EP1047150B1 - Coupleur à bande large et à couche mince - Google Patents

Coupleur à bande large et à couche mince Download PDF

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Publication number
EP1047150B1
EP1047150B1 EP00201151A EP00201151A EP1047150B1 EP 1047150 B1 EP1047150 B1 EP 1047150B1 EP 00201151 A EP00201151 A EP 00201151A EP 00201151 A EP00201151 A EP 00201151A EP 1047150 B1 EP1047150 B1 EP 1047150B1
Authority
EP
European Patent Office
Prior art keywords
coupler
thin
loop
film
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP00201151A
Other languages
German (de)
English (en)
Other versions
EP1047150A1 (fr
Inventor
Hans-Peter Löbl
Rainer Kiewitt
Mareike Klee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Intellectual Property and Standards GmbH
Koninklijke Philips NV
Original Assignee
Philips Corporate Intellectual Property GmbH
Philips Patentverwaltung GmbH
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Corporate Intellectual Property GmbH, Philips Patentverwaltung GmbH, Koninklijke Philips Electronics NV filed Critical Philips Corporate Intellectual Property GmbH
Publication of EP1047150A1 publication Critical patent/EP1047150A1/fr
Application granted granted Critical
Publication of EP1047150B1 publication Critical patent/EP1047150B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/12—Coupling devices having more than two ports
    • H01P5/16—Conjugate devices, i.e. devices having at least one port decoupled from one other port
    • H01P5/18—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers
    • H01P5/184—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers the guides being strip lines or microstrips

