Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
  • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
  • H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
  • H10K71/221—Changing the shape of the active layer in the devices, e.g. patterning by lift-off techniques
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
  • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
  • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
  • H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/03—Conductive materials
  • H05K2201/032—Materials
  • H05K2201/0329—Intrinsically conductive polymer [ICP]; Semiconductive polymer
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
  • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
  • H10K85/10—Organic polymers or oligomers
  • H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
  • H10K85/113—Heteroaromatic compounds comprising sulfur or selene, e.g. polythiophene
  • H10K85/1135—Polyethylene dioxythiophene [PEDOT]; Derivatives thereof
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
  • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]

Definitions

• the invention relates to a method for the production of conductive structured polymer layers by means of the lift-off process and to the conductive patterned polymer layers produced by this method.
• Conductive polymers have gained economic importance in recent years due to an improved property profile. By increasing the electrical conductivity on the one hand and improving the chemical stability to environmental influences on the other hand, many new applications have been developed. Thus, conductive polymers are used, for example, as antistatic layers, transparent electrodes, Lochänjektäonstiken, counter electrodes in capacitors or sensors with growing success.
• a polymer layer is not homogeneously over the whole surface on a support, such as e.g. a film or a glass plate, but consists of individual segments, e.g. from individual tracks, which are spatially separated from each other and thus electrically isolated from each other.
• a support such as e.g. a film or a glass plate
• individual segments e.g. from individual tracks
• the challenge now is to apply these spatial, lateral structures on a support with the highest possible spatial resolution.
• the regions in which the conductive polymer is present as a layer and the regions in which no polymer is present are sharply delimited from one another.
• the step created at the boundary of the areas determines the spatial resolution, which can be characterized by two variables, the step height h and the step width b.
• the step height corresponds to the thickness of the polymer layer and is typically 30 nm ⁇ h ⁇ 10 ⁇ m.
• the step width corresponds to the width of the polymer layer, wherein for many applications a step width b ⁇ 20 microns, preferably of b ⁇ 5 microns, is necessary.
• These include e.g. Electrodes for Organic Light Emitting Diodes "OLEDs” (Organic Light Emitting Devices, Ed. Joseph Shinar, 2004 Springer-Verlag) or Electrodes for Organic Field Effect Transitors "OFETs” (Organic Electronics, Ed. Hagen Klauk, 2006 Wiley ⁇ VCH, p.3ff ), which are only a few microns apart.
• the established printing methods listed above result in print images in which the deposited inks or inks have surfaces that are often inhomogeneous and microscopically rough.
• screen printing, flexographic printing, pad printing, offset printing and gravure printing require highly viscous colors per se, which then can no longer run adequately during drying and thus form rough surfaces.
• rough surfaces of conductive polymer layers with an average roughness Ra> 5 nm are undesirable, in particular in the case of OLEDs or OFETs, since they can lead to electrical short circuits here.
• Another disadvantage is that ablated fragments of the polymer deposit on the surface of the adjacent polymer layer, i. contaminate, and these can change the electrical properties and surface properties of the conductive polymer. It is also disadvantageous that the laser ablation of conductive polymers on polymeric substrates, e.g. Polyethylene terephthalate (PET) films are difficult to control because the desired removal of the conductive polymer also ablates the substrate material simultaneously.
• PET Polyethylene terephthalate
• the resolving power of laser sintering is limited to the focusability of the laser beam and is 1 to 5 ⁇ m.
• DE-A-10340641 describes the structuring of conductive polymers by means of photolithography.
• a positive photoresist layer is applied to the conductive polymer layer and applied over a shadow illuminated.
• the photoresist can be removed at the exposed areas with a developer, thus exposing the underlying conductive polymer layer. This can then be removed by placing it in a suitable solvent.
• the desired conductive polymer structures are exposed by solubilizing the overlying insoluble photoresist by large-area UV irradiation, the so-called flood exposure, and then removing it by rinsing with the developer.
• This method has the following disadvantages:
• the conductive polymer layer comes in direct contact with the photoresist, ie. the photoresist may contaminate the conductive polymer layer and thus alter its electronic properties, eg, the work function.
• Another disadvantage is that the corridor exposure can damage the conductive polymer by Fotooxi- dation sustainable and thereby the conductivity is lowered.
• the exposed photoresist is thermally cured to form a negative of the later desired structure.
• pyrroles or anilines in the presence of the oxidant FeCl 3 are spun from solution as a thin film and polymerize on the substrate. This film then lies both on the cured photoresist as well as on the areas of the substrate freed from the photoresist.
