DE3685835T2 - Greiferwerkzeug. - Google Patents

Greiferwerkzeug.

Info

Publication number
DE3685835T2
DE3685835T2 DE8686105342T DE3685835T DE3685835T2 DE 3685835 T2 DE3685835 T2 DE 3685835T2 DE 8686105342 T DE8686105342 T DE 8686105342T DE 3685835 T DE3685835 T DE 3685835T DE 3685835 T2 DE3685835 T2 DE 3685835T2
Authority
DE
Germany
Prior art keywords
gripper tool
gripper
tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8686105342T
Other languages
English (en)
Other versions
DE3685835D1 (de
Inventor
Yuji Hosoda
Kazuo Honma
Masakatsu Fujie
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP8011085A external-priority patent/JPS61239636A/ja
Priority claimed from JP8011185A external-priority patent/JPS61239637A/ja
Priority claimed from JP8230985A external-priority patent/JPS61241940A/ja
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of DE3685835D1 publication Critical patent/DE3685835D1/de
Publication of DE3685835T2 publication Critical patent/DE3685835T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/02—Gripping heads and other end effectors servo-actuated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
    • B25J9/1085—Programme-controlled manipulators characterised by positioning means for manipulator elements positioning by means of shape-memory materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
    • B25J9/14—Programme-controlled manipulators characterised by positioning means for manipulator elements fluid
    • B25J9/142—Programme-controlled manipulators characterised by positioning means for manipulator elements fluid comprising inflatable bodies
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
DE8686105342T 1985-04-17 1986-04-17 Greiferwerkzeug. Expired - Fee Related DE3685835T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP8011085A JPS61239636A (ja) 1985-04-17 1985-04-17 把持装置
JP8011185A JPS61239637A (ja) 1985-04-17 1985-04-17 把持装置
JP8230985A JPS61241940A (ja) 1985-04-19 1985-04-19 把持装置

Publications (2)

Publication Number Publication Date
DE3685835D1 DE3685835D1 (de) 1992-08-06
DE3685835T2 true DE3685835T2 (de) 1993-02-18

Family

ID=27303216

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686105342T Expired - Fee Related DE3685835T2 (de) 1985-04-17 1986-04-17 Greiferwerkzeug.

Country Status (3)

Country Link
US (1) US4715637A (de)
EP (1) EP0198501B1 (de)
DE (1) DE3685835T2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109318223A (zh) * 2018-11-19 2019-02-12 哈尔滨工业大学 一种形状记忆聚合物抓取机构

