EP2156716A4 - FLEXIBLE SWITCHING - Google Patents

FLEXIBLE SWITCHING

Info

Publication number
EP2156716A4
EP2156716A4 EP08755104A EP08755104A EP2156716A4 EP 2156716 A4 EP2156716 A4 EP 2156716A4 EP 08755104 A EP08755104 A EP 08755104A EP 08755104 A EP08755104 A EP 08755104A EP 2156716 A4 EP2156716 A4 EP 2156716A4
Authority
EP
European Patent Office
Prior art keywords
flexible circuit
flexible
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP08755104A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP2156716A1 (en
Inventor
Ellen O Aeling
Michael A Meis
Byron M Jackson
John R David
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of EP2156716A1 publication Critical patent/EP2156716A1/en
Publication of EP2156716A4 publication Critical patent/EP2156716A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09681—Mesh conductors, e.g. as a ground plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Led Device Packages (AREA)
EP08755104A 2007-06-01 2008-05-07 FLEXIBLE SWITCHING Withdrawn EP2156716A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/756,905 US20080295327A1 (en) 2007-06-01 2007-06-01 Flexible circuit
PCT/US2008/062851 WO2008150622A1 (en) 2007-06-01 2008-05-07 Flexible circuit

Publications (2)

Publication Number Publication Date
EP2156716A1 EP2156716A1 (en) 2010-02-24
EP2156716A4 true EP2156716A4 (en) 2011-07-20

Family

ID=40086541

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08755104A Withdrawn EP2156716A4 (en) 2007-06-01 2008-05-07 FLEXIBLE SWITCHING

Country Status (7)

Country Link
US (1) US20080295327A1 (enExample)
EP (1) EP2156716A4 (enExample)
JP (1) JP5539861B2 (enExample)
KR (1) KR20100028581A (enExample)
CN (1) CN101683009B (enExample)
TW (1) TWI452956B (enExample)
WO (1) WO2008150622A1 (enExample)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8525402B2 (en) 2006-09-11 2013-09-03 3M Innovative Properties Company Illumination devices and methods for making the same
US8581393B2 (en) 2006-09-21 2013-11-12 3M Innovative Properties Company Thermally conductive LED assembly
DE102007044340A1 (de) * 2007-09-17 2009-03-19 Tridonicatco Deutschland Gmbh LED-Kontaktierung in Leuchtschriften
DE102008054288A1 (de) * 2008-11-03 2010-05-06 Osram Gesellschaft mit beschränkter Haftung Verfahren zum Herstellen eines flexiblen Leuchtbands
US8771078B2 (en) * 2009-06-08 2014-07-08 Cfph, Llc Amusement device including means for processing electronic data in play of a game of chance
US8545328B2 (en) * 2009-06-08 2013-10-01 Cfph, Llc Portable electronic charge device for card devices
US8419535B2 (en) * 2009-06-08 2013-04-16 Cfph, Llc Mobile playing card devices
US8613671B2 (en) * 2009-06-08 2013-12-24 Cfph, Llc Data transfer and control among multiple computer devices in a gaming environment
US8784189B2 (en) 2009-06-08 2014-07-22 Cfph, Llc Interprocess communication regarding movement of game devices
US8287386B2 (en) * 2009-06-08 2012-10-16 Cfph, Llc Electrical transmission among interconnected gaming systems
US8545327B2 (en) * 2009-06-08 2013-10-01 Cfph, Llc Amusement device including means for processing electronic data in play of a game in which an outcome is dependant upon card values
US20110024165A1 (en) 2009-07-31 2011-02-03 Raytheon Company Systems and methods for composite structures with embedded interconnects
DE102010014579A1 (de) * 2010-04-09 2011-10-13 Würth Elektronik Rot am See GmbH & Co. KG Verfahren zum Herstellen einer elektronischen Baugruppe
US8826640B2 (en) 2010-11-12 2014-09-09 Raytheon Company Flight vehicles including electrically-interconnective support structures and methods for the manufacture thereof
BE1019763A3 (nl) * 2011-01-12 2012-12-04 Sioen Ind Werkwijze voor het inbedden van led-netwerken.
IN2014CN01637A (enExample) * 2011-09-06 2015-05-08 Koninkl Philips Nv
GB2498994B (en) 2012-02-02 2014-03-19 Trackwise Designs Ltd Method of making a flexible circuit
CN104235634B (zh) * 2013-06-14 2018-09-14 北京光景照明设计有限公司 Led灯板
US10134714B2 (en) * 2013-11-08 2018-11-20 Osram Sylvania Inc. Flexible circuit board for LED lighting fixtures
US20150209654A1 (en) 2013-11-12 2015-07-30 Deq Systems Corp. Reconfigurable playing cards and game display devices
JP6320788B2 (ja) * 2014-02-13 2018-05-09 日本メクトロン株式会社 フレキシブルプリント基板の製造方法およびフレキシブルプリント基板の製造に用いられる中間生成物
DE102014102519A1 (de) * 2014-02-26 2015-08-27 Schreiner Group Gmbh & Co. Kg Folienverbund mit elektrischer Funktionalität zum Aufbringen auf ein Substrat
JP2016009690A (ja) * 2014-06-20 2016-01-18 大日本印刷株式会社 実装基板および実装基板の製造方法
DE102015107657A1 (de) * 2015-05-15 2016-12-01 Alanod Gmbh & Co. Kg Verfahren zur Herstellung eines Anschlussträgers, Anschlussträger sowie optoelektronisches Halbleiterbauteil mit einem Anschlussträger
US10132453B2 (en) 2016-08-23 2018-11-20 Orsam Sylvania Inc. Flexible light engine with bus bars and interconnectors

