EP0947030B1 - Microwave filter - Google Patents

Microwave filter Download PDF

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Publication number
EP0947030B1
EP0947030B1 EP97953630A EP97953630A EP0947030B1 EP 0947030 B1 EP0947030 B1 EP 0947030B1 EP 97953630 A EP97953630 A EP 97953630A EP 97953630 A EP97953630 A EP 97953630A EP 0947030 B1 EP0947030 B1 EP 0947030B1
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EP
European Patent Office
Prior art keywords
substrate
strip conductor
arrangement according
main surface
strip
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EP97953630A
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German (de)
French (fr)
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EP0947030A1 (en
Inventor
Heinz Krause
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Siemens AG
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Siemens AG
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/201—Filters for transverse electromagnetic waves
    • H01P1/203—Strip line filters
    • H01P1/20327—Electromagnetic interstage coupling
    • H01P1/20336—Comb or interdigital filters

Definitions

  • bit transport systems such as. B.
  • Connection networks for ATM A-synchronous Transfer Mode
  • AN / A for: Access Network / ATM
  • crossover crossovers with high demands on selectivity and with low losses up to frequencies of 1 GHz.
  • the subject of the application relates to an arrangement for filtering an electrical signal, in particular a bandline filter, according to claim 1.
  • a stripline filter is known from EP 0373028, in which those applied to a first surface of the substrate Band conductor of a metallization on the second Surface of the substrate is applied over the entire surface and the connected to the reference potential.
  • the known stripline filter folded to reduce the area occupied, the metallizations leading the reference potential lie next to each other and the band leader in any case the reference potential opposite metallization.
  • the proposed resonator arrangement with folded resonators without an intermediate reference potential plane the known arrangement a shorter length of the strip conductor, a higher quality and further a smaller coupling between the individual resonators. This will decrease Field displacement losses and that the folded Resonators do not share a full length Ground covering are coupled, returned. Otherwise leaves the proposed stripline filter in an automated Manufacture process and thus has the advantage of low manufacturing effort.
  • the ends are associated Band leader cuts by at least one electrical conductive via connected to a strip conductor. This measure brings an independent of the edge of the substrate Arrangement of a strip conductor resonator with itself.
  • the ends of the band ladder over one by an inductor or a capacitance given coupling element connected. That way you can Filters of various types (e.g. low-pass or bandpass) as much as you like regarding bandwidth and frequency will be realized.
  • a discrete coupling element According to a special training one carries on Conductor applied substrate a discrete coupling element. In this way, a hybrid filter is formed at which a band conductor and a coupling element on one Substrate are arranged. You can continue by equipping with different coupling elements filter different Type (e.g. low pass or band pass) as much as you like in terms of bandwidth and frequency position with the same Substrate plate can be realized.
  • Type e.g. low pass or band pass
  • the band line filter shown in FIGS. 1a and 1b is with a dielectric substrate S made by a ceramic can be given, formed.
  • the substrate is special given by a thin, rectangular substrate plate of thickness h, where the opposing large area Surfaces a first main surface HO 1 and a second Form the main surface HO 2.
  • the length 1 of a strip conductor section is the same a quarter of the wavelength ⁇ of the frequency to be treated of an electrical signal.
  • On the second main surface are to the strip conductor sections of the first main surface in the top view of the main surface congruent Band conductor sections arranged.
  • a band conductor section of the first main surface and the corresponding congruent Band conductor sections of the second main surface are through suitable means electrically connected to a strip conductor.
  • One with the ribbon conductor section of the first main surface connected strip conductor section of the second main surface forms a ⁇ / 4 resonator given by a band conductor.
  • connection of the strip conductor sections forms, so to speak the short circuit of the ⁇ / 4 resonator. Close the ends of the Band conductor sections with the edge of the substrate, takes place the connection advantageously by means of a Narrow side SF of the metallization carried around the substrate. Another connection of associated strip conductor sections is through one or more vias (DK in FIG 7) given the ends of the strip conductor sections.
  • the ends of the Band conductors on the second main surface are with the reference potential, This is also known as mass in specialist circles connecting.
  • the connection with the reference potential is caused by a metallization that is perpendicular to the The longitudinal axis of the strip conductor runs and that of the second Main surface is applied.
  • the metallization for that Reference potential is around in a preferred embodiment the narrow side and possibly a little bit on the first Main surface led around.
  • the ends of the ribbon conductors are on the first major surface connected to each other with coupling elements.
  • the coupling elements are due to coupling impedances such.
  • B. Capacitors and / or coupling coils are given.
  • conductor tracks LB which is a recording for given as discrete components coupling elements, such as e.g. a chip capacitor C1..C9 and / or a discrete coupling coil L1..L3 and form an electrical connection between the ends of the strip conductor sections and the coupling elements create.
  • the conductor tracks can be designed in this way be that they have the coupling elements as so-called Form printed circuit.
  • the ends of the outer band conductors on the first main surface may be over Coupling elements with an input connection E or with connected to an output terminal A.
  • the input port and / or the output connection can be on the first main surface applied and via conductor tracks with the ends of the outer band conductor.
  • the arrangement shown in FIG. 1 forms a stripline filter.
  • the strip conductor sections connected to form a strip conductor form a folded strip conductor resonator.
  • Arrangement of discrete coupling elements on the The stripline filter substrate is specifically a hybrid filter educated.
  • Figures 2a and 2b show electrical equivalent to each other Equivalent circuits of FIG 1 valid for the ⁇ / 4 frequency.
  • the equivalent circuit is a band conductor resonator R as a parallel circuit a capacitance and an inductance.
  • FIG. 3 shows the course of the attenuation in dB over the frequency for the bandpass from FIG. 1.
  • stripline filter with different long resonators R1..R4.
  • the strip conductor sections are like this arranged that their ends - regardless of their length - with complete one edge of the substrate.
  • the one, so to speak Short-circuiting connection of associated strip conductor sections is by one around the narrow side of the substrate led around metallization causes.
  • the the reference potential leading metallization is on the second main surface of the substrate all the way up to the strip conductor sections.
  • FIG. 5 shows the electrical equivalent circuit valid for the ⁇ / 4 frequency shown in FIG.
  • the equivalent circuit is a band conductor resonator R as a parallel connection of a capacitance and an inductor.
  • FIG. 6 shows the course of the attenuation in dB over the frequency for the bandpass from FIG. 4.
  • FIG. 7 shows a stripline filter in which the connection associated strip conductor sections by means of electrically conductive Vias DK is effected. Multiple vias can have two associated strip conductor sections connect a band leader. In this embodiment the arrangement of the strip conductor sections is advantageously independent selectable from the location of the edge of the substrate.

