EP1297580A1 - Thermoelektrisches bauelement - Google Patents
Thermoelektrisches bauelementInfo
- Publication number
- EP1297580A1 EP1297580A1 EP01947196A EP01947196A EP1297580A1 EP 1297580 A1 EP1297580 A1 EP 1297580A1 EP 01947196 A EP01947196 A EP 01947196A EP 01947196 A EP01947196 A EP 01947196A EP 1297580 A1 EP1297580 A1 EP 1297580A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- leg
- thermoelectric component
- component according
- contact point
- compounds
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 229910010293 ceramic material Inorganic materials 0.000 claims abstract description 22
- 230000005678 Seebeck effect Effects 0.000 claims abstract description 3
- 238000001816 cooling Methods 0.000 claims abstract description 3
- 238000010438 heat treatment Methods 0.000 claims abstract description 3
- 239000000463 material Substances 0.000 claims description 44
- 239000000945 filler Substances 0.000 claims description 39
- 239000012704 polymeric precursor Substances 0.000 claims description 25
- 238000000197 pyrolysis Methods 0.000 claims description 21
- 150000001875 compounds Chemical class 0.000 claims description 13
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- -1 FeCrNi Inorganic materials 0.000 claims description 4
- 238000009529 body temperature measurement Methods 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 239000002243 precursor Substances 0.000 claims description 4
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 4
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 229910000604 Ferrochrome Inorganic materials 0.000 claims description 2
- 229910016006 MoSi Inorganic materials 0.000 claims description 2
- 229910018540 Si C Inorganic materials 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- 229910019974 CrSi Inorganic materials 0.000 claims 1
- 230000005679 Peltier effect Effects 0.000 abstract 1
- 239000000203 mixture Substances 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 239000000843 powder Substances 0.000 description 5
- YXTPWUNVHCYOSP-UHFFFAOYSA-N bis($l^{2}-silanylidene)molybdenum Chemical compound [Si]=[Mo]=[Si] YXTPWUNVHCYOSP-UHFFFAOYSA-N 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 229910021343 molybdenum disilicide Inorganic materials 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 229910019017 PtRh Inorganic materials 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229910017709 Ni Co Inorganic materials 0.000 description 1
- 229910003267 Ni-Co Inorganic materials 0.000 description 1
- 229910003262 Ni‐Co Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000012300 argon atmosphere Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000012886 linear function Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 235000012054 meals Nutrition 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 238000010327 methods by industry Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000006187 pill Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000007873 sieving Methods 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/851—Thermoelectric active materials comprising inorganic compositions
- H10N10/855—Thermoelectric active materials comprising inorganic compositions comprising compounds containing boron, carbon, oxygen or nitrogen
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/851—Thermoelectric active materials comprising inorganic compositions
- H10N10/8556—Thermoelectric active materials comprising inorganic compositions comprising compounds containing germanium or silicon
Definitions
- thermoelectric component in particular a thermocouple, according to the preamble of the main claim.
- thermocouples When using thermocouples to measure temperatures, there are often limits to the material load capacity with regard to temperature and operating atmosphere. In the thermocouples currently used for the temperature range up to 1500 ° C based on PtRh / Pt elements, a longer period of use above 1000 ° C often results in a drift in the thermal voltage and at the same time a considerable deterioration in the mechanical properties due to creeping processes. In particular, upon contact with carbon, metal carbides often form in such thermocouples, which change the Seebeck coefficient and the mechanical properties of the thermocouple. In addition, PtRh / Pt thermocouples are very expensive to manufacture and therefore cannot be used for certain applications.
- the object of the present invention was to provide a thermoelectric component which is to be used in particular as a thermocouple, and which also in areas with permanently high temperatures and / or transient temperature loads, both in oxidizing and in re- ducent gas atmospheres always allows a precise temperature measurement.
- thermoelectric component according to the invention has the advantage over the prior art that it has very good durability and very good constancy of the thermal voltage that occurs, even under high temperatures and reactive gas atmospheres, with a typical durability of five years.
- thermoelectric component according to the invention when used as a thermocouple, allows temperature measurements of up to 1300 ° C. both in an oxidizing and in a reducing atmosphere to be carried out with an accuracy of less than ⁇ 10 ° C. It is also advantageous that the thermoelectric component according to the invention has a short response time to temperature changes, which is typically less than a second.