• the cured photoresist can now be removed again so that the overlying layer of conductive polymer is also removed.
• the toluene or acetone-insoluble conductive polymer adheres to the photoresist exposed sites on the substrate.
• conductive polymers are realized with a step width of ⁇ 1 micron.
• a disadvantage of the method described, however, is that the conductive polymers must be polymerized in situ on the substrate, ie a chemical reaction takes place on the substrate, which can be realized industrially only with great effort.
• in-situ polymerized layers have the disadvantage that they form only moderately smooth surfaces and tend to flake off due to their tension.
• the object was therefore to provide a process for the production of conductive structured polymer layers, in which the conductive polymer can be deposited from solution or dispersion on a substrate, in which the structures of the conductive polymer layer yield a high lateral spatial resolution and in which the surfaces conductive polymer layer are smooth.
• Another object was to provide a method for patterning highly conductive polymers, i. Polymers with a conductivity of ⁇ >] 00 S / cm.
• conductive structured polymer layers which fulfill the abovementioned conditions can be produced using the lift-off process and applying at least one conductive polymer as polycarbonate and at least one polyanion to the substrate.
• the present invention therefore provides a process for the preparation of conductive structured polymer layers using the lift-off process, characterized in that at least one conductive polymer as polycation and at least one polyanion having an average molecular weight M w in a range of 1000 to 100 000 g / mol, is applied to the substrate.
• conductive polymers as polycation may represent an optionally substituted polythiophene, polyaniline or polypyrrole. It may also be that mixtures of two or more of these conductive polymers are used as a polycation.
• the polycation represents an optionally substituted polythiophene containing repeating units of the general formula (I)
• A represents an optionally substituted C 1 -C 8 -alkylene radical, preferably an optionally substituted C 2 -C 3 -alkylene radical,
• Y stands for O or S
• R is a linear or branched, optionally substituted.
• C 1 -C 6 -alkyl radical preferably linear or branched, optionally substituted C 1 -C 6 -alkyl radical, an optionally substituted C 1 -C 12 -cycloalkyl radical, an optionally substituted C 6 -C 4 -aryl radical, an optionally substituted C 7 -C 8 -aralkyl radical, is an optionally substituted Ci-Gj-hydroxyalkyl radical or a hydroxyl radical,
• x is an integer from 0 to 8, preferably 0, 3 or 2, more preferably 0 or 1, and
• radicals R are attached to A, they may be the same or different.
• the general formula (I) is to be understood such that the substituent R can be bonded to the alkylene radical A x times.
• the polycation may contain a polythiophene containing recurring units of the general formula (I) those containing recurring units of the general formula (Ia) and / or the general formula (Ib)
• R and x have the abovementioned meaning.
• the polycation represents a polythiophene containing repeating units of the general formula (I) those containing polythiophenes of the general formula (I-aa) and / or the general formula (I-ba)
• the prefix Po ⁇ y- means that more than one identical or different repeating unit is contained in the polythiophene.
• the polythiophenes contain a total of n repeating units of the general formula (I), where n can be an integer from 2 to 2000, preferably 2 to 100.
• the repeating units of general formula (I) may be the same or different within each polythiophene. Preference is given to polythiophenes containing in each case identical recurring units of the general formula (I).
• the polythiophenes preferably carry H.
• the polycation is a polythiophene having repeating units of the general formula (I) poly (3,4-ethylenedioxythiophene) or poly (3 5 4- ethyleneoxythiathiophene), ie a horaopoiethiophene from recurring units of the formula (I-aa) or (I-ba).
• the polycation represents a polythiophene having repeating units of the general formula (I) a copolymer of recurring units of the formula (I-aa) and (I-ba).
• C r C 3 -Ayky ⁇ enreste A are in the context of the invention methylene, ethylene, n-propylene, n-butylene or n-pentylene, C r Cis-alkyl in the context of the invention for linear or branched Ci-Cjg- alkyl radicals such as methyl , Ethyl, n- or iso-propyl, n-, iso-, sec- or tert-butyl, n-pentyl, 1-methylbutyl, 2-methylbutyl, 3-methylbutyl, 1-ethylpropyl, 1,1-dimethylpropyl, 1 , 2-dimethylpropyl, 2,2-dimethylpropyl, n-hexyl, n-heptyl, n-octyl, 2-ethylhexyl, n-nonyl, n-decyl ; n- Undecy !, n-
• the polycations, especially the polythiophenes, are cationic, with "cationic” referring only to the charges located on the polythiophene backbone
• the polythiophenes may carry positive and negative charges in the structural unit, with the positive ones Charges on the Polythiophenhauptkette and the negative charges may be located on the substituted by sulfonate or carboxylate groups R.
