EP1415316B1 - Dalle pour panneau a plasma a barrieres poreuses renforcees - Google Patents

Dalle pour panneau a plasma a barrieres poreuses renforcees Download PDF

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Publication number
EP1415316B1
EP1415316B1 EP02745478A EP02745478A EP1415316B1 EP 1415316 B1 EP1415316 B1 EP 1415316B1 EP 02745478 A EP02745478 A EP 02745478A EP 02745478 A EP02745478 A EP 02745478A EP 1415316 B1 EP1415316 B1 EP 1415316B1
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EP
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Prior art keywords
underlayer
base
layer
barriers
mineral
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EP02745478A
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German (de)
English (en)
French (fr)
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EP1415316A2 (fr
Inventor
Armand Bettinelli
Jean-Claude Martinez
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Thomson Plasma SAS
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Thomson Plasma SAS
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Priority claimed from FR0108628A external-priority patent/FR2826776A1/fr
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/20—Constructional details
    • H01J11/34—Vessels, containers or parts thereof, e.g. substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/20—Constructional details
    • H01J11/34—Vessels, containers or parts thereof, e.g. substrates
    • H01J11/36—Spacers, barriers, ribs, partitions or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/10—AC-PDPs with at least one main electrode being out of contact with the plasma
    • H01J11/12—AC-PDPs with at least one main electrode being out of contact with the plasma with main electrodes provided on both sides of the discharge space
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/20—Constructional details
    • H01J11/34—Vessels, containers or parts thereof, e.g. substrates
    • H01J11/44—Optical arrangements or shielding arrangements, e.g. filters, black matrices, light reflecting means or electromagnetic shielding means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
    • H01J9/241—Manufacture or joining of vessels, leading-in conductors or bases the vessel being for a flat panel display
    • H01J9/242—Spacers between faceplate and backplate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2211/00—Plasma display panels with alternate current induction of the discharge, e.g. AC-PDPs
    • H01J2211/20—Constructional details
    • H01J2211/34—Vessels, containers or parts thereof, e.g. substrates
    • H01J2211/36—Spacers, barriers, ribs, partitions or the like
    • H01J2211/361—Spacers, barriers, ribs, partitions or the like characterized by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2211/00—Plasma display panels with alternate current induction of the discharge, e.g. AC-PDPs
    • H01J2211/20—Constructional details
    • H01J2211/34—Vessels, containers or parts thereof, e.g. substrates
    • H01J2211/36—Spacers, barriers, ribs, partitions or the like
    • H01J2211/366—Spacers, barriers, ribs, partitions or the like characterized by the material

Definitions

  • the invention relates to an image display plasma panel slab comprising a substrate coated with at least one electrode array itself coated with a network of high porosity barriers; the document EP1017083 - THOMSON discloses such slabs.
  • the barriers are conventionally intended to delimit cells to form discharge zones in the plasma panel.
  • Slabs of this type generally serve as a back panel of plasma panel; for the manufacture of the plasma panel, on the tops of the barriers of a slab of this type, it is generally applied a transparent front slab also provided with at least one electrode array oriented orthogonally with respect to the electrodes of the rear slab; at the intersections of the electrodes of the rear slab and the electrodes of the front slab, the zones delimited by the walls of the barriers, by the rear slab and by the front slab form zones of light discharges, produced by applying matched potential differences between the electrodes crossing these zones.
  • the dielectric layers applied to each slab are made of dense material generally based on lead-containing mineral glass for baking in the range 500-600 ° vs.
  • the method of manufacturing a slab of the type previously mentioned comprises, after the formation of the electrode array and before the deposition of the green layer of barrier material, the deposition of a green layer of homogeneous thickness based on a powder of a dielectric mineral material and an organic binder generally followed by a firing step under conditions adapted to remove the organic binder and to densify this dielectric material.
  • the dielectric layer thus densified also serves to protect the electrodes during the projection of abrasive material for the formation of the barriers.