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)

Abstract

In the proposed stripline filter, the individual stripline resonators are folded, partially arranged on the upper side, partially arranged on the underside of the substrate. The stripline filter, which is utilized in cross-over frequency shunts in a frequency range of up to one GHz, exhibits high selectivity, low losses and, thus, high quality, high constancy, low volume and a cost-beneficial manufacturability in mass production.

Description

Bei Bittransportsystemen, wie z. B. Anschlußnetze für ATM (A-synchronous Transfer Mode) - Übertragungssysteme AN/A (für: Access Network / ATM) werden u. a. sogenannte Crossover-Frequenzweichen mit hohen Anforderungen an die Selektivität und mit geringen Verlusten bis zu Frequenzen von 1 GHz benötigt.In bit transport systems, such as. B. Connection networks for ATM (A-synchronous Transfer Mode) - Transmission systems AN / A (for: Access Network / ATM) are u. a. so-called crossover crossovers with high demands on selectivity and with low losses up to frequencies of 1 GHz.

Der Anmeldungsgegenstand betrifft eine Anordnung zur Filterung eines elektrischen Signals, insbesondere Bandleitungsfilter, gemäß dem Anspruch 1.The subject of the application relates to an arrangement for filtering an electrical signal, in particular a bandline filter, according to claim 1.

Aus der EP 0373028 ist ein Streifenleitungsfilter bekannt, bei dem die auf einer ersten Oberfläche des Substrats aufgebrachten Bandleiter einer Metallisierung, die auf der zweiten Oberfläche des Substrats vollflächig aufgebracht ist und die mit dem Bezugspotential verbunden ist, gegenüberliegen. In einer besonderen Ausführungsform ist das bekannte Streifenleitungsfilter zur Verringerung der beanspruchten Fläche gefaltet, wobei die das Bezugspotential führenden Metallisierungen aneinanderliegen und die Bandleiter jedenfalls einer das Bezugspotential führenden Metallisierung gegenüberliegen.A stripline filter is known from EP 0373028, in which those applied to a first surface of the substrate Band conductor of a metallization on the second Surface of the substrate is applied over the entire surface and the connected to the reference potential. In A special embodiment is the known stripline filter folded to reduce the area occupied, the metallizations leading the reference potential lie next to each other and the band leader in any case the reference potential opposite metallization.

