EP2131993A2 - Procédé d'ablation par laser de cellules solaires - Google Patents

Procédé d'ablation par laser de cellules solaires

Info

Publication number
EP2131993A2
EP2131993A2 EP08737595A EP08737595A EP2131993A2 EP 2131993 A2 EP2131993 A2 EP 2131993A2 EP 08737595 A EP08737595 A EP 08737595A EP 08737595 A EP08737595 A EP 08737595A EP 2131993 A2 EP2131993 A2 EP 2131993A2
Authority
EP
European Patent Office
Prior art keywords
substrate
ablation
edge
edge region
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP08737595A
Other languages
German (de)
English (en)
Inventor
Philip Grunewald
Philip Rumsby
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TEL Solar AG
Original Assignee
Oerlikon Trading AG Truebbach
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oerlikon Trading AG Truebbach filed Critical Oerlikon Trading AG Truebbach
Publication of EP2131993A2 publication Critical patent/EP2131993A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0823—Devices involving rotation of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/351—Working by laser beam, e.g. welding, cutting or boring for trimming or tuning of electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/186—Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/20—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor materials
    • H01L31/208—Particular post-treatment of the devices, e.g. annealing, short-circuit elimination
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to a method and apparatus for ablation of thin films on a substrate for use in solar cells.
  • Thin-film solar cells are becoming increasingly known as a cost-efficient and therefore interesting alternative to conventional crystalline solar cells.
  • the substantial elements of a thin film solar cell consist of a thin film layer system on a glass substrate.
  • the thin film layer system essentially comprises an absorber layer sandwiched between a back electrode and a front electrode.
  • the thin film layer system must be encapsulated such that the sensitive thin film materials do not come into contact with the external environment, both for safety reasons, and to prevent excessive aging when the solar cell is exposed to the weather. Usually, this is done by means of a second piece of glass adhered to the coated side of the substrate. In order to prevent electrical contact with the outside of the solar cell and to ensure that the bond between the two glass substrates is firm and stable, it is necessary that the thin film system be removed in an edge region along the edge of the solar cell.
  • Different methods are known for removing the thin film layer system from the edge region. These include, for example, sandblasting and laser ablation.
  • Sandblasting is unreliable and expensive because many of the thin film layer systems include materials that require special disposal measures (e.g., CdTe). It is difficult and therefore expensive to separate such materials from the sand.
  • CdTe special disposal measures
  • Laser ablation is advantageous for this, since no ablation medium mixes with the materials to be removed and collection of the ablated materials is therefore not a problem.
  • "Ablated" within the meaning of the present description By the action of electromagnetic radiation, this means that it is detached from the substrate.
  • No. 4,734,500 describes a method for laser ablation which is based on a device for laser ablation.
  • the basic components of such a device are the laser, an optical unit whose optical elements have the task of directing the laser beams and a table to store and support the substrate.
  • a laser is used which emits short laser pulses to the surface of the substrate positioned on the table.
  • the optical unit may include apertures that form the beam; lenses to focus the beam or image the aperture on the workpiece and further include movable mirror systems to rapidly move the spot across the surface of the workpiece.
  • the generated laser light must be moved over the surface of the substrate to be processed. It is therefore required a relative movement between the substrate and the laser beam. This can be achieved either by moving the substrate relative to the stationary optical unit or by moving the optical unit relative to the stationary solar cell, or by a combination of both.
  • a CNC machine with X and Y guide can be used for the movement.
  • Figure 1 in US 4,734,550 shows an embodiment of a laser ablation apparatus which employs an XY table to move the substrate and in which the optical unit is stationary.
  • the substrate is kept horizontal with the coating facing the light beam during ablation. This can lead to, for example, due to gravity, ablated material is only partially removed from the substrate and deposited on this again.
  • FIG. 12 of US 4 734 550 An embodiment in which the "table" is suspended vertically from a support rail is shown in Figure 12 of US 4 734 550.
  • the optical unit is arranged as a whole on an XY table and therefore movable with respect to the workpiece stationary in at least one direction. At least for the ablation, which is done on the upper part of the workpiece, it can happen that detached material only is incompletely collected and deposited again on the substrate. This can happen, for example, when thin film material is to be removed from the edge region along the top edge.
  • the width of the edge region is typically less than 20mm.
  • the object is achieved according to the invention by a method for ablating thin layers in the edge region of the surface of a planar thin-film-coated substrate, wherein the edge region extends along the edge of the substrate, comprising the following steps:
  • the optical unit used to propagate laser pulses to the ablation area and optionally also means for finally removing the ablated material can be made completely stationary and it is ensured that the ablated material is always efficiently directed away from the substrate can.
  • the substrate is held in a vertical orientation.
  • This has the advantage of simplifying the required movement of the substrate.
  • the movement of the border area of the sub- strates through the ablation region can take place in such a way that ablation is always carried out in the region at the edge of the substrate currently located at the bottom.
  • Gravitational forces then cause or at least assist in transporting the ablated material away from the substrate. Sometimes the effect of the gravitational forces is sufficient and no further means of evacuation need be provided.
  • FIG. 1 Device for laser ablation of the known type
  • FIG. 4 Ablation head with means for the final removal of the ablated material.
  • FIG. 5 Embodiment of the device according to the invention with vertical
  • FIG. 1 shows a laser ablation device known from the prior art. This comprises a laser 3, an optical unit 5 with different optical elements such as mirrors and lenses and a table 7 which is movable along an X and a Y direction.
