EP1401251B1 - LGA-Contact à douille - Google Patents

LGA-Contact à douille Download PDF

Info

Publication number
EP1401251B1
EP1401251B1 EP03255558A EP03255558A EP1401251B1 EP 1401251 B1 EP1401251 B1 EP 1401251B1 EP 03255558 A EP03255558 A EP 03255558A EP 03255558 A EP03255558 A EP 03255558A EP 1401251 B1 EP1401251 B1 EP 1401251B1
Authority
EP
European Patent Office
Prior art keywords
contact
plate part
elastic
bent
base plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
EP03255558A
Other languages
German (de)
English (en)
Other versions
EP1401251A1 (fr
Inventor
Hiroshi Shirai
Hidenori Taguchi
Shinichi Hashimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tyco Electronics Japan GK
Original Assignee
Tyco Electronics AMP KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tyco Electronics AMP KK filed Critical Tyco Electronics AMP KK
Publication of EP1401251A1 publication Critical patent/EP1401251A1/fr
Application granted granted Critical
Publication of EP1401251B1 publication Critical patent/EP1401251B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2442—Contacts for co-operating by abutting resilient; resiliently-mounted with a single cantilevered beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H05K7/1069—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals

Definitions

  • the present invention relates to an LGA (land grid array) socket contact which is used in an LGA socket.
  • LGA sockets are used to connect circuit boards with IC sockets that have a plurality of contact pads on the bottom surface.
  • IC sockets that have a plurality of contact pads on the bottom surface.
  • the contact shown in Figs. 7 and 8 has been known as a contact used in such LGA sockets (see U.S. Patent No. 5984693).
  • this contact 100 has a substantially rectangular base plate part 101, and is formed by stamping and forming a metal plate. Furthermore, guide projections 102 that protrude upward are formed on both ends of the upper edge 103 of the base plate part 101, and engaging pins 104 that protrude downward are formed on both ends of the lower edge of the base plate part 101. Moreover, two anchoring projections 105 are formed in positions that are separated by a specified distance in the vertical direction on each of the two side walls of the base plate part 101. Furthermore, an elastic C-shaped engaging part 106 which extends from between the engaging pins 104 and is bent so that this part is folded back in the upward direction is formed on the lower edge of the base plate part 101.
  • a contact plate part 107 which is bent so that this part extends upward from the tip end of the elastic C-shaped engaging part 106 is formed on the tip end of this engaging part 106.
  • the contact plate part 107 is separated by a specified distance from an inclined surface 103a formed between the guide projections 102 on the upper edge 103 of the base plate part 101, and the contact plate part 107 is caused to contact the inclined surface 103a by the application of an external force to the contact plate part 107 in the downward direction.
  • the contact 100 shown in Fig. 7 is accommodated inside the contact accommodating space 111 of a housing 110 as shown in Fig. 8. As a result, the LGA socket 120 is completed.
  • the anchoring projections 105 of the contact 100 are anchored to the housing walls, and the contact plate part 107 protrudes upward beyond the upper surface of the housing 110, while the engaging pins 104 protrude downward beyond the undersurface of the housing 110.
  • the LGA socket 120 is clamped between an IC package 130 and a circuit board 140.
  • the engaging pins 104 contact contact pad 141 formed on the surface of the circuit board 140, and a contact pad 131 formed on the IC package 130 pushes the contact plate part 107 downward so that the contact plate part 107 contacts the inclined surface 103a.
  • an electrical short-circuiting path is formed between the contact plate part 107 and the engaging pins 104, so that the contact pad 131 of the IC package 130 and the contact pad 141 of the circuit board 140 are electrically connected to each other.
  • the contact pad 131 formed on the IC package 130 contacts the contact plate part 107, the contact pad 131 contacts the cut surface of the contact plate part 107 that is formed when the contact 100 is stamped; accordingly, the stability of this contact is poor.
  • the contact shown in Fig. 9 has been developed as an LGA socket contact which solves these problems.
  • This contact 200 has a substantially rectangular base plate part 201, and is formed by stamping and forming a metal plate. Furthermore, two anchoring projections 202 are formed so that these projections are separated by a specified distance in the vertical direction on each of the two side walls of the base plate part 201. Moreover, a cut-out 203 is formed between the anchoring projections 202 of one side wall of the base plate part 201, and an elastic contact part 205 is formed via an L-shaped base part 204 which is bent approximately 90° from this cut-out 203.
  • This elastic contact part 205 comprises a first elastic plate part 206 which extends upward from the tip end of the L-shaped base part 204, and a second elastic plate part 207 which extends upward at an inclination toward the opposite anchoring projection 202 from the upper end of the first elastic plate part 206.
  • the direction of extension of the plate surface of the first elastic plate part 206 is perpendicular to the direction of extension of the plate surface of the base plate part 201, and the direction of extension of the plate surface of the second elastic plate part 207 is also perpendicular to the direction of extension of the plate surface of the base plate part 201.
