EP1047150A1 - Coupleur à bande large et à couche mince - Google Patents
Coupleur à bande large et à couche mince Download PDFInfo
- Publication number
- EP1047150A1 EP1047150A1 EP00201151A EP00201151A EP1047150A1 EP 1047150 A1 EP1047150 A1 EP 1047150A1 EP 00201151 A EP00201151 A EP 00201151A EP 00201151 A EP00201151 A EP 00201151A EP 1047150 A1 EP1047150 A1 EP 1047150A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- coupler
- thin
- loop
- film
- frequency
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/12—Coupling devices having more than two ports
- H01P5/16—Conjugate devices, i.e. devices having at least one port decoupled from one other port
- H01P5/18—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers
- H01P5/184—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers the guides being strip lines or microstrips
Definitions
- the invention relates to a thin-film coupler with a carrier substrate and two overlying it Strip lines, one of which is the main coupler loop and one is the Auxiliary coupler loop is.
- Couplers provide, among other things, high-frequency components for cell phones or base stations represents the decoupling of RF signals between the output of a power amplifier and enable an antenna.
- the decoupled signal is used to Regulate output power of the amplifier.
- Such a coupler has two, for example Coupler loops on; one of which is the main loop and the transmit signal should be transmitted as losslessly as possible.
- the second loop the so-called secondary loop, decouples a small signal compared to the transmission signal.
- Such couplers are known in various embodiments.
- Multi-layer ceramic coupler With these ceramic couplers, the Electrode structures printed on ceramic foils, the foils are stacked and then sintered into components.
- the disadvantage of this printing process is the coarse-grained Morphology of the electrodes, which results in a higher electrical resistance Has.
- the invention has for its object an inexpensive, compact coupler to provide the same coupling at several frequencies.
- the object is achieved by a thin-film coupler with a carrier substrate and two strip lines above, one of which is the main coupler loop and one is the secondary coupler loop, in which a component is in the secondary coupler loop is integrated, which causes a phase shift in the frequency of the decoupled signal.
- Couplers usually show a strong frequency dependence of the coupling.
- the bandwidth of the coupling is larger.
- the thin film coupler is in the secondary coupler loop as a component that has a phase shift in the frequency of the output Signal causes a stripline integrated.
- the thin film coupler is in the Auxiliary coupler loop as a component that has a phase shift in the frequency of the decoupled signal causes a coil integrated.
- a coil can be easily integrated into the secondary coupler loop by also in stripline design and thus in the same process step as the best of the Auxiliary coupler loop is executed.
- a coil can also be used with the help of others Thin-film techniques are shown and then with the secondary coupler loop be contacted electrically.
- the thin-film coupler is in the Auxiliary coupler loop as a component that has a phase shift in the frequency of the decoupled signal causes a coil and a series or parallel capacitor integrated.
- a ceramic material is used as the material for the carrier substrate ceramic material with a planarization layer made of glass, a glass ceramic Material or a glass material is used.
- a carrier substrate made of these materials is inexpensive to manufacture and the process costs for this component can be low being held.
- each end of a coupler loop has one Power supply is in electrical contact.
- each component can be combined with other components Circuit are electrically connected.
- Component assembly can be a galvanic SMD end contact or a power supply Bump-end contact or a contact surface can be used. By using it Discrete components can be produced from SMD end contacts or bump-end contacts become.
- At least one protective layer over the thin film coupler applied from an inorganic material and / or an organic material is.
- the protective layer protects the component from mechanical stress and Corrosion protected by moisture.
- This metallic layer serves as the ground plane.
- the metallic layer is connected to at least one further power supply.
- a thin-film coupler has a carrier substrate 1, for example a ceramic material, a ceramic material with a planarization layer made of glass, a glass-ceramic material or a glass material contains.
- a main coupler loop 2 and a secondary coupler loop 3 are applied on the carrier substrate 1. Both loops can, for example, be of the stripline type and Cu, Al, Ag, Au or a combination of these metals.
- the secondary coupler loop 3 is a component 4 which shifts the frequency of the decoupled signal.
- four power leads 5 are attached to the thin-film coupler, each of which two power supplies connected to each other via one of the two coupler loops are.
- a galvanic SMD end contact for example, can be used as the power supply 5 Cr / Cu, Ni / Sn or Cr / Cu, Cu / Ni / Sn or Cr / Ni, Pb / Sn or a bump-end contact or a contact surface can be used.
- phase-shifting component 4 can also loop like the coupler are designed in stripline design and directly into the secondary coupler loop 3 can be integrated.
- the phase-shifting component 4 can, for example can also be produced using thin-film techniques and then with the secondary coupler loop 3 can be electrically contacted.
- the secondary coupler loop 3 is designed such that its length is one Phase shift.
