EP1402565A2 - Dispositif de maintien pour des plaquettes de semi-conducteur - Google Patents

Dispositif de maintien pour des plaquettes de semi-conducteur

Info

Publication number
EP1402565A2
EP1402565A2 EP02740254A EP02740254A EP1402565A2 EP 1402565 A2 EP1402565 A2 EP 1402565A2 EP 02740254 A EP02740254 A EP 02740254A EP 02740254 A EP02740254 A EP 02740254A EP 1402565 A2 EP1402565 A2 EP 1402565A2
Authority
EP
European Patent Office
Prior art keywords
wafer
holding device
grippers
holding
axis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP02740254A
Other languages
German (de)
English (en)
Inventor
Karsten Urban
Winfried Deutscher
Joachim Wienecke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Leica Microsystems CMS GmbH
KLA Tencor MIE Jena GmbH
Original Assignee
Leica Microsystems Jena GmbH
Leica Microsystems CMS GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leica Microsystems Jena GmbH, Leica Microsystems CMS GmbH filed Critical Leica Microsystems Jena GmbH
Publication of EP1402565A2 publication Critical patent/EP1402565A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S294/00—Handling: hand and hoist-line implements
    • Y10S294/902—Gripping element

Definitions

  • the invention relates to a holding device for wafers in an arrangement for wafer inspection, comprising two grippers, each of which, when the holding device is closed, encloses a portion of the circumference of the wafer and which are connected to a drive device, when actuated, the grippers open for the purpose of opening the holding device away from each other and to close the holding device to move towards each other and a holding arm on which both grippers are pivotally mounted.
  • Such a holding device is known from US 5,700,046 A.
  • the holding device described there is movably mounted and is used to hold wafers when moving from, for example, a transfer station to an inspection station.
  • the holding device can be moved along a horizontal axis, moved up and down and pivoted about an axis perpendicular to the transport direction.
  • the transport direction and the main direction of extension of the wafer are always in one plane, i. H. the orientation of the two opposing surfaces of the wafer is retained with respect to the direction of transport during the transfer.
  • the grippers enclose the wafer in an arc.
  • the wafer only bears against the intermediate pieces provided on the grippers.
  • these are designed such that the wafer is held flat only on its non-structured lower or rear side and is punctiform on its peripheral side edge.
  • the intermediate pieces are L-shaped.
  • the underside or back of the wafer lies on horizontal legs of the intermediate pieces and is held centered by means of the vertical legs, which bear against the side edge of the wafer.
  • An inspection arrangement is known from US Pat. No. 5,807,062 A in which a wafer passes through different inspection stations.
  • a macro-inspection station in which the wafer is immediately visually inspected by a controller. Large defects, such as scratches or color deviations, can be identified. In addition, contaminants such as dust particles adhering to the wafer can be detected.
  • the object of the invention is to create a device which enables viewing of both the structured and the unstructured surface of a wafer.
  • a holding device of the type mentioned in which the holding arm is rotatably mounted about an axis A, which lies essentially in the plane spanned by the wafer, so that a wafer held between the grippers is rotated through 180 ° about the axis is turned.
  • the axis A should advantageously run approximately in the middle between two swivel bearings for the grippers.
  • a wafer can be held securely and turned in any transport position of the holding device, ie at an inspection station or also halfway between two stations, so that it is possible to move from a fixed inspection station from both the front and the back. Since the wafer is only held on its side edge by the grippers, the view of its two surfaces is not, or only insignificantly, restricted.
  • the holding device is preferably used in an arrangement for the visual inspection of wafers. This arrangement comprises a transfer station, a macro inspection station and a micro inspection station as well as a transfer device for transporting a wafer between the individual stations.
  • the holding device is arranged in the macro inspection station.
  • both its structured front side and its rear side can be macroscopically examined.
  • the wafer must not be placed on its structured front side, since this could lead to damage which would render the wafer unusable. With the holding device, such an impairment of the front side during the inspection of the wafer is avoided.
  • the holding arm is pivotally mounted about a further axis B, which runs essentially tangentially to the wafer circumference and intersects the axis A at least approximately at a right angle. This makes it possible to swing the wafer out of its position before turning. This is particularly advantageous if components of the wafer inspection device could collide with the wafer or the grippers when turning.
  • the axis A should advantageously run approximately in the middle between two swivel bearings for the grippers.
  • Support arm is slidably mounted in a straight guide, the direction of displacement C intersects the axes A and B substantially at right angles.
  • the travel path and the swivel angle can be reduced, as a result of which the time for turning the wafer can be reduced.
  • the movements i. H. the translation movement and the pivoting movements of the holding arm, carried out simultaneously.
  • the grippers each have at their sections facing the wafer periphery intermediate pieces, at least one of which is geometrically shaped such that the wafer is held on its peripheral edges only by touching it. In this way, a secure holding of the wafer is ensured on the one hand, and on the other hand any contact with the front is avoided. In addition, the impairment of the visible area remains very low, especially on the back of the wafer. The very small contact surfaces also reduce the risk of particle transfer.
  • At least one intermediate piece is preferably provided, which abuts against both peripheral edges of the wafer when gripping.
  • Such an intermediate piece can, for example, be opened in a V-shape towards the wafer, the peripheral edges of a held wafer resting in the V-profile.