  • porous barriers are not without drawbacks; because of their structure, they are more fragile or less resistant than dense classical barriers; this effect is accentuated for barriers of small width, especially less than or equal to 70 microns.
  • the document JP11219659 discloses a slab for an image display plasma panel comprising a barrier network whose porosity is between 3 and 30% by volume, arranged on a porous base sub-layer whose porosity is less than or equal to 2% by volume.
  • EP1290711 (corresponding to WO01 / 99149 ), published after this document, describes the formation of barriers on a slab, by etching in a glass layer having a porosity of between 10% and 60% by volume; the etching is not necessarily carried out over the entire thickness of this layer, a full underlayer of indeterminate thickness can remain under the barriers.
  • the invention aims to provide a slab of the aforementioned type of simpler structure and reinforced porous barriers, which can be achieved by a more economical process.
  • the subject of the invention is an image display plasma panel slab comprising a substrate coated with at least one electrode array itself coated with a network of barriers of mineral material whose porosity is greater than 25%, intended to delimit cells to form discharge zones in said panel, also comprising a porous base sub-layer which is interposed between said electrode array and said network of barriers, which is made of mineral material whose porosity is greater than 25%.
  • the thickness of the base sub-layer is between 10 ⁇ m and 40 ⁇ m in all points of the slab, at least in all points of the active surface of the slab which corresponds to the whole discharge areas; the bottom of the cells of the slab is then formed by the surface of the base sub-layer, which has no hole revealing areas of electrodes or areas of the substrate of the slab.
  • Each barrier conventionally comprises a base, slopes, and a summit; the base underlayer completely covers the electrodes in the active surface area of the slab; the active surface area of the slab that corresponds to the cells of the panel.
  • the adhesion of the barriers to the substrate is more critical when the substrate has a low roughness and the barriers have a high porosity; thanks to the underlayment according to the invention, the barriers cover the entire surface of the substrate via the underlayer, which improves the stability of the barriers and their adhesion to the substrate.
  • porous barriers pose more problems with mechanical stability and adhesion to the substrate; these substrates being generally made of glass, it is understood that a porous material adheres more difficultly to the glass than the glassy material of the dense barriers; the addition of a base underlayer according to the invention, which extends before and after firing over the entire effective surface of the slab, makes it possible to improve the mechanical stability of the barriers and the adhesion of these barriers to the substrate, especially when these barriers are narrow and porous; the base underlayer according to the invention therefore also has a function of anchoring the barriers on the slab, whether before or after firing; this anchoring advantage is particularly appreciated in the case where the formation of the barriers - in the raw state, that is to say uncooked - comprises a step of "sand-blasting" (see below) which requires the application preliminary of a protective mask having the reasons of the network of barriers, and which is followed by a step of eliminating this protective mask, because during this step, there is a particular risk of weakening or destabil
  • the width of the barriers is less than or equal to 70 ⁇ m, especially at the slopes; indeed, such barriers are particularly fragile, whether in the cooked state or in the raw state before cooking, during the manufacture of the slab; the underlayer according to the invention is then all the more useful for reinforcing these barriers; in the case of slope gates, the width is measured at half height.
  • the slab has no intermediate layer, especially dielectric, between the electrodes and said base sublayer.
  • the base underlayer which forms the bottom of the cells is sufficient to protect the electrodes against the action and erosion of plasma discharges, even if it is porous; indeed, this erosion is low because the proportion of discharges triggered from the electrodes of the slab according to the invention is low at view of the total number of discharges on a plasma panel in normal use comprising a slab according to the invention.
  • the base sub-layer comprises a component adapted to reflect light; the titanium oxide is preferably used for this purpose.
  • the reflective effect thus obtained the radiation emitted towards the bottom of the cells is not lost and the luminous efficiency of the plasma panels comprising a slab according to the invention is increased.
  • the base underlayer according to the invention then has a triple function of protecting the electrodes during the manufacture of the panel (see below), anchoring the barriers, and improving the light output; the use of a single sub-layer for three functions is particularly advantageous economically, since it avoids inserting a specific dielectric layer and a specific reflection layer.