Families Citing this family (71)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4900078A (en) * 1986-12-23 1990-02-13 The Boeing Company Gripping device utilizing a shape memory alloy
DE3707672A1 (de) * 1987-03-10 1988-09-22 Sitesa Sa Epitaxieanlage
US4744709A (en) * 1987-03-30 1988-05-17 Varian Associates, Inc. Low deflection force sensitive pick
US4817556A (en) * 1987-05-04 1989-04-04 Varian Associates, Inc. Apparatus for retaining wafers
DE3741614A1 (de) * 1987-12-09 1989-06-29 Wolters Peter Fa Vorrichtung zum halten eines teiles
ATE208961T1 (de) * 1988-05-24 2001-11-15 Unaxis Balzers Ag Vakuumanlage
JP2617530B2 (ja) * 1988-09-02 1997-06-04 学校法人早稲田大学 球根りん片植付ハンド
US4913481A (en) * 1988-09-13 1990-04-03 Applied Power Inc. Clean room gripper
DE3919611A1 (de) * 1989-06-15 1990-12-20 Wacker Chemitronic Haltevorrichtung zur aufnahme von scheibenfoermigen gegenstaenden, insbesondere halbleiterscheiben, und verfahren zu deren behandlung
EP0452041B1 (de) * 1990-04-06 1996-11-27 Canon Kabushiki Kaisha Transportvorrichtung für Substrate und Verfahren zur Kontrolle
US5222310A (en) * 1990-05-18 1993-06-29 Semitool, Inc. Single wafer processor with a frame
US5092901A (en) * 1990-06-06 1992-03-03 The Royal Institution For The Advancement Of Learning (Mcgill University) Shape memory alloy fibers having rapid twitch response
FR2665148A1 (fr) * 1990-07-25 1992-01-31 Technicatome Pince comprenant deux machoires mobiles sur un support et une piece de commande.
US5656088A (en) * 1991-08-28 1997-08-12 Dainippon Screen Mfg. Co., Ltd. Apparatus for dipping substrates in processing fluid
US5749469A (en) * 1992-05-15 1998-05-12 Fluoroware, Inc. Wafer carrier
US5389072A (en) * 1992-06-05 1995-02-14 Mircor Biomedical, Inc. Mechanism for manipulating a tool and flexible elongate device using the same
US5643366A (en) * 1994-01-31 1997-07-01 Applied Materials, Inc. Wafer handling within a vacuum chamber using vacuum
EP0696497B1 (de) * 1994-08-12 1998-11-18 Nikon Corporation Mikro-Greifer
KR0152324B1 (ko) * 1994-12-06 1998-12-01 양승택 웨이퍼 측면파지 이송 반도체 제조장치
US5647723A (en) * 1995-11-13 1997-07-15 Rush; Joe A. Memory wire robotic hand
NL1002848C2 (nl) * 1996-04-12 1997-10-15 Od & Me Bv Grijperinrichting voor het beetpakken van een schijfvormig object.
EP0834380A1 (de) * 1996-10-07 1998-04-08 Jack H. Schron Spannvorrichtung
KR19980032592A (ko) * 1996-10-07 1998-07-25 ２세 잭에이치.스키론 클램핑 장치
US5722709A (en) * 1996-10-30 1998-03-03 Hughes Electronics Separation device using a shape memory alloy retainer
US6126115A (en) * 1997-01-21 2000-10-03 Lockheed Martin Corporation Apparatus for retaining and releasing a payload
US6410886B1 (en) * 1997-07-10 2002-06-25 Nitinol Technologies, Inc. Nitinol heater elements
US6174011B1 (en) * 1999-04-14 2001-01-16 Arthur Keigler Method of and apparatus for handling thin and flat workpieces and the like
US6474712B1 (en) 1999-05-15 2002-11-05 Applied Materials, Inc. Gripper for supporting substrate in a vertical orientation
US6467827B1 (en) 1999-10-30 2002-10-22 Frank J. Ardezzone IC wafer handling apparatus incorporating edge-gripping and pressure or vacuum driven end-effectors
US6578893B2 (en) * 2000-10-02 2003-06-17 Ajs Automation, Inc. Apparatus and methods for handling semiconductor wafers
CA2423552A1 (en) * 2000-10-13 2002-04-18 Irm Llc High throughput processing system and method of using
US6592324B2 (en) * 2001-02-26 2003-07-15 Irm, Llc Gripper mechanism
DE10121115A1 (de) * 2001-04-28 2002-10-31 Leica Microsystems Haltevorrichtung für Wafer
US7140655B2 (en) * 2001-09-04 2006-11-28 Multimetrixs Llc Precision soft-touch gripping mechanism for flat objects
JP2004345043A (ja) * 2003-05-23 2004-12-09 Canon Inc 物体の把持機構
US7300082B2 (en) * 2003-07-21 2007-11-27 Asyst Technologies, Inc. Active edge gripping and effector
US7993093B2 (en) * 2004-09-15 2011-08-09 Applied Materials, Inc. Systems and methods for wafer translation
US7798764B2 (en) 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
US7255747B2 (en) 2004-12-22 2007-08-14 Sokudo Co., Ltd. Coat/develop module with independent stations
US7819079B2 (en) 2004-12-22 2010-10-26 Applied Materials, Inc. Cartesian cluster tool configuration for lithography type processes
US7651306B2 (en) 2004-12-22 2010-01-26 Applied Materials, Inc. Cartesian robot cluster tool architecture
US7374391B2 (en) * 2005-12-22 2008-05-20 Applied Materials, Inc. Substrate gripper for a substrate handling robot
WO2007047163A2 (en) * 2005-10-04 2007-04-26 Applied Materials, Inc. Methods and apparatus for drying a substrate
TWI321350B (en) * 2006-04-18 2010-03-01 Advanced Semiconductor Eng Heatsink and heatsink positioning system
US7631914B2 (en) * 2006-07-10 2009-12-15 Goss International Americas, Inc. Adjustable gripper pad with eccentric bore
US20080166210A1 (en) * 2007-01-05 2008-07-10 Applied Materials, Inc. Supinating cartesian robot blade
JP4746003B2 (ja) * 2007-05-07 2011-08-10 リンテック株式会社 移載装置及び移載方法
US8382180B2 (en) * 2007-10-31 2013-02-26 Applied Material, Inc. Advanced FI blade for high temperature extraction
FR2932272B1 (fr) * 2008-06-09 2011-02-25 Stago Diagnostica Dispositif de prehension d'une cuvette de reaction
DE112009004261B4 (de) * 2009-01-31 2017-07-06 Abb Ag Greiferfinger, Greiferwerkzeug und Verfahren zum Justieren eines Greiferwerkzeugs
JP5705469B2 (ja) * 2009-07-22 2015-04-22 株式会社Sumco 石英ガラスルツボのハンドリング装置及びハンドリング方法
US8747045B2 (en) * 2009-11-03 2014-06-10 National Oilwell Varco, L.P. Pipe stabilizer for pipe section guide system
EP2605891B1 (de) * 2010-08-19 2014-10-01 Abb Ag Greifmechanismus segment und greifmechanismus
US9401296B2 (en) * 2011-11-29 2016-07-26 Persimmon Technologies Corporation Vacuum robot adapted to grip and transport a substrate and method thereof with passive bias
KR102169595B1 (ko) * 2013-07-29 2020-10-26 삼성디스플레이 주식회사 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
DE202014105994U1 (de) * 2014-12-11 2016-03-14 Ipek International Gmbh Hebeeinrichtung, insbesondere für ein Inspektionssystem
US10661447B2 (en) * 2016-01-20 2020-05-26 Soft Robotics, Inc. End of arm tools for soft robotic systems
CN108778640B (zh) 2016-01-20 2019-10-22 软机器人公司 用于杂乱抓持环境、高加速度移动、食品操作以及自动化仓储系统的软机器人抓持器
US10569422B2 (en) * 2016-01-20 2020-02-25 Soft Robotics, Inc. End of arm tools for soft robotic systems
US10478974B2 (en) * 2016-01-20 2019-11-19 Soft Robtics, Inc. End of arm tools for soft robotic systems
EP3694689B1 (de) 2017-10-13 2024-04-17 Soft Robotics, Inc. End-of-arm-werkzeuge für weiche robotersysteme
WO2019094964A1 (en) * 2017-11-10 2019-05-16 Soft Robotics, Inc. Fasteners with reduced bacterial harborage points, sealing capabilities, and component protection features
CN108584413B (zh) * 2018-04-13 2019-11-26 宁波高新区神台德机械设备有限公司 一种工业搬运机器人
EP3657537A1 (de) * 2018-11-23 2020-05-27 ATOTECH Deutschland GmbH Endeffektor für plattenförmige substrate
CN110203683B (zh) * 2019-05-24 2021-11-09 上海提牛机电设备有限公司 一种方形件的夹持装置及搬运系统
CN111168707B (zh) * 2020-02-18 2021-08-03 江南大学 可快速脱附式软体机器人手爪结构
CN112655565B (zh) * 2020-11-18 2022-11-25 温州医科大学 ivc系统自动化抽气架体
CN113459134B (zh) * 2021-07-05 2022-05-13 吉林大学 一种电阻自感知力和位移的sma丝驱动夹持器
CN113233183B (zh) * 2021-07-12 2021-11-05 常州市昌隆电机股份有限公司 一种电机轴用下料装置及生产工艺
WO2023060504A1 (zh) * 2021-10-14 2023-04-20 阳普医疗科技股份有限公司 一种夹爪
CN116425013B (zh) * 2023-06-12 2023-08-15 定襄县宇特法兰有限公司 一种圆盘式法兰卡扣吊具