  • an intermediate piece as a roller, which is mounted eccentrically on a gripper and can be fixed in a selected angular position.
  • the resilient support of at least one intermediate piece on a gripper ensures secure gripping on the one hand, and on the other hand the contract forces at the contact points can be controlled well, so that damage can be avoided with a high degree of certainty.
  • the spring-elastic support can take place, for example, via a leaf spring, the intermediate piece being articulated to the associated gripper via a leaf spring. This has the advantage that the holding force of the spring is not affected when turning. Rather, the position of the wafer relative to the grippers is retained when turning. Furthermore, it is also possible to pre-tension the gripper movements themselves in order to keep the risk of damage to the peripheral edges of the wafer low, in particular when the grippers are closed.
  • At least one stop is provided between the grippers and the holding arm, which limits the pivoting angle during the gripper movement. This in particular improves the safety of the holding device.
  • a tension spring is provided between the grippers, by means of which the wafer is held under elastic tension between the grippers even without driving force.
  • a sensor for checking the presence of a wafer between grippers is provided on at least one gripper. This is particularly advantageous for an automated mode of operation of the holding device, in which a wafer is gripped automatically, then turned, subsequently turned back to its original position and finally released again.
  • FIG. 1 shows a schematic illustration of an inspection arrangement with a holding device for turning a wafer
  • 2 shows a spatial view of the holding device
  • 3 shows a side view of the holding device in a first position before gripping a wafer
  • FIG. 4 shows a side view of the holding device in a second position when gripping a wafer
  • FIG. 5 shows a side view of the holding device in a third position immediately before turning the wafer, in which the wafer has already been lifted up and pivoted
  • FIG. 7 shows a detailed view of an intermediate piece
  • FIG. 8 shows a detailed view of a spring-elastic intermediate piece
  • FIG. 10 shows a detailed view of a stop for the grippers.
  • the first exemplary embodiment shows in FIG. 1 an inspection arrangement 1 with which flat substrates such as wafers W can be examined both directly visually and microscopically.
  • the inspection arrangement 1 can be used to examine wafers W that have been assessed as defective and discarded during production, in order to draw conclusions about the cause of the fault.
  • the inspection arrangement can also be used for other examinations.
  • the inspection arrangement 1 comprises three stations at which different tasks or preparatory tasks are carried out. These three stations, namely a transfer station 2, a macro inspection station 3 and a micro inspection station 4 are arranged in a common housing 5 which is closed to the outside.
  • the individual wafers W are transported between the individual stations 2, 3 and 4 by means of a transfer device 6.
  • the transfer device 6 comprises a star-shaped holder which rotates about a central axis Z and is stopped at the individual stations.
  • a wafer W is loaded into the inspection arrangement 1 by means of an indicated transfer device 7 and is transferred to the remote device 6 filed. From there, the wafer W reaches the macro-inspection station 3 with a rotation of the transfer device 6 by 120 °. In this, an inspection is carried out by a control person P standing or sitting next to the inspection arrangement 1 , whereas the unstructured back of the wafer W rests on the transfer device 6. After observing the front side, the wafer W is turned over so that the control person P can also inspect its rear side. For this purpose, a holding device 8 is provided in the macro inspection station 3, which first detects the wafer W, lifts it up from the transfer device 6 and then turns it over. After an inspection of the back of the wafer, the wafer W is first turned back and then placed back with the back on the transfer device 6.
  • the wafer W By switching the transfer device 6 through another 120 °, the wafer W reaches the micro-inspection station 4.
  • the wafer W can be examined section by section with a microscope 9.
  • the microscope 9 comprises a movable table 10, on which the wafer W to be inspected is temporarily placed for inspection. After the inspection, the wafer W is transported further to the transfer station 2, in which the wafer W is removed by means of the transfer device 7.
  • Suitable transfer devices are known to the person skilled in the art and therefore do not require any further explanation. For example, a device as described in US Pat. No. 5,700,046 A can be used here.
  • the holding device 8 according to the invention arranged in the macro inspection station 3 for turning a wafer W will now be explained in more detail below.
  • the holding device 8 which is shown in more detail in FIG. 2, comprises two curved grippers 11 and 12, the shape of which is adapted to the diameter of the wafers W to be gripped and which surround the wafer on its side edge approximately in three-quarters.
  • the two grippers 11 and 12 are mounted on a holding arm 13 and can be moved relative to one another. To open the grippers 11 and 12 are pivoted apart so that the gripper interior Pages can be guided to the height of the wafer edge.
  • the holding device is closed, ie the grippers 11 and 12 are moved towards one another until they come into contact with the wafer edge by means of the intermediate pieces 14 and 15.
  • the intermediate pieces 14 and 15 are designed in such a way that, when a wafer W is gripped, they only abut against the peripheral edges of the wafer periphery, as shown in FIG. This ensures secure gripping on the one hand, and avoids any contact with the structured front side as well as the rear side of the wafer W on the other hand. Furthermore, the contact area between the contract elements 14 and 15 and the wafer W remains small, so that as few particles as possible are released or transferred when the wafer W is gripped and released.
  • a total of four evenly spaced intermediate pieces 14 are fixedly arranged on the grippers 11 and 12, each of which is designed in the manner of a roller. When viewed in a plane perpendicular to the gripping plane, this roller has a wedge-shaped profile that tapers towards the center of the roller. When gripping, the two opposing wedge surfaces 16 and 17 each abut against a peripheral edge of the wafer W and thus also center the wafer W in the gripping plane.
