EP1581673B1 - Anode zur galvanisierung - Google Patents

Anode zur galvanisierung Download PDF

Info

Publication number
EP1581673B1
EP1581673B1 EP03813909A EP03813909A EP1581673B1 EP 1581673 B1 EP1581673 B1 EP 1581673B1 EP 03813909 A EP03813909 A EP 03813909A EP 03813909 A EP03813909 A EP 03813909A EP 1581673 B1 EP1581673 B1 EP 1581673B1
Authority
EP
European Patent Office
Prior art keywords
anode
shield
electroplating
metal
active layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP03813909A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP1581673A2 (de
Inventor
Jörg WURM
Stephane Menard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Metakem Gesellschaft fur Schichtchemie der Metalle mbH
Micropulse Plating Concepts SAS MPC
Original Assignee
Metakem Gesellschaft fur Schichtchemie der Metalle mbH
Micropulse Plating Concepts SAS MPC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Metakem Gesellschaft fur Schichtchemie der Metalle mbH, Micropulse Plating Concepts SAS MPC filed Critical Metakem Gesellschaft fur Schichtchemie der Metalle mbH
Publication of EP1581673A2 publication Critical patent/EP1581673A2/de
Application granted granted Critical
Publication of EP1581673B1 publication Critical patent/EP1581673B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode