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2031796A (en) * 1978-09-29 1980-04-30 Hakuto Kk Erforations to sheet metal apparatus for sticking nonconductive tape having plating p
US4846922A (en) * 1986-09-29 1989-07-11 Monarch Marking Systems, Inc. Method of making deactivatable tags
DE4340996C1 (de) * 1993-12-02 1995-03-02 Heraeus Gmbh W C Verfahren und Vorrichtung zur Herstellung eines Folienverbundes
EP1473978A1 (en) * 2002-01-24 2004-11-03 Yuan Lin Lamp on sheet and manufacturing method thereof

Family Cites Families (103)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1486034A (fr) * 1966-07-06 1967-06-23 Global Patents Panneaux conducteurs électriques feuilletés et leur procédé de fabrication
US4271408A (en) * 1978-10-17 1981-06-02 Stanley Electric Co., Ltd. Colored-light emitting display
US4502761A (en) * 1981-03-13 1985-03-05 Robert Bosch Gmbh Gradient-free illumination of passive readout display devices
US4542449A (en) * 1983-08-29 1985-09-17 Canadian Patents & Development Limited Lighting panel with opposed 45° corrugations
US4588258A (en) * 1983-09-12 1986-05-13 Minnesota Mining And Manufacturing Company Cube-corner retroreflective articles having wide angularity in multiple viewing planes
CA1319341C (en) * 1985-03-29 1993-06-22 Frederick J. Fox Method of supporting a louvered plastic film
JPH0754874B2 (ja) * 1986-10-20 1995-06-07 フアナツク株式会社 多層プリント配線板
US4766023A (en) * 1987-01-16 1988-08-23 Minnesota Mining And Manufacturing Company Method for making a flexible louvered plastic film with protective coatings and film produced thereby
US4984144A (en) * 1987-05-08 1991-01-08 Minnesota Mining And Manufacturing Company High aspect ratio light fixture and film for use therein
US4799131A (en) * 1987-11-18 1989-01-17 Minnesota Mining And Manufacturing Company Automotive lighting element
US4920467A (en) * 1988-05-05 1990-04-24 Honsberger Calvin P Controlled stratified random area illuminator
US5183597A (en) * 1989-02-10 1993-02-02 Minnesota Mining And Manufacturing Company Method of molding microstructure bearing composite plastic articles
US5122902A (en) * 1989-03-31 1992-06-16 Minnesota Mining And Manufacturing Company Retroreflective articles having light-transmissive surfaces
US5486949A (en) * 1989-06-20 1996-01-23 The Dow Chemical Company Birefringent interference polarizer
US5122905A (en) * 1989-06-20 1992-06-16 The Dow Chemical Company Relective polymeric body
JPH0439991A (ja) * 1990-06-05 1992-02-10 Sony Corp 多層プリント基板
US5138488A (en) * 1990-09-10 1992-08-11 Minnesota Mining And Manufacturing Company Retroreflective material with improved angularity
US5094788A (en) * 1990-12-21 1992-03-10 The Dow Chemical Company Interfacial surface generator
US5217794A (en) * 1991-01-22 1993-06-08 The Dow Chemical Company Lamellar polymeric body
US5248193A (en) * 1991-10-18 1993-09-28 Texas Microsystems, Inc. Extruded enclosure for a computer system
US5528720A (en) * 1992-03-23 1996-06-18 Minnesota Mining And Manufacturing Co. Tapered multilayer luminaire devices
US5303322A (en) * 1992-03-23 1994-04-12 Nioptics Corporation Tapered multilayer luminaire devices
JPH05343847A (ja) * 1992-06-05 1993-12-24 Hitachi Ltd 多層印刷配線板の製造方法
US5321593A (en) * 1992-10-27 1994-06-14 Moates Martin G Strip lighting system using light emitting diodes
TW289095B (enExample) * 1993-01-11 1996-10-21
US6052164A (en) * 1993-03-01 2000-04-18 3M Innovative Properties Company Electroluminescent display with brightness enhancement
US5310355A (en) * 1993-03-09 1994-05-10 Irmgard Dannatt Strip lighting assembly
US5433819A (en) * 1993-05-26 1995-07-18 Pressac, Inc. Method of making circuit boards
US5389324A (en) * 1993-06-07 1995-02-14 The Dow Chemical Company Layer thickness gradient control in multilayer polymeric bodies
SG66765A1 (en) * 1993-12-02 2001-01-16 Heraeus Gmbh W C Process and apparatus for producing a laminate
US5882774A (en) * 1993-12-21 1999-03-16 Minnesota Mining And Manufacturing Company Optical film
US6025897A (en) * 1993-12-21 2000-02-15 3M Innovative Properties Co. Display with reflective polarizer and randomizing cavity