- thermoelectric component according to the invention can also be implemented in a small size, so that microstructured thermocouples or microstructured thermoelectric components can also be produced therewith.
- a microstructured component is understood to mean a component that has typical dimensions of the legs in the micrometer range.
- thermoelectric component according to the invention Due to the good temperature resistance or resistance to reactive gas atmospheres, a ceramic or metallic protective tube can also be dispensed with in the thermoelectric component according to the invention, so that when used as a thermocouple, an accurate and at the same time rapid temperature measurement is possible.
- the thermoelectric component according to the invention has the advantage of a long life expectancy even in reactive gas atmospheres with a high temperature resolution and fast response time.
- it can be produced inexpensively and, particularly when used as a thermocouple, has typical thermal voltages in the mV range that are easy to measure.
- thermoelectric component is not only suitable as a thermocouple, but it can also be designed as a Peltier element by impressing an external electrical current in a manner known per se, in order to implement a thermoelectric heating element or cooling element, for example.
- the legs of the thermoelectric component furthermore advantageously consist of a first ceramic material and a different ceramic material, of which preferably at least one additionally contains one or more suitable fillers. In this way, the contact voltages that occur increase due to the
- a filler with at least approximately metallic conductivity is particularly advantageously suitable for one of the legs and, on the other hand, an electrically semi-conductive or insulating filler for the other leg.
- the ceramic material of at least one leg by pyrolysis of a polymeric precursor material. terials or a polymeric precursor material provided with one or more fillers has been obtained.
- the thermal expansion coefficients of the legs of the thermoelectric component can be matched to one another in a particularly simple manner by selecting the polymeric precursor material and by the type and proportion of the fillers in this polymeric precursor material.
- the selection and the proportion of the polymeric precursor materials as well as the selection and the proportion of the fillers in a simple manner also advantageously make it possible to match the shrinkage in the legs of the thermoelectric component which is unavoidable during the pyrolysis of the precursor materials.
- thermoelectric component can also be realized in that at least in one area of the contact point only one leg is made of a ceramic material, while the second leg is made of a known solderable metal.
- FIG. 1 shows a thermoelectric component in the form of a thermocouple
- FIG. 2 shows the course of the contact voltage or the thermal voltage in the region of the contact point of the two legs of the thermocouple as a function of the temperature of the contact point.
- Particularly suitable polymeric precursor materials for the exemplary embodiments explained below are polymers which are obtained by pyrolysis in ceramic materials based on Si-C compounds, Si-CN compounds, Si-Ti-CO compounds, Si-CO compounds, Si -BCN compounds, Si-BCO compounds, BCN compounds, Si-Al-CO compounds, Si-Al-NCO compounds or Si-CON compounds can be converted.
- fillers with at least approximately metallic conductivity such as MoSi 2 , Cr 3 C 2 , TiC, WC, TiN, FeCr, FeCrNi, ZrN or ZrC are suitable as fillers in these polymeric precursor materials or the ceramic materials obtained after pyrolysis.
- an electrically semiconducting or insulating filler such as, for example, A1 2 O 3 , SiC, B 4 C, BN, ZrO 2 , SiO 2 , Si 3 N 4 or graphite can also be used as the filler.
- Molybdenum disilicide with a specific electrical resistance of 2xl0 ⁇ 5 ⁇ cm and a positive temperature coefficient of electrical resistance of 5x10 ⁇ 3 K _1 is particularly suitable.
- Al 2 O 3 with a specific electrical resistance of more than 10 11 ⁇ cm at room temperature is preferably used as a high-resistance insulating, high-temperature-resistant filler, which is combined with a ceramic material based on an Si-OC compound as the conductivity-carrying phase, the specific electrical phase Resistance after pyrolysis at 1400 ° C is about 2 ⁇ cm.
- FIG. 1 shows a thermoelectric component in the form of a thermocouple 5, which has a first leg 10 and a second leg 11, which are connected to one another by a contact point 12 in the form of a thermal contact. It is further provided that the thermocouple 5 is electrically connected to a device for measuring the contact voltage. The thermocouple 5 is used to measure a temperature to which the contact point 12 is exposed. This temperature is typically in the range from 0 ° C to 1500 ° C.
