EP0731365B1 - Méthode de fabrication d'un dispositif électro-optique - Google Patents

Méthode de fabrication d'un dispositif électro-optique Download PDF

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Publication number
EP0731365B1
EP0731365B1 EP96102068A EP96102068A EP0731365B1 EP 0731365 B1 EP0731365 B1 EP 0731365B1 EP 96102068 A EP96102068 A EP 96102068A EP 96102068 A EP96102068 A EP 96102068A EP 0731365 B1 EP0731365 B1 EP 0731365B1
Authority
EP
European Patent Office
Prior art keywords
carrier plate
structures
forming die
metal layer
adjusting structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP96102068A
Other languages
German (de)
English (en)
Other versions
EP0731365A3 (fr
EP0731365A2 (fr
Inventor
Dietmar Dr.Phys. Hahn
Klaus-Michael Dr.Phys. Mayer
Peter Dr.Phys. Dannberg
Volker Phys. Scharrer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of EP0731365A2 publication Critical patent/EP0731365A2/fr
Publication of EP0731365A3 publication Critical patent/EP0731365A3/fr
Application granted granted Critical
Publication of EP0731365B1 publication Critical patent/EP0731365B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G02B6/1221—Basic optical elements, e.g. light-guiding paths made from organic materials
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3648—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures
    • G02B6/3652—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3684—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier
    • G02B6/3696—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier by moulding, e.g. injection moulding, casting, embossing, stamping, stenciling, printing, or with metallic mould insert manufacturing using LIGA or MIGA techniques

Definitions

  • the invention is based on a method of the generic type of the main claim.
  • a method of this type is known from the publication "Popcorn: A Novel Technology for Polymer Based Integrated Optics ", H. Kragl, 1993 ECIO-93, Neuchatel, conference proceedings.
  • a optical hybrid component first from a mold an optical waveguide structure on a waveguide substrate molded.
  • a semiconductor device here an indium phosphide (InP) detector chip, with plastic to a cover plate shed.
  • InP indium phosphide
  • Adjustment groove for this, the cover plate with the semiconductor chip exactly on the previously created waveguide substrate with the Position fiber optic structures.
  • For electrical supply of the semiconductor component are on arranged on its underside conductor tracks.
  • the concept of a Adjustment groove which is on the waveguide substrate existing counter-adjustment structures cooperates, permitted it, a semiconductor device precisely on one Adjust waveguide substrate.
  • For Training of the adjustment groove in the semiconductor device complex work step required.
  • the inventive method allows the production of electro-optical components with each other in a predetermined Way exactly assigned optical and electrical Structures.
  • the alignment with each other is done by a self-adjusting, mechanical technology.
  • Active Adjustment processes or photolithographic process steps are not mandatory.
  • the process is based on simple and inexpensive methods of plastic mass production, and allows a high degree of automation.
  • FIG. 1 shows a metallized carrier plate in the Section
  • Figure 2 is a mold with a machined Carrier plate in section
  • Figure 3 with a carrier plate galvanically reinforced conductor tracks in section
  • Figure 4 a section through a machined support plate with a engaged second mold
  • Figure 5 a Component before putting on a cover plate.
  • the starting point for the proposed procedure is how reproduced in Figure 1, a support plate 10 from Plastic, by evaporation or sputtering a thin metal layer 11 was applied over the entire surface.
  • the carrier plate 10 consists of a thermoplastic Material. Suitable materials are those which on the one hand, the conditions of manufacture, in particular in the metallization, as well as the one to be expected later Withstand the operating temperatures of the components. Examples for materials of this type are plexiglass (PMMA) or Polycarbonate.
  • the metallized carrier plate 10 On the surface of the metallized carrier plate 10 are, as indicated in Figure 2, by embossing with a Mold 12 electrical structures 16 as well Adjustment structures 18 created. Tears in places during embossing vertical edges 19 from the metal layer 11. This allows on the surface of the carrier plate 10th to generate any structures from the rest of the parts the carrier plate 10 are electrically insulated. Conductor tracks 16, as shown in Figure 2, by embossing the circumferential edges in the form of trenches 15 are generated. One remains between two trenches 15 insulated electrical surface, the conductor track 16. A modified form of this conductor path generation provides the entire area surrounding a conductor track 16 impress, and only the conductor track 16 are raised leave.
  • the adjustment structures 18 have because of it self-adjusting property preferably a V-shaped Cross-section. Of course, it is also possible any other cross sections.
  • the molding tool 12 used for the embossing step becomes expediently by micro-electroplating an Silicon wafers manufactured. Be on the silicon wafer here the electrical structures 16 and the Adjustment structures 18 defined photolithographically, and by known methods of microstructuring, such as dry or wet chemical etching. From finished wafer is then through galvanic impression produces a metallic replica that Molding tool 12. Its shape is the inverse of the structure later embossed into the carrier plate 10. As in As indicated in FIG. 2, it assigns battlements 14 in particular Generation of the trenches 15 and thus the conductor tracks 16 and an arrowhead-shaped counter-adjustment structure 13. When embossing, the thermoplastic can shrink Carrier plate 10 come. He is replaced by an appropriate one Provision when designing the structures of the mold 12 taken into account.
  • the existing metal layer 11 is another metal layer 21 applied with a desired thickness.
  • the same metal can be used for the layer 21 be like for the metal layer 11.
  • the formation of the Metal layer 21 can be made by selective etching different metals are made, thereby using etching solution systems used, which etch only a certain metal, or by differential etching, it is etched until the thin base metallization is removed, and only that galvanically reinforced structures with accordingly reduced layer thickness remain. Below remaining, not galvanically reinforced Components of the metal layer 11 in an etching step completely removed.
  • FIG. 4 illustrates the state of a Carrier plate after removing the non-reinforced Metal structures.
  • the galvanic can Reinforcing the conductor tracks 16 by applying the Metal layer 21 is eliminated.
  • a second molding tool 22 is then attached on the support plate 10 provided with electrical structures . It is expediently in the same way as the first molding tool 12 manufactured and in particular also has a arrowhead-shaped counter-adjustment structure 25, which is an accurate inverse image of the V-shaped embossed in the carrier plate 10 Adjustment structure 18 is. That also points Molding tool 2 also has a wall structure 23 rectangular cross section to create a Optical fiber channel, and a support beam 24. When bringing the prepared carrier plate 10 together the molding tool 2 takes the arrowhead-shaped Counter-adjustment structure 25 into that on the carrier plate 10 existing adjustment structure 18 and thus causes an exact Alignment of the molding tool 22 on the carrier plate 10.
  • the wall structure 23 becomes exact aligned to the conductor track 16, which in turn is defined to the adjustment structure 18.
  • the Support beam 24 ensures a defined distance between the wall structure 23, that is, the later Optical waveguide and the conductor track 16.
  • the carrier plate 10 and between the carrier plate 10 and forming tool 22 are space 28 then with a substrate material 17, advantageously one Potted plastic. This is done in a simple manner conventional reaction casting process used to to minimize a reaction shrinkage, advantageous under Pressure is performed.
  • the molding tool 22 is then cast from the Carrier plate removed. It arises, as in FIG. 5 reproduced, an arrangement with internal Carrier plate 10 from a waveguide substrate 26 Plastic 17 is bordered. Points to an upper side the waveguide substrate 26 one into the carrier plate 10 descending V-groove and one from the wall structure 23 of the molding tool 22 molded channel 29. Exactly below the channel 29 is the inside Trace 16.
  • Channel 29 is now used as core material for training an optical fiber 27 a prepolymer, the Refractive index is higher than that for producing the Waveguide substrates 26 used substrate material 17, filled and then networked. Doing so at the same time a cover plate 30 on the arrangement pressed on, which displaces excess prepolymer and the resulting optical fiber 27 covered upwards becomes.
  • the method step is illustrated in FIG. 5.
  • the resulting after placing the cover plate 30 Component with exactly assigned optical fibers27 and conductor track structures 16 are suitable, for example as a thermally controlled optical switch. Is a Provided fiber optic coupling, the fibers are in front of the Filling the prepolymer into the channel 29 into the V-grooves 31 to insert.
  • the by molding the support beam 24 in Waveguide substrate 26 has formed for the recess Function of the component has no meaning. It can be empty left, together with the channel 29 with a prepolymer filled, or after the end of manufacture of the component be separated.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Integrated Circuits (AREA)