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR553283A (fr) * 1921-06-27 1923-05-19 Perfectionnements apportés aux appareils de manutention, notamment à ceux à utiliser pour manutentionner des objets fragiles et de petites dimensions
GB862174A (en) * 1957-06-24 1961-03-01 Rolls Royce Improved device for remote control, movement, or handling of an object
US3403238A (en) * 1966-04-05 1968-09-24 Navy Usa Conversion of heat energy to mechanical energy
FR2104696B1 (de) * 1970-07-31 1973-12-07 Electricite De France
SU662344A1 (ru) * 1977-01-25 1979-05-15 Севастопольский Приборостроительный Институт Схват промышленного робота
SU727426A1 (ru) * 1978-10-30 1980-04-15 Предприятие П/Я В-8495 Захват
SU889591A2 (ru) * 1980-02-13 1981-12-15 Центральное Конструкторско-Технологическое Бюро Госкомсельхозтехники Усср Захват-кантователь
JPS58155736A (ja) * 1982-03-11 1983-09-16 Nec Corp 半導体基板用ハンドリング装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109318223A (zh) * 2018-11-19 2019-02-12 哈尔滨工业大学 一种形状记忆聚合物抓取机构
CN109318223B (zh) * 2018-11-19 2021-05-25 哈尔滨工业大学 一种形状记忆聚合物抓取机构

Also Published As

Publication number Publication date
EP0198501A3 (en) 1989-06-14
DE3685835D1 (de) 1992-08-06
US4715637A (en) 1987-12-29
EP0198501B1 (de) 1992-07-01
EP0198501A2 (de) 1986-10-22

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee