EP2289668B1 - Appareil de polissage - Google Patents

Appareil de polissage Download PDF

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Publication number
EP2289668B1
EP2289668B1 EP10251498.1A EP10251498A EP2289668B1 EP 2289668 B1 EP2289668 B1 EP 2289668B1 EP 10251498 A EP10251498 A EP 10251498A EP 2289668 B1 EP2289668 B1 EP 2289668B1
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Prior art keywords
fluid
polishing
shaped member
work
carrier
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EP10251498.1A
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German (de)
English (en)
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EP2289668A2 (fr
EP2289668A3 (fr
Inventor
Norihiko Moriya
Kazutaka Shibuya
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Fujikoshi Machinery Corp
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Fujikoshi Machinery Corp
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Publication of EP2289668A3 publication Critical patent/EP2289668A3/fr
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces

Definitions

  • the present invention relates to a polishing apparatus for polishing a work, e.g., wafer, and to a method of polishing.
  • a single-side polishing apparatus for polishing a work e.g., semiconductor wafer
  • the work held by a polishing head is pressed onto a polishing surface of a polishing plate, on which a polishing cloth is adhered, and the polishing plate is relatively moved with respect to the polishing head so as to polish the surface of the work.
  • a conventional single-side polishing apparatus is disclosed in Japanese Laid-open Patent Publication No. P2000-317819A .
  • the single-side polishing apparatus has a polishing head for holding a wafer, the wafer is pressed onto a polishing pad (polishing cloth) adhered on a rotary polishing plate so as to polish the surface of the wafer.
  • the polishing head comprises: a main body section facing the polishing plate and being capable of rotating; a carrier being loosely fitted in the polishing head and being capable of moving in the vertical direction; and a retainer ring enclosing the wafer and being brought into contact with the polishing pad with the wafer.
  • the retainer ring is attached to the carrier by an O-ring, an air spraying member is provided on a lower face of the carrier, a protection sheet covers an outer face of the air spraying member, and the wafer is pressed onto the polishing pad, together with the protection sheet, by air (air layer) sprayed from the air spraying member.
  • the air layer is formed between the air spraying member and the protection sheet, and the wafer is pressed onto the polishing pad (polishing cloth), together with the protection sheet, by the air layer.
  • the wafer is pressed, together with the protection sheet, by the air layer. Therefore, the wafer can move to follow the concavities and convexities, so that the wafer can be polished with high polishing accuracy and damaging the wafer can be prevented by the protection sheet.
  • the O-ring is provided between the retainer ring and the carrier, so the carrier and the air spraying member fixed to the carrier hardly move in the horizontal direction. Namely, the carrier and the air spraying member can move only in the vertical direction with maintaining the horizontal state.
  • the wafer moves to follow the concavities and convexities of the polishing cloth, the wafer sometimes inclines with respect to the air spraying member which always maintains the horizontal state. Air is downwardly sprayed from the air spraying member. If the wafer inclines with respect to the horizontal plane, a distance between the wafer and the air spraying member is vary from place to place, so pressure applied to the wafer must be uneven and the wafer cannot be polished evenly.
  • JP2002-170796A which is the closest prior art discloses a polishing apparatus for polishing a surface of a work comprising a polishing plate having a surface on which a polishing cloth is adhered, a polishing head for pressing the work onto the polishing cloth and a driving mechanism for relatively moving the polishing head with respect to the polishing plate.
  • the polishing head includes a main body section and a carrier being capable of inclining, wherein the carrier has a fluid feeding member which has a plurality of spraying ports from which a fluid is sprayable downward.
  • the polishing head further includes fluid supplying means for supplying the fluid to the carrier so as to spray the fluid downward from the fluid feeding member and an elastic sheet covering a lower side of the fluid feeding member so as to form a first fluid chamber, the elastic sheet being capable of holding the work on a lower surface thereof.