  • a contact part 208 which contacts a contact pad formed on the IC package (not shown in the figures) with a rolled surface is formed on the tip end of the second elastic plate part 207. Since the contact part 208 contacts the contact pad of the IC package with a rolled surface, the contact stability is good. Furthermore, a solder ball attachment paddle 209 which extends in a direction perpendicular to the base plate part 201 via a connecting part 210 is disposed on the lower edge of the base plate part 201. A solder ball (not shown in the figures) is disposed on the undersurface of the solder ball attachment paddle 209, and the solder ball attachment paddle 209 is connected by soldering to a contact pad on a circuit board (not shown in the figures).
  • the first elastic plate part 206 of the elastic contact part 205 extends from the tip end of an L-shaped base part 204 which is bent approximately 90° from the base plate part 201, and the direction of extension of the plate surface of the first elastic plate part 206 is perpendicular to the direction of extension of the plate surface of the base plate part 201. Accordingly, the height H from the back surface of the base plate part 201 to the edge of the first elastic plate part 206, i.e., the height of the elastic contact part 205 in the direction perpendicular to the base plate part 201 in the vicinity of the root of the elastic contact part 205, is increased. As a result, in cases where the contact 200 is arranged in the direction perpendicular to the base plate part 201, the reduction of the arrangement pitch is severely restricted.
  • the width of the first elastic plate part 206 might be minimized in order to reduce the arrangement pitch in the direction perpendicular to the base plate part 201. If this is done, however, the amount of displacement of the elastic contact part 205 cannot be set at a large amount. The reason for this is that if the width of the first elastic plate part 206 is reduced, the first elastic plate part 206 will undergo plastic deformation in cases where even a small external force is applied to the contact part 208 in the downward direction.
  • the width of the first elastic plate part 206 is reduced, the cross-sectional area of the first elastic plate part 206 is reduced, so that the connection resistance is increased.
  • a further prior art land grid array socket contact (on which the preamble of claim 1 is based) is disclosed in US Patent No 5688140.
  • the contact comprises a base plate part with anchoring projections formed on side walls thereof, an elastic contact part which has a contact part on its tip end with a curved surface and a board connecting part which extends from a lower end of the base plate part.
  • the present invention was devised in light of the problems described above. It is an object of the present invention to provide an LGA socket contact which makes it possible to minimize the size of the elastic contact part in the direction perpendicular to the base plate part in the vicinity of the root of this elastic contact part, so that the arrangement pitch in this direction can be reduced, and which allows a large amount of displacement of the elastic contact part so that the connection resistance can be minimized.
  • the LGA socket contact of Claim 1 comprises a base plate part in which anchoring projections are formed on side walls thereof, an elastic contact part which has a contact part on its tip end for contacting a contact pad of integrated circuit (IC) package with a curved surface, and a board connecting part which extends from the lower end of the base plate part, and which is connected by soldering to a circuit board, characterised in that the elastic contact part extends via a bent part that is bent by approximately 180° from a side wall of the base plate part.
  • IC integrated circuit
  • the LGA socket contact of claim 2 comprises the contact of Claim 1, wherein a taper part i.s disposed on an upper surface of the bent part, and the taper part drops continuously towards a root part of the part that is bent by approximately 180°.
  • Fig. 1 is a perspective view of a first embodiment of the LGA socket contact of the present invention.
  • Fig. 2 is a plan view showing a state in which the LGA socket contact shown in Fig.1 is accommodated in a contact accommodating space.
  • the LGA socket contact (hereafter referred to simply as a "contact") 1 of the first embodiment has a substantially rectangular base plate part 2, and is formed by stamping and forming a metal plate. Furthermore, a plurality of anchoring projections 3 (in the present embodiment, two on the upper part and one on the lower part) are formed on each of the two side walls of the base plate part 2 in positions that are separated by a specified gap in the vertical direction. Moreover, a cut-out 4 is formed in one side wall of the base plate part 2 between the anchoring projections 3 of the upper part and the anchoring projection 3 of the lower part. Furthermore, an elastic contact part 6 extends via a bent part 5 which is bent approximately 180° from this cut-out 4.
  • This elastic contact part 6 has a first elastic plate part 7 which is bent upward from the tip of the bent part 5, and which extends upward, and a second elastic plate part 8 which is bent from the upper end of the first elastic plate part 7 in the direction that separates this second elastic plate part 8 from the base plate part 2, and which extends upward at an inclination.
  • the direction of extension of the plate surface of the first elastic plate part 7 and the direction of extension of the plate surface of the base plate part 2 are parallel.
  • a contact part 9 which contacts a contact pad formed on an IC package (not shown in the figures) with a rolled surface is formed on the tip end of the second elastic plate part 8. Since the contact part 9 contacts the contact pad of the IC package with a rolled surface, the contact stability is good.
  • solder ball attachment paddle (board connecting part) 10 which extends via a connecting part 11 in a direction perpendicular to the base plate part 2 is disposed on the lower edge of the base plate part 2.
