EP0937269A1 - Disposition a centrage automatique de corps microstructures - Google Patents
Disposition a centrage automatique de corps microstructuresInfo
- Publication number
- EP0937269A1 EP0937269A1 EP97950040A EP97950040A EP0937269A1 EP 0937269 A1 EP0937269 A1 EP 0937269A1 EP 97950040 A EP97950040 A EP 97950040A EP 97950040 A EP97950040 A EP 97950040A EP 0937269 A1 EP0937269 A1 EP 0937269A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- recesses
- arrangement according
- bodies
- recess
- components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000463 material Substances 0.000 claims abstract description 12
- 238000004519 manufacturing process Methods 0.000 claims abstract description 10
- 238000013459 approach Methods 0.000 claims description 19
- 230000003287 optical effect Effects 0.000 claims description 9
- 239000012778 molding material Substances 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 101000802895 Dendroaspis angusticeps Fasciculin-1 Proteins 0.000 claims description 3
- 101000802894 Dendroaspis angusticeps Fasciculin-2 Proteins 0.000 claims description 3
- 101000611023 Homo sapiens Tumor necrosis factor receptor superfamily member 6 Proteins 0.000 claims description 3
- 102100040403 Tumor necrosis factor receptor superfamily member 6 Human genes 0.000 claims description 3
- 101100001764 Oryza sativa subsp. japonica ANS2 gene Proteins 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 18
- 239000000758 substrate Substances 0.000 abstract description 11
- 238000005516 engineering process Methods 0.000 abstract description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 11
- 229910052710 silicon Inorganic materials 0.000 description 11
- 239000010703 silicon Substances 0.000 description 11
- 239000013307 optical fiber Substances 0.000 description 8
- 210000002105 tongue Anatomy 0.000 description 8
- 238000003780 insertion Methods 0.000 description 5
- 230000037431 insertion Effects 0.000 description 5
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000969 carrier Substances 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 101100291267 Drosophila melanogaster Miga gene Proteins 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000011345 viscous material Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
Definitions
- the invention relates to an arrangement of microstructured bodies according to the preamble of claim 1.
- spherical lenses on silicon substrates can be used in pyramid-shaped recesses which have been produced with the aid of anisotropic etching processes.
- the ball lenses touch the etched recesses in only four points. Due to their simple geometric shape, spherical lenses can be manufactured very precisely at low cost.
- the arrangement is said to be self-centering, i.e. H. when one component is placed on top of the other, both components are to assume their final position on their own. At most, such displacements of the two components should be possible that have little or no effect on the function of the assembly.
- the arrangement is intended to make active adjustment steps when positioning the components superfluous or at least to keep them to a minimum.
- the invention is based on providing the components with lugs and corresponding recesses. It is now essential to design the lugs or the recesses or the connection between the two in such a way that (elastic or plastic) deformation occurs when the lugs are inserted into the recesses.
- the approaches and / or the recesses deform themselves when the approaches are inserted into the recesses.
- a molded material introduced between the neck and the recess deforms, for example. B. can be an adhesive.
- minor mismatches which are unavoidable depending on the manufacturing process, can be compensated for.
- one of the bodies is a silicon substrate into which pyramidal or V-shaped recesses are etched.
- the other body is a plastic component processed using LIGA technology, which has essentially wedge-shaped projections on its underside. The wedge-shaped lugs fit into the corresponding recesses in the silicon substrate.
- the top of the plastic part has holding structures that accommodate other components such as lenses, optical fibers, laser bars or guide pins for connector systems.
- the plastic part here acts as an intermediate carrier, which also allows components to be precisely positioned on a silicon carrier which, owing to their geometry, cannot be inserted or can only be inserted with difficulty into the recesses which can be produced by etching.
- Fig. 2 A support body TK with recesses AI and A2 for receiving the approaches of the lens body in a simplified perspective view (different scale than Fig. 1);
- 3a detailed drawing of an advantageous embodiment of the invention according to claim 2, state before the alignment of the body K2 with respect to the body Kl;
- 3b detailed drawing of the embodiment according to FIG. 3, body K2- aligned with Kl;
- Fig. 1 and Fig. 2 show a first embodiment of the invention.
- a lens body is shown, which was specially developed for the coupling of laser bars to optical fibers.
- the lens body has holes LH in which microlenses are inserted.
- the lenses can be worked out directly from the lens body LK.