Die vorgeschlagene Resonatoranordnung mit gefalteten Resonatoren ohne dazwischenliegender Bezugspotentialebene weist gegenüber der bekannten Anordnung eine kürzere Länge der Bandleiter, eine höhere Güte und weiter eine kleinere Verkopplung zwischen den einzelnen Resonatoren auf. Dies wird auf geringere Feldverdrängungsverluste und darauf, daß die gefalteten Resonatoren nicht auf der ganzen Länge über einen gemeinsamen Massebelag verkoppelt sind, zurückgeführt. Im übrigen läßt sich das vorgeschlagene Streifenleitungsfilter in einem automatisierten Prozeß fertigen und weist damit den Vorteil eines geringen Aufwandes für die Herstellung auf. The proposed resonator arrangement with folded resonators without an intermediate reference potential plane the known arrangement a shorter length of the strip conductor, a higher quality and further a smaller coupling between the individual resonators. This will decrease Field displacement losses and that the folded Resonators do not share a full length Ground covering are coupled, returned. Otherwise leaves the proposed stripline filter in an automated Manufacture process and thus has the advantage of low manufacturing effort.

Gemäß einer besonderen Weiterbildung schließen die Enden zugehöriger Bandleiterabschnitte mit der Kante des Substrats ab und die Bandleiterabschnitte sind durch eine um die Schmalseite des Substrats herumgeführte Metallisierung zu einem Bandleiter verbunden. Diese Maßnahme erübrigt das Einbringen von Durchbrüchen in das Substrat.According to a special development, the ends of the associated ones close Strip conductor sections with the edge of the substrate and the ribbon conductor sections are through one around the narrow side of the substrate led around to a Band leader connected. This measure makes the introduction unnecessary of breakthroughs in the substrate.

Gemäß einer besonderen Weiterbildung sind die Enden zugehöriger Bandleiterahschnitte durch mindestens eine elektrisch leitende Durchkontaktierung zu einem Bandleiter verbunden. Diese Maßnahme bringt eine von der Kante des Substrats unabhängige Anordenbarkeit eines Bandleiterresonators mit sich.According to a special development, the ends are associated Band leader cuts by at least one electrical conductive via connected to a strip conductor. This measure brings an independent of the edge of the substrate Arrangement of a strip conductor resonator with itself.

Gemäß einer besonderen Weiterbildung sind die Enden der Bandleiter über ein durch eine Induktivität oder eine Kapazität gegebenes Verkopplungselement verbunden. Auf diese Weise können Filter verschiedener Art (z. B. Tiefpässe oder Bandpässe) nach weitgehendem Belieben bezüglich der Bandbreite und Frequenzlage realisiert werden.According to a special development, the ends of the band ladder over one by an inductor or a capacitance given coupling element connected. That way you can Filters of various types (e.g. low-pass or bandpass) as much as you like regarding bandwidth and frequency will be realized.

Gemäß einer besonderen Weiterbildung ist ein Ende eines Bandleiters mit einer auf das Substrat aufmetallisierten Leiterbahn verbunden. Diese Maßnahme bringt eine Herstellbarkeit eines Bandleiters und einer Leiterbahn in einem Arbeitsgang mit sich.According to a special development, one end of a strip conductor with a conductor track metallized on the substrate connected. This measure brings manufacturability a strip conductor and a conductor track in one operation with himself.

Gemäß einer besonderen Weiterbildung ist ein Verkopplungselement mit einer Leiterbahn gebildet. Diese Maßnahme bringt durch Realisierung eines Verkopplungselementes in einer als gedruckte Schaltung bekannten Ausführung eine zusammen mit anderen auf das Substrat aufzumetallisierender Flächen in einem Arbeitsgang mit sich und erspart die Anordnung eines diskreten Bauelements.According to a special development, there is a coupling element formed with a conductor track. This measure brings by realizing a coupling element in a as Printed circuit known version together with other surfaces to be metallized on the substrate in one Work with itself and saves the arrangement of a discrete Component.

Gemäß einer besonderen Weiterbildung trägt eine auf das Substrat aufgebrachte Leiterbahn ein diskretes Verkopplungselement. Auf diese Weise ist ein Hybridfilter gebildet, bei dem ein Bandleiter und ein Verkopplungselement auf einem Substrat angeordnet sind. Weiter können durch Bestückung mit unterschiedlichen Verkopplungselementen Filter verschiedener Art (z. B. Tiefpässe oder Bandpässe) nach weitgehendem Belieben bezüglich der Bandbreite und Frequenzlage mit der gleichen Substratplatte realisiert werden.According to a special training one carries on Conductor applied substrate a discrete coupling element. In this way, a hybrid filter is formed at which a band conductor and a coupling element on one Substrate are arranged. You can continue by equipping with different coupling elements filter different Type (e.g. low pass or band pass) as much as you like in terms of bandwidth and frequency position with the same Substrate plate can be realized.

Gemäß einer besonderen Weiterbildung ist ein Anschluß der Anordnung auf dem Substrat aufgebracht. Diese Maßnahme bringt eine einfache Anschließbarkeit der Anordnung mit sich.According to a special development is a connection of the arrangement applied to the substrate. This measure brings an easy connectability of the arrangement.

Das Aufbringen der Metallisierungen in Dickschichttechnik oder in Dünnschichttechnik auf das Substrat bringt eine Herstellbarkeit in einer gängigen Technologie mit sich.The application of the metallizations using thick-film technology or in thin-film technology on the substrate brings a manufacturability in a common technology with it.

Der Anmeldungsgegenstand wird im Folgenden als Ausführungsbeispiel in einem zum Verständnis erforderlichen Umfang anhand von Figuren näher beschrieben. Dabei zeigen:

FIG 1a und FIG 1b
perspektivische Darstellungen eines anmeldungsgemäßen Streifenleitungsfilters,
FIG 2a und FIG 2b
zueinander äquivalente elektrische Ersatzschaltungen für das Filter nach FIG 1, gültig für die λ/4 Frequenz,
FIG 3
den Dämpfungsverlauf eines Filters nach FIG 1,
FIG 4
ein dielektrisches Bandpaßfilter mit Bandleitungsresonatoren unterschiedlicher Länge,
FIG 5
eine elektrische Ersatzschaltung für das Filter nach FIG 4, gültig für die λ/4 Frequenz,
FIG 6
den Dämpfungsverlauf eines Filters nach FIG 5 und
FIG 7
einen Streifenleitungsfilter mit Durchkontaktierungen.
The subject of the application is described in more detail below as an exemplary embodiment to the extent necessary for understanding with reference to figures. Show:
FIG 1a and 1b
perspective representations of a stripline filter according to the application,
FIG 2a and 2b
equivalent electrical equivalent circuits for the filter according to FIG. 1, valid for the λ / 4 frequency,
FIG 3
1 shows the attenuation curve of a filter according to FIG. 1,
FIG 4
a dielectric bandpass filter with bandline resonators of different lengths,
FIG 5
an electrical equivalent circuit for the filter according to FIG 4, valid for the λ / 4 frequency,
FIG 6
the attenuation curve of a filter according to FIG 5 and
FIG 7
a stripline filter with vias.

Die Beschreibung eines in einer Figur bezeichneten und/oder dargestellten Elements gilt gleichermaßen für gleich bezeichnete und/oder gleich dargestellte Elemente anderer Figuren.The description of a and / or designated in a figure shown element applies equally to the same and / or similarly represented elements of other figures.

Das in FIG 1a und FIG 1b dargestellte Bandleitungsfilter ist mit einem dielektrischen Substrat S, das durch eine Keramik gegeben sein kann, gebildet. Das Substrat ist insbesondere durch eine dünne, rechteckige Substratplatte der Dicke h gegeben, bei der die einander gegenüberliegenden großflächigen Oberflächen eine erste Hauptoberfläche HO 1 und eine zweite Hauptoberfläche HO 2 bilden.The band line filter shown in FIGS. 1a and 1b is with a dielectric substrate S made by a ceramic can be given, formed. The substrate is special given by a thin, rectangular substrate plate of thickness h, where the opposing large area Surfaces a first main surface HO 1 and a second Form the main surface HO 2.