• the positive charges of the polythiophene main chain can be partially or completely saturated by the optionally present anionic groups on the radicals R.
• the polythiophenes are all considered cationic polythiophenes in the context of the invention, since the positive charges on the polythiophene backbone are critical. because their exact number and position can not be determined correctly. However, the number of positive charges is at least 1 and at most n, where n is the total number of all repeating units (equal or different) within the polythiophene. To compensate for the positive charge, as far as this is not already done by the sulfonate or carboxylate-subsaturated and thus negatively charged radicals R, the polycations or cationic polythiophenes require anions as counter ions.
• counterions are preferably polymeric anions, hereinafter also referred to as polyanions, in question.
• suitable polyanions are anions of polymeric carboxylic acids, such as polyacrylic acids, polymethacrylic acid or polymaleic acids, or anions of polymeric sulfonic acids, such as polystyrenesulfonic acids and polyvinylsulfonic acids.
• polymeric carboxylic acids such as polyacrylic acids, polymethacrylic acid or polymaleic acids
• polymeric sulfonic acids such as polystyrenesulfonic acids and polyvinylsulfonic acids.
• These polycarboxylic and -sulfonic acids can also be copolymers of vinylcarboxylic and vinylsulfonic acids with other polymerizable monomers, such as acrylic acid esters and styrene.
• M + is , for example, Li + , Na + , K + , Rb + , Cs + or NH4 4" , preferably H + , Na + or K + stands.
• polystyrene sulfonic acid PSS
• Cationic polythiophenes which contain anions as counterions for charge compensation are also often referred to in the art as polythiophene / (poly) anion complexes.
• the polycation is 3,4 " (ethylenedioxythiophene) and the polyanion is polystyrenesulfonate.
• the average molecular weight M w (weight average) of the polyanionic polyacids is preferably in a range of from 20,000 to 70,000 g / mol, more preferably in a range of from 30,000 to 60,000 g / mol.
• the polyacids or their alkali salts are commercially available which can be prepared (for example polystyrene sulfonic acids and polyacrylic acids, or by known processes see eg Houben Weyl? Methods of Organic Chemistry, Vol. E 20 Macromolecular Materials, Part 2 (1987), p 1141 uf ).
• the average molecular weight M w is determined by aqueous gel permeation chromatography (GPC) using a phosphate buffer as eluent and a column combination MCX. The detection takes place here by means of an RI detector. The signals are evaluated by means of a polystyrene sulfonic acid calibration at 25 ° C.
• the conductive polymer layers containing at least one polycation and at least one polyanion can be applied to the substrate in the form of a dispersion or solution.
• processes such as spin coating, knife coating, immersion and spray coating are suitable for applying the conductive polymer layers or printing processes, such as ink-jet, offset, gravure and flexo printing, preference is given to spin-coating,
• Suitable substrates are glass, silicon wafers, paper and plastic films such as polyester, polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyacrylate, polsulfone or polyimide films.
• the deposited conductive polymer layers form homogeneous layers with average surface roughness typically ⁇ 5nm Ra. This value can be determined by means of a scanning force microscope (Digital Instruments) on an area of] ⁇ m 2 .
• the layer thickness d is determined using a stylus profuometer (Tencor 500) at the level of a scratch in the polymer layer.
• the dispersion or solution may be aqueous or alcoholic.
• alcohol it is meant that a mixture containing water and alcohol (s) is used.
• alcohols for example, aliphatic alcohols such as methanol, ethanol, i-propanol and butanol are suitable.
• Suitable binders are polymeric, organic binders, for example polyvinyl alcohols, polyvinylpyrolidones, polyvinyl chlorides, polyvinyl acetates, polyvinyl butyrates, polyacrylic acid esters, polyacrylic acid amides, polymethacrylic acid esters, polymethacrylic acid amides, polyacrylonitriles, styrene / acrylic acid ester, vinyl acetate / acrylic acid ester and ethylene / vinyl acetate copolyyrinates, poly butadienes, polyisoprenes, polystyrenes, polyethers, polyesters, polycarbonates, polyurethanes, polyamides, polyimides, polysulfones, melamine-formaldehyde resins, epoxy resins, silycon resins or celluloses.
• the solids content of polymeric binder is between 0 and 3 percent by weight (wt)
• the dispersions or solutions may additionally comprise adhesion promoters such as, for example, organofunctional silanes or their hydrolyzates, for example 3-glycidoxypropyltrialkoxysilane, 3-aminopropyltriethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-metacryloxypropyltrimethoxysilane, vinyltrimethoxysilane or octyltriethoxysilane.