  • the optical unit 5 directs the laser pulse generated by the laser 3 into a region on the surface of a coated substrate 9, which rests with its rear side on the table 7. This defines an ablation range. Since the coating is applied to the front side of the substrate 9, there is the disadvantage that the material which is removed by a laser pulse from the surface of the substrate is deposited again on the substrate with relatively high probability due to the gravitational forces and thereby disturbing impurities and problems can cause.
  • FIG. 2 shows a first embodiment of the present invention. Shown is a device for laser ablation 201 with a laser 203 and an optical unit 205, which directs the laser pulses of the laser 203 to an ablation region 207.
  • the laser ablation apparatus 201 also includes a table 209 to horizontally support a coated substrate 211.
  • the table 209 can be moved in two horizontal directions X and Y, but it can also be rotated about a vertical axis. These movement possibilities are indicated in the figure 2 with the broken arrows.
  • the extent of the table 209 and in particular the table surface is so much smaller than the extent of the substrate 211 that the substrate 211 can be positioned on the table such that the entire edge region to be machined projects beyond the table.
  • the front side coated substrate 211 is placed on the table 209 with the front side so that the entire edge portion to be processed projects beyond the table.
  • the coating faces down and the laser ablation is performed through the substrate.
  • the laser light first transmits through the substrate before it hits the coating.
  • means 213 for finally picking up the removed material Due to gravity, the material removed from the glass surface will move downwardly away from the substrate.
  • the means 213 may comprise only one container to collect this material.
  • the means preferably generates a flow of gas into the container, in the sense of a vacuum cleaner, thereby at least supporting the process of gathering and removing the material removed by ablation.
  • FIG. 3a to 3j illustrate in a sequence how the method of ablation according to the present invention is performed.
  • the coated substrate is shown. Coated areas are shaded. Areas where material has been removed by ablation are displayed transparently.
  • the ablation is started somewhere in the middle region of the long edge of the substrate. This is shown in FIG. 3a. There is no material here yet removed.
  • Ablation is now performed while the substrate is pushed through the ablation region along the edge region to be treated in a linear motion until a first corner of the substrate is reached. This is shown in FIG. 3b. Now, the substrate is rotated to the position shown in Fig. 3c. This rotation around the first corner involves a rotation of the table as well as movements in the X and Y directions.
  • FIGS. 3 a to 3 j each show a small, non-dashed vector. This defines a directional distance, which remains constant during the ablation process, in the room with start point outside and end point within the substratum. It can be seen that this is a method for ablating thin layers in the edge region of the surface of a planar thin-film-coated substrate, wherein the edge region runs along the edge of the substrate, with the following steps
  • FIG. 4 shows an example of means for finally picking up material removed from the substrate.
  • An ablation head 401 is shown which includes a lens 421 as part of the optical unit.
  • the ablation head 401 also includes a container 413 provided near the edge region of a substrate 411 with the thin film coating 419.
  • the container 413 also includes a tube 425 to aspirate the ablated material 423.
  • the geometry of the container 413 is selected so that a gas flow is generated from both sides of the substrate to the tube by negative pressure in the container and thereby the ablated material is transported away from the substrate.
  • the ablation head may also include means for absorbing the portion of the laser light which is transmitted through the substrate without being absorbed. Such means are not shown in FIG.
  • the ability to rotate the table is important. Only with such a rotatable table is it possible to keep the ablation head 401, as shown in FIG. 4, completely stationary.
  • the substrate is held in a vertical orientation. This is shown in FIG.
  • the ablation procedure is then carried out in such a way that the area of the ablation always comes to rest on the lower edge of the substrate.
  • the coated surface may point toward or away from the optical unit: gravity carries the ablated material away from the substrate in both cases.
  • a slight advantage may be to have the coating whitened away from the optical unit, since then no ablated material can interact with the laser light still needed for ablation.
  • it is important to have a substrate holder which, in addition to permitting linear movements in the substrate plane, allows for rotation about a normal on the substrate surface. Only this will make it possible for the Ablation region is in each case at the lower edge of the substrate.
  • the support of the substrate can be accomplished with a mechanism based on negative pressure.
  • Figure 6 shows an embodiment of the present invention wherein the table is replaced by a robust multi-axis industrial robot.
  • a robot With such a robot, not only the steps shown in Fig. 3 can be made, but also an efficient loading and unloading of the substrates is possible.
  • the use of a robot makes it possible to support the substrate with the aid of a component at the end of the robot arm, whereby the component is fastened to the uncoated side of the substrate.
  • the coated side can be towards or away from the optical component Unit, with the latter configuration having slight advantages, since it is clear that ablated material does not interact with the laser light still needed for ablation.
  • the device of the invention is an apparatus for ablating thin layers in the edge region of the surface of a planar thin film coated substrate, the edge region extending along the edge or edges of the substrate comprises - a laser for generating laser light for ablation
  • the ablation method according to the invention can be carried out, namely a method for ablating thin layers in the edge region of the surface of a thin film-coated substrate, wherein the edge region runs along the edge or edges of the substrate, and at least ablating the thin layers two not necessarily disjoint regions of the edge region along non-parallel edge pieces should take place with the following steps - providing a laser beam
  • the orientation of the coated substrate is maintained at least substantially substantially during the ablation process in at least approximately vertical orientation and the substrate is moved so that the ablation region is always located at the lower edge of the substrate during ablation. It may be advantageous to use a multiaxial robot.
  • the substrate is held by means that interact only with inner regions of the surface spaced from the edge region.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