Definitions

  • the invention relates to an anode for electroplating.
  • insoluble anodes are known in the art. These generally consist of a carrier material and an active layer.
  • a carrier material usually titanium, niobium and others are used. In any case, however, materials are used which are self-passivating under the electrolysis conditions, so, for example, it is also possible to use nickel in alkaline baths.
  • the active layer is usually an electron-conducting layer. It usually consists of materials such as platinum, iridium, mixed oxides with platinum metals or diamond.
  • the active layer may be located directly on the surface of the carrier material, but it may also be located on a substrate which is attached to the carrier material spaced therefrom. As a substrate, for example, such materials can be used, which also come into consideration as a carrier material.
  • additives are added to the baths which act as brighteners, increase the hardness and increase the scattering. These are mostly organic compounds.
  • Anodes are often used here, whose base body consists of titanium and whose active layer consists of platinum or mixed oxide. This active layer is during operation very fast (related calculated on the power conversion in Ah / m 2 ) compared to active layers in the base metal electroplating. This is due, for the most part, to the attack of additives on this active layer, which dissolve the platinum metals of the layer by complex formation. Moreover, certain types of baths can also interfere with cyanate and carbonate formation.
  • the EP 0 471 577 A1 discloses an electrolyzer having an upper electrode and a lower electrode and wherein each of the opposing surfaces of the two electrodes is covered by a respective membrane. Each electrode and the adjacent membrane are mounted in a support structure.
  • the invention also relates to the method of electroplating according to claim 8 and to the use of the anode according to claim 9.
  • the anode for electroplating according to the invention is characterized in that it comprises an anode base body and a shield, wherein the anode base body has a carrier material and an active layer, the shield is attached to the anode base body spaced therefrom and the substance -transport reduced to the anode base body and away from it, the shield is made of metal or plastic and metal and the shield is electrically connected to the anode main body.
  • the anode according to the invention is preferably an anode in which the carrier material is self-passivating under electrolysis conditions.
  • the active layer is preferably electron-conducting.
  • the shield consists of metal. This metal should be largely corrosion resistant under anode conditions. It is further particularly preferred if the shield consists of a metal mesh, an expanded metal or a perforated plate.
  • the shield is made of plastic and metal, as it allows different desirable material properties to be combined.
  • the metallic shielding can bring about an additional potential effect, while with plastic, an effective transport obstacle is more easily achieved.
  • a combination of two metal meshes and an interposed fine tissue or membrane of plastic therefore constitutes a preferred embodiment of the present invention.
  • a particular advantage of this arrangement the very simple installation proves.
  • the shield of the anode according to the invention is electrically conductively connected to the anode base body.
  • positively charged additives must overcome an electrostatic barrier in addition to the mechanical barrier.
  • the efficiency of shielding This can be significantly increased.
  • Such a charged metallic shield acts electrostatically, but can not act electrochemically due to the oxide layer forming on the surface of the shield.
  • the shielding in particular has a distance to the anode base of 0.01 to 100 mm, preferably from 0.05 to 50 mm, more preferably from 0.1 to 20 mm and most preferably from 0.5 to 10 mm.
  • the shield is not parallel to the anode body, e.g. in the case of a corrugated metal sheet used as a shielding, the above-mentioned values relate to the mean distance between the shielding and the anode base body.
  • the effect of a shield located at this distance from the anode base body is particularly great since the additive molecules or ions must first travel a certain distance. This is a particular advantage e.g. against a shield applied directly to the anode-body surface and only a few microns thick.
  • a reduction in the surface area of the active layer of the anode base body is not present in the anode according to the invention, which represents a further advantage over the aforementioned anode with a shield located directly on the active layer.
  • a shield of the anode base body is also possible, but this is preferably also front and rear attached.
  • Another preferred embodiment of the present invention is an anode in which the configuration of the shield in its shape, the arrangement and the distance to the anode base body is such that the gas bubbles produced at the anode during operation are brought together.
  • the gases produced at the anode rise in the form of small bubbles up.
  • the number of bubbles increases towards the top and therefore leads to an inhomogeneous shielding of the anode.
  • the anode according to the invention leads to a reduction in the number of bubbles, since the bubbles are brought together and thus are larger. Since the additive degradation is in part a gas-liquid reaction, this change in the surface to volume ratio causes a further reduction in additive degradation.
  • By decreasing the shielding caused by the bubbles advantageously, there is also an increase in the deposition rate.
  • Another advantage is that the layer of metal deposited on the cathode side becomes more homogeneous as the inhomogeneity of the shielding caused by the bubbles is reduced.
  • the anode according to the invention thus also helps to save material.
  • the gradient caused by the remaining bubbles on the height of the anode and thus also the cathode can advantageously be compensated, for example, by the fact that the active layer of the anode base body tapers towards the bottom, or can also be compensated by using expanded metals with different surface factors.
  • the anode according to the invention advantageously allows use even in strongly alkaline solutions, since the anode in operation by the above-described local pH lowering of the anode environment in the resulting medium is essentially corrosion resistant.
  • the anode in operation by the above-described local pH lowering of the anode environment in the resulting medium is essentially corrosion resistant.
  • the anode described above may be connected according to the invention as a cathode.
  • the shield In cathodic switching of the anode, the shield is non-self-passivating. It is therefore advantageous if a large surface is present, since this reduces the current density and thus the cathodic overvoltage. This leads to a longer service life of the cathode connected as an anode.
  • the invention further relates to methods of electroplating in which an anode is used as described above.
  • a cathodic circuit of the anode ie, the anode is the cathode, of importance, - this is the case, inter alia, in so-called reverse pulse method.
  • the polarity reversal can occur at different times of the galvanization process.
  • a series of pulses are initially applied to the printed circuit board lying at cathodic potential and the anode according to the invention lying at anodic potential.
  • the polarization is reversed for a few milliseconds, so the circuit board is then at anodic potential, while the anode according to the invention acts as a cathode.
  • the iron object is first set to anodic potential to cause activation of the surface.
  • the anode according to the invention is the cathode.
  • the polarization is reversed and the anode according to the invention, which is now at anodic potential, is used in the usual way for the galvanization of the iron object, which is now at cathodic potential.
  • the shielding of the anode causes a reduction in the current density at the polarity reversal, which is advantageous for the life of the anode.
  • the additive degradation was investigated under the operating conditions of a sulfuric acid copper bath in DC operation.
  • the additive used was a sulfur compound.
  • As anodes two DC plates with an active layer of mixed oxide were used. In this case, the first consisted only of the anode body and the second anode according to the invention of anode body and shield.
  • As the cathode a brass plate was used in each case.
  • the additive consumption when using the two anodes would be measured cyclovoltametrisch and is in FIG. 1 applied against the flowed ampere hours. It can be clearly seen that the additive degradation when using the second anode according to the invention is reduced by a factor of 2.5 to 3 compared with the additive degradation when using the first anode.
  • Bubble formation under production conditions in a sulfuric acid copper bath was investigated for the copper plating of wells under reverse pulse plating conditions.
  • the first anode consisted only of an anode base composed of a titanium support material and an active layer of mixed oxide having a size of 1100 mm ⁇ 500 mm ⁇ 1.5 mm.
  • the second anode according to the invention also consisted of a base body which consisted of titanium as a carrier material and a mixed oxide as the active layer and had the same size as the main body of the first anode, and a shield of titanium expanded metal.
  • the same stream was passed through both anodes, and at the first anode the usual bubbling and a vigorously agitated bath were observed.
  • the second anode according to the invention however, the formation of bubbles was greatly reduced.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Magnetic Heads (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
EP03813909A 2002-12-23 2003-12-23 Anode zur galvanisierung Expired - Lifetime EP1581673B1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10261493A DE10261493A1 (de) 2002-12-23 2002-12-23 Anode zur Galvanisierung
DE10261493 2002-12-23
PCT/EP2003/014785 WO2004059045A2 (de) 2002-12-23 2003-12-23 Anode zur galvanisierung