ATE440480T1 (de) * 1993-12-30 2009-09-15 Miyake Kk Verbundfolie mit schaltungsfírmiger metallfolie oder dergleichen und verfahren zur herstellung
JPH07254770A (ja) * 1994-03-16 1995-10-03 Sumitomo Electric Ind Ltd フレキシブルプリント配線板の製造方法
US6101032A (en) * 1994-04-06 2000-08-08 3M Innovative Properties Company Light fixture having a multilayer polymeric film
EP0765487B1 (en) * 1994-06-21 2002-08-28 Minnesota Mining And Manufacturing Company A composite used for light control or privacy
DE69513992T2 (de) * 1994-09-27 2000-07-27 Minnesota Mining & Mfg Folie zur luminanzsteuerung
US5626800A (en) * 1995-02-03 1997-05-06 Minnesota Mining And Manufacturing Company Prevention of groove tip deformation in brightness enhancement film
DE69602588T2 (de) * 1995-03-03 1999-10-14 Minnesota Mining & Mfg Lichtlenkender film mit in der höhe variierender strukturierter oberfläche und daraus hergestellter lichtlenkender artikel
US5751388A (en) * 1995-04-07 1998-05-12 Honeywell Inc. High efficiency polarized display
US6080467A (en) * 1995-06-26 2000-06-27 3M Innovative Properties Company High efficiency optical devices
EP0871923A1 (en) * 1995-06-26 1998-10-21 Minnesota Mining And Manufacturing Company Transflective displays with reflective polarizing transflector
DE69626124T2 (de) * 1995-06-26 2003-10-09 Minnesota Mining & Mfg Diffus reflektierende mehrschicht-polarisatoren und spiegel
US6088067A (en) * 1995-06-26 2000-07-11 3M Innovative Properties Company Liquid crystal display projection system using multilayer optical film polarizers
US5699188A (en) * 1995-06-26 1997-12-16 Minnesota Mining And Manufacturing Co. Metal-coated multilayer mirror
EP0835294B1 (en) * 1995-06-26 2003-01-29 Minnesota Mining And Manufacturing Company Light diffusing adhesive
US5917664A (en) * 1996-02-05 1999-06-29 3M Innovative Properties Company Brightness enhancement film with soft cutoff
US5759422A (en) * 1996-02-14 1998-06-02 Fort James Corporation Patterned metal foil laminate and method for making same
US5825543A (en) * 1996-02-29 1998-10-20 Minnesota Mining And Manufacturing Company Diffusely reflecting polarizing element including a first birefringent phase and a second phase
US5867316A (en) * 1996-02-29 1999-02-02 Minnesota Mining And Manufacturing Company Multilayer film having a continuous and disperse phase
US5783120A (en) * 1996-02-29 1998-07-21 Minnesota Mining And Manufacturing Company Method for making an optical film
US5919551A (en) * 1996-04-12 1999-07-06 3M Innovative Properties Company Variable pitch structured optical film
US6507413B1 (en) * 1996-06-14 2003-01-14 3M Innovative Properties Company Display unit and method of displaying an image
US5908874A (en) * 1996-06-18 1999-06-01 3M Innovative Properties Company Polymerizable compositions containing fluorochemicals to reduce melting temperature
US5808794A (en) * 1996-07-31 1998-09-15 Weber; Michael F. Reflective polarizers having extended red band edge for controlled off axis color
JPH1075053A (ja) * 1996-09-02 1998-03-17 Mitsui Petrochem Ind Ltd フレキシブル金属箔積層板の製造方法
US5857767A (en) * 1996-09-23 1999-01-12 Relume Corporation Thermal management system for L.E.D. arrays
JP3821175B2 (ja) * 1997-01-30 2006-09-13 富士ゼロックス株式会社 多層プリント配線板
US6280063B1 (en) * 1997-05-09 2001-08-28 3M Innovative Properties Company Brightness enhancement article
TW408497B (en) * 1997-11-25 2000-10-11 Matsushita Electric Works Ltd LED illuminating apparatus
US6179948B1 (en) * 1998-01-13 2001-01-30 3M Innovative Properties Company Optical film and process for manufacture thereof
US6276822B1 (en) * 1998-02-20 2001-08-21 Yerchanik Bedrosian Method of replacing a conventional vehicle light bulb with a light-emitting diode array
US6618939B2 (en) * 1998-02-27 2003-09-16 Kabushiki Kaisha Miyake Process for producing resonant tag
US6256146B1 (en) * 1998-07-31 2001-07-03 3M Innovative Properties Post-forming continuous/disperse phase optical bodies
US6208466B1 (en) * 1998-11-25 2001-03-27 3M Innovative Properties Company Multilayer reflector with selective transmission