L'invention concerne un dispositif destiné à l'ablation de films minces d'un substrat revêtu, dans la zone de bordure du substrat, ainsi qu'un procédé y relatif. Le dispositif selon l'invention comprend un laser, une unité optique destinée à diriger la lumière laser dans la zone d'ablation, et un support pour des substrats plans. Le support permet de déplacer le substrat, dans le plan du substrat, linéairement, suivant deux directions linéairement indépendantes, tout en laissant au substrat la possibilité de tourner autour d'un axe s'étendant perpendiculairement à la surface du substrat. L'invention permet ainsi d'obtenir un montage stationnaire simplifié du dispositif par rapport à l'unité optique, tout en disposant de moyens d'élimination définitive des matériaux ayant fait l'objet de l'ablation.
EP08737595A 2007-03-30 2008-03-26 Procédé d'ablation par laser de cellules solaires Withdrawn EP2131993A2 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102007015767A DE102007015767A1 (de) 2007-03-30 2007-03-30 Methode zum Laserritzen von Solarzellen
US90972807P 2007-04-03 2007-04-03
PCT/IB2008/001117 WO2008120102A2 (fr) 2007-03-30 2008-03-26 Procédé d'ablation par laser de cellules solaires

Publications (1)

Publication Number Publication Date
EP2131993A2 true EP2131993A2 (fr) 2009-12-16

Family

ID=39719583

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08737595A Withdrawn EP2131993A2 (fr) 2007-03-30 2008-03-26 Procédé d'ablation par laser de cellules solaires

Country Status (7)

Country Link
US (1) US8299396B2 (fr)
EP (1) EP2131993A2 (fr)
JP (1) JP2010524203A (fr)
CN (1) CN101647126B (fr)
DE (1) DE102007015767A1 (fr)
TW (1) TWI440199B (fr)
WO (1) WO2008120102A2 (fr)

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WO2011061160A1 (fr) * 2009-11-19 2011-05-26 Oerlikon Solar Ag, Trübbach Procédé et dispositif pour l'ablation de couches minces d'un substrat
CN102110745B (zh) * 2010-12-20 2012-07-04 东莞宏威薄膜真空技术有限公司 薄膜层边缘清除装置及清除方法
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DE102011103481B4 (de) * 2011-06-03 2017-08-17 Leibniz-Institut für Oberflächenmodifizierung e.V. Selektives Abtragen dünner Schichten mittels gepulster Laserstrahlung zur Dünnschichtstrukturierung
US20130153552A1 (en) * 2011-12-14 2013-06-20 Gwangju Institute Of Science And Technology Scribing apparatus and method for having analysis function of material distribution
US8980156B2 (en) * 2012-02-23 2015-03-17 Nike, Inc. System and method for making golf balls
CN102626831A (zh) * 2012-04-09 2012-08-08 镇江大成新能源有限公司 薄膜太阳能电池飞秒激光刻蚀设备
DE102018010277B4 (de) 2018-03-29 2022-01-13 Hegla Boraident Gmbh & Co. Kg Entschichtungsverfahren und Verwendung einer Entschichtungseinrichtung zum Entschichten von Glastafeln, vorzugsweise Verbundglastafeln
DE102018107697B4 (de) 2018-03-29 2020-12-10 Hegla Boraident Gmbh & Co. Kg Entschichtungseinrichtungen und -verfahren zum Entschichten von Glastafeln, vorzugsweise Verbundglastafeln
KR102270936B1 (ko) 2019-06-17 2021-07-01 세메스 주식회사 기판 처리 방법 및 기판 처리 장치
DE102019213603A1 (de) 2019-09-06 2021-03-11 Hegla Boraident Gmbh & Co. Kg Entschichtungseinrichtung und -verfahren zum Entschichten von Glasscheiben, sowie Verfahren zur Herstellung von Glasscheiben für Stufenglas, Stufenglas und Stufenglasfenster

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Also Published As

Publication number Publication date
US20080237189A1 (en) 2008-10-02
WO2008120102A3 (fr) 2008-12-24
US8299396B2 (en) 2012-10-30
TW200849634A (en) 2008-12-16
CN101647126B (zh) 2011-09-07
TWI440199B (zh) 2014-06-01
CN101647126A (zh) 2010-02-10
JP2010524203A (ja) 2010-07-15
DE102007015767A1 (de) 2008-10-02
WO2008120102A2 (fr) 2008-10-09

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