Publications (2)

Publication Number Publication Date
EP1581673A2 EP1581673A2 (de) 2005-10-05
EP1581673B1 true EP1581673B1 (de) 2011-03-23

Family

ID=32478077

Family Applications (1)

Application Number Title Priority Date Filing Date
EP03813909A Expired - Lifetime EP1581673B1 (de) 2002-12-23 2003-12-23 Anode zur galvanisierung

Country Status (10)

Country Link
US (1) US7943032B2 (ja)
EP (1) EP1581673B1 (ja)
JP (1) JP4346551B2 (ja)
KR (1) KR101077000B1 (ja)
CN (1) CN101027432B (ja)
AT (1) ATE503043T1 (ja)
AU (1) AU2003296716A1 (ja)
DE (2) DE10261493A1 (ja)
ES (1) ES2363278T3 (ja)
WO (1) WO2004059045A2 (ja)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5156175B2 (ja) * 2004-10-29 2013-03-06 Ｆｄｋエナジー株式会社 ニッケル光沢メッキを施した電池
EP1712660A1 (de) 2005-04-12 2006-10-18 Enthone Inc. Unlösliche Anode
EP1717351A1 (de) * 2005-04-27 2006-11-02 Enthone Inc. Galvanikbad
DE102005051632B4 (de) 2005-10-28 2009-02-19 Enthone Inc., West Haven Verfahren zum Beizen von nicht leitenden Substratoberflächen und zur Metallisierung von Kunststoffoberflächen
WO2007056267A2 (en) * 2005-11-04 2007-05-18 The Trustees Of Columbia University In The City Of New York Thermally actuated valves, photovoltaic cells and arrays comprising same, and methods for producing same
EP2009147A1 (en) * 2007-06-20 2008-12-31 METAKEM Gesellschaft für Schichtchemie der Metalle GmbH Anode assembly for electroplating
TWI384094B (zh) * 2008-02-01 2013-02-01 Zhen Ding Technology Co Ltd 電鍍用陽極裝置及包括該陽極裝置之電鍍裝置
FR2927909B1 (fr) * 2008-02-26 2010-03-26 Serme Cache souple pour support galvanique, support et procede de mise en oeuvre
EP2123799B1 (en) * 2008-04-22 2015-04-22 Rohm and Haas Electronic Materials LLC Method of replenishing indium ions in indium electroplating compositions
DE202008006707U1 (de) 2008-05-16 2008-08-07 Saueressig Gmbh & Co. Vorrichtung zum Glavanisieren von Werkstücken
US8236163B2 (en) * 2009-09-18 2012-08-07 United Technologies Corporation Anode media for use in electroplating processes, and methods of cleaning thereof
TWI422714B (zh) * 2010-11-24 2014-01-11 Intech Electronics Co Ltd 電鍍裝置及其電鍍槽中的電極板結構
CN102477576A (zh) * 2010-11-30 2012-05-30 加贺开发科技有限公司 电镀装置及其电镀槽中的电极板结构
CN103820839A (zh) * 2014-01-14 2014-05-28 杭州三耐环保科技有限公司 一种高效抑制电积酸雾的阴阳极板结构及其实现方法
CN104073862A (zh) * 2014-07-11 2014-10-01 张钰 一种用于碱性锌镍合金电镀的不溶性阳极装置
US10428439B2 (en) * 2015-11-16 2019-10-01 Intel Corporation Predictive capability for electroplating shield design
EP3914757B1 (en) 2019-01-24 2023-04-05 Atotech Deutschland GmbH & Co. KG Method for electrolytic zinc-nickel alloy deposition using a membrane anode system
CN110029381B (zh) * 2019-04-25 2020-12-15 首钢集团有限公司 一种高镀锡量镀锡板的生产方法
CN113106527B (zh) * 2021-04-19 2024-09-10 深圳铱创科技有限公司 不溶性阳极及脉冲电镀设备

