 | Oracle International Corporation | Heat dissipation structure for an integrated circuit (IC) chip |
JP5893976B2 (ja) * | 2012-03-22 | 2016-03-23 | 株式会社Uacj | ヒートシンク及びその製造方法 |
CN104247010B (zh) * | 2012-10-29 | 2017-06-20 | 富士电机株式会社 | 半导体装置 |
TWI494051B (zh) * | 2012-11-19 | 2015-07-21 | Acer Inc | 流體熱交換裝置 |
JP6204048B2 (ja) * | 2013-04-08 | 2017-09-27 | 株式会社Uacj | 冷却器 |
WO2016122568A1 (en) * | 2015-01-30 | 2016-08-04 | Hewlett-Packard Development Company, L.P. | Stacked fin structure |
EP3332172B1 (en) * | 2015-08-04 | 2018-12-12 | Philips Lighting Holding B.V. | Heat sink lighting device and method for manufacturing a heat sink |
CN105744802B (zh) * | 2016-01-12 | 2018-05-11 | 严继光 | 用于发热设备的辐射式空调系统 |
WO2019138564A1 (ja) * | 2018-01-15 | 2019-07-18 | 三菱電機株式会社 | ヒートシンク |
CN109595965B (zh) * | 2018-12-28 | 2024-02-23 | 江苏利柏特股份有限公司 | 模块生产用板式换热装置 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3265127A (en) * | 1963-10-21 | 1966-08-09 | Ford Motor Co | Heat exchange element |
US6170566B1 (en) * | 1999-12-22 | 2001-01-09 | Visteon Global Technologies, Inc. | High performance louvered fin for a heat exchanger |
US6205662B1 (en) * | 1999-05-14 | 2001-03-27 | Yun-Ching Chen | Method of producing a built-up heat exchanger and product thereof |
US6446709B1 (en) * | 2001-11-27 | 2002-09-10 | Wuh Choung Industrial Co., Ltd. | Combination heat radiator |
US20060016582A1 (en) * | 2004-07-23 | 2006-01-26 | Usui Kokusai Sangyo Kaisha Limited | Fluid agitating fin, method of fabricating the same and heat exchanger tube and heat exchanger or heat exchanging type gas cooling apparatus inwardly mounted with the fin |
US20060283581A1 (en) * | 2005-06-17 | 2006-12-21 | Dae-Young Lee | Louver fin type heat exchanger having improved heat exchange efficiency by controlling water blockage |
US20070240865A1 (en) * | 2006-04-13 | 2007-10-18 | Zhang Chao A | High performance louvered fin for heat exchanger |
US20080285290A1 (en) * | 2007-05-15 | 2008-11-20 | Hitachi, Ltd. | Liquid crystal display device |
JP2009099740A (ja) * | 2007-10-16 | 2009-05-07 | Furukawa Electric Co Ltd:The | 筐体の冷却装置 |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06209178A (ja) * | 1993-01-12 | 1994-07-26 | Fanuc Ltd | 電子機器用冷却装置 |
US5311928A (en) * | 1993-06-28 | 1994-05-17 | Marton Louis L | Heat dissipator |
JP3236137B2 (ja) * | 1993-07-30 | 2001-12-10 | 富士通株式会社 | 半導体素子冷却装置 |
JP2981586B2 (ja) * | 1993-10-15 | 1999-11-22 | ダイヤモンド電機株式会社 | ヒートシンク |
JP3095624B2 (ja) * | 1994-07-19 | 2000-10-10 | 株式会社ボッシュオートモーティブシステム | 積層型熱交換器の偏平チューブのろう付け方法 |
JPH08204369A (ja) * | 1995-01-20 | 1996-08-09 | Sansha Electric Mfg Co Ltd | 冷却フィン構造 |
SG72716A1 (en) * | 1995-12-14 | 2000-05-23 | Texas Instruments Inc | Tape-on heat sink |
US5957194A (en) * | 1996-06-27 | 1999-09-28 | Advanced Thermal Solutions, Inc. | Plate fin heat exchanger having fluid control means |
US6113485A (en) * | 1997-11-26 | 2000-09-05 | Advanced Micro Devices, Inc. | Duct processor cooling for personal computer |
JP3469475B2 (ja) * | 1998-09-10 | 2003-11-25 | 株式会社東芝 | 鉄道車両用半導体冷却装置 |
JP2001168561A (ja) * | 1999-12-07 | 2001-06-22 | Mitsubishi Alum Co Ltd | 放熱器 |
JP2001358482A (ja) * | 2000-04-14 | 2001-12-26 | Matsushita Refrig Co Ltd | 放熱モジュール |
JP4634599B2 (ja) * | 2000-11-30 | 2011-02-16 | 株式会社ティラド | 水冷ヒートシンク |
US6453987B1 (en) * | 2001-10-19 | 2002-09-24 | Chunyao Cheng | Unitary heat-dissipating fin strip unit with straight strip portions and U-shaped strip portions |
US6615910B1 (en) * | 2002-02-20 | 2003-09-09 | Delphi Technologies, Inc. | Advanced air cooled heat sink |
JP2004153001A (ja) * | 2002-10-30 | 2004-05-27 | Denso Corp | 冷却フィンおよびそれを用いた沸騰冷却装置 |
CN2634414Y (zh) * | 2003-06-16 | 2004-08-18 | 李建民 | 通用热交换组件 |
CN2724201Y (zh) * | 2004-07-06 | 2005-09-07 | 陈万添 | 散热器结构 |