  • the fixed intermediate pieces 14 are each eccentrically mounted on the associated gripper 11 or 12. The position of a gripped wafer W relative to the grippers 11 and 12 can thus be adjusted by rotation. After an adjustment has been made, the intermediate pieces 14 are fixed in the selected angular position.
  • a resilient intermediate piece 15 is also provided, which is shown in detail in FIG. This corresponds essentially in shape to a halved intermediate piece 14, so that the spring-elastic mounted intermediate piece 15 with two wedge surfaces 16 and 17 can bear against the peripheral edges of a wafer W.
  • the intermediate piece 15 is fastened to a leaf spring 18, which in turn is fastened to the inner flank of the gripper 11 facing the side edge of the wafer W.
  • the leaf spring 18 is elastic in the gripping plane steerable, on the other hand rigid in a direction perpendicular to it. This radial springing enables a particularly soft gripping of a wafer W.
  • a sensor 19 is attached to the grippers 11 and 12, with which the presence of a wafer W between the grippers 11 and 12 can be determined.
  • the signal generated by the sensors 19 is evaluated in a control device (not shown in more detail) in order to enable automated operation of the holding device 8. For example, before turning a wafer, it can be determined whether it has been gripped properly. Furthermore, when the wafer W is placed on the transfer device 6 again, it is possible to determine whether the gripper 11 and 12 has actually been released from the wafer W before the wafer W is removed.
  • the sensors 19 are designed and arranged accordingly. In the exemplary embodiment shown, they are located on the inner flanks of the grippers 11 and 12.
  • FIG. 10 shows a closed position of the grippers 11 and 12. In this closed position, the stop 20 abuts against a stop surface 21 of the holding arm 13.
  • a tension spring is arranged, which is connected to both grippers 11 and 12 in order to pull them into the closed position. This ensures that a wafer W always remains securely held between the grippers 11 and 12.
  • the opening and closing takes place by means of a drive device which is coupled to the grippers 11 and 12.
  • a further drive device is provided for turning the wafer W, which enables the wafer to be rotated about an axis A by 180 °. After a rotation about this turning axis A, the wafer W is essentially in the starting position, but the front and the back are reversed. As FIG. 2 shows, the turning axis W runs through the holding arm 13 parallel to or through the gripping plane and preferably also through the central axis M of the wafer W.
  • the holding arm 13 is in turn pivotally mounted on a bracket 23.
  • the pivot axis B extends transversely to the turning axis A.
  • the pivot axis B runs horizontally and outside a wafer W that is gripped between the grippers 11 and 12.
  • the console 23 is in turn supported on a base part 24 and is guided linearly in relation to the latter in the direction of displacement C.
  • the linear guide 25 enables the bracket 23 to move up and down and thus simultaneously the holding arm 13 and the grippers 11 and 12.
  • Each of the individual movements ie the opening and closing of the grippers 11 and 12, the turning of the holding arm 13 with the grippers 11 and 12 about the turning axis A, the pivoting of the holding arm 13 about the pivot axis B and the up and down movement of the console 23 along the direction of displacement C takes place via a separately controllable drive device.
  • Actuators or stepper motors can be provided so that the individual movements can take place completely independently of one another.
  • the individual drive devices are designated in FIGS. 2 to 5 with the reference symbols 26 to 29. The mode of operation of the holding device 8 will now be explained in more detail below with reference to FIGS. 3 to 5.
  • FIG. 3 shows a starting position in which a wafer W is conveyed into the macro inspection station 3 in a transfer plane T by means of the transfer device 6.
  • the grippers 11 and 12 are located one position below the transfer plane T.
  • the gripping plane of the grippers 11 and 12 is aligned approximately parallel to the transfer plane T.
  • the drive device 26 for moving the console 23 along the displacement direction C is first actuated. This is designed here as a linear motor 26.
  • the grippers 11 and 12 are opened by actuating the associated drive device 27, so that the intermediate pieces 14 and 15 do not collide with the wafer W when moving upwards.
  • the upward movement along the direction of displacement C is stopped when the gripping plane coincides with the transfer plane T.
  • the grippers 11 and 12 are moved into the closed position, whereupon the intermediate pieces 14 and 15 are brought into abutment against the wafer W and thereby grip the side edge thereof.
  • This state is shown in Fig.4.
  • the drive device 26 is actuated again in order to lift the wafer W from the transfer device 6 and to move it upward.
  • the holding arm 13 is pivoted relative to the bracket 23 about the axis B, as is indicated in FIG.
  • the wafer W is moved upwards and pivoted about the axis B until the grippers 11 and 12 can be rotated with the wafer W freely around the turning axis A without colliding with the transfer device 6.
  • the rear of the wafer W can be assessed by appropriately aligning the holding device 8 in this pivoted position from an observer position next to the inspection arrangement.
  • the drive device 29 is actuated to rotate about the axis A.
  • a wobble movement can be carried out with the wafer W in the position shown in FIG Dust particles improved. This wobble can be done for viewing the structured front as well as for viewing the back.
  • the holding device 8 is moved into the position shown in FIG.
  • the wafer is released by opening the grippers 11 and 12. This is also recognized by means of the sensors 19.
  • the grippers 11 and 12 are withdrawn from the transfer plane T and are closed to relieve the associated drive device 27.
  • the holding device explained enables a quick and efficient macroscopic inspection of the front and back of a wafer in one operation.
  • the scope of the inspection of an inspection arrangement is increased by the arrangement in the macro inspection station.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