  • a solder ball (not shown in the figures) is disposed on the undersurface of the solder ball attachment paddle 10, and the solder ball attachment paddle 10 is connected by soldering to a contact pad on a circuit board (not shown in the figures).
  • the height H of the bent part 5 and first elastic plate part 7 in the direction perpendicular to the base plate part 2 is substantially the same as twice the thickness of the metal plate that forms the contact 1, since the bent part 5 is bent approximately 180°. Accordingly, this height H is far smaller than the height H of the L-shaped base part 204 and first elastic plate part 206 of the contact 200 shown in Fig. 10. Consequently, the size of the contact 1 in the direction perpendicular to the base plate part 2 can be minimized, so that the arrangement pitch in this direction can be reduced.
  • the width W of the first elastic plate part 7 can be maximized.
  • the width W of the first elastic plate part 7 is substantially the same as the width of the bent part 5.
  • the contact 1 shown in Fig. 1 is accommodated inside the contact accommodating spaces 20 of a housing (not shown in the figures) as shown in Fig. 2.
  • the contact accommodating spaces 20 are disposed in the housing in a plurality of rows so as to correspond to the contact pads of an IC package, and a plurality of contacts 1 are accommodated inside the contact accommodating spaces 20.
  • the LGA socket is completed.
  • the anchoring projections 3 of the contacts 1 are anchored to the housing walls; furthermore, the second contact plate parts 8 of the respective contacts protrude upward beyond the upper surface of the housing, and the solder ball attachment paddles 10 on which solder balls are disposed protrude downward beyond the undersurface of the housing.
  • the anchoring projections 3 are formed on the upper and lower parts of the side walls of each base plate part 2, and the elastic contact part 6 of each contact 1 extends from between these anchoring projections 3; accordingly, the span between the anchoring projections 3 is long, and when the anchoring projections 3 are anchored to the housing walls, the contact part 9 formed on the tip end of each elastic contact part 6 can be positioned with good precision.
  • this LGA socket is mounted on a circuit board by connecting (by soldering) the solder balls disposed on the solder ball attachment paddles 10 to contact pads on the circuit board.
  • the contact pads disposed on the IC package contact the contact parts 9 of the respective contacts 1, and push these contact parts 9 downward, so that the second elastic plate part 8 and first elastic plate part 7 of each contact 1 undergo elastic deformation.
  • the contact pads of the IC package and the contact pads of the circuit board are electrically connected to each other.
  • the width W of the first elastic plate parts 7 can be maximized as described above, there is no plastic deformation of the first elastic plate parts 7 even in cases where a large external force acts on the contact parts 9 in a downward direction. Accordingly, the amount of displacement of the elastic contact parts 6 can be increased to a large value.
  • the width W of the first elastic plate parts 7 can be increased to a large value, the cross-sectional area of the first elastic plate parts 7 can be increased, so that the contact resistance can be reduced
  • the contacts 1 shown in Fig. 1 are accommodated inside a plurality of rows of contact accommodating spaces 20 in the housing as shown in Fig. 2.
  • the elastic contact parts 6 of the contacts 1 accommodated in one row are not located in positions that overlap with the contact carriers C of the contacts 1 accommodated in an adjacent row
  • this accommodation is accomplished as follows : specifically, the contact carriers C of the respective contacts 1 are cut after both the plurality of contacts 1 of one row and the plurality of contacts 1 of the adjacent row have been inserted into the contact accommodating spaces 20. Accordingly, the following merit is obtained: namely, the accommodation of the contacts 1 shown in Fig. 1 in the contact accommodating spaces 20 can be accomplished easily
  • Fig. 3 shows a second embodiment of the LGA socket contact of the present invention
  • Fig. 3 (A) is a perspective view seen at an inclination from above on the side of the front surface
  • Fig. 3 (B) is a perspective view seen at an inclination from above on the side of the back surface.
  • the contact 71 of the second embodiment has the same basic structure as the contact 1 shown in Fig. 1; however, this contact 71 differs from the contact 1 in that a taper part 75a which drops continuously toward the root portion 75d from the portion 75c that is bent approximately 180° is formed on the upper surface of the bent part 75 on the side of the base plate part 72, and in that a taper part 75b which rises continuously toward the side wall of the first elastic plate part 77 from the portion 75c that is bent approximately 180° is formed on the upper surface of the bent part 75 on the side of the elastic contact part 76.
  • the contact 71 has a substantially rectangular base plate part 72, and is formed by stamping and forming a metal plate. Furthermore, a plurality of anchoring projections 73 are formed on each of the two side walls of the base plate part 72 in positions that are separated by a specified gap in the vertical direction. Moreover, a cut-out 74 is formed in one of the side walls of the base plate part 72 between the upper and lower anchoring projections 73. Furthermore, the elastic contact part 76 extends from this cut-out 74 via the bent part 75 that is bent approximately 180°.
  • This elastic contact part 76 has a first elastic plate part 77 which is bent upward from the tip end of the bent part 75, and which extends upward, and a second elastic plate part 78 which is bent from the upper end of the first elastic plate part 77 in the direction that separates this elastic plate part 78 from the base plate part 72, and which extends upward at an inclination.