• adhesion promoters such as, for example, organofunctional silanes or their hydrolyzates, for example 3-glycidoxypropyltrialkoxysilane, 3-aminopropyltriethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-metacryloxypropyltrimethoxysilane, vinyltrimethoxysilane or octyltriethoxysilane.
• conductivity-increasing agents such as dimethyl sulfoxide
• conductivity-increasing agents are especially compounds containing ether groups, for example tetrahydrofuran, compounds containing lactone groups, such as ⁇ -butyrolactone, ⁇ -valerolactone, compounds containing amide or lactam groups, such as caprolactam, N-methylcaprolactam, N, N-dimethylacetamide, N-methylacetamide, N 5 ND imethylformamide (DMF), N-methylformamide, N-methylformanea, N-methylpyrrolidone (NMP), N-octylpyrrolidone, pyrrolidone, sulfones and sulfoxides such as sulfolane (tetramethylene sulfone
• the polycarbonate and polyanion (s) can be used in a weight ratio (weight ratio) of from 1: 2 to 1: 7, preferably from 1: 2.5 to 1: 6.5, and more preferably from 1: 3 to 1: 6.
• the weight of the polycation corresponds to the initial weight of the monomers used, assuming that complete conversion of the monomer takes place during the polymerization.
• a further subject of the present invention are the conductive structured polymer layers produced by the process according to the invention.
• the step width b of the conductive polymer layer produced by the method according to the invention is preferably less than 5 ⁇ m, more preferably less than 1 ⁇ m.
• the achieved step widths can be determined with a stylus profilometer (Tencor 500).
• the steps of the structured, conductive polymer layers produced according to the method according to the invention had a width b ⁇ 5 ⁇ m. Since this width corresponds to the lateral resolution of the stylus filoi ⁇ teter, it can be assumed that the true step width is actually still less than 5.
• a 50mm x 50mm glass substrate was first cleaned with acetone, then with muconic solution in an ultrasonic bath and finally in a UV / ozone reactor (UPV, Inc, PR-100).
• the photoresist AZ 1512 HS (Micro Chemicals GmbH) was then treated with a spin coater (Carl Süss, RC8) at 1000 U / min for 30 seconds (sec.) At an acceleration of 200U / sec 2 and the lid open spun down on the glass substrate.
• the substrate coated with photoresist was covered with a shadow mask consisting of a thick aluminum foil with milling cutouts of 100-400 ⁇ m width and held in a photoresist (Walter Lemmen, Kreuzwertheim, Aktina E) for 80 seconds (sec.) UV light applied.
• the substrate was then placed for 120 seconds with stirring in a developer solution consisting of 1 part of AZ 35 IB (MicroChemicals GmbH) and 3 parts of water (see Fig. 1-2 and Fig. 1-3).
• the glass substrates were then covered with patterned photoresist, exposing areas previously exposed by the shutter mask to photoresist and covering the shaded areas with photoresist.
• the height profile of the photoresist structures is shown schematically in Fig. 2-1.
• the solution was stirred for 30 minutes. Subsequently, 6.9 g of sodium persulfate were added and the solution was stirred for a further 24 hours. After completion of the reaction, 60 g of a cation exchanger (Lewatit SlOO H, Lanxess AG) and 80 g of an anion exchanger (Lewatit MP 62, Lanxess AG) were added to remove inorganic salts and the solution was stirred for a further 2 hours. Subsequently, the ion exchanger was filtered off. The weight ratio of PEDOT to PSS in the solution was 1: 6.
• a fluoride surfactant solution F09108 Zonyl FSN, Fluorinated Surfactant 10% in water, ABCR GmbH
• the solution was spin-coated onto the photoresist-structured substrate from Example 1 at 850 rpm for 30 seconds with an acceleration of 200 U / sec 2 and an open lid, and then dried for 15 minutes at 130 ° C. on a hotplate.
• the layer thus produced homogeneously covered both the photoresist coated and uncoated areas of the glass surface.
• the crosslinked photoresist was completely dissolved. This dissolution process could be followed visually, since the photoresist had a yellow-brownish intrinsic color.
• the PEDOT / PSS layer lying on the photoresist was not lifted off, but remained as a coherent loose skin on the substrate. This manifested itself in a diffuse elevation profile with no clear boundaries between detached and remaining areas, as shown in Fig. 2-3.
• Example 3 The procedure was analogous to that in Example 2 with the difference that this time in the polymerization of EDT the PSS with a weight average M w of 47 000 g / mol was used.