  • the barriers may also include a reflective component to improve light output.
  • the mineral material of the base sub-layer comprising a mineral filler and a mineral binder
  • the weight proportion of inorganic binder in the inorganic material of the barriers is less than 13%.
  • the mineral material of the base sub-layer comprising a mineral filler and optionally a mineral binder
  • the weight proportion of inorganic binder in the mineral material of the base sub-layer is less than 13%; this is a preferred way to obtain a porous sub-layer; in the case, in particular, where the electrodes are silver and where the underlayer and / or the barriers have a reflection function for improving the light output, this low level of inorganic binder prevents the migration of silver in this underlayer and in the barriers, and prevents the coloring, including yellowing, of the mineral material which would degrade its reflective properties.
  • the material of the base sub-layer is identical to the material of the barriers, which simplifies the manufacture of the slab.
  • the slab may comprise a plurality of base sub-layers, for example one in the same material as that of the barriers, and another comprising a component adapted to reflect light.
  • the slab according to the invention comprises a layer of phosphors covering, at least partially, the slopes of the barriers and said sub-layer.
  • the nature of the phosphors of this layer differs generally according to the rows or columns of cells delimited by the barriers; the luminophores thus deposited on the walls of the cells have the function of transforming the ultraviolet radiation of the discharges into visible radiation in one of the three primary colors conventionally used to visualize images; in general, adjacent cells with different primary colors form an image element or pixel.
  • these luminophores are deposited directly on the porous sub-layer and the porous barriers; it has been found that this porosity favored the adherence of phosphors; no intermediate layer of adhesion then is necessary.
  • the radius of curvature is greater than or equal to 10 ⁇ m; it has been found that such a radius of curvature is even more favorable to the stability of the barriers, but also to the regularity of the phosphor deposition.
  • the subject of the invention is also an alternating-type and memory-effect image-viewing plasma panel comprising a first slab according to the invention and a second slab provided with coplanar electrodes for maintaining memory-effect discharges. , providing between them zones of discharges delimited by said barriers.
  • the invention also relates to a method of manufacturing a plasma panel slab according to claim 11.
  • the base sub-layer and the main layer are deposited on the starting slab, or substrate, provided with its electrode array, so as to have each an approximately uniform thickness on the active surface of the slab.
  • the abrasion speed of the underlayer is, according to the invention, lower than the abrasion speed of the main layer under comparable abrasion conditions, namely the use of the same abrasive material under the same operating conditions. than during the projection for the formation of the barriers.
  • the bottom of these cells is then formed by the surface of the base sub-layer, which has no holes revealing areas of electrodes or substrate; the base sub-layer may have been partly penetrated by the abrasive material but must have withstood sufficient time for the slab electrodes to be completely covered by this base sub-layer; the main function of the underlayer therefore is, at this level, to protect the underlying electrodes during the formation of the green barriers by spraying an abrasive material; after cooking, the bottom of the cells is always formed by the surface of the fired base sublayer.
  • the base subbase mineral material comprises a mineral filler and optionally a mineral binder; the particle size of the powder of the mineral material of this underlayer, in particular of said mineral filler, if any, the nature of said inorganic binder and the proportions of this binder in this powder, the method of mixing the components of this powder, and the cooking conditions are adapted so that the apparent density of the base sub-layer obtained after cooking is also less than 75% of the theoretical density of the mineral filler of this underlayer.
  • the proportion of inorganic binder in the mineral material of the base sub-layer is less than 13%; this proportion can even be zero here.
  • this underlayer thus having a porosity greater than 25%, and in the case where the formation of the electrode array has been carried out by deposition of a green layer comprising a conducting material and an organic binder, it is even more It is easy to carry out the firing of this layer of electrodes at the end of the process, at the same time as that of the base underlayer and the raw barriers, because the porosity of this base sub-layer and that of the barriers facilitate the removal of decomposition products from organic binders, including those from the electrode layer.