  • the direction of extension of the plate surface of the first elastic plate part 77 and the direction of extension of the plate surface of the base plate part 72 are parallel.
  • a taper part 75a which drops continuously toward the root portion 75d from the portion 75c that is bent approximately 180° is formed on the upper surface of the bent part 75 on the side of the base plate part 72
  • a taper part 75b which rises continuously toward the side wall of the first elastic plate part 77 of the elastic contact part 76 from the portion 75c that is bent approximately 180° is formed on the upper surface of the bent part 75 on the side of the elastic contact part 76.
  • the width (in the vertical direction) of the bent part 75 own the side of the elastic contact part 76 increases continuously toward the first elastic plate part 77 from the portion 75c that is bent approximately 180°.
  • a contact part 79 which contacts a contact pad formed on an IC package (not shown in the figures) with a rolled surface is formed on the tip end of the second elastic plate part 78. Since the contact part 79 contacts the contact pad of the IC package with a rolled surface, the contact stability is good.
  • a solder ball attachment paddle (board connecting part) 80 which extends via a connecting part 81 in a direction perpendicular to the base plate part 72 is disposed on the lower edge of the base plate part 72.
  • a solder ball (not shown in the figures) is disposed on the undersurface of the solder ball attachment paddle 80, and the solder ball attachment paddle 80 is connected by soldering to a contact pad on a circuit board (not shown in the figures).
  • the height H of the bent part 75 and first elastic plate part 77 in the direction perpendicular to the base plate part 72 is substantially the same as twice the thickness of the metal plate that forms the contact 71, since the bent part 75 is bent approximately 180° in the same manner as in the contact 1 shown in Fig. Accordingly, this height H is far smaller than the height H of the L-shaped base part 204 and first elastic plate part 206 of the contact 200 shown in Fig. 9. Consequently, the size of the contact 71 in the direction perpendicular to the base plate part 72 can be minimized, so that the arrangement pitch in this direction can be reduced.
  • the height H of the bent part 75 and first elastic plate part 77 in the direction perpendicular to the base plate part 72 can be reduced, the width W of the first elastic plate part 77 can be maximized. Accordingly, the cross-sectional area of the first elastic plate part 77 can be increased, so that the connection resistance can be reduced.
  • the width (in the vertical direction) of the bent part 75 on the side of the base plate part 72 decreases continuously from Wa to Wb toward the root portion 75d from the portion 75c that is bent approximately 180°, the region in which the elastic contact part 76 can act as a spring is expanded to the root portion 75d of the bent part 75 compared to the contact 1 shown in Fig. 1.
  • the width (in the vertical direction) of the bent part 75 on the side of the elastic contact part 76 increases continuously toward the first elastic plate part 77 from the portion 75c that is bent approximately 180°, the cross-sectional area of the bent part 75 on the side of the elastic contact part 76 can be increased compared to the contact 1 shown in Fig. 1, so that a current path with a relatively large cross-sectional area can be ensured.
  • the elastic contact part 6 extends via a bent part 5 from a cut-out 4 formed between the upper and lower anchoring projections 3.
  • this elastic contact part 6 it would also be possible for this elastic contact part 6 to extend via the bent part 5 from the side wall of the base plate part 2 between the upper and lower anchoring projections 3, without forming a cut-out 4.
  • the elastic contact part 6 extends via such a bent part 5 from the side wall of the base plate part 2 on which anchoring projections 3 are formed, it is not absolutely necessary that this elastic contact part 6 extend from between the upper and lower anchoring projections 3.
  • the LGA socket contact of Claim 1 of the present application comprises a base plate part in which anchoring projections are formed on side walls thereof, an elastic contact part which has a contact part on its tip end for contacting a contact pad of an IC package with a curved surface, and a board connecting part which extends from the lower end of the base plate part, and which is connectable by soldering to a circuit board characterised in that the elastic part extends via a bent part that is bent by approximately 180 from a side wall of the base plate part. Accordingly, the height of the elastic contact part in the direction perpendicular to the base plate part in the vicinity of the root portion of the elastic contact part is substantially the same as twice the thickness of the metal plate that forms the contact.
  • this height can be reduced, so that the height in the direction perpendicular to the base plate part can be minimized, thus making it possible to reduce the arrangement pitch in this direction.
  • the width of the elastic contact part can be maximized, and the amount of displacement of the elastic contact part can be increased.
  • the width of the elastic contact part can be increased, a current path with a relatively large cross-sectional area can be ensured, so that the connection resistance can be reduced.
  • the region in which the elastic contact part can act as a spring can be expanded to the root portion of the bent part while ensuring a current path with a relatively large cross-sectional area.
  • the LGA socket contact of Claim 2 comprises the contact of Claim 1, wherein a taper part is disposed on an upper surface of the bent part and the taper part drops continuously toward a root part of the part that is bent by approximately 180°.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connecting Device With Holders (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Claims (2)