Auf die erste Hauptoberfläche ist eine Mehrzahl paralleler Bandleiterabschnitte in einer Breite W und einem Abstand a angeordnet. Die Länge 1 eines Bandleiterabschnitts gleicht einem Viertel der Wellenlänge λ der zu behandelnden Frequenz eines elektrischen Signals. Auf der zweiten Hauptoberfläche sind zu den Bandleiterabschnitten der ersten Hauptoberfläche in der Draufsicht auf die Hauptoberfläche deckungsgleiche Bandleiterabschnitte angeordnet. Ein Bandleiterabschnitt der ersten Hauptoberfläche und der zugehörige deckungsgleiche Bandleiterabschnitt der zweiten Hauptoberfläche sind durch geeignete Mittel zu einem Bandleiter elektrisch verbunden. Ein mit dem Bandleiterabschnitt der ersten Hauptoberfläche verbundener Bandleiterabschnitt der zweiten Hauptoberfläche bildet einen durch einen Bandleiter gegebenen λ/4-Resonator. Die Verbindung der Bandleiterabschnitte bildet gewissermaßen den Kurzschluß des λ/4-Resonators. Schließen die Enden der Bandleiterabschnitte mit der Kante des Substrats ab, erfolgt die Verbindung vorteilhafterweise mittels einer um die Schmalseite SF des Substrats herumgeführten Metallisierung. Eine andere Verbindung zugehöriger Bandleiterabschnitte ist durch eine oder mehrere Durchkontaktierungen (DK in FIG 7) an den Enden der Bandleiterabschnitte gegeben. Die Enden der Bandleiter auf der zweiten Hauptoberfläche sind mit dem Bezugspotential, das in Fachkreisen auch als Masse bezeichnet wird, verbunden. Die Verbindung mit dem Bezugspotential ist durch eine Metallisierung bewirkt, die rechtwinklig zu der Längsachse der Bandleiter verläuft und die auf die zweite Hauptoberfläche aufgebracht ist. Die Metallisierung für das Bezugspotential ist in einer bevorzugten Ausführungsform um die Schmalseite und gegebenenfalls ein Stück weit auf die erste Hauptoberfläche herumgeführt.There is a plurality of parallel ones on the first main surface Band conductor sections in a width W and a distance a arranged. The length 1 of a strip conductor section is the same a quarter of the wavelength λ of the frequency to be treated of an electrical signal. On the second main surface are to the strip conductor sections of the first main surface in the top view of the main surface congruent Band conductor sections arranged. A band conductor section of the first main surface and the corresponding congruent Band conductor sections of the second main surface are through suitable means electrically connected to a strip conductor. One with the ribbon conductor section of the first main surface connected strip conductor section of the second main surface forms a λ / 4 resonator given by a band conductor. The connection of the strip conductor sections forms, so to speak the short circuit of the λ / 4 resonator. Close the ends of the Band conductor sections with the edge of the substrate, takes place the connection advantageously by means of a Narrow side SF of the metallization carried around the substrate. Another connection of associated strip conductor sections is through one or more vias (DK in FIG 7) given the ends of the strip conductor sections. The ends of the Band conductors on the second main surface are with the reference potential, This is also known as mass in specialist circles connecting. The connection with the reference potential is caused by a metallization that is perpendicular to the The longitudinal axis of the strip conductor runs and that of the second Main surface is applied. The metallization for that Reference potential is around in a preferred embodiment the narrow side and possibly a little bit on the first Main surface led around.