  • a protective mask of polymer material with patterns corresponding to the network of the barriers to be formed is generally applied to this deposit; this mask is intended to protect against abrasion areas of the main layer corresponding to the tops of the barriers; therefore, after the abrasion operation but before cooking and, if necessary, before other operations such as the deposition of phosphors, this mask is removed, usually by projection of an aqueous alkaline solution (or "stripping ").
  • the radius of curvature is greater than or equal to 10 microns; this radius of curvature is even higher than the difference between abrasive speed of the base sub-layer and that of the main barrier layer is low.
  • a solvent-soluble binder will be selected which is easy to remove without danger;
  • a water-resistant organic binder preferably chosen from the group consisting of cellulosic resins, acrylic resins, methacrylic resins, rosin resins, and cross-linked polyvinyl alcohol resins; preferably, the organic binder of the base underlayer is based on polyvinyl alcohol.
  • the proportion of organic binder in the base sub-layer is greater than the proportion of organic binder in the layer. main.
  • the glass transition temperature of the organic binder of the base sub-layer is lower than that of the organic binder of the main layer, in particular less than or equal to 60 ° C.
  • the method according to the invention does not include deposition of intermediate layer, especially dielectric, between the formation of the electrode array and the deposition of the base sub-layer; by avoiding to apply an intermediate dielectric layer, the method according to the invention is therefore much more economical than the methods of the prior art.
  • the method according to the invention comprises only a single baking heat treatment after the formation of the at least one electrode array.
  • the method according to the invention advantageously comprises only one final firing, without intermediate firing between the deposit of the green layer of electrodes and the deposition of the base sub-layer; thanks to the porosity of the underlayer, the decomposition products of the organic binder of the electrode network easily pass through this underlayer without damaging it; the almost non-vitreous nature of this sub-layer avoids, during cooking, the phenomena of parasitic diffusion of the material of the electrodes; advantageously, it is no longer necessary to bake the electrode array before the barriers are deposited.
  • the method according to the invention does not include any step where the temperature of the slab exceeds 480 ° C.
  • the inorganic barrier material comprises a mineral barrier filler and a mineral binder; the particle size of the powder of this mineral material, in particular the mineral filler of the barriers, the nature of its inorganic binder and the proportions of this binder in this powder, the method of mixing the components of this powder, and the cooking conditions are adapted so that the apparent density of the barriers obtained after firing is less than 75% of the theoretical density of said mineral filler; Barriers having a porosity greater than 25% are thus obtained, which advantageously facilitates and shortens the pumping of the plasma panel.
  • these barriers are preferably used for wherein the weight ratio of inorganic binder is less than 13%; as the inorganic binder, a glass or a low-melting sinter is generally used; in the case of these small proportions of inorganic binder, the inorganic binder advantageously comprises colloidal silica, silicates or hydrolysed silanes, which improve the strength of the porous barriers.
  • the method advantageously comprises the deposition of a raw layer based on phosphor and an organic binder, both on the green underlayer covering the electrode array and on the base and the slopes of the barriers; this step is, in itself, known from the prior art; thanks to the invention, the green phosphor layer wets the walls of the barriers and the bottom of the cells in the same way, since they consist of identical materials; a more uniform distribution and a better homogeneity of the phosphors are thus obtained; after firing, a better adhesion of the phosphors to the walls of the barriers and to the bottom of the cells is obtained without the use of an intermediate adhesion layer.
  • the barrier material powder generally comprises a mineral filler and a mineral binder based on glass; the temperature reached during the firing of the barriers is generally greater than or equal to the glass transition temperature of the glass, so as to activate the inorganic binder and to obtain sufficient consolidation after removal of the organic binder; to obtain a high porosity barrier material, especially greater than 25%, the weight content of this glass in the powder of the barrier material will preferably be greater than or equal to 2%, less than or equal to 10%; this content will be higher for narrower barriers.
  • the base undercoat material powder also comprises a mineral filler and, optionally, a mineral glass binder.