  1. Contact à douille en grille matricielle (LGA) (1) comprenant une partie formant plaque de base (2) dans laquelle des saillies d'ancrage (3) sont formée sur ses parois latérales, une partie de contact élastique (6) qui possède une partie de contact (9) sur son extrémité de pointe pour entrer en contact avec un plot de contact d'un boítier de circuit intégré (CI) présentant une surface incurvée, et une partie de connexion de carte (11) qui s'étend depuis une extrémité inférieure de la partie formant plaque de base (2) et qui peut être reliée par brasage à une carte à circuit, caractérisé en ce que la partie de contact élastique (6) s'étend via une partie recourbée (5) qui est recourbée à approximativement 180° par rapport à une paroi latérale de la partie formant plaque de base (2).
  2. Contact à douille en grille matricielle (LGA) (71) selon la revendication 1, dans lequel une partie d'effilement (75a, 75b) est disposée sur une surface supérieure de la partie recourbée (75) et la partie d'effilement (75a, 75b) descend de façon continue vers une partie d'empattement (75d) de la partie qui est recourbée à approximativement 180°.
EP03255558A 2002-09-12 2003-09-05 LGA-Contact à douille Expired - Fee Related EP1401251B1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2002267103 2002-09-12
JP2002267103 2002-09-12
JP2003193009 2003-07-07
JP2003193009A JP2004158430A (ja) 2002-09-12 2003-07-07 Ｌｇａソケット用コンタクト