Definitions

  • the invention relates to a thin-film coupler with a carrier substrate and two overlying it Strip lines, one of which is the main coupler loop and one is the Auxiliary coupler loop is.
  • Couplers provide, among other things, high-frequency components for cell phones or base stations represents the decoupling of RF signals between the output of a power amplifier and enable an antenna.
  • the decoupled signal is used to Regulate output power of the amplifier.
  • Such a coupler has two, for example Coupler loops, one of which is the main loop and the transmission signal should be transmitted as losslessly as possible.
  • the second loop the so-called secondary loop, decouples a small signal compared to the transmission signal.
  • Such couplers are known in various embodiments.
  • Multi-layer ceramic coupler With these ceramic couplers, the Electrode structures printed on ceramic foils, the foils are stacked and then sintered into components.
  • the disadvantage of this printing process is the coarse-grained Morphology of the electrodes, which results in a higher electrical resistance Has.
  • EP 0 298 434 describes a thin-film coupler based on a dielectric Substrate several coupled strip lines with a closely adjacent course having. To ensure a phase difference of 90 ° is approximately in the middle Coupling path inserted an ohmic resistor.
  • EP 0 641 037 describes a coupler with two strip lines, the Strip lines are applied and connected such that they have a coil with one or form more turns.
  • EP 0 522 524 describes a coupler which has two inductors in the form of two Strip lines between two pairs of gates and two groups of capacitors, each connected to a pair of the gates.
  • the invention has for its object an inexpensive, compact coupler to provide the same coupling at several frequencies.
  • a thin-film coupler with a carrier substrate and two strip lines above, one of which is the main coupler loop and one is the secondary coupler loop, in which a component is in the secondary coupler loop is integrated, which is a phase shift in the frequency of the coupled signal causes a coil is integrated as a component in the secondary coupler loop.
  • Couplers usually show a strong frequency dependence of the coupling. By the Installation of a coil in the secondary coupler loop increases the bandwidth of the coupling.
  • a coil can be easily integrated into the secondary coupler loop by they also have a stripline design and thus in the same process step as the rest of the Auxiliary coupler loop is executed.
  • a coil can also be used with the help of others Thin-film techniques are shown and then with the secondary coupler loop be contacted electrically.
  • the thin-film coupler is in the Secondary coupler loop a coil and a series or parallel capacitor integrated.
  • a ceramic material, a ceramic material be used as the material for the carrier substrate Material with a planarization layer made of glass, a glass-ceramic material or a glass material is used.
  • a carrier substrate made of these materials is inexpensive Manufacture and process costs for this component can be kept low become.
  • each end of a coupler loop has one Power supply is in electrical contact.
  • each component can be combined with other components Circuit are electrically connected.
  • Component assembly can be a galvanic SMD end contact or a power supply Bump-end contact or a contact surface can be used. By using it Discrete components can be produced from SMD end contacts or bump-end contacts become.
  • At least one protective layer over the thin film coupler applied from an inorganic material and / or an organic material is.
  • the protective layer protects the component from mechanical stress and Corrosion protected by moisture.
  • This metallic layer serves as the ground plane.
  • the metallic layer is connected to at least one further power supply.
  • a thin-film coupler has a carrier substrate 1, which, for example a ceramic material, a ceramic material with a planarization layer made of glass, a glass-ceramic material or a glass material contains.
  • a main coupler loop 2 and a secondary coupler loop 3 are applied on the carrier substrate 1. Both loops can, for example, be of the stripline type and Cu, Al, Ag, Au or a combination of these metals.
  • the secondary coupler loop 3 is a component 4 which shifts the frequency of the decoupled signal.
  • four power leads 5 are attached to the thin-film coupler, each of which two power supplies connected to each other via one of the two coupler loops are.
  • a galvanic SMD end contact for example, can be used as the power supply 5 Cr / Cu, Ni / Sn or Cr / Cu, Cu / Ni / Sn or Cr / Ni, Pb / Sn or a bump-end contact or a contact surface can be used.
  • phase-shifting component 4 can also loop like the coupler are designed in stripline design and directly into the secondary coupler loop 3 can be integrated.
  • the phase-shifting component 4 can, for example can also be produced using thin-film techniques and then with the secondary coupler loop 3 can be electrically contacted.
  • the secondary coupler loop 3 is designed with one turn, so that it through their shape also acts as a coil and causes a phase shift.
  • the secondary coupler loop 3 is designed with turns, so that it through their Form also acts as a coil and causes a phase shift.
  • a protective layer made of an organic and / or inorganic material can be applied over the entire thin-film coupler.
  • polybenzocyclobutene or polyimide can be used as the organic material and Si 3 N 4 , SiO 2 or Si x O y N z (0 x x 1 1, 0 y y 1 1, 0 ⁇ z 1 1), for example, can be used as the inorganic material ,
  • a metallic layer can be on the back of the carrier substrate 1 for example Cu contains to be applied.
  • this metallic layer be connected to at least one further power supply.
  • a main coupler loop 2 and a secondary coupler loop 3 made of Cu with a width of 115 ⁇ m were applied to a carrier substrate 1 made of Al 2 O 3 with a thickness of 0.43 mm.
  • the distance between the main coupler loop 2 and the secondary coupler loop 3 is 35 ⁇ m.
  • the length of the coupler path between the two coupler loops is divided into two 1.45 mm long sections, which are connected by a thin-layer coil with 5.3 turns, with an inner turn radius of 50 ⁇ m, a distance between the turns of 20 ⁇ m and a coil turn width of 30 ⁇ m.
  • a Cr / Cu, Cu / Ni / Sn SMD end contact is attached as a power supply 5.
  • IL stands for insertion loss
  • C for Coupling (coupling)
  • I for isolation.
  • a main coupler loop 2 and a secondary coupler loop 3 made of Cu with a width of 115 ⁇ m were applied to a carrier substrate 1 made of Al 2 O 3 with a thickness of 0.43 mm.
  • the distance between the main coupler loop 2 and the secondary coupler loop 3 is 35 ⁇ m.
  • the length of the coupler path between the two coupler loops is divided into two 1.45 mm long sections, which were connected by a thin-film coil made of Cu with an inductance of 5.4 nH and a parallel-connected thin-film capacitor with a capacitance of 1 pF.
  • the thin film capacitor contains a lower and an upper electrode made of Al and a dielectric made of Si 3 N 4 .
  • a Cr / Cu, Cu / Ni / Sn SMD end contact is attached as power supply 5.
  • IL stands for insertion loss
  • C for Coupling (coupling)
  • I for isolation.

Landscapes

  • Waveguide Connection Structure (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Claims (7)

  1. Coupleur à couche mince avec un substrat porteur (1) et deux microrubans superposés dont l'un constitue la boucle de couplage principale (2) et l'autre la boucle de couplage auxiliaire (3), un composant (4) qui assure un déphasage de la fréquence du signal couplé étant intégré dans la boucle de couplage auxiliaire (3),
    caractérisé en ce    qu'une bobine est intégrée comme composant (4) dans la boucle de couplage auxiliaire (3).
  2. Coupleur à couche mince selon la revendication 1,
        caractérisé en ce    qu'une bobine et un condensateur monté en série ou en parallèle sont intégrés comme composant dans la boucle de couplage auxiliaire (3).
  3. Coupleur à couche mince selon la revendication 1,
        caractérisé en ce    qu'un matériau céramique, un matériau céramique avec une couche de planarisation en verre, un matériau en céramique de verre ou un matériau en verre sont utilisés comme matériau pour le substrat porteur (1).
  4. Coupleur à couche mince selon la revendication 1,
        caractérisé en ce    que chaque extrémité d'une boucle de couplage se trouve en contact électrique avec une alimentation électrique (5).
  5. Coupleur à couche mince selon la revendication 1,
        caractérisé en ce    qu'au moins une couche de protection en un matériau inorganique et/ou organique est appliquée sur le coupleur à couche mince.
  6. Coupleur à couche mince selon la revendication 1,
        caractérisé en ce    qu'une couche métallique est appliquée sur la face intérieure du substrat porteur (1).
  7. Coupleur à couche mince selon la revendication 8,
        caractérisé en ce que la couche métallique est reliée à au moins une alimentation électrique supplémentaire.
EP00201151A 1999-04-03 2000-03-28 Coupleur à bande large et à couche mince Expired - Lifetime EP1047150B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19915246 1999-04-03
DE19915246A DE19915246A1 (de) 1999-04-03 1999-04-03 Dünnschicht-Breitbandkoppler