- the lens body LK is provided with two approaches AN1 and AN2, the execution of which will be discussed below.
- the lens body LK is intended to be used in the carrier body TK shown in FIG. 2.
- the carrier body is a silicon substrate.
- a laser bar LR is attached to the carrier body with flip-chip bonds.
- a number of optical waveguide sections WL are applied to the surface of the carrier body TK.
- Optical fibers, which are guided in V-shaped etched trenches, can also take the place of the optical waveguides.
- the carrier body TK is provided with two recesses AI and A2. In the exemplary embodiment, these are V-shaped depressions that are anisotropically etched into a silicon substrate. The etching process is preferably divided into two stages, as z. B. in an article by A. Ambrosy et al.
- the recesses AI and A2 can lengthened in such a way that the lens body LK can be displaced in this direction, ie between the laser bar LR and the waveguide sections WL Such a displacement has relatively little effect on the coupling efficiency, but has the advantage that the requirements are met the accuracy of fit can be reduced.
- the carrier body TK also contains a trough-shaped recess W.
- the lens body LK partially projects into this inner recess W. This ensures that the optical axes of the lenses in the lens body LK run just above the surface of the carrier body.
- the exit openings of the semiconductor lasers and the entry openings of the optical waveguides are usually also located at this height. Without lowering the lenses to this height, both the optical waveguide and the laser bar would have to be arranged in an elevated manner, which would be associated with considerable difficulties.
- the shape of the approaches is explained in more detail below with reference to FIGS. 3a and 3b.
- the approach of the body K2 shown there consists of two wedge-shaped tongues ZI and Z2. If the material of the body K2 permits this, the tongues can move in the direction of the arrows P shown in FIG. 3a. When the projection formed from the two tongues is inserted into the recess A, the rigid flanks of the recess A exert forces on the tongues, so that the tongues yield inwards. If the material of the body K2 is elastic, the tongues ZI and Z2 press against the flanks of the recess A in the final position of the body K2 towards the body Kl.
- FIGS. 4a and 4b show an exemplary embodiment in which an attachment AN of a body K2 consisting of a deformable material is inserted into a non-yielding recess A of a body Kl.
- the approach AN has a curved boundary surface before insertion. The pressure exerted by the rigid recess A on insertion AN deforms it so that the stop AN touches the recess A in the area of a larger area.
- the recesses can also be designed such that they deform plastically or elastically when the lugs are inserted.
- the question here is less a deformability due to the shape, but rather due to the material properties.
- polymers have elastic or plastic properties that allow the formation of recesses that can be deformed according to the invention.
- FIG. 5 This self-centering process is shown schematically in FIG. 5.
- An approach AN of a body K2 protrudes into a symmetrical recess of a body Kl.
- the molding material FS introduced into the recess prior to insertion is partially displaced by the protruding attachment AN in such a way that a thin film is formed between the recess and the attachment AN. Since the film tends to assume a uniform thickness, as can be seen in FIG. 5, the attachment is centered very precisely in relation to the recess.
- An adhesive can be used particularly advantageously as the molding material. In the liquid state, the adhesive has plastic or elastic properties and thus supports self-centering. However, z. B. foils or silicone can be used.
- the arrangement of neck and recess is used only to position the body to be placed against the supporting body in a horizontal, ie. H. parallel to the surface of the supporting body.
- the vertical position is determined using suitably designed stops.
- Fig. 6 the embodiment shown in Fig. 5 is sketched again in the overview.
- the approaches ANl and AN2 protrude into the corresponding recesses of the supporting body Kl. Since a molding material is also introduced between the shoulders and the recesses here, the body K2 does not initially rest firmly on the body K1, so that the vertical position of the bodies relative to one another is not exactly determined.
- the body K2 is provided with two stops ANSI and ANS2. These stops are on the body Kl. As a result, the distance between the two bodies is precisely defined. Due to the symmetrical arrangement of the lugs or recesses, in this embodiment it is achieved that even with larger manufacturing tolerances the attached body K2 is exactly centered on the carrier body Kl.
- lugs and recesses of the body may be useful not to provide the lugs and recesses of the body with flat, but with curved surfaces.
- ceramics for example, micro-milling can be used to produce recesses that have the shape of a spherical section. This is shown in a lateral section in FIG. 7.
- the supporting body is not provided with recesses, but with approaches.
- the attached body accordingly has no lugs, but recesses. It is also possible that a body has both approaches and recesses.