  • the inorganic filler of the barrier material is selected from stable mineral products in the range of firing temperature, high adsorbent; preferably, this charge is selected from the group comprising alumina, zirconia, yttrium oxide, titanium oxide and mixtures thereof; alumina in particular because it is an amphoteric powder with high adsorbent properties; zirconia or titanium oxide according to the desired dielectric constant; the mineral filler may also include products such as mullite, cordierite or zeolites; preferably, 80% of the elementary grains of the mineral filler have a size of between 0.3 ⁇ m and 10 ⁇ m; after cooking, the grain size is globally unchanged.
  • the mineral filler of the base sub-layer material may be the same as or different from that of the barrier material; according to a variant of the invention, this mineral filler comprises other components than the mineral filler for the main layer of barriers, such as for example a light reflecting material; to form a white background and reflective at the bottom of the discharge cells, it is thus possible to use titanium oxide as another component.
  • the average grain size of the inorganic binder is less than or equal to that of the mineral filler.
  • a high porosity base underlayer material in particular greater than 25%, the weight content of binder optional mineral in the powder of the base underlayer material will preferably be less than 13%; the powder of the base underlayer material may contain no inorganic binder.
  • the inorganic filler and, where appropriate, the mineral binder are then mixed to obtain the barrier material powder or the base underlay material powder; as the proportions of two main mineral components of this powder are very different, their mixing mode is very important to best disperse the mineral binder around the grains of the mineral filler and allow it to ensure a significant consolidation of the barriers during baking step; a typical procedure for mixing about 1 liter of powder consists in placing this powder in a container of about 4 liters and shaking dry with a 150 mm diameter knife rotating at 7000 rpm for about 4 minutes.
  • Organic binders are preferably selected from the group consisting of cellulosic resins, acrylic resins, methacrylic resins, rosin resins, and cross-linked polyvinyl alcohol resins.
  • the composition of the raw base sub-layer is adapted so that the abrasion rate of this base sub-layer is significantly lower than the abrasion speed of the main layer under the same projection conditions; the abrasion rate of a green layer or underlayer under predetermined abrasive material spraying conditions generally decreases as the proportion of organic binder increases in this layer, and / or when the intrinsic elasticity of this binder increases.
  • projection conditions are not only the conditions of use of the abrasive material but also the nature, texture and structure of this material.
  • the raw barrier main layer a organic binder much more sensitive to abrasion than that of the base sub-layer;
  • rosin or "rosin" in English
  • An advantageous solution consists in using for the underlayer an organic binder based on polyvinyl alcohol crosslinkable under UV.
  • an organic binder having a glass transition temperature lower than that of the binder of the main layer advantageously, an organic binder having a glass transition temperature of less than or equal to 60 ° C can be used; for example, a very abrasion-resistant base underlayer was obtained by using as organic binder 4% by weight of an acrylic or methacrylic resin having a glass transition temperature of 57 ° C.
  • the base sub-layer with an organic binder content will be formulated. 2.5 to 8 times higher than in the main layer: for example, by taking as binder ethyl cellulose of grade N4 having a glass transition temperature of the order of 156 ° C, the proportion (weight of binder / weight of mineral powder) would be 2 to 4% in the main layer, against 10 to 15% in the base underlayer.
  • the abrasibility of the main barrier layer can be increased by using a binder of higher molecular weight; thus, a lower molecular weight grade will preferably be used in the base underlayer than in the main layer.
  • the binder will preferably be added to the binder.
  • organic layer of this underlayer a plasticizer adapted to said binder, avoiding too high a content which could cause cracking of the green underlayer after application; with the ethyl cellulose of grade N4 mentioned above, 1 to 4% by weight of butyl benzyl phthalate can be used, always based on the weight of mineral powder.
  • any other means may be used to lower the glass transition temperature of this binder in the base sub-layer, measured in the crosslinked state.
  • the powder of barrier material or underlay material is then mixed in a manner known per se with its organic binder.
  • the deposition of raw layers of barriers on the slab provided with its network of electrodes can then be carried out directly by liquid, or by transfer of a green film of this preformed layer ("green tape” in English), as described in the document EP 722179 (DUPONT ).