Publications (2)

Publication Number Publication Date
EP1401251A1 EP1401251A1 (fr) 2004-03-24
EP1401251B1 true EP1401251B1 (fr) 2005-11-30

Family

ID=31949584

Family Applications (1)

Application Number Title Priority Date Filing Date
EP03255558A Expired - Fee Related EP1401251B1 (fr) 2002-09-12 2003-09-05 LGA-Contact à douille

Country Status (9)

Country Link
US (1) US6976888B2 (fr)
EP (1) EP1401251B1 (fr)
JP (1) JP2004158430A (fr)
KR (1) KR20040024458A (fr)
CN (1) CN100361349C (fr)
DE (1) DE60302515T2 (fr)
MY (1) MY137315A (fr)
SG (1) SG121789A1 (fr)
TW (1) TWM241952U (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10886647B2 (en) 2018-11-27 2021-01-05 International Business Machines Corporation Electronic circuitry socket structure

Families Citing this family (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7244125B2 (en) 2003-12-08 2007-07-17 Neoconix, Inc. Connector for making electrical contact at semiconductor scales
US7114961B2 (en) 2003-04-11 2006-10-03 Neoconix, Inc. Electrical connector on a flexible carrier
US8584353B2 (en) 2003-04-11 2013-11-19 Neoconix, Inc. Method for fabricating a contact grid array
US7758351B2 (en) 2003-04-11 2010-07-20 Neoconix, Inc. Method and system for batch manufacturing of spring elements
JP4243970B2 (ja) * 2003-04-15 2009-03-25 タイコエレクトロニクスアンプ株式会社 ボールグリッドアレー型ｉｃソケット
JP2005108518A (ja) * 2003-09-29 2005-04-21 Tyco Electronics Amp Kk Ｉｃソケット用コンタクト
JP4592292B2 (ja) * 2004-01-16 2010-12-01 株式会社日本マイクロニクス 電気的接続装置
US7196907B2 (en) * 2004-02-09 2007-03-27 Wen-Chun Zheng Elasto-plastic sockets for Land or Ball Grid Array packages and subsystem assembly
WO2005091998A2 (fr) 2004-03-19 2005-10-06 Neoconix, Inc. Systeme d'interconnexion sur support souple
CN100399632C (zh) * 2005-06-29 2008-07-02 富士康(昆山)电脑接插件有限公司 电连接器
US7419383B2 (en) * 2005-09-29 2008-09-02 Intel Corporation Self-balanced dual L-shaped socket
JP4427501B2 (ja) * 2005-10-13 2010-03-10 タイコエレクトロニクスジャパン合同会社 Ｉｃソケット
CN100440628C (zh) * 2005-10-17 2008-12-03 富士康(昆山)电脑接插件有限公司 电连接器
CN100355152C (zh) * 2005-12-08 2007-12-12 番禺得意精密电子工业有限公司 电连接器
TWI321379B (en) * 2006-01-20 2010-03-01 Hon Hai Prec Ind Co Ltd Contact for electrical connector
TWM307876U (en) * 2006-01-20 2007-03-11 Hon Hai Prec Ind Co Ltd Electrical contact
TWI346425B (en) 2006-05-30 2011-08-01 Fujikura Ltd Socket contact terminal and semiconductor apparatus
JP2008021637A (ja) 2006-06-12 2008-01-31 Fujikura Ltd ソケットとその製造方法及び半導体装置
JP4973988B2 (ja) 2006-06-12 2012-07-11 山一電機株式会社 コンタクト及びこれを用いたｉｃソケット
CN200986989Y (zh) * 2006-06-23 2007-12-05 富士康(昆山)电脑接插件有限公司 电连接器端子
JP2008027759A (ja) 2006-07-21 2008-02-07 Fujikura Ltd Ｉｃソケット及びｉｃパッケージ実装装置
KR100941360B1 (ko) * 2006-07-21 2010-02-11 가부시키가이샤후지쿠라 집적 회로 소켓, 집적 회로 소켓 조립체, 및 집적 회로 소켓의 제조 방법