  • the polishing head further includes a ring-shaped member capable of enclosing the work held on the lower surface of the elastic sheet and pressing means for pressing the carrier downward. The work is pressed onto the polishing cloth with the elastic sheet by a pressing force generated by the pressing means and applied to the carrier and inner pressure of the first fluid chamber generated by the fluid supplied to the first fluid chamber, so as to polish the work, and the fluid, which has been downwardly supplied into the first fluid chamber horizontally flows outward in the first fluid chamber.
  • a preferred embodiment of the invention may provide a polishing apparatus, which is capable of highly improving polishing accuracy.
  • the polishing apparatus of the present invention which polishes a surface of a work, comprises:
  • Fig. 1 is a schematic explanation view of a polishing apparatus of the present embodiment.
  • the polishing apparatus 10 comprises: a polishing plate 12 having an upper surface on which a polishing cloth 11 for polishing a work W (see Fig. 2 ) is adhered; a polishing head 14 for holding the work W on a lower surface and pressing the work W onto the polishing cloth 11; and a driving mechanism for relatively moving the polishing head 14 with respect to the polishing plate 12.
  • the driving mechanism is constituted by a first rotary driving unit (not shown) for rotating the polishing plate 12 about a rotary shaft 15 and a second rotary driving unit (not shown) for rotating the polishing head 14 about a rotary shaft 16.
  • the polishing head 14 has a vertical driving unit (not shown) and a horizontal driving unit (not shown), holds the work W on the lower surface, and presses the work W onto the polishing cloth 11. While pressing the work W onto the polishing cloth 11, the driving mechanism relatively rotates the polishing plate 12 and the polishing head 14 so as to polish the lower surface of the work W.
  • a slurry supply nozzle 18 supplies slurry to the polishing cloth 11 adhered on the polishing plate 12.
  • Fig. 2 is a schematic sectional view of the polishing head 14.
  • a main body section 20 has a side wall 20a and a concave part whose open end is aimed downward.
  • a board-shaped member 22 has a side wall 22a and a concave part 23 whose open end is aimed downward.
  • the board-shaped member 22 is suspended, in the main body section 20, by a ring-shaped rubber diaphragm 24 having enough elasticity, and capable of moving in the vertical direction.
  • the side wall 20a acts as a guide for the vertical movement of the board-shaped member 22.
  • a third fluid chamber 25 is formed, between the board-shaped member 22 and the main body section 20, by the diaphragm 24.
  • Air is supplied from a compressed air source (not shown), e.g., air compressor, to the third fluid chamber 25 via a fluid path 26 formed in the rotary shaft 16 (not shown in Fig. 2 ) of the polishing head 14.
  • the fluid path 26 is connected to the compressed air source by a rotary joint (not shown).
  • the fluid path 26, the compressed air source, etc. constitute third fluid supplying means.
  • the third fluid chamber 25, the third fluid supplying means, etc. constitute first pressing means.
  • a carrier 28 is located in the concave part 23 of the board-shaped member 22, supported by a diaphragm 29 and capable of inclining, in a state where a prescribed gap is formed between an outer circumferential face of the carrier 28 and an inner face of the side wall 22a of the concave part 23, with respect to the horizontal plane.
  • a second fluid chamber 34 is formed, between the carrier 28 and the board-shaped member 22, by the diaphragm 29. Air is supplied from the compressed air source (not shown) to the second fluid chamber 34 via a fluid path 35 formed in the rotary shaft 16 (not shown in Fig. 2 ) of the polishing head 14.
  • the fluid path 35 is connected to the compressed air source by a rotary joint (not shown).
  • the fluid path 35, the compressed air source, etc. constitute second fluid supplying means.
  • the third second chamber 34, the second fluid supplying means, etc. constitute second pressing means.
  • An air reservoir 30 is formed in the carrier 28.
  • a fluid feeding member 31 is fixed to the carrier 28 and covers the lower side of the air reservoir 30.
