EP2264748A3 - Vorrichtung zur Montage von elektrischen Bauteilen - Google Patents
Vorrichtung zur Montage von elektrischen Bauteilen Download PDFInfo
- Publication number
- EP2264748A3 EP2264748A3 EP10183623A EP10183623A EP2264748A3 EP 2264748 A3 EP2264748 A3 EP 2264748A3 EP 10183623 A EP10183623 A EP 10183623A EP 10183623 A EP10183623 A EP 10183623A EP 2264748 A3 EP2264748 A3 EP 2264748A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- pressing force
- pressure bonding
- bonding member
- force adjusting
- mounting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
- B30B15/02—Dies; Inserts therefor; Mounting thereof; Moulds
- B30B15/022—Moulds for compacting material in powder, granular of pasta form
- B30B15/024—Moulds for compacting material in powder, granular of pasta form using elastic mould parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
- B30B15/06—Platens or press rams
- B30B15/065—Press rams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B5/00—Presses characterised by the use of pressing means other than those mentioned in the preceding groups
- B30B5/02—Presses characterised by the use of pressing means other than those mentioned in the preceding groups wherein the pressing means is in the form of a flexible element, e.g. diaphragm, urged by fluid pressure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/75251—Means for applying energy, e.g. heating means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/75301—Bonding head
- H01L2224/75302—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/75301—Bonding head
- H01L2224/75302—Shape
- H01L2224/75303—Shape of the pressing surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/75301—Bonding head
- H01L2224/75314—Auxiliary members on the pressing surface
- H01L2224/75315—Elastomer inlay
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7598—Apparatus for connecting with bump connectors or layer connectors specially adapted for batch processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005026787 | 2005-02-02 | ||
EP06712384A EP1845556A4 (de) | 2005-02-02 | 2006-01-26 | Anbringvorrichtung für elektrische komponenten |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP06712384.4 Division | 2006-01-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2264748A2 EP2264748A2 (de) | 2010-12-22 |
EP2264748A3 true EP2264748A3 (de) | 2012-09-05 |
Family
ID=36777132
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP10183623A Withdrawn EP2264748A3 (de) | 2005-02-02 | 2006-01-26 | Vorrichtung zur Montage von elektrischen Bauteilen |
EP06712384A Withdrawn EP1845556A4 (de) | 2005-02-02 | 2006-01-26 | Anbringvorrichtung für elektrische komponenten |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP06712384A Withdrawn EP1845556A4 (de) | 2005-02-02 | 2006-01-26 | Anbringvorrichtung für elektrische komponenten |
Country Status (8)
Country | Link |
---|---|
US (1) | US7857028B2 (de) |
EP (2) | EP2264748A3 (de) |
JP (1) | JP4841431B2 (de) |
KR (1) | KR101253794B1 (de) |
CN (1) | CN100557783C (de) |
HK (1) | HK1116920A1 (de) |
TW (1) | TWI335631B (de) |
WO (1) | WO2006082744A1 (de) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4206320B2 (ja) * | 2003-09-19 | 2009-01-07 | 株式会社ルネサステクノロジ | 半導体集積回路装置の製造方法 |
