EP0947030B1 - Filtre hyperfrequence - Google Patents

Filtre hyperfrequence Download PDF

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Publication number
EP0947030B1
EP0947030B1 EP97953630A EP97953630A EP0947030B1 EP 0947030 B1 EP0947030 B1 EP 0947030B1 EP 97953630 A EP97953630 A EP 97953630A EP 97953630 A EP97953630 A EP 97953630A EP 0947030 B1 EP0947030 B1 EP 0947030B1
Authority
EP
European Patent Office
Prior art keywords
substrate
strip conductor
arrangement according
main surface
strip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP97953630A
Other languages
German (de)
English (en)
Other versions
EP0947030A1 (fr
Inventor
Heinz Krause
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of EP0947030A1 publication Critical patent/EP0947030A1/fr
Application granted granted Critical
Publication of EP0947030B1 publication Critical patent/EP0947030B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/201—Filters for transverse electromagnetic waves
    • H01P1/203—Strip line filters
    • H01P1/20327—Electromagnetic interstage coupling
    • H01P1/20336—Comb or interdigital filters

Definitions

  • bit transport systems such as. B.
  • Connection networks for ATM A-synchronous Transfer Mode
  • AN / A for: Access Network / ATM
  • crossover crossovers with high demands on selectivity and with low losses up to frequencies of 1 GHz.
  • the subject of the application relates to an arrangement for filtering an electrical signal, in particular a bandline filter, according to claim 1.
  • a stripline filter is known from EP 0373028, in which those applied to a first surface of the substrate Band conductor of a metallization on the second Surface of the substrate is applied over the entire surface and the connected to the reference potential.
  • the known stripline filter folded to reduce the area occupied, the metallizations leading the reference potential lie next to each other and the band leader in any case the reference potential opposite metallization.
  • the proposed resonator arrangement with folded resonators without an intermediate reference potential plane the known arrangement a shorter length of the strip conductor, a higher quality and further a smaller coupling between the individual resonators. This will decrease Field displacement losses and that the folded Resonators do not share a full length Ground covering are coupled, returned. Otherwise leaves the proposed stripline filter in an automated Manufacture process and thus has the advantage of low manufacturing effort.
  • the ends are associated Band leader cuts by at least one electrical conductive via connected to a strip conductor. This measure brings an independent of the edge of the substrate Arrangement of a strip conductor resonator with itself.
  • the ends of the band ladder over one by an inductor or a capacitance given coupling element connected. That way you can Filters of various types (e.g. low-pass or bandpass) as much as you like regarding bandwidth and frequency will be realized.
  • a discrete coupling element According to a special training one carries on Conductor applied substrate a discrete coupling element. In this way, a hybrid filter is formed at which a band conductor and a coupling element on one Substrate are arranged. You can continue by equipping with different coupling elements filter different Type (e.g. low pass or band pass) as much as you like in terms of bandwidth and frequency position with the same Substrate plate can be realized.
  • Type e.g. low pass or band pass
  • the band line filter shown in FIGS. 1a and 1b is with a dielectric substrate S made by a ceramic can be given, formed.
  • the substrate is special given by a thin, rectangular substrate plate of thickness h, where the opposing large area Surfaces a first main surface HO 1 and a second Form the main surface HO 2.
  • the length 1 of a strip conductor section is the same a quarter of the wavelength ⁇ of the frequency to be treated of an electrical signal.
  • On the second main surface are to the strip conductor sections of the first main surface in the top view of the main surface congruent Band conductor sections arranged.
  • a band conductor section of the first main surface and the corresponding congruent Band conductor sections of the second main surface are through suitable means electrically connected to a strip conductor.
  • One with the ribbon conductor section of the first main surface connected strip conductor section of the second main surface forms a ⁇ / 4 resonator given by a band conductor.
  • connection of the strip conductor sections forms, so to speak the short circuit of the ⁇ / 4 resonator. Close the ends of the Band conductor sections with the edge of the substrate, takes place the connection advantageously by means of a Narrow side SF of the metallization carried around the substrate. Another connection of associated strip conductor sections is through one or more vias (DK in FIG 7) given the ends of the strip conductor sections.
  • the ends of the Band conductors on the second main surface are with the reference potential, This is also known as mass in specialist circles connecting.
  • the connection with the reference potential is caused by a metallization that is perpendicular to the The longitudinal axis of the strip conductor runs and that of the second Main surface is applied.
  • the metallization for that Reference potential is around in a preferred embodiment the narrow side and possibly a little bit on the first Main surface led around.
  • the ends of the ribbon conductors are on the first major surface connected to each other with coupling elements.
  • the coupling elements are due to coupling impedances such.
  • B. Capacitors and / or coupling coils are given.
  • conductor tracks LB which is a recording for given as discrete components coupling elements, such as e.g. a chip capacitor C1..C9 and / or a discrete coupling coil L1..L3 and form an electrical connection between the ends of the strip conductor sections and the coupling elements create.
  • the conductor tracks can be designed in this way be that they have the coupling elements as so-called Form printed circuit.
  • the ends of the outer band conductors on the first main surface may be over Coupling elements with an input connection E or with connected to an output terminal A.
  • the input port and / or the output connection can be on the first main surface applied and via conductor tracks with the ends of the outer band conductor.
  • the arrangement shown in FIG. 1 forms a stripline filter.
  • the strip conductor sections connected to form a strip conductor form a folded strip conductor resonator.
  • Arrangement of discrete coupling elements on the The stripline filter substrate is specifically a hybrid filter educated.
  • Figures 2a and 2b show electrical equivalent to each other Equivalent circuits of FIG 1 valid for the ⁇ / 4 frequency.
  • the equivalent circuit is a band conductor resonator R as a parallel circuit a capacitance and an inductance.
  • FIG. 3 shows the course of the attenuation in dB over the frequency for the bandpass from FIG. 1.
  • stripline filter with different long resonators R1..R4.
  • the strip conductor sections are like this arranged that their ends - regardless of their length - with complete one edge of the substrate.
  • the one, so to speak Short-circuiting connection of associated strip conductor sections is by one around the narrow side of the substrate led around metallization causes.
  • the the reference potential leading metallization is on the second main surface of the substrate all the way up to the strip conductor sections.
  • FIG. 5 shows the electrical equivalent circuit valid for the ⁇ / 4 frequency shown in FIG.
  • the equivalent circuit is a band conductor resonator R as a parallel connection of a capacitance and an inductor.
  • FIG. 6 shows the course of the attenuation in dB over the frequency for the bandpass from FIG. 4.
  • FIG. 7 shows a stripline filter in which the connection associated strip conductor sections by means of electrically conductive Vias DK is effected. Multiple vias can have two associated strip conductor sections connect a band leader. In this embodiment the arrangement of the strip conductor sections is advantageously independent selectable from the location of the edge of the substrate.

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)

Claims (10)

  1. Agencement pour le filtrage d'un signal électrique, en particulier filtre à conducteur en bande, dans lequel:
    un substrat diélectrique est formé, qui présente une première surface principale et une deuxième surface principale située face à la première surfacé principale,
    une pluralité de conducteurs parallèles en bande est disposée,
    un conducteur en bande de longueur donnée est divisé entre un premier tronçon appliqué sur la première surface principale et un deuxième tronçon appliqué sur la deuxième surface principale,
    le premier tronçon et le deuxième tronçon du conducteur en bande sont superposés,
    le premier tronçon et le deuxième tronçon du conducteur en bande sont reliés par des moyens appropriés pour former le conducteur en bande de longueur définie,
    les premières extrémités des conducteurs en bande sont reliées par des éléments de couplage,
    les premières extrémités des conducteurs en bande extérieurs sont reliées resp. à l'entrée (E) et à la sortie (A) de l'agencement, et
    les deuxièmes extrémités des conducteurs en bande sont reliées par une métallisation appliquée sur la deuxième surface principale.
  2. Agencement selon la revendication 1, caractérisé en ce que
    les extrémités de conducteurs en bande associés se raccordent aux bords du substrat, et
    le moyen de liaison des conducteurs en bande pour former un seul conducteur en bande est fourni par une métallisation appliquée autour du côté étroit (SF) du substrat.
  3. Agencement selon la revendication 1, caractérisé en ce que le moyen pour relier les extrémités de conducteurs en bande associés de manière à former un seul conducteur en bande est réalisé par au moins une perforation électriquement conductrice de mise en contact (DK).
  4. Agencement selon l'une des revendications précédentes, caractérisé en ce que les extrémités des conducteurs en bande qui ne sont pas tournées vers la métallisation qui conduit le potentiel de référence sont reliées par un élément de couplage.
  5. Agencement selon l'une des revendications précédentes, caractérisé en ce qu'une liaison d'une extrémité d'un conducteur en bande qui n'est pas tournée vers la métallisation qui conduit le potentiel de référence est réalisée par l'intermédiaire d'une piste conductrice (LB) appliquée par métallisation sur le substrat.
  6. Agencement selon l'une des revendications 4 ou 5, caractérisé en ce qu'un élément de couplage est formé d'une piste conductrice.
  7. Agencement selon l'une des revendications 4, 5 ou 6, caractérisé en ce qu'une piste conductrice porte un élément de couplage discret.
  8. Agencement selon l'une des revendications 4, 5, 6 ou 7, caractérisé en ce qu'un raccordement de l'agencement est appliqué sur le substrat.
  9. Agencement selon l'une des revendications précédentes, caractérisé par des métallisations appliquées sur le substrat par une technique en couches épaisses.
  10. Agencement selon l'une des revendications 1 à 9, caractérisé par des métallisations appliquées sur le substrat par une technique en couches minces.
EP97953630A 1996-12-18 1997-12-16 Filtre hyperfrequence Expired - Lifetime EP0947030B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19652799A DE19652799C2 (de) 1996-12-18 1996-12-18 Mikrowellenfilter
DE1965279 1996-12-18
PCT/DE1997/002924 WO1998027607A1 (fr) 1996-12-18 1997-12-16 Filtre hyperfrequence