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5213300Y2 (ja) * 1971-02-01 1977-03-25
US3875041A (en) * 1974-02-25 1975-04-01 Kennecott Copper Corp Apparatus for the electrolytic recovery of metal employing improved electrolyte convection
US4075069A (en) * 1975-04-10 1978-02-21 Mitsui Mining & Smelting Co., Ltd. Processes for preventing the generation of a mist of electrolyte and for recovering generated gases in electrowinning metal recovery, and electrodes for use in said processes
JPS59226189A (ja) * 1983-06-06 1984-12-19 Nippon Steel Corp 鉄系電気メツキにおけるメツキ液の通電酸化抑制方法
GB8327300D0 (en) * 1983-10-12 1983-11-16 Deso Inc Acid mist reduction
JP2722259B2 (ja) * 1989-09-14 1998-03-04 ペルメレック電極株式会社 電極保護体
JPH0452296A (ja) * 1990-06-20 1992-02-20 Permelec Electrode Ltd 銅めっき方法
JPH08376Y2 (ja) * 1990-08-15 1996-01-10 株式会社アルメックス 不溶解性陽極を用いたメッキ装置
JPH086198B2 (ja) * 1990-08-15 1996-01-24 株式会社アルメックス 水平搬送型メッキ装置
JP3468545B2 (ja) * 1993-04-30 2003-11-17 ペルメレック電極株式会社 電解用電極
JPH07316861A (ja) 1994-05-24 1995-12-05 Permelec Electrode Ltd 電極構造体
JP3188361B2 (ja) * 1994-06-27 2001-07-16 ペルメレック電極株式会社 クロムめっき方法
DE19545231A1 (de) 1995-11-21 1997-05-22 Atotech Deutschland Gmbh Verfahren zur elektrolytischen Abscheidung von Metallschichten
US6391166B1 (en) * 1998-02-12 2002-05-21 Acm Research, Inc. Plating apparatus and method
DE19834353C2 (de) * 1998-07-30 2000-08-17 Hillebrand Walter Gmbh & Co Kg Alkalisches Zink-Nickelbad
DE19845506A1 (de) 1998-10-02 2000-04-06 Wieland Edelmetalle Verfahren zur Herstellung von prothetischen Formteilen für den Dentalbereich und prothetisches Formteil
US6120658A (en) * 1999-04-23 2000-09-19 Hatch Africa (Pty) Limited Electrode cover for preventing the generation of electrolyte mist
US6254742B1 (en) * 1999-07-12 2001-07-03 Semitool, Inc. Diffuser with spiral opening pattern for an electroplating reactor vessel
US6156169A (en) * 1999-10-06 2000-12-05 Jyu Lenq Enterprises Co., Ltd. Electroplating anode titanium basket
US6755960B1 (en) * 2000-06-15 2004-06-29 Taskem Inc. Zinc-nickel electroplating
ES2250166T5 (es) * 2000-06-15 2016-05-20 Coventya Inc Electrochapado de zinc-níquel
US6402909B1 (en) * 2000-10-02 2002-06-11 Advanced Micro Devices, Inc. Plating system with shielded secondary anode for semiconductor manufacturing
US6425991B1 (en) * 2000-10-02 2002-07-30 Advanced Micro Devices, Inc. Plating system with secondary ring anode for a semiconductor wafer
US6391170B1 (en) * 2000-12-01 2002-05-21 Envirotech Pumpsystems, Inc. Anode box for electrometallurgical processes
US6852209B2 (en) * 2002-10-02 2005-02-08 Applied Materials, Inc. Insoluble electrode for electrochemical operations on substrates

