EP1968110A3 - Hochtemperatur-Anti-Regeldifferenz Endeffektor zur Substratübertragung - Google Patents
Hochtemperatur-Anti-Regeldifferenz Endeffektor zur Substratübertragung Download PDFInfo
- Publication number
- EP1968110A3 EP1968110A3 EP08152541.2A EP08152541A EP1968110A3 EP 1968110 A3 EP1968110 A3 EP 1968110A3 EP 08152541 A EP08152541 A EP 08152541A EP 1968110 A3 EP1968110 A3 EP 1968110A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- substrate
- end effector
- high temperature
- temperature anti
- substrate transfer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title abstract 10
- 239000012636 effector Substances 0.000 title abstract 6
- 239000004065 semiconductor Substances 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
- B25J9/041—Cylindrical coordinate type
- B25J9/042—Cylindrical coordinate type comprising an articulated arm
- B25J9/043—Cylindrical coordinate type comprising an articulated arm double selective compliance articulated robot arms [SCARA]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/16—Programme controls
- B25J9/1628—Programme controls characterised by the control loop
- B25J9/1638—Programme controls characterised by the control loop compensation for arm bending/inertia, pay load weight/inertia
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US89409807P | 2007-03-09 | 2007-03-09 |
Publications (3)
Publication Number | Publication Date |
---|---|
EP1968110A2 EP1968110A2 (de) | 2008-09-10 |
EP1968110A3 true EP1968110A3 (de) | 2013-12-04 |
EP1968110B1 EP1968110B1 (de) | 2020-09-23 |
Family
ID=39493366
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP08152541.2A Active EP1968110B1 (de) | 2007-03-09 | 2008-03-10 | Hochtemperatur-Anti-Regeldifferenz Endeffektor zur Substratübertragung |
Country Status (7)
Country | Link |
---|---|
US (1) | US9443752B2 (de) |
EP (1) | EP1968110B1 (de) |
JP (1) | JP5800447B2 (de) |
KR (1) | KR100989721B1 (de) |
CN (1) | CN101303994B (de) |
SG (1) | SG146547A1 (de) |
TW (1) | TWI455226B (de) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104658958B (zh) * | 2015-02-13 | 2018-04-24 | 苏州工业园区纳米产业技术研究院有限公司 | 晶片抓取手臂 |
CN106032014A (zh) * | 2015-03-13 | 2016-10-19 | 上海理想万里晖薄膜设备有限公司 | 一种机械手臂 |
CN105575865A (zh) * | 2015-12-23 | 2016-05-11 | 苏州工业园区纳米产业技术研究院有限公司 | 一种适用于深硅刻蚀后薄片的深硅机台手臂的结构改造及改造方法 |
US10090188B2 (en) * | 2016-05-05 | 2018-10-02 | Applied Materials, Inc. | Robot subassemblies, end effector assemblies, and methods with reduced cracking |
US10651067B2 (en) * | 2017-01-26 | 2020-05-12 | Brooks Automation, Inc. | Method and apparatus for substrate transport apparatus position compensation |
US20190013215A1 (en) * | 2017-07-05 | 2019-01-10 | Kawasaki Jukogyo Kabushiki Kaisha | Substrate holding hand and substrate conveying apparatus including the same |
CN109461693B (zh) * | 2017-09-06 | 2023-06-02 | 台湾积体电路制造股份有限公司 | 晶片传送装置、晶片处理系统及方法 |
KR102322129B1 (ko) * | 2019-06-07 | 2021-11-04 | 블루테크코리아 주식회사 | 반도체 로봇용 엔드이펙터 |
CN114207798A (zh) * | 2019-08-08 | 2022-03-18 | 朗姆研究公司 | 多站处理模块中用于晶片传送的主轴组件 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5957651A (en) * | 1995-06-08 | 1999-09-28 | Kokusai Electric Co., Ltd. | Substrate carrying apparatus |
WO2002012970A1 (en) * | 2000-08-09 | 2002-02-14 | Genmark Automation, Inc. | Robot motion compensation system |
JP2004128021A (ja) * | 2002-09-30 | 2004-04-22 | Mitsubishi Electric Corp | ウェハ搬送装置 |
US20060216137A1 (en) * | 2004-07-02 | 2006-09-28 | Katsunori Sakata | Carrying apparatus and carrying control method for sheet-like substrate |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0661331A (ja) | 1992-08-06 | 1994-03-04 | Tokyo Electron Tohoku Ltd | 基板搬送装置 |
JP3172900B2 (ja) | 1993-02-19 | 2001-06-04 | 東京エレクトロン株式会社 | 基板搬送装置及び基板処理装置及び基板搬送方法及び基板処理方法 |