• the weight ratio of PEDOT to PSS in the solution was also 1: 6.
• the solution was spin-coated at 500 rpm for 30 seconds and an acceleration of 200U / sec 2 with the lid open.
• the polymer layer on the crosslinked photoresist was rinsed off in acetone together with the crosslinked photoresist.
• the PEDOT / PSS layer sticks to the substrate.
• the transitions between remaining and detached areas were sharp, as the step formed here shows a narrow step width of b ⁇ 5 ⁇ m in the height profile (see Fig. 2-2).
• the average molecular weight Mw of the PSS has a considerable influence on whether the structuring of the conductive polymer layer by means of the lift-off process succeeds successfully.
• This structuring is successful if the PEDOT / PSS dispersion used has a PSS with a mean molecular weight M w of ⁇ 100 000 g / mol, referred to as short-chain PSS.
• Reason for this may be that by using this short-chain PSS, the tensile strength of the conductive polymer layer is sufficiently lowered, so that a detachment of the conductive polymer layer can take place.
• EXAMPLE 4 A 2 l three-necked flask with stirrer and internal thermometer was charged with 868 g of deionized water and 330 g of an aqueous polystyrenesulfonic acid solution having a weight-average M w of 450000 g / mol and a solids content of 3.8% by weight. The determination of the molecular weight was carried out by means of aqueous gel permeation chromatography (GPC). The solution was treated with 0.075 g of ferrous sulfate. The reaction temperature was maintained between 20 and 25 ° C. With stirring, 5.1 g of 3,4-ethylenedioxythiophene was added. The solution was stirred for 30 minutes.
• GPC gel permeation chromatography
• the obtained PEDOT / PSS dispersion was homogenized five times at a pressure of 900 bar with a high-pressure homogenizer; Subsequently, 95 g of this solution were mixed with 5 g of dimethyl sulfoxide.
• the crosslinked photoresist was completely dissolved. This dissolution process could be visually tracked due to the yellow-brownish inherent color of the crosslinked photoresist.
• the PEDOT / PSS target lying on the photoresist was not lifted off, but remains as coherently loose skin on the substrate. The desired lift-off, as shown in Fig. 1-5, thus did not take place.
• Example 4 The procedure was analogous to Example 4 with the difference that in the polymerization, a polystyrene sulfonic acid having a weight average M w of 49 000 g / mol was used.
• the weight ratio of PEDOT to the polymer PSS was 3: 2.5, as in Example 4.
• the PEDOT / PSS dispersion was homogenized five times at a pressure of 900 bar with a high-pressure homogenizer; Subsequently, 95 g of this solution were mixed with 5 g of dimethyl sulfoxide.
• the crosslinked photoresist was completely dissolved. This dissolution process could be visually tracked due to the yellow-brownish inherent color of the crosslinked photoresist.
• the PEDOT / PSS layer lying on the photoresist was lifted off in some places. The desired lift-off, as shown in Fig. 1-5, thus partially took place.
• the dispersion prepared according to Example 5 was diluted with additional polystyrene sulfonic acid.
• the PSS used had a weight average M w of 49,000 g / mol.
• the mixture was set so that the ratio of PEDOT to PSS in the dispersion was 1: 3; Subsequently, 95 g of this solution were mixed with 5 g of dimethyl sulfoxide.
• the dispersion prepared according to Example 5 was diluted with additional polystyrenesulfonic acid.
• the PSS used for this purpose had weight average Mw of 49,000 g / mol.
• the mixture was prepared so that the ratio of PEDOT to PSS in the dispersion was 1: 3.5. Subsequently, 95 g of this solution were mixed with 5 g Dimethylsuifoxid.
• Example 8 (according to the invention):
• the dispersion prepared according to Example 5 was diluted with additional polystyrene sulfonic acid.
• the PSS used had a weight average M w of 49,000 g / mol.
• the mixture was adjusted so that the ratio of PEDOT to PSS in the dispersion was 1: 4. Subsequently, 95 g of this solution were mixed with 5 g of dimethyl sulfoxide.
• the dispersion prepared according to Example 5 was diluted with additional polystyrene sulfonic acid.
• the PSS used had a weight average M w of 49,000 g / mol.
• the mixture was set so that the ratio of PEDOT to PSS in the dispersion was 1: 4.5.
• 95 g of this solution were mixed with 5 g of dimethyl sulfoxide.
• the solution was spun at 1000 rpm for 30 sec at an acceleration of 200U / sec 2 with the lid open.
• the layer was dried at 130 ° C for 15 min on a hot plate.

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