US20060011324A1 (en) * | 2004-07-13 | 2006-01-19 | Rogers C J | Wound, louvered fin heat sink device |
JP4814777B2 (ja) * | 2006-12-19 | 2011-11-16 | 株式会社ソニー・コンピュータエンタテインメント | 積層放熱フィン |
JP2009026785A (ja) | 2007-07-17 | 2009-02-05 | Kiko Kagi Kofun Yugenkoshi | 電子装置の冷却装置における冷却用冷媒を真空封止する装置および方法 |
JP2009026784A (ja) * | 2007-07-17 | 2009-02-05 | Furukawa Electric Co Ltd:The | 放熱部品 |
JP4888721B2 (ja) * | 2007-07-24 | 2012-02-29 | 中村製作所株式会社 | 板状のフィンを有する放熱器の製造方法 |
JP2009176881A (ja) * | 2008-01-23 | 2009-08-06 | Nissan Motor Co Ltd | 冷却装置 |
JP5041435B2 (ja) * | 2008-05-22 | 2012-10-03 | 古河電気工業株式会社 | ヒートシンク |
US7684197B2 (en) * | 2008-06-23 | 2010-03-23 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Memory module assembly having heat sinks with improved structure |
CN101762200B (zh) * | 2008-12-23 | 2013-03-06 | 富瑞精密组件(昆山)有限公司 | 电子装置及其散热装置与散热片 |
JP5888882B2 (ja) * | 2011-06-15 | 2016-03-22 | 古河電気工業株式会社 | ヒートシンク |
-
2010
- 2010-08-03 WO PCT/JP2010/004876 patent/WO2011016221A1/ja active Application Filing
- 2010-08-03 US US13/389,117 patent/US20120132400A1/en not_active Abandoned
- 2010-08-03 EP EP10806221.7A patent/EP2463903A4/en not_active Withdrawn
- 2010-08-03 CN CN201080034790.5A patent/CN102473693B/zh not_active Expired - Fee Related
- 2010-08-03 JP JP2011525783A patent/JP5718814B2/ja active Active
- 2010-08-03 KR KR1020127004347A patent/KR101729254B1/ko active IP Right Grant
- 2010-08-05 TW TW099126139A patent/TW201111736A/zh unknown
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3265127A (en) * | 1963-10-21 | 1966-08-09 | Ford Motor Co | Heat exchange element |
US6205662B1 (en) * | 1999-05-14 | 2001-03-27 | Yun-Ching Chen | Method of producing a built-up heat exchanger and product thereof |
US6170566B1 (en) * | 1999-12-22 | 2001-01-09 | Visteon Global Technologies, Inc. | High performance louvered fin for a heat exchanger |
US6446709B1 (en) * | 2001-11-27 | 2002-09-10 | Wuh Choung Industrial Co., Ltd. | Combination heat radiator |
US20060016582A1 (en) * | 2004-07-23 | 2006-01-26 | Usui Kokusai Sangyo Kaisha Limited | Fluid agitating fin, method of fabricating the same and heat exchanger tube and heat exchanger or heat exchanging type gas cooling apparatus inwardly mounted with the fin |
US20060283581A1 (en) * | 2005-06-17 | 2006-12-21 | Dae-Young Lee | Louver fin type heat exchanger having improved heat exchange efficiency by controlling water blockage |
US20070240865A1 (en) * | 2006-04-13 | 2007-10-18 | Zhang Chao A | High performance louvered fin for heat exchanger |
US20080285290A1 (en) * | 2007-05-15 | 2008-11-20 | Hitachi, Ltd. | Liquid crystal display device |
JP2009099740A (ja) * | 2007-10-16 | 2009-05-07 | Furukawa Electric Co Ltd:The | 筐体の冷却装置 |
Non-Patent Citations (1)
Title |
---|
See also references of WO2011016221A1 * |
Also Published As
Publication number | Publication date |
---|---|
TW201111736A (en) | 2011-04-01 |
US20120132400A1 (en) | 2012-05-31 |
CN102473693A (zh) | 2012-05-23 |
JPWO2011016221A1 (ja) | 2013-01-10 |
WO2011016221A1 (ja) | 2011-02-10 |
CN102473693B (zh) | 2015-09-09 |
EP2463903A1 (en) | 2012-06-13 |
KR101729254B1 (ko) | 2017-04-24 |
JP5718814B2 (ja) | 2015-05-13 |
KR20120040246A (ko) | 2012-04-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20120307 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR |
|
DAX | Request for extension of the european patent (deleted) | ||
A4 | Supplementary search report drawn up and despatched |
Effective date: 20150129 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: H01L 23/367 20060101AFI20150123BHEP Ipc: H05K 7/20 20060101ALI20150123BHEP Ipc: H01L 23/473 20060101ALI20150123BHEP Ipc: H01L 23/467 20060101ALI20150123BHEP |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20150828 |