- a particularly advantageous embodiment of the invention provides for an intermediate carrier to be fastened on a stable carrier, for example made of silicon or a ceramic, in the manner according to the invention.
- a stable carrier for example made of silicon or a ceramic
- the underside of the intermediate carrier is provided with approaches according to the invention, which are inserted into corresponding recesses in the stable carrier.
- Positioning structures are located on the top of the intermediate carrier, which serve to position other components in the correct position. These further components can be mechanical, optical, electrical or fluidic microstructures, for example.
- Fig. 8 shows an intermediate carrier K2, which is placed on a carrier Kl. On the upper side of the intermediate carrier there are recesses which receive optical fibers FAS1 and FAS2 in this example.
- the intermediate carrier K2 here consists of an elastically or plastically deformable material which yields when the comparatively hard optical fibers FAS1 and FAS2 are inserted into the corresponding recesses AI and A2.
- the intermediate carrier K2 thus acts as a kind of assembly platform for further components.
- the intermediate carrier also allows components to be arranged precisely with respect to one another, which are otherwise difficult or impossible to position and fasten on conventional semiconductor or ceramic carriers. If e.g. B. cuboid components are to be passively adjusted, the corresponding recesses in the carrier should also be cuboid. Such cuboid recesses cannot be produced in the usual carriers with the precision required for passive adjustment. With the insertion of an intermediate carrier, rectangular components can also be positioned reliably and with high precision, since the production of rectangular recesses, for example in plastic, using LIGA or related techniques.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
La présente invention concerne un arrangement à centrage automatique de corps microstructurés, en particulier de composants microoptiques sur l'un des substrats servant de support. C'est un procédé bien connu de doter les composants microoptiques de pièces ajoutées qui s'intègrent dans les cavités prévues à cet effet. La présente invention vise à améliorer l'orientation des composants (K1, K2) les uns par rapport aux autres de telle manière que, lorsque l'on introduit les pièces ajoutables (Z1, Z2) dans lesdites cavités (A), il en résulte une déformation. Cette déformation peut concerner les pièces ajoutées ou les cavités directement ou un matériau façonné situé entre les pièces ajoutées et les cavités. Cette déformation entraîne une amélioration des caractéristiques d'autocentrage. En outre, les tolérances de fabrication sont plus faciles à compenser. Lorsque le corps ne peut être pourvu d'une pièce ajoutable appropriée, on utilise un support intermédiaire, à savoir un corps plastique fabriqué par exemple selon la technique LIGA.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19644758 | 1996-10-29 | ||
DE19644758A DE19644758A1 (de) | 1996-10-29 | 1996-10-29 | Zentrieranordnung zum Positionieren von mikrostrukturierten Körpern |
PCT/EP1997/005968 WO1998019194A1 (fr) | 1996-10-29 | 1997-10-29 | Disposition a centrage automatique de corps microstructures |
Publications (1)
Publication Number | Publication Date |
---|---|
EP0937269A1 true EP0937269A1 (fr) | 1999-08-25 |
Family
ID=7810212
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP97950040A Withdrawn EP0937269A1 (fr) | 1996-10-29 | 1997-10-29 | Disposition a centrage automatique de corps microstructures |
Country Status (6)
Country | Link |
---|---|
US (1) | US6255724B1 (fr) |
EP (1) | EP0937269A1 (fr) |