US7402049B2 (en) * 2006-08-24 2008-07-22 Hon Hai Precision Ind. Co., Ltd. Contact for an interposer-type connector array
US20080119086A1 (en) * 2006-11-20 2008-05-22 Chou Hsuan Tsai Terminal structure of electrical connector
CN200972945Y (zh) * 2006-11-21 2007-11-07 富士康(昆山)电脑接插件有限公司 电连接器端子
TWM318819U (en) * 2006-12-28 2007-09-11 Molex Taiwan Ltd Electric connector and terminal thereof
US7520752B2 (en) * 2007-08-31 2009-04-21 Tyco Electronics Corporation Electrical contact for land grid array socket assembly
KR101059970B1 (ko) 2008-03-26 2011-08-26 가부시키가이샤후지쿠라 전자부품 실장용 기판 및 그 제조방법과 전자 회로 부품
US20090253287A1 (en) * 2008-04-03 2009-10-08 Hon Hai Precision Ind. Co., Ltd. Electrical connector with LGA contacts
TWI373166B (en) * 2008-05-12 2012-09-21 Hon Hai Prec Ind Co Ltd Electrical contact
JP4294078B1 (ja) 2008-06-30 2009-07-08 株式会社フジクラ 両面接続型コネクタ
JP4832479B2 (ja) 2008-08-01 2011-12-07 株式会社フジクラ コネクタ及び該コネクタを備えた電子部品
TWM357747U (en) * 2008-09-30 2009-05-21 Hon Hai Prec Ind Co Ltd Electrical connector and contacts thereof
CN201523102U (zh) * 2009-09-17 2010-07-07 富士康(昆山)电脑接插件有限公司 端子及其料带
CN201774029U (zh) * 2010-02-08 2011-03-23 富士康(昆山)电脑接插件有限公司 电连接器
TWM391758U (en) 2010-04-28 2010-11-01 Hon Hai Prec Ind Co Ltd Electrical connector
US8641428B2 (en) 2011-12-02 2014-02-04 Neoconix, Inc. Electrical connector and method of making it
TWI583068B (zh) * 2012-08-02 2017-05-11 鴻海精密工業股份有限公司 電連接器
US9680273B2 (en) 2013-03-15 2017-06-13 Neoconix, Inc Electrical connector with electrical contacts protected by a layer of compressible material and method of making it
CN104064895A (zh) * 2013-03-22 2014-09-24 富士康(昆山)电脑接插件有限公司 端子模组及其制造方法
DE102013110477B4 (de) * 2013-09-23 2021-11-04 Phoenix Contact Gmbh & Co. Kg Durchführungsklemme und elektrische Baueinrichtung
DE102014006033A1 (de) * 2014-02-15 2015-08-20 Johnson Electric Germany GmbH & Co. KG Elektrischer Mikroschalter, umfassend zumindest einen elektrischen Kontakt und Verfahren zum Herstellen eines elektrischen Mikroschalters
EP3051563B1 (fr) * 2015-01-30 2019-12-11 Tyco Electronics Austria GmbH Élément ressort pour un élément de commutation électrique
CN108281820B (zh) * 2018-01-12 2020-04-24 番禺得意精密电子工业有限公司 电连接器
US10116079B1 (en) * 2017-11-21 2018-10-30 Lotes Co., Ltd Electrical connector and terminal thereof
US10498062B2 (en) * 2018-01-05 2019-12-03 Shenzhen Deren Electronic Co., Ltd. Electrical connector
CN108306138A (zh) * 2018-01-09 2018-07-20 番禺得意精密电子工业有限公司 电连接器
CN111262063B (zh) * 2018-11-30 2023-08-15 富顶精密组件（深圳）有限公司 导电端子、导电端子制造方法以及端子料带结构
KR102092006B1 (ko) * 2019-04-23 2020-03-23 박상량 판 스프링 타입의 연결핀
JP7365099B2 (ja) * 2019-07-23 2023-10-19 タイコエレクトロニクスジャパン合同会社 インターポーザ
CN113764947A (zh) * 2020-06-02 2021-12-07 山一电机株式会社 插座、ic封装以及接触片对连接器壳体的安装方法
US20230208058A1 (en) * 2021-12-28 2023-06-29 TE Connectivity Services Gmbh Socket connector