Publications (2)

Publication Number Publication Date
EP1047150A1 EP1047150A1 (fr) 2000-10-25
EP1047150B1 true EP1047150B1 (fr) 2002-09-04

Family

ID=7903499

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00201151A Expired - Lifetime EP1047150B1 (fr) 1999-04-03 2000-03-28 Coupleur à bande large et à couche mince

Country Status (4)

Country Link
US (1) US6600386B1 (fr)
EP (1) EP1047150B1 (fr)
JP (1) JP4264182B2 (fr)
DE (2) DE19915246A1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE50304801D1 (de) * 2003-03-25 2006-10-05 Audioton Kabelwerk Scheinfeld Antennenkoppler und halterung für mobilfunkendgeräte
JP4533243B2 (ja) * 2005-05-27 2010-09-01 双信電機株式会社 方向性結合器
DE102005054348B3 (de) * 2005-11-15 2007-03-15 Atmel Duisburg Gmbh Kopplungselement zur elektromagnetischen Kopplung von mindestens zwei Leitern einer Transmissionsleitung
JP4782562B2 (ja) * 2005-12-28 2011-09-28 東京計器株式会社 方向性結合器、空中線整合器及び送信機
DE102007029127A1 (de) * 2007-06-25 2009-01-02 Rohde & Schwarz Gmbh & Co. Kg Richtkoppler mit induktiv kompensierter Richtschärfe
JP5246301B2 (ja) * 2011-06-14 2013-07-24 株式会社村田製作所 方向性結合器
JP5786902B2 (ja) * 2013-06-26 2015-09-30 株式会社村田製作所 方向性結合器
JP5979402B2 (ja) * 2015-07-17 2016-08-24 Tdk株式会社 方向性結合器および無線通信装置
US11437695B2 (en) 2019-03-13 2022-09-06 KYOCERA AVX Components Corporation Compact thin film surface mountable coupler having wide-band performance

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4648087A (en) * 1984-06-28 1987-03-03 International Business Machines Corporation Capacitive sensing employing thin film inductors
EP0298434A3 (fr) * 1987-07-08 1990-05-02 Siemens Aktiengesellschaft Coupleur en quadrature selon la technique des couches minces
US4800345A (en) * 1988-02-09 1989-01-24 Pacific Monolithics Spiral hybrid coupler
US4999593A (en) * 1989-06-02 1991-03-12 Motorola, Inc. Capacitively compensated microstrip directional coupler
US5410179A (en) * 1990-04-05 1995-04-25 Martin Marietta Corporation Microwave component having tailored operating characteristics and method of tailoring
IT1251221B (it) * 1991-07-11 1995-05-04 Sits Soc It Telecom Siemens Accoppiatore direzionale di tipo ibrido e microonde a costanti concentrate con uscite in quadratura.
US5400002A (en) * 1992-06-12 1995-03-21 Matsushita Electric Industrial Co., Ltd. Strip dual mode filter in which a resonance width of a microwave is adjusted and dual mode multistage filter in which the strip dual mode filters are arranged in series
JP2656000B2 (ja) * 1993-08-31 1997-09-24 日立金属株式会社 ストリップライン型高周波部品
US5432487A (en) * 1994-03-28 1995-07-11 Motorola, Inc. MMIC differential phase shifter
JP3125691B2 (ja) * 1995-11-16 2001-01-22 株式会社村田製作所 結合線路素子

Also Published As

Publication number Publication date
EP1047150A1 (fr) 2000-10-25
DE50000436D1 (de) 2002-10-10
DE19915246A1 (de) 2000-10-05
JP2000315903A (ja) 2000-11-14
US6600386B1 (en) 2003-07-29
JP4264182B2 (ja) 2009-05-13

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