JP (1) | JP2001516464A (fr) |
CA (1) | CA2270139A1 (fr) |
DE (1) | DE19644758A1 (fr) |
WO (1) | WO1998019194A1 (fr) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
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JP3403306B2 (ja) * | 1997-01-17 | 2003-05-06 | 古河電気工業株式会社 | 光モジュール |
US6095697A (en) * | 1998-03-31 | 2000-08-01 | Honeywell International Inc. | Chip-to-interface alignment |
DE19843164C2 (de) * | 1998-09-21 | 2000-11-23 | Harting Elektrooptische Bauteile Gmbh & Co Kg | Steckerteil für eine optische Steckverbindung |
DE19861139C2 (de) * | 1998-09-21 | 2001-03-08 | Harting Elektrooptische Bauteile Gmbh & Co Kg | Steckerteil für eine optische Steckverbindung |
EP1122567A1 (fr) | 2000-02-02 | 2001-08-08 | Corning Incorporated | Alignement passif utilisant un socle à surface inclinée |
DE10018546A1 (de) * | 2000-04-14 | 2001-10-25 | Koenig & Bauer Ag | Vorrichtung zur Fokussierung eines aus einer Glasfaser austretenden Laserstrahls |
DE10058074A1 (de) | 2000-11-23 | 2002-06-06 | Vitalij Lissotschenko | Verfahren zur Herstellung einer mikrooptischen Funktionseinheit |
US20020110328A1 (en) | 2001-02-14 | 2002-08-15 | Bischel William K. | Multi-channel laser pump source for optical amplifiers |
WO2002065600A2 (fr) * | 2001-02-14 | 2002-08-22 | Gemfire Corporation | Source de pompage laser a canaux multiples et procede d'emballage |
US6443631B1 (en) | 2001-02-20 | 2002-09-03 | Avanti Optics Corporation | Optical module with solder bond |
US6956999B2 (en) | 2001-02-20 | 2005-10-18 | Cyberoptics Corporation | Optical device |
US6546173B2 (en) | 2001-02-20 | 2003-04-08 | Avanti Optics Corporation | Optical module |
US6546172B2 (en) | 2001-02-20 | 2003-04-08 | Avanti Optics Corporation | Optical device |
US20050031291A1 (en) * | 2003-03-24 | 2005-02-10 | Renfeng Gao | Assembly of device components and sub-systems |
US20060108518A1 (en) * | 2004-11-15 | 2006-05-25 | Nsmc Holdings International Corp. Ltd. | Structure for calibrating packaging of electric micro-optic modules |
US7454105B2 (en) * | 2004-11-22 | 2008-11-18 | Avago Technologies Fiber Ip (Singapore) Pte. Ltd. | Passive alignment using elastic averaging in optoelectronics applications |
DE102004060197A1 (de) * | 2004-12-14 | 2006-07-06 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren und Vorrichtung zum Präzisionsausrichten und/oder Fügen von Bauteilen |
WO2007076888A1 (fr) * | 2005-12-30 | 2007-07-12 | Fci | Dispositif de couplage optique |
JP4730274B2 (ja) * | 2006-09-29 | 2011-07-20 | ソニー株式会社 | 光結合器、光コネクタ及びレセプタクル型光伝送モジュール |
DE102006059274A1 (de) * | 2006-12-13 | 2008-06-26 | Stein, Ralf | Verfahren zur Herstellung eines Bauteils für das Werk einer mechanischen Uhr |
WO2009002271A1 (fr) * | 2007-06-22 | 2008-12-31 | Agency For Science, Technology And Research | Agencement de plaquettes et procédé de fabrication de l'agencement de plaquettes |
US8270100B2 (en) * | 2009-11-03 | 2012-09-18 | Honeywell International Inc. | Optical component design for silicon optical bench |
JP2010097231A (ja) * | 2010-02-01 | 2010-04-30 | Furukawa Electric Co Ltd:The | アレイ導波路回折格子型光合分波器 |
EP2508925B1 (fr) | 2011-04-07 | 2013-06-12 | Rosenberger-OSI GmbH & Co. OHG | Système de couplage optique pour deux guides d'onde |
US20140086533A1 (en) * | 2012-09-27 | 2014-03-27 | Ezra GOLD | Method for alignment between two optical components |
JP5869686B2 (ja) * | 2012-09-27 | 2016-02-24 | 株式会社フジクラ | 光モジュール |
JP2014071228A (ja) * | 2012-09-28 | 2014-04-21 | Kyocera Corp | 光配線基板および光伝送モジュール |
DE102012112683A1 (de) * | 2012-12-19 | 2014-06-26 | Reichle & De-Massari Ag | Optische Leiterplatte |
JP6481381B2 (ja) * | 2015-01-21 | 2019-03-13 | 富士通株式会社 | レンズ間調整方法および光電混載基板 |
WO2016202357A1 (fr) * | 2015-06-15 | 2016-12-22 | Rwth Aachen | Auto-alignement pour appareil comprenant un dispositif photonique |