US6246010B1 (en) * 1998-11-25 2001-06-12 3M Innovative Properties Company High density electronic package
JP3405242B2 (ja) * 1998-12-21 2003-05-12 ソニーケミカル株式会社 フレキシブル基板
US6280822B1 (en) * 1999-01-11 2001-08-28 3M Innovative Properties Company Cube corner cavity based retroeflectors with transparent fill material
US6287670B1 (en) * 1999-01-11 2001-09-11 3M Innovative Properties Company Cube corner cavity based retroreflectors and methods for making same
JP2000208938A (ja) * 1999-01-18 2000-07-28 Sony Corp 多層基板の製造方法
US6752505B2 (en) * 1999-02-23 2004-06-22 Solid State Opto Limited Light redirecting films and film systems
US6268070B1 (en) * 1999-03-12 2001-07-31 Gould Electronics Inc. Laminate for multi-layer printed circuit
US6122103A (en) * 1999-06-22 2000-09-19 Moxtech Broadband wire grid polarizer for the visible spectrum
ATE285435T1 (de) * 1999-12-03 2005-01-15 Toray Industries Biaxial gestreckte polyesterfolie zur formgebung
US6657381B1 (en) * 1999-12-13 2003-12-02 Makoto Arutaki Display device having a multi-layered structure with light-emitting devices mounted thereon
US6295210B1 (en) * 2000-04-07 2001-09-25 Lucent Technologies, Inc. Chassis grounding ring for a printed wiring board mounting aperture
JP4349600B2 (ja) * 2000-04-20 2009-10-21 大日本印刷株式会社 積層体、絶縁フィルム、電子回路及び積層体の製造方法
US6585846B1 (en) * 2000-11-22 2003-07-01 3M Innovative Properties Company Rotary converting apparatus and method for laminated products and packaging
DE10122324A1 (de) * 2001-05-08 2002-11-14 Philips Corp Intellectual Pty Flexible integrierte monolithische Schaltung
JP2003036708A (ja) * 2001-07-19 2003-02-07 Ichikoh Ind Ltd 自動車用ストップランプ
US20030035231A1 (en) * 2001-08-03 2003-02-20 Epstein Kenneth A. Optical film having microreplicated structures; and methods
US6988666B2 (en) * 2001-09-17 2006-01-24 Checkpoint Systems, Inc. Security tag and process for making same
US6932495B2 (en) * 2001-10-01 2005-08-23 Sloanled, Inc. Channel letter lighting using light emitting diodes
US6916544B2 (en) * 2002-05-17 2005-07-12 E. I. Du Pont De Nemours And Company Laminate type materials for flexible circuits or similar-type assemblies and methods relating thereto
TWI298988B (en) * 2002-07-19 2008-07-11 Ube Industries Copper-clad laminate
US6776496B2 (en) * 2002-08-19 2004-08-17 Eastman Kodak Company Area illumination lighting apparatus having OLED planar light source
US6880954B2 (en) * 2002-11-08 2005-04-19 Smd Software, Inc. High intensity photocuring system
US7557781B2 (en) * 2003-01-06 2009-07-07 Tpo Displays Corp. Planar display structure with LED light source
US6855404B2 (en) * 2003-03-13 2005-02-15 E. I. Du Pont De Nemours And Company Inorganic sheet laminate
JP2004304041A (ja) * 2003-03-31 2004-10-28 Citizen Electronics Co Ltd 発光ダイオード
US6788541B1 (en) * 2003-05-07 2004-09-07 Bear Hsiung LED matrix moldule
US7000999B2 (en) * 2003-06-12 2006-02-21 Ryan Jr Patrick Henry Light emitting module
JP2005249942A (ja) * 2004-03-02 2005-09-15 Hitachi Displays Ltd 表示装置
KR20050090203A (ko) * 2004-03-08 2005-09-13 삼성전자주식회사 광학 부재, 이를 갖는 백라이트 어셈블리 및 이를 갖는표시장치
US20050207156A1 (en) * 2004-03-22 2005-09-22 Harvatek Corporation Flexible light array and fabrication procedure thereof
US7052924B2 (en) * 2004-03-29 2006-05-30 Articulated Technologies, Llc Light active sheet and methods for making the same
EP1877696A1 (en) * 2005-03-12 2008-01-16 3M Innovative Properties Company Illumination device and methods for making the same
JP4596145B2 (ja) * 2005-04-28 2010-12-08 ミネベア株式会社 面状照明装置
US7745733B2 (en) * 2005-05-02 2010-06-29 3M Innovative Properties Company Generic patterned conductor for customizable electronic devices
KR100666282B1 (ko) * 2005-06-22 2007-01-09 디케이 유아이엘 주식회사 멀티 레이어 연성회로기판 제조방법
CA2614982A1 (en) * 2005-07-14 2007-01-18 Tir Technology Lp Power board and plug-in lighting module
US8525402B2 (en) * 2006-09-11 2013-09-03 3M Innovative Properties Company Illumination devices and methods for making the same
US8581393B2 (en) * 2006-09-21 2013-11-12 3M Innovative Properties Company Thermally conductive LED assembly