- FIG. 2 shows the course of the thermal voltage which occurs in the area of the contact point 12 of the thermocouple 5 as a function of the temperature to which the contact point 12 is exposed. It can be seen from FIG. 2 that the thermal voltage occurring is in the mV range and is a linear function of the temperature in the range from approximately 50 ° C. to 1000 ° C.
- thermocouple 5 further consists in its two legs 10, 11 of a single pyrolysis ceramic, but filled with two different fillers, whose electrical properties with regard to the Seebeck coefficient and the specific electrical resistance in the region of the first leg 10 and second leg 11 have been set defined by the type of filler.
- the shaping of the thermocouple 5 before pyrolysis was carried out using common manufacturing processes in plastic process engineering, such as transfer molding, injection molding or hot pressing.
- the area of the contact point 12 in which the two materials of the first leg 10 and the second leg 11 meet is particularly important for the function of the thermocouple 5. In this contact area, in which the thermal voltage to be measured occurs, it is important that the two materials of the first and second leg 10, 11 are each as homogeneous as possible in an environment of the contact point 12.
- thermoelectric component can furthermore be provided in a preferred embodiment in that the materials used before the pyrolysis are matched to one another with regard to the shrinkage occurring during the pyrolysis.
- This adaptation preferably takes place via the selection and the proportion of the filler in the respective polymeric precursor material.
- the thermal expansion coefficients of the material of the first leg 10 and the material of the second leg 11 are adapted to one another in order to avoid stresses and cracks in the area during operation of the thermocouple 5 to minimize or avoid the contact point 12.
- the electromotive force or the Seebeck coefficient of the materials of the first leg 10 and the second leg 11 is set only by the type of filler used, while both legs 10, 11 are otherwise made of the same polymeric pre-pyrolysis.
- cursor material exist.
- molybdenum disilicide is used as a high-temperature-resistant filler with at least approximately metallic conductivity. Electrically semiconducting or insulating fillers such as aluminum oxide or graphite are then used for the second leg.
- a solderable metal such as Vacon (manufacturer: VAC vacuum melt), i.e. a Ni-Co alloy with a low coefficient of thermal expansion.
- the second leg of the thermocouple 5 is then made of the ceramic material which is filled with one of the fillers explained.
- thermocouple 5 provides that two different polymeric precursor materials are used as materials for the first leg 10 or the second leg 11, which after pyrolysis are in the form of two different ceramic materials, for example an Si-Ti-CO -Connection on the side of one leg 10 and an Si-CO connection on the side of the other leg 11.
- the contact point 12 is formed in the form of a thermal contact with an occurring thermal voltage for a thermocouple 5 from adjacent pyrolysis ceramics of different compositions with preferably different fillers.
- the proportion of the filler in the polymeric precursor material (s) used can also be varied in order in this way to improve the thermoelectric and mechanical properties, in particular the Seebeck coefficient Contact area 12 of the thermocouple 5 obtained.
- the total filler content is between 10% by volume and 50% by volume based on the volume of the green body present before the pyrolysis with the polymeric precursor materials explained.
- the thermal voltage or the Seebeck coefficient that occurs in the area of the contact point 12 can also be set within certain limits by the process parameters during the pyrolysis in all the above exemplary embodiments.
- thermocouple 5 An exemplary embodiment for producing a thermocouple 5 according to FIG. 1 will now be explained in more detail.
- Alternative exemplary embodiments can easily be implemented by the person skilled in the art with knowledge of documents EP 0 412 028 B1 or DE 195 38 695 A1 by varying the type and amount of the fillers used or the type of polymeric precursor compounds used.
- 53.1 g of powdery, condensation-crosslinked polymethylsiloxane and 46.9 g of Al 2 O 3 powder are specified in 1000 millimeters of iron grinding balls. This corresponds to a degree of filling of 20 vol.% A1 2 0 3 based on the polymer-filler mixture.
- the powder mixture obtained is then separated from the iron balls and sieved using a 150 ⁇ m sieve.
