EP2308085A4 - Boîtier semi-conducteur doté d un blindage contre les interférences intégré et son procédé de fabrication - Google Patents

Boîtier semi-conducteur doté d un blindage contre les interférences intégré et son procédé de fabrication

Info

Publication number
EP2308085A4
EP2308085A4 EP08796999.4A EP08796999A EP2308085A4 EP 2308085 A4 EP2308085 A4 EP 2308085A4 EP 08796999 A EP08796999 A EP 08796999A EP 2308085 A4 EP2308085 A4 EP 2308085A4
Authority
EP
European Patent Office
Prior art keywords
semiconductor package
interference shielding
integrated interference
therof
manufacture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP08796999.4A
Other languages
German (de)
English (en)
Other versions
EP2308085A1 (fr
Inventor
Patrick L Welch
Yifan Guo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Skyworks Solutions Inc
Original Assignee
Skyworks Solutions Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Skyworks Solutions Inc filed Critical Skyworks Solutions Inc
Priority to EP14163096.2A priority Critical patent/EP2752872B1/fr
Publication of EP2308085A1 publication Critical patent/EP2308085A1/fr
Publication of EP2308085A4 publication Critical patent/EP2308085A4/fr
Withdrawn legal-status Critical Current

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    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
EP08796999.4A 2008-07-31 2008-07-31 Boîtier semi-conducteur doté d un blindage contre les interférences intégré et son procédé de fabrication Withdrawn EP2308085A4 (fr)

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JP (1) JP5276169B2 (fr)
KR (1) KR101533866B1 (fr)
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WO (1) WO2010014103A1 (fr)

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CN102105981B (zh) 2013-11-13
KR101533866B1 (ko) 2015-07-03
WO2010014103A1 (fr) 2010-02-04
EP2752872A1 (fr) 2014-07-09
EP2308085A1 (fr) 2011-04-13
CN102105981A (zh) 2011-06-22
HK1159311A1 (en) 2012-07-27
JP5276169B2 (ja) 2013-08-28
KR20110039448A (ko) 2011-04-18
EP2752872B1 (fr) 2018-06-27
JP2011529638A (ja) 2011-12-08

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