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2031796A (en) * 1978-09-29 1980-04-30 Hakuto Kk Erforations to sheet metal apparatus for sticking nonconductive tape having plating p
US4846922A (en) * 1986-09-29 1989-07-11 Monarch Marking Systems, Inc. Method of making deactivatable tags
DE4340996C1 (de) * 1993-12-02 1995-03-02 Heraeus Gmbh W C Verfahren und Vorrichtung zur Herstellung eines Folienverbundes
EP1473978A1 (en) * 2002-01-24 2004-11-03 Yuan Lin Lamp on sheet and manufacturing method thereof

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2008150622A1 *

Also Published As

Publication number Publication date
CN101683009A (zh) 2010-03-24
JP5539861B2 (ja) 2014-07-02
TWI452956B (zh) 2014-09-11
KR20100028581A (ko) 2010-03-12
JP2010529652A (ja) 2010-08-26
EP2156716A1 (en) 2010-02-24
CN101683009B (zh) 2012-07-04
TW200922430A (en) 2009-05-16
WO2008150622A1 (en) 2008-12-11
US20080295327A1 (en) 2008-12-04

Similar Documents

Publication Publication Date Title
EP2156716A4 (en) FLEXIBLE SWITCHING
TWI372325B (en) Voltage reference circuit
EP2130672A4 (en) FLEXIBLE SUBSTRATE
TWI347167B (en) Circuit module
EP2175802A4 (en) FLEXIBLE STENT
IL199623A0 (en) An arrangement
GB0719511D0 (en) Pixel circuit
TWI369851B (en) Motor-driving circuit
TWI368202B (en) Pixel circuit
AP2010005314A0 (en) Nanodispersian
GB0802269D0 (en) Receiver circuit
GB0823397D0 (en) Multilayer devices on flexible supports
GB0716540D0 (en) Mount
TWI368779B (en) Peripheral circuit
GB0801211D0 (en) Enclosures
PL2197761T3 (pl) Elastyczne nosidło
TWI368206B (en) Pixel circuit
GB0702574D0 (en) Loopback circuit
TWI341648B (en) Osciuating circuit
TWI368454B (en) Pixel circuit
TWI365390B (en) Layout circuit
GB0716534D0 (en) Mount
EP2280827A4 (en) JOINT FOR FLEXIBLE CIRCUIT
EP2384281A4 (en) FLEXIBLE SWITCHING
TWI347668B (en) Circuit component structure

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20091221

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL BA MK RS

DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20110620

17Q First examination report despatched

Effective date: 20131018

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: EXAMINATION IS IN PROGRESS

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20181201