- the sieved powder mixture is then poured into a mold and cold-pressed at a pressure of 150 MPa.
- This first pul mixture thus serves as a first polymeric precursor material provided with a first filler, from which the first leg 10 of the thermocouple 5 will be formed.
- the second leg 11 of the thermocouple 5 35.3 g of powdered, condensation-crosslinked polymethylsiloxane and 64.7 g of molybdenum disilicide powder are also initially used on 1000 g of iron grinding balls. This corresponds to a degree of filling of 25 vol.% Molybdenum disilicide based on the polymer-filler mixture. After grinding and sieving, which is carried out as stated above, the powder mixture is then filled into the press mold as a second polymeric precursor material provided with a second filler, in which the material for the first leg 10 is already located. After a cold pressing process at
- the resulting composite is then cured at a pressure of 10 MPa and a temperature of 170 ° C for 30 minutes.
- thermo element 5 obtained according to this temperature program has a thermoelectric voltage which is in the area of the thermoelectric voltage. known thermocouples based on PtPh / Pt. The temperature dependence of the occurring thermal voltage of the thermocouple 5 obtained is shown in FIG. 2.
- the thermocouple 5 has typical dimensions of the width of the legs 10, 11 from 10 ⁇ m to 1 cm and a thickness of the legs 10, 11 from 1 ⁇ m to 1 cm. Furthermore, the typical length of the legs 10, 11 is in the range of 1 cm and more. The distance between the first and second legs 10, 11 is between 50 ⁇ m and 5 cm in the region of the thermocouple 5 in which these two legs 10, 11 run parallel to one another.
- the thermocouple 5 can thus in particular also be designed as a microstructured thermocouple with typical dimensions in the micrometer range. It is also clear that, instead of a thermocouple 5 in the manner explained above, a thermoelectric component in the form of a Peltier element can also be implemented. For this purpose, more than one contact point 12 can then also be provided, which are formed by corresponding material combinations for the legs 10, 11 defining these contact points 12.
- thermocouple 5 is not limited to the U-shape explained according to FIG. 1; H. other geometries and other dimensions of the thermoelectric component can also be implemented depending on the desired response time.
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
Description
Claims
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10030354A DE10030354A1 (de) | 2000-06-21 | 2000-06-21 | Thermoelektrisches Bauelement |
DE10030354 | 2000-06-21 | ||
PCT/DE2001/002144 WO2001099204A1 (de) | 2000-06-21 | 2001-06-07 | Thermoelektrisches bauelement |
Publications (1)
Publication Number | Publication Date |
---|---|
EP1297580A1 true EP1297580A1 (de) | 2003-04-02 |
Family
ID=7646378
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP01947196A Withdrawn EP1297580A1 (de) | 2000-06-21 | 2001-06-07 | Thermoelektrisches bauelement |
Country Status (5)
Country | Link |
---|---|
US (1) | US7029173B2 (de) |
EP (1) | EP1297580A1 (de) |
JP (1) | JP4314028B2 (de) |
DE (1) | DE10030354A1 (de) |
WO (1) | WO2001099204A1 (de) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7361830B2 (en) * | 2002-03-21 | 2008-04-22 | Rtd Company | Polymer encapsulated micro-thermocouple |
US6977575B2 (en) * | 2003-05-22 | 2005-12-20 | Rtd Company | Flexible averaging resistance temperature detector |