Also Published As

Publication number Publication date
DE10261493A1 (de) 2004-07-08
EP1581673A2 (de) 2005-10-05
DE50313572D1 (de) 2011-05-05
KR20050085863A (ko) 2005-08-29
US20060124454A1 (en) 2006-06-15
US7943032B2 (en) 2011-05-17
ES2363278T3 (es) 2011-07-28
CN101027432A (zh) 2007-08-29
WO2004059045A2 (de) 2004-07-15
AU2003296716A1 (en) 2004-07-22
JP2006511712A (ja) 2006-04-06
KR101077000B1 (ko) 2011-10-26
JP4346551B2 (ja) 2009-10-21
WO2004059045A3 (de) 2005-02-24
ATE503043T1 (de) 2011-04-15
CN101027432B (zh) 2010-09-29
AU2003296716A8 (en) 2004-07-22

Similar Documents

Publication Publication Date Title
EP1581673B1 (de) Anode zur galvanisierung
DE60306772T2 (de) Elektrode für gasentwicklung und deren herstellungsverfahren
EP1717351A1 (de) Galvanikbad
EP1102875A2 (de) Alkalisches zink-nickelbad
DE3043571A1 (de) Verfahren und vorrichtung zur durchfuehrung eines elektrolytischen prozesses
DE10013339C1 (de) Verfahren und Vorrichtung zum Regulieren der Konzentration von Metallionen in einer Elektrolytflüssigkeit sowie Anwendung des Verfahrens und Verwendung der Vorrichtung
EP1712660A1 (de) Unlösliche Anode
EP0638664A1 (de) Verfahren und Vorrichtung zur Regenerierung einer Metallionen und Schwefelsäure enthaltenden Lösung
DE2404167C2 (de) Zelle zur elektrolytischen Gewinnung von Metallen sowie Metallgewinnungsverfahren
DE102007040005A1 (de) Verfahren zum Abscheiden funktioneller Schichten aus einem Galvanikbad
EP1626098A2 (de) Verfahren zur Auflösung von Zink in Laugen
EP1015667B1 (de) Verfahren und vorrichtung zur konzentrationsregulierung von stoffen in elektrolyten
DE4232958C1 (ja)
WO1997015704A2 (de) Galvanikanlage
DD215589B5 (de) Verfahren zur elektrolytischen Metallabscheidung bei erzwungener Konvektion
EP1080252B1 (de) Verfahren zur galvanischen verkupferung von substraten
DE102005027735A1 (de) Elektrochemische Zelle
EP1518828B1 (de) Verfahren und Vorrichtung zur anodischen Oxidation von Cyaniden in wässrigen Lösungen
DE3045968A1 (de) Elektrolytisches bad, herstellung von palladiumbeschichtungen unter verwendung des elektrolytischen bades und regenerierung des elektrolytischen bades
DE60121337T2 (de) Verfahren zur verbesserung einer elektrode
DE4218916C2 (de) Verwendung einer Gitteranode zur elektrolytische Entgiftung oder Regeneration einer Cyanid enthaltenden wäßrigen Lösung
DE2940741A1 (de) Verfahren zur elektrolytischen gewinnung von nickel
DE4134656C2 (de) Verfahren zum Elektroplattieren von Nickel mit reduziertem Aufbau von Nickelionen
DE10060127B4 (de) Elektrolytisches Eisenabscheidungsbad und Verfahren zum elektrolytischen Abscheiden von Eisen und Anwendungen des Verfahrens
DE2258913C3 (de) Galvanisches Bad zur Abscheidung von Platin-Iridium-Legierungen