  • a plurality of spraying ports, which are capable of spraying air downward, are formed in the fluid feeding member 31.
  • Air is supplied from the compressed air source (not shown) to the air reservoir 30 via a fluid path 37 formed in the rotary shaft 16 (not shown in Fig. 2 ) of the polishing head 14.
  • the fluid path 37 is connected to the compressed air source by a rotary joint (not shown).
  • the fluid path 37, the compressed air source, etc. constitute first fluid supplying means.
  • An elastic sheet 36 covers the lower side of the fluid feeding member 31, and an outer edge of the elastic sheet 36 is air-tightly fixed to a lower end of the side wall 22a of the board-shaped member 22 by suitable means (not shown). With this structure, a first fluid chamber 38 is formed under the fluid feeding member 31.
  • the elastic sheet 36 is a two-layered sheet constituted by a sheet-shaped member 39, which is composed of rubber and has enough elasticity, and a holding member 40, which is provided under the sheet-shaped member 39 and has many holes for holding the work W by surface tension of water.
  • a ring-shaped member 42 composed of plastic, which encloses the work W held on a lower surface of the elastic sheet 36, is attached to a lower edge of the elastic sheet 36.
  • a plurality of fluid outlets 44 for discharging the fluid from the first fluid chamber 38 are formed, in the board-shaped member 22, at positions higher than the lower surface of the fluid feeding member 31.
  • the fluid outlets 44 are equiangularly arranged.
  • discharge pipes 45 are respectively connected to the fluid outlets 44, and the discharge pipes 45 are connected to a collecting pipe 46.
  • a relief valve 47 is provided to the collecting pipe 46. The relief valve 47 maintains inner pressure of the first fluid chamber 38 at prescribed pressure. When the inner pressure of the first fluid chamber 38 is higher than the prescribed pressure, the relief valve 47 discharges air from the first fluid chamber 38.
  • number of the fluid outlet 44 may be one.
  • the discharge pipes 45 are extended outside of the main body section 20 via large through-holes formed in the side wall 20a.
  • Air discharged by the relief valve 47 may be collected and introduced to the compressed air source (not shown) to reuse. With this structure, running cost of the apparatus can be reduced and the apparatus is better for the environment.
  • discharge pipes 45 and the relief valve 47 may be omitted. Further, the fluid may be directly discharged from the fluid outlets 44.
  • the polishing apparatus of the present embodiment has the above described structure. Next, a polishing method in the polishing apparatus will be explained.
  • air is supplied into the third fluid chamber 25 to press the board-shaped member 22 (the press action is performed by the first pressing means) and the ring-shaped member 42 is pressed onto the polishing cloth 11 with the side wall 22a of the board-shaped member 22 and the elastic sheet 36 while polishing the work W, so that excessive polishing of the outer edge of the work W can be prevented.
  • Air is supplied into the second fluid chamber 34 so as to press the carrier 28 downward. Further, air is supplied into the first fluid chamber 38 so as to press the elastic sheet 36.
  • a pressing force for pressing the carrier 28, which is applied by the second fluid chamber 34 (the second pressing means), and the inner pressure of the air supplied into the first fluid chamber 38 are applied to the work W via the elastic sheet 36, so that the work W is pressed onto the polishing cloth 11 and polished thereon.
  • the inner pressures of the first fluid chamber 38 and the second fluid chamber 34 are suitably set so as not to break the air layer in the first fluid chamber 38 by the inner pressure of the second fluid chamber 34.
  • the air which has been downwardly supplied into the first fluid chamber 38, horizontally flows outward in the first fluid chamber 38, collides with the inner face of the side wall 22a of the concave part 23 of the board-shaped member 22 and flows upward, and then the air is discharged outside from the fluid outlets 44.
  • the fluid outlets 44 are located at positions sufficiently-higher than a lower surface of the fluid feeding member 31. Since the air horizontally flows outward in the first fluid chamber 38, collides with the inner face of the side wall 22a of the concave part 23 of the board-shaped member 22 and flows upward, the carrier 28 (the fluid feeding member 31) is centered by a reactive force generated by colliding the air with the ring-shaped side wall 22a.