WO2005112140A2 (en) * | 2004-04-12 | 2005-11-24 | The Board Of Governors For Higher Education, State Of Rhode Island And Providence Plantations | Thin film ceramic thermocouples |
EP1677087A1 (de) * | 2004-12-21 | 2006-07-05 | Vesuvius Crucible Company | Thermoelementeinheit und Verfahren zu deren Verwendung |
DE102005001116A1 (de) * | 2005-01-05 | 2006-07-20 | Universität Kassel | Mikrosystemtechnisches Bauelement |
US7719400B1 (en) | 2005-08-02 | 2010-05-18 | Rtd Company | Method and apparatus for flexible temperature sensor having coiled element |
US20070084499A1 (en) * | 2005-10-14 | 2007-04-19 | Biprodas Dutta | Thermoelectric device produced by quantum confinement in nanostructures |
US20070084495A1 (en) * | 2005-10-14 | 2007-04-19 | Biprodas Dutta | Method for producing practical thermoelectric devices using quantum confinement in nanostructures |
US8790256B2 (en) * | 2006-08-14 | 2014-07-29 | Frederick J. Buja | System and method employing a thermocouple junction for monitoring of physiological parameters |
US8251579B2 (en) * | 2007-07-16 | 2012-08-28 | Rtd Company | Robust stator winding temperature sensor |
DE102008007740B3 (de) * | 2008-02-05 | 2009-07-30 | Uhde Gmbh | Thermoelement aus einem oxidischen und nichtoxidischen keramischen Thermopaar |
KR101149144B1 (ko) * | 2009-07-24 | 2012-06-01 | 현대제철 주식회사 | 압연재의 온도 측정 장치 |
US20110026562A1 (en) * | 2009-07-31 | 2011-02-03 | Rtd Company | Temperature sensor using thin film resistance temperature detector |
JP2013083324A (ja) * | 2011-10-11 | 2013-05-09 | Ricoh Co Ltd | 駆動力伝達装置、および画像形成装置 |
DE102012217166A1 (de) * | 2012-09-24 | 2014-03-27 | Siemens Aktiengesellschaft | Verfahren zur Herstellung eines thermoelektrischen Generators |
JP6243917B2 (ja) | 2012-10-16 | 2017-12-06 | メジャメント スペシャリティーズ, インコーポレイテッド | 補強された可撓性の温度センサ |
US9891114B2 (en) * | 2014-05-28 | 2018-02-13 | Hamilton Sundstrand Corporation | Flexible laminated thermocouple |
NL2020545B1 (en) | 2018-03-07 | 2019-09-13 | Rgs Dev B V | Thermoelectric conversion device |
Family Cites Families (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US885430A (en) * | 1907-12-27 | 1908-04-21 | William H Bristol | Thermo-electric couple. |
US971767A (en) * | 1909-09-03 | 1910-10-04 | Hoskins Mfg Company | Thermo-electric couple. |
US2094102A (en) * | 1932-11-25 | 1937-09-28 | Fitterer Pyrometer Company | Thermoelectric apparatus |
US2691690A (en) * | 1952-08-22 | 1954-10-12 | Driver Harris Co | Thermocouple element composition |
DE1082311B (de) * | 1955-08-08 | 1960-05-25 | Siemens Ag | Thermoelement |
US2912477A (en) * | 1957-09-18 | 1959-11-10 | Max Planck Inst Eisenforschung | Thermocouples |
DE1060881B (de) | 1958-02-19 | 1959-07-09 | Siemens Ag | Thermoelektrisches Material |
US2981775A (en) * | 1958-11-12 | 1961-04-25 | Steatite Res Corp | Oxide thermocouple device |
US3411956A (en) * | 1963-10-15 | 1968-11-19 | Hoskins Mfg Company | Thermocouple with nickel-containing elements |
US3449175A (en) * | 1968-02-21 | 1969-06-10 | Atomic Energy Commission | Zirconia-based thermoelectric compositions |
DE1764388B1 (de) * | 1968-05-29 | 1972-03-09 | Foerderung Der Eisenhuettentec | Thermoelement zum Messen hoher Temperaturen in aggressiven Medien |
CH504764A (de) | 1968-12-10 | 1971-03-15 | Hugo Dipl Phys Wyss | Verfahren zum Herstellen eines elektrisch leitenden Widerstandskörpers |
US3906721A (en) * | 1974-08-22 | 1975-09-23 | Gen Motors Corp | Thermoelectric exhaust gas sensor |