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20050714

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL LT LV MK

DAX Request for extension of the european patent (deleted)
RIN1 Information on inventor provided before grant (corrected)

Inventor name: MENARD, STEPHANE

Inventor name: WURM, JOERG

17Q First examination report despatched

Effective date: 20080228

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

Free format text: NOT ENGLISH

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

REF Corresponds to:

Ref document number: 50313572

Country of ref document: DE

Date of ref document: 20110505

Kind code of ref document: P

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 50313572

Country of ref document: DE

Effective date: 20110505

REG Reference to a national code

Ref country code: NL

Ref legal event code: T3

REG Reference to a national code

Ref country code: ES

Ref legal event code: FG2A

Ref document number: 2363278

Country of ref document: ES

Kind code of ref document: T3

Effective date: 20110728

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20110323

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20110624

REG Reference to a national code

Ref country code: CH

Ref legal event code: NV

Representative=s name: KATZAROV S.A.

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20110323

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20110323

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20110623

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20110323

REG Reference to a national code

Ref country code: IE

Ref legal event code: FD4D

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20110725

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20110323

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20110323

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20110323

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20110323

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20110323

26N No opposition filed

Effective date: 20111227

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20110323

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 50313572

Country of ref document: DE

Effective date: 20111227

BERE Be: lapsed

Owner name: METAKEM G.- FUR SCHICHTCHEMIE DER METALLE MBH

Effective date: 20111231

Owner name: MICROPULSE PLATING CONCEPTS

Effective date: 20111231

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MC

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20111231

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20111231

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20111223

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: HU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20110323

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 13

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: TR

Payment date: 20160118

Year of fee payment: 14

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 14

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 15

REG Reference to a national code

Ref country code: CH

Ref legal event code: PCAR

Free format text: NEW ADDRESS: AVENUE DES MORGINES 12, 1213 PETIT-LANCY (CH)

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: NL

Payment date: 20191212

Year of fee payment: 17

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: AT

Payment date: 20191125

Year of fee payment: 17

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20201217

Year of fee payment: 18

Ref country code: CH

Payment date: 20201215

Year of fee payment: 18

REG Reference to a national code

Ref country code: NL

Ref legal event code: MM

Effective date: 20210101

REG Reference to a national code

Ref country code: AT

Ref legal event code: MM01

Ref document number: 503043

Country of ref document: AT

Kind code of ref document: T

Effective date: 20201223

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20210101

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: AT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20201223

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20211116

Year of fee payment: 19

Ref country code: FR

Payment date: 20211125

Year of fee payment: 19

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: IT

Payment date: 20211129

Year of fee payment: 19

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: ES

Payment date: 20220105

Year of fee payment: 19

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: TR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20201223

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20211223

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20211223

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20211231

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20211231

REG Reference to a national code

Ref country code: DE

Ref legal event code: R119

Ref document number: 50313572

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20230701

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20221231

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20221223

REG Reference to a national code

Ref country code: ES

Ref legal event code: FD2A

Effective date: 20240131

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: ES

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20221224

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: ES

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20221224