  • the carrier 28 (the fluid feeding member 31) is floated and the carrier 28 does not directly act on the work W. Therefore, even if concavities and convexities exist on the surface of the polishing cloth 11 like gurge, the wafer can move to follow the concavities and convexities thereon.
  • the carrier 28 (the fluid feeding member 31) is supported by the board-shaped member 22 and capable of inclining, with respect to the horizontal plane, in a state where a prescribed gap is formed between an outer circumferential face of the carrier 28 and the inner face of the side wall 22a of the concave part 23.
  • the carrier 28 (the fluid feeding member 31) is also horizontal. If concavities and convexities exist in the surface of the polishing cloth 11, the work W is inclined, with respect to the horizontal carrier 28 (the fluid feeding member 31), as shown in Fig. 3 . Note that, the inclination of the work W is exaggerated in Fig. 3 .
  • the horizontal state of the carrier is maintained, so a distance between the carrier (the fluid feeding member) and the work is varied, so the work cannot be uniformly pressed and cannot be evenly polished.
  • the carrier 28 (the fluid feeding member 31) is inclinable with respect to the board-shaped member 22.
  • pressure a reactive force
  • the carrier 28 (the fluid feeding member 31) from a part X of the work W, at which the distance is short, is higher; on the other hand, pressure (a reactive force) applied to the carrier 28 (the fluid feeding member 31) from a part Y of the work W, at which the distance is longer, is lower.
  • one part of the carrier 28 which corresponds to the part X of the work W and to which the higher pressure (the reactive force) is applied, is moved away from the work W; the other part of the carrier 28 (the fluid feeding member 31), which corresponds to the part Y of the work W and to which the lower pressure (the reactive force) is applied, is moved close to the work W.
  • the carrier 28 (the fluid feeding member 31) is inclined and made parallel to the work W. Therefore, the distance between the carrier 28 (the fluid feeding member 31) and the work W is made constant, so that the pressing force can be uniformly applied to the work W and the work W can be evenly polished.
  • the air pressure is applied to the carrier 28 (the fluid feeding member 31) so as to center the carrier 28 (the fluid feeding member 31). Even if the carrier 28 (the fluid feeding member 31) is inclined and shifted from the center of the board-shaped member 22, the carrier 28 (the fluid feeding member 31) is always biased toward the center of the board-shaped member 22.
  • the carrier 28 has the above described floating structure, and no load is applied from the work W while the polishing operation. Therefore, the diaphragm 29, which suspends the carrier 28, need not have high rigidity, so the carrier 28 can be easily inclinably suspended.
  • Fig. 4 is a schematic sectional view of another polishing head 14. Note that, the structural elements shown in Fig. 2 are assigned the same symbols and explanation will be omitted.
  • an air reservoir of the carrier 28 is divided into a plurality of reservoirs, e.g., a central air reservoir 30a and an outer air reservoir 30b.
  • Fluid supplying means 50a and 50b respectively supply air to the air reservoirs 30a and 30b.
  • a flow volume controller 52 is provided to the fluid supplying means 50a so as to control flow volume of the air supplied to the air reservoir 30a.
  • Another flow volume controller (not shown) may be provided to the fluid supplying means 50b.
  • a pressure controller or controllers may be employed instead of the flow volume controller or controllers.
  • the pressing force applied to a center zone and an outer zone of the work W can be controlled. Namely, polishing conditions can be precisely controlled.
  • the work W may be coaxially divided into three zones or more, and the pressing force can be controlled in the zones respectively.
  • the fluid is air.
  • the fluid may be a liquid.