JP4841431B2 (ja) | 2005-02-02 | 2011-12-21 | ソニーケミカル&インフォメーションデバイス株式会社 | 電気部品の実装装置 |
JP4925669B2 (ja) * | 2006-01-13 | 2012-05-09 | ソニーケミカル&インフォメーションデバイス株式会社 | 圧着装置及び実装方法 |
JP4979288B2 (ja) * | 2006-07-19 | 2012-07-18 | ソニーケミカル&インフォメーションデバイス株式会社 | 熱圧着ヘッドを用いた実装方法 |
JP5122192B2 (ja) * | 2007-07-04 | 2013-01-16 | パナソニック株式会社 | 半導体素子実装装置 |
JP2009141269A (ja) * | 2007-12-10 | 2009-06-25 | Sony Chemical & Information Device Corp | 電気部品の実装方法及び実装装置 |
JP4916494B2 (ja) * | 2008-08-08 | 2012-04-11 | ソニーケミカル&インフォメーションデバイス株式会社 | 圧着装置、圧着方法、および押圧板 |
JP2011109046A (ja) * | 2009-11-20 | 2011-06-02 | Sony Chemical & Information Device Corp | 実装装置および電子モジュールの製造方法 |
JP5602439B2 (ja) * | 2010-01-22 | 2014-10-08 | デクセリアルズ株式会社 | 加熱装置および実装体の製造方法 |
WO2011132384A1 (ja) * | 2010-04-23 | 2011-10-27 | 住友ベークライト株式会社 | 電子装置の製造方法および装置、その一対の挟圧部材 |
KR20120009713A (ko) * | 2010-07-20 | 2012-02-02 | 삼성전자주식회사 | 인쇄회로기판 조립체의 제조장치 및 이의 제조방법 |
US8381965B2 (en) * | 2010-07-22 | 2013-02-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Thermal compress bonding |
US8651359B2 (en) * | 2010-08-23 | 2014-02-18 | International Business Machines Corporation | Flip chip bonder head for forming a uniform fillet |
US8104666B1 (en) | 2010-09-01 | 2012-01-31 | Taiwan Semiconductor Manufacturing Company, Ltd. | Thermal compressive bonding with separate die-attach and reflow processes |
US8177862B2 (en) | 2010-10-08 | 2012-05-15 | Taiwan Semiconductor Manufacturing Co., Ltd | Thermal compressive bond head |
JP5437221B2 (ja) * | 2010-11-29 | 2014-03-12 | アルファーデザイン株式会社 | ボンディング装置 |
JP5732239B2 (ja) * | 2010-11-30 | 2015-06-10 | デクセリアルズ株式会社 | 熱圧着ヘッド、熱圧着装置、実装方法 |
CN102426919A (zh) * | 2011-08-17 | 2012-04-25 | 六和电子(江西)有限公司 | 低噪音金属化薄膜电容器生产工艺 |
JP6043058B2 (ja) * | 2011-11-07 | 2016-12-14 | デクセリアルズ株式会社 | 接続装置、接続構造体の製造方法、チップスタック部品の製造方法及び電子部品の実装方法 |
US9842817B2 (en) | 2012-02-27 | 2017-12-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Solder bump stretching method and device for performing the same |
US8912045B2 (en) * | 2012-06-12 | 2014-12-16 | International Business Machines Corporation | Three dimensional flip chip system and method |
KR102170192B1 (ko) * | 2013-08-22 | 2020-10-26 | 삼성전자주식회사 | 본딩 방법, 본딩 장치, 그리고 기판 제조 방법 |
DE102014114096A1 (de) | 2014-09-29 | 2016-03-31 | Danfoss Silicon Power Gmbh | Sinterwerkzeug für den Unterstempel einer Sintervorrichtung |
DE102014114093B4 (de) | 2014-09-29 | 2017-03-23 | Danfoss Silicon Power Gmbh | Verfahren zum Niedertemperatur-Drucksintern |
DE102014114095B4 (de) * | 2014-09-29 | 2017-03-23 | Danfoss Silicon Power Gmbh | Sintervorrichtung |
DE102014114097B4 (de) | 2014-09-29 | 2017-06-01 | Danfoss Silicon Power Gmbh | Sinterwerkzeug und Verfahren zum Sintern einer elektronischen Baugruppe |
US10566469B2 (en) * | 2016-03-29 | 2020-02-18 | Panasonic Intellectual Property Management Co., Ltd. | Method of manufacturing solar cell module |
KR101996936B1 (ko) * | 2018-12-19 | 2019-07-05 | (주)제이스텍 | 백업 히팅 acf 본딩장치 |
JP7301468B2 (ja) * | 2019-04-17 | 2023-07-03 | 株式会社ディスコ | 被加工物の加工方法、熱圧着方法 |
US11676937B2 (en) | 2021-05-04 | 2023-06-13 | Asmpt Singapore Pte. Ltd. | Flexible sinter tool for bonding semiconductor devices |