Die Enden der Bandleiter auf der ersten Hauptoberfläche sind mit Verkopplungselementen untereinander verbunden. Die Verkopplungselemente sind durch Kopplungsimpedanzen, wie z. B. Kondensatoren und/oder Koppelspulen gegeben. Auf das Substrat mögen Leiterbahnen LB aufgebracht sein, die eine Aufnahme für als diskrete Bauelemente gegebene Verkopplungselemente, wie z.B. einen Chipkondensator C1..C9 und/oder eine diskrete Koppelspule L1..L3 bilden und die eine elektrische Verbindung zwischen den Enden der Bandleiterabschnitte und den Verkopplungselementen schaffen. Die Leiterbahnen können so ausgestaltet sein, daß sie die Verkopplungselemente als sogenannte gedruckte Schaltung ausbilden. Die Enden der äußeren Bandleiter auf der ersten Hauptoberfläche sind gegebenenfalls über Verkopplungselemente mit einem Eingangsanschluß E bzw. mit einem Ausgangsanschluß A verbunden. Der Eingangsanschluß und/oder der Ausgangsanschluß können auf der ersten Hauptoberfläche aufgebracht und über Leiterbahnen mit den Enden der äußeren Bandleiter verbunden sein.The ends of the ribbon conductors are on the first major surface connected to each other with coupling elements. The coupling elements are due to coupling impedances such. B. Capacitors and / or coupling coils are given. On the substrate may be applied conductor tracks LB, which is a recording for given as discrete components coupling elements, such as e.g. a chip capacitor C1..C9 and / or a discrete coupling coil L1..L3 and form an electrical connection between the ends of the strip conductor sections and the coupling elements create. The conductor tracks can be designed in this way be that they have the coupling elements as so-called Form printed circuit. The ends of the outer band conductors on the first main surface may be over Coupling elements with an input connection E or with connected to an output terminal A. The input port and / or the output connection can be on the first main surface applied and via conductor tracks with the ends of the outer band conductor.

Die auf das Substrat aufgebrachten Bandleiterabschnitte, die Metallisierung des Bezugspotentials, die Leiterbahnen und gegebenenfalls die als gedruckte Schaltung gegebenen Verkopplungselemente mögen durch in Dickschichttechnik oder in Dünnschichttechnik auf das Substrat aufgebrachte Metallisierungen M gegeben sein.The strip conductor sections applied to the substrate, the Metallization of the reference potential, the conductor tracks and if necessary the coupling elements given as a printed circuit like through thick-film technology or thin-film technology metallizations applied to the substrate M be given.

Die in FIG 1 dargestellte Anordnung bildet ein Streifenleitungsfilter. Die zu einem Bandleiter verbundenen Bandleiterabschnitte bilden einen gefalteten Bandleiterresonator. Bei Anordnung von diskreten Verkopplungselementen auf dem Substrat des Streifenleitungsfilters ist speziell ein Hybridfilter gebildet.The arrangement shown in FIG. 1 forms a stripline filter. The strip conductor sections connected to form a strip conductor form a folded strip conductor resonator. at Arrangement of discrete coupling elements on the The stripline filter substrate is specifically a hybrid filter educated.

Die FIG 2a und 2b zeigen zueinander äquivalente, elektrische Ersatzschaltungen von FIG 1 gültig für die λ/4-Frequenz. In der Ersatzschaltung ist ein Bandleiterresonator R als Parallelschaltung einer Kapazität und einer Induktivität wiedergegeben.Figures 2a and 2b show electrical equivalent to each other Equivalent circuits of FIG 1 valid for the λ / 4 frequency. In the equivalent circuit is a band conductor resonator R as a parallel circuit a capacitance and an inductance.

FIG 3 zeigt den Verlauf der Dämpfung in dB über der Frequenz für den Bandpaß aus FIG 1.3 shows the course of the attenuation in dB over the frequency for the bandpass from FIG. 1.

FIG 4 zeigt einen Streifenleitungsfilter mit unterschiedlich langen Resonatoren R1..R4. Die Bandleiterabschnitte sind so angeordnet, daß ihre Enden - unabhängig von ihrer Länge - mit einer Kante des Substrats abschließen. Die gewissermaßen einen Kurzschluß bewirkende Verbindung zugehöriger Bandleiterabschnitte ist durch eine um die Schmalseite des Substrats herumgeführte Metallisierung bewirkt. Die das Bezugspotential führende Metallisierung ist auf der zweiten Hauptoberfläche des Substrats flächig bis an die Bandleiterabschnitte herangeführt.4 shows a stripline filter with different long resonators R1..R4. The strip conductor sections are like this arranged that their ends - regardless of their length - with complete one edge of the substrate. The one, so to speak Short-circuiting connection of associated strip conductor sections is by one around the narrow side of the substrate led around metallization causes. The the reference potential leading metallization is on the second main surface of the substrate all the way up to the strip conductor sections.