- the secondary coupler loop 3 is designed with turns, so that it through their Form also acts as a coil and causes a phase shift.
- a protective layer made of an organic and / or inorganic material can be applied over the entire thin-film coupler.
- polybenzocyclobutene or polyimide can be used as the organic material and Si 3 N 4 , SiO 2 or Si x O y N z (0 ⁇ x 1 1, 0 y y 1 1, 0 z z 1 1), for example, can be used as the inorganic material .
- a metallic layer can be on the back of the carrier substrate 1 for example Cu contains to be applied.
- this metallic layer be connected to at least one further power supply.
- a main coupler loop 2 and a secondary coupler loop 3 made of Cu with a width of 115 ⁇ m were applied to a carrier substrate 1 made of Al 2 O 3 with a thickness of 0.43 mm.
- the distance between the main coupler loop 2 and the secondary coupler loop 3 is 35 ⁇ m.
- the length of the coupler path between the two coupler loops is divided into two 1.8 mm long sections, which were connected by a 20.5 mm long and 115 ⁇ m wide strip line.
- the stripline represents the phase-shifting component 4.
- a Cr / Cu, Cu / Ni / Sn SMD end contact is attached to each end of the two coupler loops as a power supply 5.
- IL stands for insertion loss
- C for Coupling
- RL reflection loss (return loss)
- I isolation.
- a main coupler loop 2 and a secondary coupler loop 3 made of Cu with a width of 115 ⁇ m were applied to a carrier substrate 1 made of Al 2 O 3 with a thickness of 0.43 mm.
- the distance between the main coupler loop 2 and the secondary coupler loop 3 is 35 ⁇ m.
- the length of the coupler path between the two coupler loops is divided into two 1.45 mm long sections, which are connected by a thin-layer coil with 5.3 turns, with an inner turn radius of 50 ⁇ m, a distance between the turns of 20 ⁇ m and a coil turn width of 30 ⁇ m.
- a Cr / Cu, Cu / Ni / Sn SMD end contact is attached as a power supply 5.
- IL stands for insertion loss
- C for Coupling (coupling)
- I for isolation.
- a main coupler loop 2 and a secondary coupler loop 3 made of Cu with a width of 115 ⁇ m were applied to a carrier substrate 1 made of Al 2 O 3 with a thickness of 0.43 mm.
- the distance between the main coupler loop 2 and the secondary coupler loop 3 is 35 ⁇ m.
- the length of the coupler path between the two coupler loops is divided into two 1.45 mm long sections, which were connected by a thin-film coil made of Cu with an inductance of 5.4 nH and a parallel-connected thin-film capacitor with a capacitance of 1 pF.
- the thin film capacitor contains a lower and an upper electrode made of Al and a dielectric made of Si 3 N 4 .
- a Cr / Cu, Cu / Ni / Sn SMD end contact is attached as a power supply 5.
- IL stands for insertion loss
- C for Coupling (coupling)
- I for isolation.
Landscapes
- Waveguide Connection Structure (AREA)
- Coils Or Transformers For Communication (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19915246 | 1999-04-03 | ||
DE19915246A DE19915246A1 (de) | 1999-04-03 | 1999-04-03 | Dünnschicht-Breitbandkoppler |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1047150A1 true EP1047150A1 (fr) | 2000-10-25 |
EP1047150B1 EP1047150B1 (fr) | 2002-09-04 |
Family
ID=7903499
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP00201151A Expired - Lifetime EP1047150B1 (fr) | 1999-04-03 | 2000-03-28 | Coupleur à bande large et à couche mince |
Country Status (4)
Country | Link |
---|---|
US (1) | US6600386B1 (fr) |
EP (1) | EP1047150B1 (fr) |
JP (1) | JP4264182B2 (fr) |
DE (2) | DE19915246A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009000434A1 (fr) * | 2007-06-25 | 2008-12-31 | Rohde & Schwarz Gmbh & Co. Kg | Coupleur orienté à netteté d'orientation compensée inductivement |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE50304801D1 (de) * | 2003-03-25 | 2006-10-05 | Audioton Kabelwerk Scheinfeld | Antennenkoppler und halterung für mobilfunkendgeräte |
JP4533243B2 (ja) * | 2005-05-27 | 2010-09-01 | 双信電機株式会社 | 方向性結合器 |
DE102005054348B3 (de) * | 2005-11-15 | 2007-03-15 | Atmel Duisburg Gmbh | Kopplungselement zur elektromagnetischen Kopplung von mindestens zwei Leitern einer Transmissionsleitung |