KR102573094B1 (ko) * | 2021-05-11 | 2023-09-01 | 정라파엘 | 다이 본딩 방법 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4233073A1 (de) * | 1992-10-01 | 1994-04-07 | Siemens Ag | Verfahren zum Herstellen eines Halbleiter-Modulaufbaus |
JP2002324821A (ja) * | 2001-04-25 | 2002-11-08 | Matsushita Electric Ind Co Ltd | 電子部品の圧着装置及び圧着方法 |
JP2003077953A (ja) * | 2001-09-06 | 2003-03-14 | Sony Corp | フリップチップ実装方法及び装置、半導体装置 |
JP2004014883A (ja) * | 2002-06-07 | 2004-01-15 | Towa Corp | アンダーフィル樹脂モールド方法及び金型と樹脂部材 |
WO2005006430A1 (ja) * | 2003-07-11 | 2005-01-20 | Sony Chemicals Corp. | 電気部品の実装方法及び実装装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4875966A (en) * | 1988-09-12 | 1989-10-24 | General Dynamics Corp., Pomona Div. | Pressure transfer plate assembly for a heat bonding apparatus |
US5186632A (en) * | 1991-09-20 | 1993-02-16 | International Business Machines Corporation | Electronic device elastomeric mounting and interconnection technology |
JP4077982B2 (ja) | 1998-06-26 | 2008-04-23 | 日機装株式会社 | 加圧成形用型 |
JP3663931B2 (ja) * | 1998-08-25 | 2005-06-22 | セイコーエプソン株式会社 | 圧着方法、圧着装置及び液晶表示装置の製造方法 |
US6484776B1 (en) * | 2000-04-07 | 2002-11-26 | Northrop Grumman Corporation | System for constructing a laminate |
JP4513235B2 (ja) | 2001-05-31 | 2010-07-28 | ソニー株式会社 | フリップチップ実装装置 |
JP4718734B2 (ja) * | 2001-09-12 | 2011-07-06 | 日機装株式会社 | 回路素子の実装方法 |
JP2003258413A (ja) * | 2002-03-06 | 2003-09-12 | Nikkiso Co Ltd | 回路素子の実装装置および実装方法 |
JP2003298226A (ja) * | 2002-03-29 | 2003-10-17 | Optrex Corp | 基板接続装置 |
JP4841431B2 (ja) | 2005-02-02 | 2011-12-21 | ソニーケミカル&インフォメーションデバイス株式会社 | 電気部品の実装装置 |
-
2006
- 2006-01-26 JP JP2006523461A patent/JP4841431B2/ja not_active Expired - Fee Related
- 2006-01-26 KR KR1020077019961A patent/KR101253794B1/ko not_active IP Right Cessation
- 2006-01-26 EP EP10183623A patent/EP2264748A3/de not_active Withdrawn
- 2006-01-26 CN CNB2006800037724A patent/CN100557783C/zh not_active Expired - Fee Related
- 2006-01-26 WO PCT/JP2006/301202 patent/WO2006082744A1/ja active Application Filing
- 2006-01-26 EP EP06712384A patent/EP1845556A4/de not_active Withdrawn
- 2006-01-27 TW TW095103361A patent/TWI335631B/zh not_active IP Right Cessation
-
2007
- 2007-07-30 US US11/882,049 patent/US7857028B2/en not_active Expired - Fee Related
-
2008
- 2008-06-19 HK HK08106838.5A patent/HK1116920A1/xx not_active IP Right Cessation
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4233073A1 (de) * | 1992-10-01 | 1994-04-07 | Siemens Ag | Verfahren zum Herstellen eines Halbleiter-Modulaufbaus |
JP2002324821A (ja) * | 2001-04-25 | 2002-11-08 | Matsushita Electric Ind Co Ltd | 電子部品の圧着装置及び圧着方法 |
JP2003077953A (ja) * | 2001-09-06 | 2003-03-14 | Sony Corp | フリップチップ実装方法及び装置、半導体装置 |
JP2004014883A (ja) * | 2002-06-07 | 2004-01-15 | Towa Corp | アンダーフィル樹脂モールド方法及び金型と樹脂部材 |
WO2005006430A1 (ja) * | 2003-07-11 | 2005-01-20 | Sony Chemicals Corp. | 電気部品の実装方法及び実装装置 |
EP1646081A1 (de) * | 2003-07-11 | 2006-04-12 | Sony Chemicals Corp. | Kapselungsverfahren und system einer elektrischen komponente |
Also Published As
Publication number | Publication date |
---|---|
EP1845556A4 (de) | 2010-02-10 |
TW200636894A (en) | 2006-10-16 |
WO2006082744A1 (ja) | 2006-08-10 |
KR101253794B1 (ko) | 2013-04-12 |
EP2264748A2 (de) | 2010-12-22 |
CN100557783C (zh) | 2009-11-04 |
KR20070099679A (ko) | 2007-10-09 |
EP1845556A1 (de) | 2007-10-17 |