In FIG 5 ist die für die λ/4-Frequenz gültige elektrische Ersatzschaltung von FIG 4 dargestellt. In der Ersatzschaltung ist ein Bandleiterresonator R als Parallelschaltung einer Kapazität und einer Induktivität wiedergegeben.5 shows the electrical equivalent circuit valid for the λ / 4 frequency shown in FIG. In the equivalent circuit is a band conductor resonator R as a parallel connection of a capacitance and an inductor.

FIG 6 zeigt den Verlauf der Dämpfung in dB über der Frequenz für den Bandpaß aus FIG 4.6 shows the course of the attenuation in dB over the frequency for the bandpass from FIG. 4.

FIG 7 zeigt einen Streifenleitungsfilter, bei dem die Verbindung zugehöriger Bandleiterabschnitte mittels elektrisch leitender Durchkontaktierungen DK bewirkt ist. Mehrere Durchkontaktierungen können zwei zugehörige Bandleiterabschnitte zu einem Bandleiter verbinden. Bei dieser Ausführungsform ist die Anordnung der Bandleiterabschnitte vorteilhafterweise unabhängig von der Lage der Kante des Substrats wählbar.7 shows a stripline filter in which the connection associated strip conductor sections by means of electrically conductive Vias DK is effected. Multiple vias can have two associated strip conductor sections connect a band leader. In this embodiment the arrangement of the strip conductor sections is advantageously independent selectable from the location of the edge of the substrate.

Für die Dimensionierung dieser Filter können bekannte Synthese- und Optimierungsverfahren mit diskreten und Leitungselementen als Näherung angewendet werden. Als Zielschaltungen sollten jedoch die nach FIG 2b und FIG 5 angestrebt werden, weil die Elemente der Parallelkreise mit den Resonanzfrequenzen F1 bis F4 in die mechanischen Parameter des Resonators = λ/4=c/4F ε und Z = (120π/ε) * h/(h+w) umgerechnet werden können (Z=Wellenwiderstand des Bandleiters, l=Länge und w=Breite des Bandleiterabschnitts, h=Dicke des Substrates S, ε=Dielektrizitätskonstante, c=Lichtgeschwindigkeit).Known synthesis and optimization methods with discrete and line elements can be used as an approximation for the dimensioning of these filters. However, the target circuits according to FIG. 2b and FIG. 5 should be aimed for, because the elements of the parallel circuits with the resonance frequencies F1 to F4 are included in the mechanical parameters of the resonator = λ / 4 = c / 4 F ε and Z = (120π / ε ) * h / (h + w) can be converted (Z = wave impedance of the strip conductor, l = length and w = width of the strip conductor section, h = thickness of the substrate S, ε = dielectric constant, c = speed of light).

Da die Verkopplung zwischen den Resonatoren bei einem Resonatorabstand a>w relativ klein ist, ergeben diese Rechnungen mit diskreten Elementen brauchbare Näherungen. Eine Optimierung mit planaren Elementen bringt eine noch genauere Übereinstimmung mit der Praxis.Because the coupling between the resonators at a resonator distance a> w is relatively small, these calculations result approximations useful with discrete elements. An optimization with planar elements brings an even more exact match with practice.

Claims (10)