JP3125908B2 (ja) | 1993-09-14 | 2001-01-22 | 株式会社安川電機 | ウエハ搬送フォークの製造方法 |
JPH0799225A (ja) * | 1993-09-27 | 1995-04-11 | Dainippon Screen Mfg Co Ltd | 基板搬送装置 |
US6267423B1 (en) | 1995-12-08 | 2001-07-31 | Applied Materials, Inc. | End effector for semiconductor wafer transfer device and method of moving a wafer with an end effector |
US5746460A (en) * | 1995-12-08 | 1998-05-05 | Applied Materials, Inc. | End effector for semiconductor wafer transfer device and method of moving a wafer with an end effector |
JPH10177999A (ja) | 1996-10-15 | 1998-06-30 | Ebara Corp | 基板搬送用ハンド及びポリッシング装置 |
EP1498934A3 (de) | 1996-02-28 | 2005-12-21 | Ebara Corporation | Wafer-Transportroboter |
JPH10242235A (ja) * | 1997-02-27 | 1998-09-11 | Dainippon Screen Mfg Co Ltd | 基板搬送装置 |
CN1291345A (zh) | 1998-02-18 | 2001-04-11 | 应用材料有限公司 | 用在处理系统晶片搬运器上的端部操作装置 |
JP2000183128A (ja) * | 1998-12-17 | 2000-06-30 | Komatsu Ltd | ワーク搬送装置の制御装置 |
JP4189093B2 (ja) | 1999-08-31 | 2008-12-03 | 京セラ株式会社 | セラミック製搬送アーム及びその製造方法 |
US7334826B2 (en) * | 2001-07-13 | 2008-02-26 | Semitool, Inc. | End-effectors for handling microelectronic wafers |
US7289230B2 (en) * | 2002-02-06 | 2007-10-30 | Cyberoptics Semiconductors, Inc. | Wireless substrate-like sensor |
TWI356100B (en) | 2003-07-24 | 2012-01-11 | Applied Materials Inc | Shutter disk and blade for physical vapor depositi |
CN1669892B (zh) * | 2003-11-13 | 2011-11-16 | 应用材料股份有限公司 | 高速载入器相对于基片传送系统的校准 |
JP4696467B2 (ja) * | 2004-04-19 | 2011-06-08 | 三菱樹脂株式会社 | ロボットアーム装置用ハンド |
KR20050108944A (ko) * | 2004-05-14 | 2005-11-17 | 삼성전자주식회사 | 웨이퍼 이송장치 |
TW200618964A (en) | 2004-10-14 | 2006-06-16 | Toshiba Machine Co Ltd | Industrial robot |
JP2006110662A (ja) | 2004-10-14 | 2006-04-27 | Toshiba Mach Co Ltd | 産業用ロボット |
US20060113806A1 (en) * | 2004-11-29 | 2006-06-01 | Asm Japan K.K. | Wafer transfer mechanism |
KR101198179B1 (ko) * | 2005-01-17 | 2012-11-16 | 삼성전자주식회사 | 핸들링 로봇의 정적 처짐 보정방법 및 장치 |
JP2006332460A (ja) * | 2005-05-27 | 2006-12-07 | Hitachi High-Tech Control Systems Corp | ウェーハの搬送装置 |
JP4903027B2 (ja) * | 2006-01-06 | 2012-03-21 | 東京エレクトロン株式会社 | 基板搬送装置および基板支持体 |
US7717481B2 (en) * | 2007-01-11 | 2010-05-18 | Applied Materials, Inc. | High temperature robot end effector |
-
2008
- 2008-03-07 KR KR1020080021358A patent/KR100989721B1/ko active IP Right Grant
- 2008-03-07 CN CN2008100074550A patent/CN101303994B/zh active Active
- 2008-03-07 TW TW097108171A patent/TWI455226B/zh active
- 2008-03-07 JP JP2008057723A patent/JP5800447B2/ja active Active
- 2008-03-07 US US12/044,401 patent/US9443752B2/en active Active
- 2008-03-07 SG SG200801902-8A patent/SG146547A1/en unknown
- 2008-03-10 EP EP08152541.2A patent/EP1968110B1/de active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5957651A (en) * | 1995-06-08 | 1999-09-28 | Kokusai Electric Co., Ltd. | Substrate carrying apparatus |
WO2002012970A1 (en) * | 2000-08-09 | 2002-02-14 | Genmark Automation, Inc. | Robot motion compensation system |
JP2004128021A (ja) * | 2002-09-30 | 2004-04-22 | Mitsubishi Electric Corp | ウェハ搬送装置 |
US20060216137A1 (en) * | 2004-07-02 | 2006-09-28 | Katsunori Sakata | Carrying apparatus and carrying control method for sheet-like substrate |
Also Published As
Publication number | Publication date |
---|---|
US9443752B2 (en) | 2016-09-13 |
SG146547A1 (en) | 2008-10-30 |
CN101303994A (zh) | 2008-11-12 |
JP2008227491A (ja) | 2008-09-25 |
US20080219815A1 (en) | 2008-09-11 |
JP5800447B2 (ja) | 2015-10-28 |
TW200845267A (en) | 2008-11-16 |
TWI455226B (zh) | 2014-10-01 |
EP1968110A2 (de) | 2008-09-10 |
KR20080082922A (ko) | 2008-09-12 |
KR100989721B1 (ko) | 2010-10-26 |
CN101303994B (zh) | 2011-05-18 |
EP1968110B1 (de) | 2020-09-23 |
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