  • liquid deposition method it is possible, for example, to use screen printing, slit coater, or curtain deposition.
  • a slab is obtained with an electrode network covered with a base underlayer and a green barrier layer of uniform overall thickness.
  • a solid powder or "sand” is generally used, for example glass beads, metal balls, or calcium carbonate powder; the operation is then referred to as "sandblasting" or “sand-blasting” in the English language; a liquid can also be used as an abrasive material.
  • the polymeric material of the mask is based on polyvinyl alcohol (or "PVA”) crosslinked;
  • PVA polyvinyl alcohol
  • the advantage of this material is that it can be developed with hot water, which makes it possible to avoid the use of solution containing alkaline elements, that it is particularly resistant to abrasion and that it is can be easily removed by burning or pyrolysis after the abrasion operation;
  • this method of elimination compared to a conventional "stripping" operation, makes it possible to avoid weakening the barriers and to envisage even narrower barriers; using this method of elimination, it is again avoided the use of mask removal solution (so-called “stripping solution”) containing sodium or potassium with all the risks inherent in the pollution of the slab, that d as much as a large developed surface difficult to rinse was generated during the sanding of the barriers; a very high resistance to abrasion was obtained with contents of (PVA + plasticizer) of 100%, with a plasticizer / resin ratio of 1 to 2.
  • Another method described in the document EP 722179 already mentioned is to apply on the main layer of barrier material, an overcoat not only loaded barrier material but containing a sufficiently large proportion of light-curing organic binder to be able to withstand the projection of abrasive material; thus, it is in the over-layer itself that the mask is made by photolithography; according to the document EP 722179 the advantage of this method is that it is not necessary to remove the mask directly after the abrasion operation since the photopolymerized binder is subsequently removed during the baking operation, its pyrolysis being facilitated by the porosity mineral charge; after cooking, the remaining part of this overlay forms the top of the barriers.
  • the organic photopolymerizable binder of the overcoat is based on crosslinked polyvinyl alcohol; the advantage of this material is that it is particularly resistant to abrasion; we got very strong resistances high abrasion with contents (PVA + plasticizer) typically from 20 to 50%, with a plasticizer / resin ratio typically from 1 to 2.
  • a slab is thus obtained with an array of electrodes and a network of raw barriers delimiting the future discharge zones or cells of the plasma panel, where the bottom of the cells and the electrodes crossing the bottom of the cells are covered with the base underlayer which has resisted the projection of abrasive material, and thus served, according to the invention, to protect the electrodes against the projection of abrasive material in the absence of dielectric layer.
  • a slab is obtained with an array of electrodes, a network of barriers, coated with phosphors.
  • the firing of the assembly comprising the green underlayer, the green barriers and the green phosphor layers is then carried out under conditions adapted to remove the organic binder from the different green layers and, in the case of the barriers and their sub-layers. base layer, to obtain the consolidation of the mineral material; the organic compounds are generally removed below 380 ° C, and in a first step of the baking heat treatment, a gradual rise up to this temperature so as to eliminate these organic compounds without damaging the structure of the layers raw; in a second stage of the heat treatment, heating is carried out at least to a temperature close to the softening temperature of the inorganic binder incorporated in the barriers and, optionally, to their base underlayer.
  • the conditions of the second stage of the baking heat treatment are adapted so as to obtain sufficient consolidation of the barrier material while maintaining a high porosity for both the base sub-layer and the barriers; it has been found that cooking under these conditions causes almost no shrinkage.
  • the slab according to the invention does not comprise any specific dielectric layer interposed between the electrodes and the base sub-layer, it avoids the heat treatment relative to this dielectric layer.
  • the slab according to the invention is thus obtained, as represented in FIG. figure 1 or, alternatively, to the figure 2 ; this slab is provided with at least one electrode array 11 and a network of porous barriers 17 made of mineral material, delimiting cells for the discharge zones of the panel, where, at the bottom of the cells, the electrodes 11 are covered a porous base underlayer 18 based on a mineral material; on the figure 1 the slopes of the barriers and the bottom of the cells are covered with luminophores 41; on the figure 2 the luminophores are not represented.