Publications (2)

Publication Number Publication Date
EP0947030A1 EP0947030A1 (fr) 1999-10-06
EP0947030B1 true EP0947030B1 (fr) 2003-03-05

Family

ID=7815220

Family Applications (1)

Application Number Title Priority Date Filing Date
EP97953630A Expired - Lifetime EP0947030B1 (fr) 1996-12-18 1997-12-16 Filtre hyperfrequence

Country Status (5)

Country Link
US (1) US6265954B1 (fr)
EP (1) EP0947030B1 (fr)
AT (1) ATE233957T1 (fr)
DE (2) DE19652799C2 (fr)
WO (1) WO1998027607A1 (fr)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040232982A1 (en) * 2002-07-19 2004-11-25 Ikuroh Ichitsubo RF front-end module for wireless communication devices
US7493094B2 (en) * 2005-01-19 2009-02-17 Micro Mobio Corporation Multi-mode power amplifier module for wireless communication devices
US7071783B2 (en) * 2002-07-19 2006-07-04 Micro Mobio Corporation Temperature-compensated power sensing circuit for power amplifiers
DE10313868B4 (de) * 2003-03-21 2009-11-19 Siemens Ag Katheter zur magnetischen Navigation
US20050205986A1 (en) 2004-03-18 2005-09-22 Ikuroh Ichitsubo Module with integrated active substrate and passive substrate
US7254371B2 (en) * 2004-08-16 2007-08-07 Micro-Mobio, Inc. Multi-port multi-band RF switch
US7262677B2 (en) * 2004-10-25 2007-08-28 Micro-Mobio, Inc. Frequency filtering circuit for wireless communication devices
US7580687B2 (en) * 2005-01-19 2009-08-25 Micro Mobio Corporation System-in-package wireless communication device comprising prepackaged power amplifier
US7084702B1 (en) * 2005-01-19 2006-08-01 Micro Mobio Corp. Multi-band power amplifier module for wireless communication devices
US7769355B2 (en) * 2005-01-19 2010-08-03 Micro Mobio Corporation System-in-package wireless communication device comprising prepackaged power amplifier
US7548111B2 (en) * 2005-01-19 2009-06-16 Micro Mobio Corporation Miniature dual band power amplifier with reserved pins
US7477108B2 (en) * 2006-07-14 2009-01-13 Micro Mobio, Inc. Thermally distributed integrated power amplifier module
WO2008015899A1 (fr) * 2006-08-02 2008-02-07 Murata Manufacturing Co., Ltd. Élément de filtre et procédé de fabrication d'un élément de filtre
JP5532604B2 (ja) * 2006-12-01 2014-06-25 日立金属株式会社 積層型バンドパスフィルタ、高周波部品及びそれらを用いた通信装置
JP4770801B2 (ja) * 2007-06-26 2011-09-14 横河電機株式会社 高周波フィルタ
DE102008020597B4 (de) * 2008-04-24 2017-11-23 Epcos Ag Schaltungsanordnung
US9107300B2 (en) * 2009-12-14 2015-08-11 Nec Corporation Resonant via structures in multilayer substrates and filters based on these via structures
KR101295869B1 (ko) * 2009-12-21 2013-08-12 한국전자통신연구원 복수의 절연층들에 형성된 선로 필터

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2648641B2 (fr) 1988-11-30 1994-09-09 Thomson Hybrides Filtre passif passe-bande
NO176298C (no) * 1989-02-16 1995-03-08 Oki Electric Ind Co Ltd Filter av LC- eller hybridtypen
DE69411973T2 (de) * 1993-03-25 1998-12-10 Matsushita Electric Ind Co Ltd Geschichteter dielektrischer Resonator und dielektrisches Filter
JPH07240611A (ja) * 1994-02-28 1995-09-12 Kyocera Corp 積層型共振器、フィルタの周波数調整方法
EP0718906B1 (fr) * 1994-12-22 1999-05-12 SIEMENS MATSUSHITA COMPONENTS GmbH & CO. KG Filtre du type ligne à bande

Also Published As

Publication number Publication date
DE19652799A1 (de) 1998-06-25
US6265954B1 (en) 2001-07-24
ATE233957T1 (de) 2003-03-15
DE19652799C2 (de) 1999-05-20
DE59709460D1 (de) 2003-04-10
WO1998027607A1 (fr) 1998-06-25
EP0947030A1 (fr) 1999-10-06

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