  1. Arrangement for filtering an electrical signal, in particular stripline filter, in which
    a dielectric substrate is provided which has a first main surface and a second main surface situated opposite to the first main surface
    a plurality of strip conductors are arranged parallel
    a strip conductor of given length is divided into a first section applied on the first main surface and into a second section applied on the second main surface
    the first section and the second section of the strip conductor overlap
    the first section and the second section of the strip conductor are connected by suitable means to form the strip conductor of given length
    the first ends of the strip conductors are connected by coupling elements
    the first ends of the outer strip conductors are connected to the input (E) and, respectively, to the output (A) of the arrangement
    the second ends of the strip conductors are connected by a metallization layer applied on the second main surface.
  2. Arrangement according to Claim 1,
    characterized in that
    the ends of associated strip conductor sections terminate with the edge of the substrate and
    the means for connecting the strip conductor sections to form a strip conductor is given by a metallization layer led around the narrow side (SF) of the substrate.
  3. Arrangement according to Claim 1,
    characterized in that
    the means for connecting the ends of associated strip conductor sections to form a strip conductor is given by at least one electrically conductive plated-through hole (DK).
  4. Arrangement according to one of the preceding claims,
    characterized in that
    the ends of the strip conductors which are remote from the metallization layer carrying the reference-earth potential are connected via a coupling element.
  5. Arrangement according to one of the preceding claims,
    characterized in that
    a connection of an end of a strip conductor which is remote from the metallization layer carrying the reference-earth potential is provided via an interconnect (LB) metallized onto the substrate.
  6. Arrangement according to either of Claims 4 and 5,
    characterized in that
    a coupling element is formed with an interconnect.
  7. Arrangement according to either of Claims 4, 5 and 6,
    characterized in that
    an interconnect carries a discrete coupling element.
  8. Arrangement according to either of Claims 4, 5, 6 and 7,
    characterized in that
    a terminal of the arrangement is applied on the substrate.
  9. Arrangement according to one of the preceding claims,
    characterized by
    metallization layers applied to the substrate using thick-film technology.
  10. Arrangement according to one of Claims 1 to 9,
    characterized by
    metallization layers applied to the substrate using thin-film technology.
EP97953630A 1996-12-18 1997-12-16 Microwave filter Expired - Lifetime EP0947030B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19652799A DE19652799C2 (en) 1996-12-18 1996-12-18 Microwave filter
DE1965279 1996-12-18
PCT/DE1997/002924 WO1998027607A1 (en) 1996-12-18 1997-12-16 Microwave filter

Publications (2)

Publication Number Publication Date
EP0947030A1 EP0947030A1 (en) 1999-10-06
EP0947030B1 true EP0947030B1 (en) 2003-03-05

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP97953630A Expired - Lifetime EP0947030B1 (en) 1996-12-18 1997-12-16 Microwave filter

Country Status (5)

Country Link
US (1) US6265954B1 (en)
EP (1) EP0947030B1 (en)
AT (1) ATE233957T1 (en)
DE (2) DE19652799C2 (en)
WO (1) WO1998027607A1 (en)

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US7493094B2 (en) * 2005-01-19 2009-02-17 Micro Mobio Corporation Multi-mode power amplifier module for wireless communication devices
DE10313868B4 (en) * 2003-03-21 2009-11-19 Siemens Ag Catheter for magnetic navigation
US20050205986A1 (en) 2004-03-18 2005-09-22 Ikuroh Ichitsubo Module with integrated active substrate and passive substrate
US7254371B2 (en) * 2004-08-16 2007-08-07 Micro-Mobio, Inc. Multi-port multi-band RF switch
US7262677B2 (en) * 2004-10-25 2007-08-28 Micro-Mobio, Inc. Frequency filtering circuit for wireless communication devices
US7548111B2 (en) * 2005-01-19 2009-06-16 Micro Mobio Corporation Miniature dual band power amplifier with reserved pins
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US7769355B2 (en) * 2005-01-19 2010-08-03 Micro Mobio Corporation System-in-package wireless communication device comprising prepackaged power amplifier
US7580687B2 (en) * 2005-01-19 2009-08-25 Micro Mobio Corporation System-in-package wireless communication device comprising prepackaged power amplifier
US7477108B2 (en) * 2006-07-14 2009-01-13 Micro Mobio, Inc. Thermally distributed integrated power amplifier module
CN101341627A (en) * 2006-08-02 2009-01-07 株式会社村田制作所 Filter element and method for manufacturing filter element
US8093963B2 (en) * 2006-12-01 2012-01-10 Hitachi Metals, Ltd. Laminated bandpass filter, high-frequency component and communications apparatus comprising them
JP4770801B2 (en) * 2007-06-26 2011-09-14 横河電機株式会社 High frequency filter
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KR101295869B1 (en) * 2009-12-21 2013-08-12 한국전자통신연구원 Line filter formed on a plurality of insulation layers

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DK0718906T3 (en) * 1994-12-22 1999-11-01 Siemens Matsushita Components Micro Strip Filter

Also Published As

Publication number Publication date
DE19652799C2 (en) 1999-05-20
EP0947030A1 (en) 1999-10-06
DE19652799A1 (en) 1998-06-25
DE59709460D1 (en) 2003-04-10
ATE233957T1 (en) 2003-03-15
WO1998027607A1 (en) 1998-06-25
US6265954B1 (en) 2001-07-24

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