CN101647126B - 用于激光刻蚀太阳能电池的方法 - Google Patents
用于激光刻蚀太阳能电池的方法 Download PDFInfo
- Publication number
- CN101647126B CN101647126B CN2008800106174A CN200880010617A CN101647126B CN 101647126 B CN101647126 B CN 101647126B CN 2008800106174 A CN2008800106174 A CN 2008800106174A CN 200880010617 A CN200880010617 A CN 200880010617A CN 101647126 B CN101647126 B CN 101647126B
- Authority
- CN
- China
- Prior art keywords
- substrate
- fringe region
- laser
- described substrate
- ablation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 34
- 238000000608 laser ablation Methods 0.000 title description 14
- 239000000758 substrate Substances 0.000 claims abstract description 115
- 230000003287 optical effect Effects 0.000 claims abstract description 23
- 238000002679 ablation Methods 0.000 claims abstract description 19
- 239000011248 coating agent Substances 0.000 claims description 12
- 238000000576 coating method Methods 0.000 claims description 12
- 230000007246 mechanism Effects 0.000 claims description 12
- 239000007888 film coating Substances 0.000 claims description 7
- 238000009501 film coating Methods 0.000 claims description 7
- 238000002360 preparation method Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 abstract description 27
- 239000010409 thin film Substances 0.000 abstract description 6
- 230000002093 peripheral effect Effects 0.000 abstract 1
- 239000010408 film Substances 0.000 description 7
- 230000005484 gravity Effects 0.000 description 7
- 239000011521 glass Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 229910004613 CdTe Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 230000003447 ipsilateral effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
- 239000006228 supernatant Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0823—Devices involving rotation of the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/351—Working by laser beam, e.g. welding, cutting or boring for trimming or tuning of electrical components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/186—Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/20—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor materials
- H01L31/208—Particular post-treatment of the devices, e.g. annealing, short-circuit elimination
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
Claims (5)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102007015767.5 | 2007-03-30 | ||
DE102007015767A DE102007015767A1 (de) | 2007-03-30 | 2007-03-30 | Methode zum Laserritzen von Solarzellen |
US90972807P | 2007-04-03 | 2007-04-03 | |
US60/909,728 | 2007-04-03 | ||
PCT/IB2008/001117 WO2008120102A2 (de) | 2007-03-30 | 2008-03-26 | Methode zum laserritzen von solarzellen |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101647126A CN101647126A (zh) | 2010-02-10 |
CN101647126B true CN101647126B (zh) | 2011-09-07 |
Family
ID=39719583
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008800106174A Expired - Fee Related CN101647126B (zh) | 2007-03-30 | 2008-03-26 | 用于激光刻蚀太阳能电池的方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8299396B2 (zh) |
EP (1) | EP2131993A2 (zh) |
JP (1) | JP2010524203A (zh) |
CN (1) | CN101647126B (zh) |
DE (1) | DE102007015767A1 (zh) |
TW (1) | TWI440199B (zh) |
WO (1) | WO2008120102A2 (zh) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007275962A (ja) * | 2006-04-10 | 2007-10-25 | Disco Abrasive Syst Ltd | レーザー加工装置 |
DE102009020365A1 (de) * | 2009-05-07 | 2010-11-11 | Jenoptik Automatisierungstechnik Gmbh | Verfahren zur Herstellung von Dünnschichtsolarzellenmodulen mit einer vorbestimmten Transparenz |