JP4782562B2 (ja) * | 2005-12-28 | 2011-09-28 | 東京計器株式会社 | 方向性結合器、空中線整合器及び送信機 |
JP5246301B2 (ja) * | 2011-06-14 | 2013-07-24 | 株式会社村田製作所 | 方向性結合器 |
JP5786902B2 (ja) * | 2013-06-26 | 2015-09-30 | 株式会社村田製作所 | 方向性結合器 |
JP5979402B2 (ja) * | 2015-07-17 | 2016-08-24 | Tdk株式会社 | 方向性結合器および無線通信装置 |
US11437695B2 (en) | 2019-03-13 | 2022-09-06 | KYOCERA AVX Components Corporation | Compact thin film surface mountable coupler having wide-band performance |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0298434A2 (fr) * | 1987-07-08 | 1989-01-11 | Siemens Aktiengesellschaft | Coupleur en quadrature selon la technique des couches minces |
US4800345A (en) * | 1988-02-09 | 1989-01-24 | Pacific Monolithics | Spiral hybrid coupler |
EP0522524A1 (fr) * | 1991-07-11 | 1993-01-13 | Siemens Telecomunicazioni S.P.A. | Coupleur directif hybridre à micro-onde, à constantes localisées et à sorties en quadrature |
EP0641037A1 (fr) * | 1993-08-31 | 1995-03-01 | Hitachi Ferrite Ltd. | Elément à hautes fréquences de type à ligne à bande |
US5410179A (en) * | 1990-04-05 | 1995-04-25 | Martin Marietta Corporation | Microwave component having tailored operating characteristics and method of tailoring |
US5818308A (en) * | 1995-11-16 | 1998-10-06 | Murata Manufacturing Co., Ltd. | Coupled line element |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4648087A (en) * | 1984-06-28 | 1987-03-03 | International Business Machines Corporation | Capacitive sensing employing thin film inductors |
US4999593A (en) * | 1989-06-02 | 1991-03-12 | Motorola, Inc. | Capacitively compensated microstrip directional coupler |
US5400002A (en) * | 1992-06-12 | 1995-03-21 | Matsushita Electric Industrial Co., Ltd. | Strip dual mode filter in which a resonance width of a microwave is adjusted and dual mode multistage filter in which the strip dual mode filters are arranged in series |
US5432487A (en) * | 1994-03-28 | 1995-07-11 | Motorola, Inc. | MMIC differential phase shifter |
-
1999
- 1999-04-03 DE DE19915246A patent/DE19915246A1/de not_active Withdrawn
-
2000
- 2000-03-28 DE DE50000436T patent/DE50000436D1/de not_active Expired - Lifetime
- 2000-03-28 EP EP00201151A patent/EP1047150B1/fr not_active Expired - Lifetime
- 2000-03-31 JP JP2000098133A patent/JP4264182B2/ja not_active Expired - Fee Related
- 2000-03-31 US US09/540,866 patent/US6600386B1/en not_active Expired - Lifetime
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0298434A2 (fr) * | 1987-07-08 | 1989-01-11 | Siemens Aktiengesellschaft | Coupleur en quadrature selon la technique des couches minces |
US4800345A (en) * | 1988-02-09 | 1989-01-24 | Pacific Monolithics | Spiral hybrid coupler |
US5410179A (en) * | 1990-04-05 | 1995-04-25 | Martin Marietta Corporation | Microwave component having tailored operating characteristics and method of tailoring |
EP0522524A1 (fr) * | 1991-07-11 | 1993-01-13 | Siemens Telecomunicazioni S.P.A. | Coupleur directif hybridre à micro-onde, à constantes localisées et à sorties en quadrature |
EP0641037A1 (fr) * | 1993-08-31 | 1995-03-01 | Hitachi Ferrite Ltd. | Elément à hautes fréquences de type à ligne à bande |
US5818308A (en) * | 1995-11-16 | 1998-10-06 | Murata Manufacturing Co., Ltd. | Coupled line element |
Non-Patent Citations (1)
Title |
---|
SEIICHI ARAI ET AL: "A 900MHZ 90 DEGREES HYBRID FOR QPSK MODULATOR", MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST,US,NEW YORK, IEEE, VOL. -, PAGE(S) 857-860, XP000260455 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009000434A1 (fr) * | 2007-06-25 | 2008-12-31 | Rohde & Schwarz Gmbh & Co. Kg | Coupleur orienté à netteté d'orientation compensée inductivement |
US8049575B2 (en) | 2007-06-25 | 2011-11-01 | Rohde & Schwarz Gmbh & Co. Kg | Directional coupler with inductively-compensated sharpness of directivity |
Also Published As
Publication number | Publication date |
---|---|
EP1047150B1 (fr) | 2002-09-04 |
DE50000436D1 (de) | 2002-10-10 |
DE19915246A1 (de) | 2000-10-05 |
JP2000315903A (ja) | 2000-11-14 |
US6600386B1 (en) | 2003-07-29 |
JP4264182B2 (ja) | 2009-05-13 |
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