L'invention concerne un dispositif de maintien pour des plaquettes de semi-conducteur dans un ensemble d'inspection de plaquettes. Le dispositif de maintien selon l'invention comprend deux pinces (11, 12) dont chacune entoure un segment partiel de la circonférence de la plaquette à l'état fermé du dispositif de maintien (8) et qui sont raccordées à un dispositif d'entraînement (27) qui, lorsqu'il est commandé, éloigne les pinces (11, 12) l'une de l'autre pour ouvrir le dispositif de maintien (8) et les rapproche l'une de l'autre pour fermer le dispositif de maintien (8). Le dispositif de maintien selon l'invention comprend également un bras de maintien (13) sur lequel les deux pinces (11, 12) sont logées pivotantes et qui pivote autour d'un axe (A) situé pratiquement dans le plan formé par la plaquette (W), de sorte qu'une plaquette de semi-conducteur (W) maintenue entre les pinces est retournée lors d'une rotation de 180 DEG autour de l'axe (A).
EP02740254A 2001-04-28 2002-04-12 Dispositif de maintien pour des plaquettes de semi-conducteur Withdrawn EP1402565A2 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10121115 2001-04-28
DE10121115A DE10121115A1 (de) 2001-04-28 2001-04-28 Haltevorrichtung für Wafer
PCT/DE2002/001370 WO2002089183A2 (fr) 2001-04-28 2002-04-12 Dispositif de maintien pour des plaquettes de semi-conducteur

Publications (1)

Publication Number Publication Date
EP1402565A2 true EP1402565A2 (fr) 2004-03-31

Family

ID=7683240

Family Applications (1)

Application Number Title Priority Date Filing Date
EP02740254A Withdrawn EP1402565A2 (fr) 2001-04-28 2002-04-12 Dispositif de maintien pour des plaquettes de semi-conducteur

Country Status (7)

Country Link
US (1) US6918735B2 (fr)
EP (1) EP1402565A2 (fr)
JP (1) JP2004524709A (fr)
KR (1) KR20030095952A (fr)
DE (1) DE10121115A1 (fr)
TW (1) TW550684B (fr)
WO (1) WO2002089183A2 (fr)

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JP2004524709A (ja) 2004-08-12
KR20030095952A (ko) 2003-12-24
WO2002089183A3 (fr) 2004-01-29
WO2002089183A2 (fr) 2002-11-07
TW550684B (en) 2003-09-01
DE10121115A1 (de) 2002-10-31
US6918735B2 (en) 2005-07-19

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