DE102009021273A1 (de) * | 2009-05-14 | 2010-11-18 | Schott Solar Ag | Verfahren und Vorrichtung zur Herstellung eines photovoltaischen Dünnschichtmoduls |
ITUD20090105A1 (it) * | 2009-05-27 | 2010-11-28 | Applied Materials Inc | Applicazione laser in fibra per un processo di rimozione della pellicola di bordo in applicazioni di celle solari |
KR20120101460A (ko) * | 2009-11-19 | 2012-09-13 | 오리콘 솔라 아게, 트루바흐 | 기판으로부터 박막을 어블레이션하는 방법 및 장치 |
CN102110745B (zh) * | 2010-12-20 | 2012-07-04 | 东莞宏威薄膜真空技术有限公司 | 薄膜层边缘清除装置及清除方法 |
DE102011103589A1 (de) * | 2011-05-30 | 2012-12-06 | Boraident Gmbh | Verfahren zum Entfernen einer Schicht auf einem Trägersubstrat |
DE102011103481B4 (de) * | 2011-06-03 | 2017-08-17 | Leibniz-Institut für Oberflächenmodifizierung e.V. | Selektives Abtragen dünner Schichten mittels gepulster Laserstrahlung zur Dünnschichtstrukturierung |
US20130153552A1 (en) * | 2011-12-14 | 2013-06-20 | Gwangju Institute Of Science And Technology | Scribing apparatus and method for having analysis function of material distribution |
US8980156B2 (en) * | 2012-02-23 | 2015-03-17 | Nike, Inc. | System and method for making golf balls |
CN102626831A (zh) * | 2012-04-09 | 2012-08-08 | 镇江大成新能源有限公司 | 薄膜太阳能电池飞秒激光刻蚀设备 |
DE102018107697B4 (de) | 2018-03-29 | 2020-12-10 | Hegla Boraident Gmbh & Co. Kg | Entschichtungseinrichtungen und -verfahren zum Entschichten von Glastafeln, vorzugsweise Verbundglastafeln |
DE102018010277B4 (de) | 2018-03-29 | 2022-01-13 | Hegla Boraident Gmbh & Co. Kg | Entschichtungsverfahren und Verwendung einer Entschichtungseinrichtung zum Entschichten von Glastafeln, vorzugsweise Verbundglastafeln |
KR102270936B1 (ko) * | 2019-06-17 | 2021-07-01 | 세메스 주식회사 | 기판 처리 방법 및 기판 처리 장치 |
DE102019213603A1 (de) | 2019-09-06 | 2021-03-11 | Hegla Boraident Gmbh & Co. Kg | Entschichtungseinrichtung und -verfahren zum Entschichten von Glasscheiben, sowie Verfahren zur Herstellung von Glasscheiben für Stufenglas, Stufenglas und Stufenglasfenster |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0213546A2 (en) * | 1985-08-20 | 1987-03-11 | Fuji Electric Corporate Research And Development Ltd. | Laser-processing method |
US6737605B1 (en) * | 2003-01-21 | 2004-05-18 | Gerald L. Kern | Single and/or dual surface automatic edge sensing trimmer |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4650524A (en) * | 1984-06-20 | 1987-03-17 | Sanyo Electric Co., Ltd | Method for dividing semiconductor film formed on a substrate into plural regions by backside energy beam irradiation |
JPS61210063A (ja) | 1985-03-14 | 1986-09-18 | Mitsubishi Chem Ind Ltd | アリ−ルスルホン類 |
US4705698A (en) * | 1986-10-27 | 1987-11-10 | Chronar Corporation | Isolation of semiconductor contacts |
FI78577C (fi) * | 1987-12-30 | 1989-08-10 | Vaisala Oy | Foerfarande foer avstaemning av en plankondensator. |
US5082791A (en) * | 1988-05-13 | 1992-01-21 | Mobil Solar Energy Corporation | Method of fabricating solar cells |
JPH0523875A (ja) * | 1991-07-24 | 1993-02-02 | Nec Yamagata Ltd | レーザーマーキング装置 |
DE59103714D1 (de) * | 1991-10-07 | 1995-01-12 | Siemens Ag | Laserbearbeitungsverfahren für einen Dünnschichtaufbau. |
DE29512519U1 (de) * | 1994-10-27 | 1995-09-21 | Benteler Ag, 33104 Paderborn | Vorrichtung zum Abbrechen eines Randstreifens einer Glasscheibe |
JPH11267860A (ja) * | 1998-03-23 | 1999-10-05 | Olympus Optical Co Ltd | マーキング装置 |
US6413839B1 (en) * | 1998-10-23 | 2002-07-02 | Emcore Corporation | Semiconductor device separation using a patterned laser projection |