US11121053B2 (en) * | 2020-01-17 | 2021-09-14 | Asia Vital Components (China) Co., Ltd. | Die heat dissipation structure |
US11719891B2 (en) | 2020-08-05 | 2023-08-08 | Corning Research & Development Corporation | Method of making a lensed connector with photosensitive glass |
GB202017243D0 (en) | 2020-10-30 | 2020-12-16 | Npl Management Ltd | Chip assembly and method of making a chip assembly |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
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GB2191601A (en) * | 1986-06-12 | 1987-12-16 | Gen Electric Co Plc | Alignment of arrays of optical waveguides |
DE3728053A1 (de) * | 1987-08-20 | 1989-03-02 | Siemens Ag | Loesbarer mehrfach-spleissverbinder fuer lichtwellenleiter |
EP0343502A3 (fr) * | 1988-05-23 | 1991-04-17 | Lam Research Corporation | Méthode et système pour serrer des plaquettes semi-conductrices |
US5227663A (en) * | 1989-12-19 | 1993-07-13 | Lsi Logic Corporation | Integral dam and heat sink for semiconductor device assembly |
DE4012080A1 (de) * | 1990-04-14 | 1991-10-17 | Bosch Gmbh Robert | Verfahren zum aufbau von mikromechanischen sensoren |
JPH0534617A (ja) * | 1991-07-26 | 1993-02-12 | Minolta Camera Co Ltd | レーザビーム走査光学装置 |
CH685521A5 (fr) * | 1991-09-10 | 1995-07-31 | Suisse Electronique Microtech | Procédé pour coupler au moins une fibre optique avec un guide d'onde optique intégré et dispositif micromécanique de couplage obtenu. |
FR2694419B1 (fr) * | 1992-07-29 | 1994-09-02 | Cit Alcatel | Procédé de couplage d'une fibre optique à un composant sur un substrat commun. |
US5359686A (en) * | 1993-03-29 | 1994-10-25 | Motorola, Inc. | Interface for coupling optical fibers to electronic circuitry |
JP3117107B2 (ja) * | 1993-08-03 | 2000-12-11 | シャープ株式会社 | 光集積回路素子の組立構造 |
DE69421767T2 (de) * | 1993-08-09 | 2000-05-31 | Nippon Telegraph And Telephone Corp., Tokio/Tokyo | Optoelektronische Hybridintegrationsplattform, optisches Untermodul, optoelektronische hybridintegrierte Schaltung, und Herstellungsverfahren der Plattform |
JP2804723B2 (ja) * | 1994-11-29 | 1998-09-30 | 富士電気化学株式会社 | 光回路素子の光学部品組付け方法とそれに用いられる治具 |
US5432878A (en) * | 1994-03-03 | 1995-07-11 | Cts Corporation | Silicon carrier for testing and alignment of optoelectronic devices and method of assembling same |
DE4410740A1 (de) * | 1994-03-28 | 1995-10-05 | Bosch Gmbh Robert | Integriert optische Schaltung |
DE19504835C1 (de) * | 1995-02-14 | 1996-03-21 | Hewlett Packard Gmbh | Diodenzeilen-Spektralphotometer |
DE19508025A1 (de) * | 1995-03-07 | 1996-09-12 | Bosch Gmbh Robert | Verfahren zur Herstellung eines elektrooptischen Bauelements |
US5574628A (en) * | 1995-05-17 | 1996-11-12 | The Whitaker Corporation | Rigid PCMCIA frame kit |
JP2828055B2 (ja) * | 1996-08-19 | 1998-11-25 | 日本電気株式会社 | フリップチップの製造方法 |
JP3241639B2 (ja) * | 1997-06-30 | 2001-12-25 | 日本電気株式会社 | マルチチップモジュールの冷却構造およびその製造方法 |
-
1996
- 1996-10-29 DE DE19644758A patent/DE19644758A1/de not_active Withdrawn
-
1997
- 1997-10-29 EP EP97950040A patent/EP0937269A1/fr not_active Withdrawn
- 1997-10-29 US US09/297,042 patent/US6255724B1/en not_active Expired - Lifetime
- 1997-10-29 JP JP52005298A patent/JP2001516464A/ja active Pending
- 1997-10-29 WO PCT/EP1997/005968 patent/WO1998019194A1/fr not_active Application Discontinuation
- 1997-10-29 CA CA002270139A patent/CA2270139A1/fr not_active Abandoned
Non-Patent Citations (1)
Title |
---|
See references of WO9819194A1 * |
Also Published As
Publication number | Publication date |
---|---|
DE19644758A1 (de) | 1998-04-30 |
CA2270139A1 (fr) | 1998-05-07 |
WO1998019194A1 (fr) | 1998-05-07 |
JP2001516464A (ja) | 2001-09-25 |
US6255724B1 (en) | 2001-07-03 |
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