  • the first pressing means (the third fluid chamber 25, etc.) and the second pressing means (the second fluid chamber 34, etc.) may be mechanical means, e.g., spring, screw mechanism.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Claims (9)

  1. Appareil de polissage (10) pour polir une surface d'une pièce (W) comprenant : une plaque de polissage (12) ayant une surface sur laquelle est fixé un tissu à polir (11) ; une tête de polissage (14) pour comprimer la pièce (W) sur le tissu à polir (11) ; et un mécanisme d'entraînement pour déplacer relativement la tête de polissage (14) par rapport à la plaque de polissage (12),
    dans lequel :
    la tête de polissage (14) comprend :
    une section de corps principal (20) ;
    un élément en forme de plaque (22) ayant une partie concave (23) dont l'extrémité ouverte est dirigée vers le bas, l'élément en forme de plaque (22) étant suspendu à partir de la section de corps principal (20) et mobile dans la direction verticale ;
    un support (28) étant positionné dans la partie concave (23) de l'élément en forme de plaque (22), étant supporté par l'élément en forme de plaque (22) et pouvant s'incliner, dans un état dans lequel un espace prescrit est formé entre une face circonférentielle externe du support (28) et une paroi latérale de la partie concave (23), par rapport au plan horizontal, le support (28) ayant un élément d'alimentation en fluide (31) qui a une pluralité d'orifices de pulvérisation (32) à partir desquels un fluide peut être pulvérisé vers le bas ;
    un moyen d'alimentation en fluide (37) pour amener le fluide au support (28) afin de pulvériser le fluide vers le bas à partir de l'élément d'alimentation en fluide (31) ;
    une feuille élastique (36) qui est prévue sur l'élément en forme de plaque (22) et recouvrant un côté inférieur de l'élément d'alimentation en fluide (31) afin de former une première chambre de fluide (38), la feuille élastique (36) pouvant maintenir la pièce (W) sur sa surface inférieure ;
    un élément de forme annulaire (42) étant prévu sur une partie de bord externe de la surface inférieure de la feuille élastique (36), l'élément de forme annulaire (42) pouvant entourer la pièce (W) maintenue sur la surface inférieure de la feuille élastique (36) ;
    un premier moyen de pression (25) pour comprimer l'élément en forme de plaque (22) vers le bas afin de comprimer l'élément de forme annulaire (42) sur le tissu à polir (11) avec la feuille élastique (36) ;
    un second moyen de pression (34) pour comprimer le support (28) vers le bas ; et
    une sortie de fluide (44) pour décharger le fluide de la première chambre de fluide (38), la sortie de fluide (44) étant formée dans l'élément en forme de plaque (22), dans une position plus haute qu'une surface inférieure de l'élément d'alimentation en fluide (31), l'agencement étant tel qu'à l'usage,
    la pièce (W) est comprimée sur le tissu à polir (11), avec la feuille élastique (36), par une force de pression générée par le second élément de pression (34) et appliquée sur le support (28) et la pression interne de la première chambre de fluide (38) générée par le fluide fourni à la première chambre de fluide (38), afin de polir la pièce (W), et
    le fluide, qui a été amené vers le bas dans la première chambre de fluide (38), s'écoule horizontalement vers l'extérieur dans la première chambre de fluide (38), entre en collision avec la paroi latérale de la partie concave (23) et s'écoule vers le haut, et ensuite le fluide est déchargé vers l'extérieur par la sortie de fluide (44), ainsi l'élément d'alimentation en fluide (31) suit le mouvement de la feuille élastique (36) et se maintient parallèle à la feuille élastique (36), et l'élément d'alimentation en fluide (31) est centré dans la première chambre de fluide (38).
  2. Appareil de polissage (10) selon la revendication 1,
    dans lequel le support (28) est supporté par l'élément en forme de plaque (22) avec un diaphragme (29) et pouvant s'incliner dans un état dans lequel l'espace prescrit est formé entre la face circonférentielle externe du support (28) et la paroi latérale de la partie concave (23), et
    le second moyen de pression comprend :
    une deuxième chambre de fluide (34) étant formée, par le diaphragme (29), entre le support (28) et l'élément en forme de plaque (22) ; et
    le deuxième moyen d'alimentation en fluide (35) pour amener le fluide à la deuxième chambre de fluide (34).