DE2519338C3 (de) | 1975-04-30 | 1979-01-18 | Danfoss A/S, Nordborg (Daenemark) | Verfahren zur Herstellung eines Thermoelements und dessen Anwendung |
GB1590011A (en) * | 1976-08-17 | 1981-05-28 | Kyoto Ceramic | Method of producing dense sintered silicon carbide body from polycarbosilane |
US4177474A (en) | 1977-05-18 | 1979-12-04 | Energy Conversion Devices, Inc. | High temperature amorphous semiconductor member and method of making the same |
DE2927226A1 (de) * | 1979-07-05 | 1981-01-08 | Kempten Elektroschmelz Gmbh | Dichte formkoerper aus polykristallinem beta -siliciumcarbid und verfahren zu ihrer herstellung durch heisspressen |
FR2469807A1 (fr) * | 1979-11-07 | 1981-05-22 | Commissariat Energie Atomique | Procede de realisation d'une jonction entre deux fils metalliques de dimension tres reduite et dispositifs de mesure realises a partir de cette jonction |
US4336215A (en) * | 1979-11-30 | 1982-06-22 | Ube Industries, Ltd. | Sintered ceramic body and process for production thereof |
US4298558A (en) * | 1980-07-23 | 1981-11-03 | Dow Corning Corporation | High yield silicon carbide pre-ceramic polymers |
KR860000371Y1 (ko) * | 1981-12-02 | 1986-03-17 | 도오교오 덴기 가가꾸 고오교오 가부시기 가이샤 | 열 전 소 자 |
JPS6115380A (ja) * | 1984-06-30 | 1986-01-23 | Toshiba Corp | 熱電対 |
DE3608559A1 (de) * | 1986-03-14 | 1987-09-17 | Kernforschungsanlage Juelich | Verfahren zum verbinden von formteilen aus sic mit keramik oder metall und zur oberflaechenbehandlung von sisic sowie eine zum verbinden brauchbare legierung |
US4946713A (en) * | 1988-02-09 | 1990-08-07 | University Of Pennsylvania | Poly(alkenylpentaborane) ceramic precursors |
JP2620364B2 (ja) * | 1988-03-18 | 1997-06-11 | 本田技研工業株式会社 | セラミックス焼結体の製造方法 |
US5246504A (en) | 1988-11-15 | 1993-09-21 | Director-General, Agency Of Industrial Science And Technology | Thermoelectric material |
US5009717A (en) * | 1989-07-18 | 1991-04-23 | Mitsubishi Metal Corporation | Thermoelectric element and method of manufacturing same |
DE3926077A1 (de) * | 1989-08-07 | 1991-02-14 | Peter Prof Dr Greil | Keramische verbundkoerper und verfahren zu ihrer herstellung |
JPH0374885A (ja) * | 1989-08-15 | 1991-03-29 | Mitsubishi Materials Corp | P型Fe珪化物熱電変換材料 |
US5332701A (en) * | 1990-12-14 | 1994-07-26 | Massachusetts Institute Of Technology | Ceramic synthesis by pyrolysis of metal-containing polymer and metal |
US5232286A (en) * | 1991-04-10 | 1993-08-03 | Her Majesty The Queen In Right Of Canada As Represented By The Minister Of Energy, Mines And Resources | Long lasting thermocouple for high temperature measurements of liquid metals, mattes and slags |
JPH05343747A (ja) * | 1992-06-09 | 1993-12-24 | Matsushita Electric Ind Co Ltd | 熱電材料及びその製造方法並びにセンサー |
JPH07196371A (ja) | 1993-12-29 | 1995-08-01 | Tonen Corp | 熱電発電素子用SiCの製造方法 |
GB2288908B (en) * | 1994-04-27 | 1997-08-20 | Rowan Technologies Ltd | Ceramic thermocouple |
DE19538695C2 (de) * | 1994-10-19 | 2003-05-28 | Bosch Gmbh Robert | Keramischer elektrischer Widerstand und dessen Verwendung |
JPH08335721A (ja) | 1995-06-08 | 1996-12-17 | Isuzu Motors Ltd | ポーラス状熱発電素子の製造方法 |
CA2282547C (en) * | 1997-12-27 | 2005-10-18 | Osamu Yamashita | Thermo-electric conversion element |
RU2223573C2 (ru) * | 1999-06-02 | 2004-02-10 | Асахи Касеи Кабусики Кайся | Термоэлектрический материал и способ его изготовления |
JP4207218B2 (ja) * | 1999-06-29 | 2009-01-14 | 住友電気工業株式会社 | 金属多孔体とその製造方法及びそれを用いた金属複合材 |