  • the embodiment of the figure 2 differs from that of the figure 1 in that the barriers have sloped slopes which are not perpendicular to the slab plane, and in that, outside the zones where it supports the barriers, the base sub-layer has a rounded surface which results from its Partial and irregular abrasion during the barrier formation stage.
  • the base underlayer 18 according to the invention considerably improves the adhesion of the barriers to the substrate.
  • the slabs according to the invention can be used in all types of plasma panels with barriers delimiting cells or groups of cells.
  • such an image-viewing plasma panel of the reciprocal type and with a memory effect, comprises a first slab according to the invention, provided with barriers 17 supported by the underlayer 18 already described, and a second slab 30 equipped with coplanar electrodes 33, providing between them zones of discharges 40 delimited by the barriers 17; the electrodes 11 of the first slab, which serve for the addressing of the discharges, are fully covered by the underlayer 18 according to the invention, at least in the active part of the panel; the coplanar electrodes 33 of the second slab 30, which serve to maintain the discharges by memory effect, are covered with a dielectric layer 32 and a protective layer 31, based on MgO.
  • the following example illustrates more particularly the invention and relates to the manufacture of a back panel plasma panel.
  • a plasma panel slab with an abrasion barrier network is thus obtained, completely eliminating the additional steps of the methods according to the prior art. relating to the application and firing of a dielectric layer, intended inter alia to serve as a protective layer for the electrodes during the forming of the barriers by abrasion.
  • the barriers although porous and narrow, have good strength thanks to the underlayment according to the invention.
  • This example is intended to illustrate the advantage of using a polyvinyl alcohol as organic binder of the base underlayer, in the steps 1 of preparation of the base underlayment and 2 of preparation of the dough main layer of the process just described.
  • Main layer with ethylcellulose binder with a resin content of 3% (terpineol solvent);
  • step 6 of projection of abrasive material or "sanding" there is a factor of 4 between the abrasion rate of the main layer and that of the underlayer.
  • Polyvinyl alcohol-based binder (15% PVA) binder without plasticizer addition, in which a diazo sensitizer allowed cross-linking under UV and water as a solvent;
  • step 6 of projection of abrasive material or "sandblasting" there is a factor 16 between the abrasion speed of the main layer and that of the underlayer.
  • crosslinked polyvinyl alcohol is particularly advantageous for the implementation of the method of the invention.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • Gas-Filled Discharge Tubes (AREA)
  • Drying Of Semiconductors (AREA)
EP02745478A 2001-06-29 2002-06-04 Dalle pour panneau a plasma a barrieres poreuses renforcees Expired - Lifetime EP1415316B1 (fr)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
FR0108628 2001-06-29
FR0108628A FR2826776A1 (fr) 2001-06-29 2001-06-29 Procede de fabrication d'une dalle pour panneau a plasma dotee de barrieres formees par projection d'un materiau abrasif
FR0112250 2001-09-21
FR0112250 2001-09-21