  3. Appareil de polissage (10) selon la revendication 1 ou 2,
    dans lequel l'élément en forme de plaque (22) est suspendu, par un diaphragme (24), à la section de corps principal (20) et mobile dans la direction verticale, et
    le premier moyen de pression comprend :
    une troisième chambre de fluide (25) qui est formée, par le diaphragme (24), entre l'élément en forme de plaque (22) et la section de corps principal (20) ; et
    le troisième moyen d'alimentation en fluide (26) pour amener le fluide à la troisième chambre de fluide (25).
  4. Appareil de polissage (10) selon l'une des revendications 1 à 3,
    dans lequel un tuyau de décharge (45) est raccordé à la sortie de fluide (44), une valve de décharge (47) est prévue sur le tuyau de décharge (45) et la pression interne de la première chambre de fluide (38) peut être maintenue, à la pression prescrite, par la valve de décharge (47).
  5. Appareil de polissage (10) selon la revendication 4,
    dans lequel l'appareil de polissage (10) est configuré de sorte que le fluide déchargé du tuyau de décharge (45) est collecté et réutilisé.
  6. Appareil de polissage (10) selon l'une des revendications 1 à 5,
    dans lequel l'appareil de polissage (10) est configuré de sorte qu'à l'usage, la force de pression, qui est appliquée sur la pièce (W) via la feuille élastique (36), est différente dans une pluralité de zones coaxiales de la pièce (W) et le volume d'écoulement du fluide vers la première chambre (38) peut être préréglé pour chacune des zones coaxiales.
  7. Appareil de polissage (10) selon l'une des revendications 2 à 6,
    dans lequel le fluide amené dans les chambres de fluide (38, 34, 25) est de l'air.
  8. Appareil de polissage (10) selon l'une des revendications 1 à 7,
    dans lequel la feuille élastique (36) est une feuille à deux couches constituées par un élément en forme de feuille (39) et un élément de maintien (40) prévu sous l'élément en forme de feuille (39).
  9. Procédé de polissage comprenant l'étape consistant à utiliser l'appareil de polissage selon l'une quelconque des revendications précédentes pour polir une pièce (W).
EP10251498.1A 2009-08-31 2010-08-26 Appareil de polissage Active EP2289668B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009200690A JP5392483B2 (ja) 2009-08-31 2009-08-31 研磨装置

Publications (3)

Publication Number Publication Date
EP2289668A2 EP2289668A2 (fr) 2011-03-02
EP2289668A3 EP2289668A3 (fr) 2014-01-22
EP2289668B1 true EP2289668B1 (fr) 2019-02-06

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US (1) US20110053474A1 (fr)
EP (1) EP2289668B1 (fr)
JP (1) JP5392483B2 (fr)
KR (1) KR101696932B1 (fr)
CN (1) CN102001036B (fr)

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JP6283957B2 (ja) * 2015-04-16 2018-02-28 信越半導体株式会社 研磨ヘッドの製造方法及び研磨ヘッド、並びに研磨装置
CN106426026B (zh) * 2016-03-07 2018-02-02 江苏省特种设备安全监督检验研究院 工位自动到位的安全阀维修台
JP7108450B2 (ja) * 2018-04-13 2022-07-28 株式会社ディスコ 研磨装置
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JP5392483B2 (ja) 2014-01-22
CN102001036A (zh) 2011-04-06
CN102001036B (zh) 2014-09-24
EP2289668A2 (fr) 2011-03-02
KR101696932B1 (ko) 2017-02-01
JP2011051047A (ja) 2011-03-17
KR20110023785A (ko) 2011-03-08
EP2289668A3 (fr) 2014-01-22
US20110053474A1 (en) 2011-03-03

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