US6225550B1 (en) * | 1999-09-09 | 2001-05-01 | Symyx Technologies, Inc. | Thermoelectric material system |
DE10055082A1 (de) * | 2000-11-07 | 2002-05-16 | Bosch Gmbh Robert | Keramischer Verbundwerkstoff |
-
2000
- 2000-06-21 DE DE10030354A patent/DE10030354A1/de not_active Ceased
-
2001
- 2001-06-07 US US10/069,680 patent/US7029173B2/en not_active Expired - Fee Related
- 2001-06-07 WO PCT/DE2001/002144 patent/WO2001099204A1/de active Application Filing
- 2001-06-07 JP JP2002503954A patent/JP4314028B2/ja not_active Expired - Fee Related
- 2001-06-07 EP EP01947196A patent/EP1297580A1/de not_active Withdrawn
Non-Patent Citations (1)
Title |
---|
See references of WO0199204A1 * |
Also Published As
Publication number | Publication date |
---|---|
JP2003536277A (ja) | 2003-12-02 |
WO2001099204A1 (de) | 2001-12-27 |
JP4314028B2 (ja) | 2009-08-12 |
DE10030354A1 (de) | 2002-01-10 |
US7029173B2 (en) | 2006-04-18 |
US20030091092A1 (en) | 2003-05-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP1297580A1 (de) | Thermoelektrisches bauelement | |
DE3512483C2 (de) | ||
DE69736662T2 (de) | Grossbereichthermistormaterial und dessen herstellungsverfahren | |
DE3519437C2 (de) | ||
DE4440005C2 (de) | Siliziumnitridkeramikheizer und Verfahren zu seiner Herstellung | |
EP2771659B1 (de) | Thermoelement | |
EP2917711B1 (de) | Temperatursensorsystem und verfahren zur herstellung eines temperatursensorsystems | |
EP1051371B1 (de) | Gesinterter stiftheizer | |
DE2314455A1 (de) | Thermistor | |
EP0755058A2 (de) | Elektrisch und thermisch leitfähiger Kunststoff und Verwendung dieses Kunststoffs | |
WO2011045227A1 (de) | Keramikmaterial, verfahren zur herstellung des keramikmaterials und widerstandsbauelement umfassend das keramikmaterial | |
EP2917710B1 (de) | Temperatursensorsystem und verfahren zur herstellung eines temperatursensorsystems | |
DE68917966T2 (de) | Elektrisch leitfähiger Keramikwerkstoff. | |
WO2001016528A1 (de) | Keramische glühstiftkerze | |
DE60307024T2 (de) | Hochpräziser Leistungswiderstand und Verfahren zu seiner Herstellung | |
EP0711496B1 (de) | Keramisches heizelement sowie verfahren zur herstellung eines solchen heizelements | |
EP3642583A1 (de) | Schichtwiderstand und dünnfilmsensor | |
DE19952127C2 (de) | Hochtemperaturbeständiger, mechanisch stabiler Temperaturfühler | |
EP1092696B1 (de) | Gesinterter keramischer Verbundkörper | |
DE102006062374A1 (de) | Keramisches elektrisches Heizelement | |
DE102020203166A1 (de) | Sensoraufbau zur Bestimmung hoher Temperaturen und Verfahren zur Herstellung des Sensoraufbaus | |
DE1943748A1 (de) | Heiz- und Temperaturmessgeraet | |
DE102018200548B3 (de) | Keramisches Thermoelement sowie Verfahren zu seiner Herstellung | |
DE102016213930B4 (de) | Verfahren zur Herstellung von Referenzmaterialien für Messungen des Seebeck-Koeffizienten sowie entsprechende Proben zur Verwendung als Referenzmaterial | |
EP0837837A1 (de) | Verfahren zur herstellung von elektrisch isolierendem siliziumkarbid |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20030121 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR |
|
RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: BOEDER, HORST Inventor name: KLONCZYNSKI, ALEXANDER Inventor name: DRESSLER, WOLFGANG Inventor name: ENGEL, CHRISTINE |
|
RBV | Designated contracting states (corrected) |
Designated state(s): DE FR GB IT |
|
17Q | First examination report despatched |
Effective date: 20081031 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20110104 |