PCT/FR2002/001868 WO2003003398A2 (fr) 2001-06-29 2002-06-04 Dalle pour panneau a plasma a barrieres poreuses renforcees

Publications (2)

Publication Number Publication Date
EP1415316A2 EP1415316A2 (fr) 2004-05-06
EP1415316B1 true EP1415316B1 (fr) 2009-01-14

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EP02745478A Expired - Lifetime EP1415316B1 (fr) 2001-06-29 2002-06-04 Dalle pour panneau a plasma a barrieres poreuses renforcees

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US (1) US7339318B2 (ko)
EP (1) EP1415316B1 (ko)
JP (1) JP4324466B2 (ko)
KR (1) KR100852678B1 (ko)
CN (1) CN100505137C (ko)
AU (1) AU2002317214A1 (ko)
DE (1) DE60230875D1 (ko)
TW (1) TWI294136B (ko)
WO (1) WO2003003398A2 (ko)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2818798B1 (fr) * 2000-12-22 2003-02-21 Thomson Multimedia Sa Procede de fabrication d'un reseau de barrieres en materiau mineral sur une dalle pour panneau de visualisation a plasma
FR2855644A1 (fr) * 2003-05-27 2004-12-03 Thomson Plasma Panneau a plasma dont les barrieres de partionnement sont en ciment
EP1530191A3 (en) * 2003-11-07 2008-02-27 Thomson Plasma S.A.S. Small-gap plasma display panel with elongate coplanar discharges
JP4103116B2 (ja) * 2004-06-09 2008-06-18 日東電工株式会社 積層シート、プラズマディスプレイパネル用背面基板の製造方法、プラズマディスプレイパネル用背面基板、及びプラズマディスプレイパネル
KR20060113137A (ko) * 2005-04-29 2006-11-02 엘지전자 주식회사 플라즈마 디스플레이 패널 및 그 제조방법
KR100612243B1 (ko) * 2005-05-25 2006-08-11 삼성에스디아이 주식회사 플라즈마 디스플레이 패널
KR100696697B1 (ko) * 2005-11-09 2007-03-20 삼성에스디아이 주식회사 플라즈마 디스플레이 패널
JP2007280816A (ja) * 2006-04-07 2007-10-25 Pioneer Electronic Corp プラズマディスプレイパネルの製造方法およびプラズマディスプレイパネル
JP4853353B2 (ja) * 2007-03-30 2012-01-11 パナソニック株式会社 プラズマディスプレイ用背面板
KR20080105787A (ko) * 2007-06-01 2008-12-04 엘지전자 주식회사 플라즈마 디스플레이 패널 및 그 제조방법

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DE4121462C2 (de) * 1991-06-28 1994-09-01 Deutsche Forsch Luft Raumfahrt Hochtemperaturwärmespeichersystem
JPH0745200A (ja) * 1993-07-29 1995-02-14 Noritake Co Ltd プラズマディスプレイパネル
JP3297782B2 (ja) * 1994-08-26 2002-07-02 ソニー株式会社 プラズマアドレス液晶表示装置及びプラズマアドレス液晶表示装置の製造方法
US5909083A (en) * 1996-02-16 1999-06-01 Dai Nippon Printing Co., Ltd. Process for producing plasma display panel
US6207268B1 (en) 1996-11-12 2001-03-27 Dai Nippon Printing Co., Ltd. Transfer sheet, and pattern-forming method
JP3649309B2 (ja) 1996-11-12 2005-05-18 大日本印刷株式会社 プラズマディスプレイパネルの形成方法
JP3623648B2 (ja) * 1998-01-30 2005-02-23 京セラ株式会社 プラズマ表示装置
JPH11306967A (ja) 1998-04-24 1999-11-05 Dainippon Printing Co Ltd プラズマディスプレイパネルの障壁形成方法
JP2000100327A (ja) 1998-09-25 2000-04-07 Dainippon Printing Co Ltd プラズマディスプレイパネルの製造方法とプラズマディスプレイパネル
KR100332097B1 (ko) * 1999-09-14 2002-04-10 구자홍 플라즈마 디스플레이 패널
FR2818798B1 (fr) * 2000-12-22 2003-02-21 Thomson Multimedia Sa Procede de fabrication d'un reseau de barrieres en materiau mineral sur une dalle pour panneau de visualisation a plasma

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Publication number Publication date
EP1415316A2 (fr) 2004-05-06
KR100852678B1 (ko) 2008-08-19
US20040169471A1 (en) 2004-09-02
JP4324466B2 (ja) 2009-09-02
WO2003003398A3 (fr) 2003-11-06
CN1526152A (zh) 2004-09-01
JP2004531041A (ja) 2004-10-07
AU2002317214A1 (en) 2003-03-03
DE60230875D1 (de) 2009-03-05
WO2003003398A2 (fr) 2003-01-09
CN100505137C (zh) 2009-06-24
KR20040012968A (ko) 2004-02-11
TWI294136B (en) 2008-03-01
US7339318B2 (en) 2008-03-04

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