US7649153B2 (en) * | 1998-12-11 | 2010-01-19 | International Business Machines Corporation | Method for minimizing sample damage during the ablation of material using a focused ultrashort pulsed laser beam |
CN1211862C (zh) * | 1999-04-07 | 2005-07-20 | 壳牌太阳能股份有限公司 | 衬底薄膜烧蚀方法及其设备 |
DE19933703B4 (de) * | 1999-04-07 | 2005-07-28 | Shell Solar Gmbh | Vorrichtung und Verfahren zum Abtragen von Schichten auf einer Solarzelle |
BE1013237A3 (fr) * | 2000-01-20 | 2001-11-06 | Wallonia Space Logistics En Ab | Procede d'enlevement local d'un revetement applique sur un substrat translucide ou transparent. |
US6422082B1 (en) * | 2000-11-27 | 2002-07-23 | General Electric Company | Laser shock peening quality assurance by ultrasonic analysis |
US6559411B2 (en) * | 2001-08-10 | 2003-05-06 | First Solar, Llc | Method and apparatus for laser scribing glass sheet substrate coatings |
US20030047538A1 (en) * | 2001-09-12 | 2003-03-13 | Paul Trpkovski | Laser etching indicia apparatus |
JP4342992B2 (ja) * | 2004-03-17 | 2009-10-14 | 株式会社ディスコ | レーザー加工装置のチャックテーブル |
US20070084838A1 (en) * | 2004-12-07 | 2007-04-19 | Chih-Ming Hsu | Method and cutting system for cutting a wafer by laser using a vacuum working table |
US20100038825A1 (en) * | 2006-12-21 | 2010-02-18 | Mcdonald Joel P | Methods of forming microchannels by ultrafast pulsed laser direct-write processing |
-
2007
- 2007-03-30 DE DE102007015767A patent/DE102007015767A1/de not_active Withdrawn
-
2008
- 2008-03-26 JP JP2010500383A patent/JP2010524203A/ja active Pending
- 2008-03-26 WO PCT/IB2008/001117 patent/WO2008120102A2/de active Application Filing
- 2008-03-26 CN CN2008800106174A patent/CN101647126B/zh not_active Expired - Fee Related
- 2008-03-26 EP EP08737595A patent/EP2131993A2/de not_active Withdrawn
- 2008-03-27 TW TW097110931A patent/TWI440199B/zh not_active IP Right Cessation
- 2008-03-31 US US12/059,305 patent/US8299396B2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0213546A2 (en) * | 1985-08-20 | 1987-03-11 | Fuji Electric Corporate Research And Development Ltd. | Laser-processing method |
US6737605B1 (en) * | 2003-01-21 | 2004-05-18 | Gerald L. Kern | Single and/or dual surface automatic edge sensing trimmer |
Also Published As
Publication number | Publication date |
---|---|
CN101647126A (zh) | 2010-02-10 |
WO2008120102A2 (de) | 2008-10-09 |
US8299396B2 (en) | 2012-10-30 |
TW200849634A (en) | 2008-12-16 |
TWI440199B (zh) | 2014-06-01 |
JP2010524203A (ja) | 2010-07-15 |
DE102007015767A1 (de) | 2008-10-02 |
EP2131993A2 (de) | 2009-12-16 |
US20080237189A1 (en) | 2008-10-02 |
WO2008120102A3 (de) | 2008-12-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: OERLIKON SOLAR ENERGY CO., LTD. (TELVBAHE) Free format text: FORMER OWNER: ALLIKON TRADE CO., LTD. (TELVBAHE) Effective date: 20100420 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20100420 Address after: Swiss Te Lui Bach Applicant after: Oerlikon Solar IP AG. Truebbach Address before: Swiss Te Lui Bach Applicant before: Oc Oerlikon Balzers AG |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: OERLIKON SOLAR AG Free format text: FORMER NAME: OERLIKON SOLAR AG (TRUBBACH) |
|
CP01 | Change in the name or title of a patent holder |
Address after: Swiss Te Lui Bach Patentee after: Oerlikon Solar AG, Truebbach Address before: Swiss Te Lui Bach Patentee before: Oerlikon Solar IP AG. Truebbach |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110907 Termination date: 20160326 |