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US111052A (en) * 1871-01-17 Improvement in lightning-rods
US3923365A (en) * 1974-11-05 1975-12-02 Amp Inc Press fitted terminal post
JPS5826152B2 (ja) * 1980-11-14 1983-06-01 日本電信電話株式会社 多極コネクタ
US5425658A (en) * 1993-10-29 1995-06-20 Bundy Corporation Card edge connector with reduced contact pitch
WO1996027925A1 (fr) * 1995-03-07 1996-09-12 The Whitaker Corporation Ensemble moteur electrique et contact afferent
DE29509102U1 (de) * 1995-06-01 1996-07-04 Siemens Ag Kontaktfederleiste zum Aufstecken auf Halteleisten, insbesondere an den Frontplatten der Baugruppen von abgeschirmten Baugruppenträgern
US5688140A (en) * 1995-12-28 1997-11-18 Hon Hai Precision Ind. Co., Ltd. Chip carrier socket
CN2266818Y (zh) * 1996-08-29 1997-11-05 鸿海精密工业股份有限公司 Ic插座中的导电端子
JPH11250966A (ja) * 1997-12-22 1999-09-17 Whitaker Corp:The コネクタ
US6299492B1 (en) * 1998-08-20 2001-10-09 A. W. Industries, Incorporated Electrical connectors
US5984693A (en) * 1998-12-17 1999-11-16 Hon Hai Precision Ind. Co., Ltd. Contact of an LGA socket
JP3286783B2 (ja) * 1999-02-18 2002-05-27 日本航空電子工業株式会社 コンタクト
US6164978A (en) * 1999-10-08 2000-12-26 Hon Hai Precision Ind. Co., Ltd. Land grid array connector
JP2002231401A (ja) * 2001-01-31 2002-08-16 Molex Inc ソケットコネクタ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10886647B2 (en) 2018-11-27 2021-01-05 International Business Machines Corporation Electronic circuitry socket structure

Also Published As

Publication number Publication date
CN1490901A (zh) 2004-04-21
SG121789A1 (en) 2006-05-26
CN100361349C (zh) 2008-01-09
MY137315A (en) 2009-01-30
DE60302515D1 (de) 2006-01-05
JP2004158430A (ja) 2004-06-03
TWM241952U (en) 2004-08-21
US20040058580A1 (en) 2004-03-25
KR20040024458A (ko) 2004-03-20
DE60302515T2 (de) 2006-08-17
US6976888B2 (en) 2005-12-20
EP1401251A1 (fr) 2004-03-24

Similar Documents

Publication Publication Date Title
EP1401251B1 (fr) LGA-Contact à douille
US6929483B2 (en) Electrical contact having contact portion with enhanced resiliency
US5984693A (en) Contact of an LGA socket
US4050755A (en) Electrical connector
US6533590B1 (en) Ball grid array connector having improved contact configuration
US7553202B2 (en) Electrical terminal
US20050208834A1 (en) Contact and electrical connector
US20020049000A1 (en) Battery connector
US20060040518A1 (en) Electrical connector having protecting protrusions
US6957987B2 (en) Socket connector for integrated circuit
US6942495B2 (en) Electrical contact with interferential protruding portions
EP1626461A2 (fr) Socle de circuit intégré
JPH11514131A (ja) 応力を分離したはんだテールを有する電気コネクタ
JP4422725B2 (ja) ランドグリッドアレイコネクタ
US6749440B1 (en) Electrical contact with dual electrical paths
US7367814B2 (en) Electrical contacts used in an electrical connector
US6916186B2 (en) Eletrical contact with dual electrical paths
US6764317B2 (en) Electric connector having elastic pins
US6471535B1 (en) Electrical socket
US4997378A (en) Contact
US7097517B2 (en) Socket connector for integrated circuit
US6431878B1 (en) Socket for PGA package
JPH08222335A (ja) 電気コンタクト及びこれを使用したｉｃソケット
US7057295B2 (en) IC module assembly
US6485313B1 (en) BGA socket with improved contacts

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL LT LV MK

17P Request for examination filed

Effective date: 20040910

17Q First examination report despatched

Effective date: 20041021

AKX Designation fees paid

Designated state(s): DE FR GB NL

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): DE FR GB NL

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REF Corresponds to:

Ref document number: 60302515

Country of ref document: DE

Date of ref document: 20060105

Kind code of ref document: P

ET Fr: translation filed
PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed

Effective date: 20060831

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20080917

Year of fee payment: 6

Ref country code: NL

Payment date: 20080924

Year of fee payment: 6

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20080929

Year of fee payment: 6

REG Reference to a national code

Ref country code: NL

Ref legal event code: V1

Effective date: 20100401

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20090905

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST

Effective date: 20100531

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20100401

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20090930

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20090905

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20100929

Year of fee payment: 8

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20130403

REG Reference to a national code

Ref country code: DE

Ref legal event code: R119

Ref document number: 60302515

Country of ref document: DE

Effective date: 20130403