JPWO2006082744A1 (ja) | 2008-06-26 |
TWI335631B (en) | 2011-01-01 |
US7857028B2 (en) | 2010-12-28 |
CN101111932A (zh) | 2008-01-23 |
JP4841431B2 (ja) | 2011-12-21 |
HK1116920A1 (en) | 2009-01-02 |
US20080035274A1 (en) | 2008-02-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP2264748A3 (de) | Vorrichtung zur Montage von elektrischen Bauteilen | |
EP1884889A3 (de) | Halbleiterbauelement | |
HK1125226A1 (en) | Packaging method of electric component | |
EP1653503A3 (de) | Halbleitervorrichtung, Leiterplatte, elektro-optische Vorrichtung, elektronische Vorrichtung | |
KR101034166B1 (ko) | 열압착 헤드를 사용한 실장 방법 | |
HK1144734A1 (en) | Method and apparatus for mounting electric component | |
TW200503206A (en) | Layered microelectronic contact and method for fabricating same | |
EP1883107A3 (de) | Verfahren zur Erzeugung verpackter mikroelektronischer Vorrichtungen und mit diesem Verfahren erzeugte Vorrichtungen | |
EP2058856A3 (de) | Halbleitervorrichtung und Verfahren für ihre Montage | |
EP1808405A3 (de) | Integrierte Verkapselung für MEMS und IC-Chip | |
EP1613027A3 (de) | Kontakt für tragbare elektronisches Einrichtung | |
SG136822A1 (en) | Integrated circuit devices with stacked package interposers | |
EP2876983A3 (de) | Elektronische Vorrichtung und Verfahren zur Montage davon | |
EP2196944A3 (de) | Fingersensor mit flexibler Schaltung und zugehörige Verfahren | |
EP2037493A3 (de) | Verfahren zur Befestigung einer leitfähigen Kugel und Vorrichtung zur Befestigung einer leitfähigen Kugel | |
WO2008123076A1 (ja) | 接続用ボード、プローブカード及びそれを備えた電子部品試験装置 | |
EP1770774A3 (de) | Kühlkörperanordnung | |
EP1699079A3 (de) | Elektronische Vorrichtung, Abstandhalter und Verfahren zur Herstellung der elektronischen Vorrichtung | |
WO2006016136A3 (en) | Shear test device | |
EP1458024A3 (de) | Zwischenstück und Halbleiteranordnung | |
EP1496733A3 (de) | Elektronische Packung mit beabstandeter Lötverbindung kontrollierter Höhe | |
EP2112488A3 (de) | Drucksensormodul und elektronische Komponente | |
WO2008142754A1 (ja) | 電子部品試験装置及び電子部品試験方法 | |
EP1681718A3 (de) | Elektronisches Bauteil, elektro-optisches Bauteil, eletronisches Gerät | |
WO2009075159A1 (ja) | 電気部品の実装方法及び実装装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
AC | Divisional application: reference to earlier application |
Ref document number: 1845556 Country of ref document: EP Kind code of ref document: P |
|
AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): DE NL |
|
PUAL | Search report despatched |
Free format text: ORIGINAL CODE: 0009013 |
|
AK | Designated contracting states |
Kind code of ref document: A3 Designated state(s): DE NL |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: H05K 3/30 20060101ALI20120731BHEP Ipc: B30B 15/06 20060101ALI20120731BHEP Ipc: H01L 21/60 20060101ALI20120731BHEP Ipc: B30B 5/02 20060101ALI20120731BHEP Ipc: B30B 15/02 20060101AFI20120731BHEP |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: B30B 15/06 20060101ALI20120814BHEP Ipc: H01L 21/60 20060101ALI20120814BHEP Ipc: H05K 3/30 20060101ALI20120814BHEP Ipc: B30B 15/02 20060101AFI20120814BHEP Ipc: B30B 5/02 20060101ALI20120814BHEP |
|
RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: DEXERIALS CORPORATION |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20130306 |