Claims (7)

  1. Procédé de fabrication d'un composant électro-optique comprenant une plaque de support recevant des structures électriques et un substrat de guide d'onde dans lequel est moulé un guide d'onde optique,
    caractérisé par
    les étapes opératoires suivantes :
    application des structures électriques (16) et des structures d'ajustage (18) sur la plaque de support (10),
    mise en place d'une matière de support (17) sur la plaque de support (10),
    moulage avec un moule (22) pour former les canaux des guides d'onde optiques (29) dans la matière du substrat (17), le moule (22) comportant une structure d'ajustage complémentaire (25) coopérant avec la structure d'ajustage (18) de la plaque de support (10), et par laquelle se fait l'alignement sur la plaque de support (10).
  2. Procédé selon la revendication 1,
    caractérisé en ce qu'
    on réalise la structure d'ajustage (18) et les structures électriques (16) sur la plaque de support (10) par matriçage.
  3. Procédé selon la revendication 1,
    caractérisé en ce qu'
    on réalise la structure d'ajustage (18) et les structures électriques (16) avec le même moule (12).
  4. Procédé selon la revendication 2,
    caractérisé en ce que
    la plaque de support (10) reçoit une mince couche métallique (11) avant son matriçage.
  5. Procédé selon la revendication 2,
    caractérisé en ce que
    les structures électriques (16) sont renforcées galvaniquement.
  6. Procédé selon la revendication 1,
    caractérisé en ce qu'
    on applique la matière du substrat (17) par coulée.
  7. Procédé selon la revendication 6,
    caractérisé en ce que
    la mise en forme par le moule (22) pour réaliser les canaux de guide de lumière (29) se fait par coulée.
EP96102068A 1995-03-07 1996-02-13 Méthode de fabrication d'un dispositif électro-optique Expired - Lifetime EP0731365B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19508025A DE19508025A1 (de) 1995-03-07 1995-03-07 Verfahren zur Herstellung eines elektrooptischen Bauelements
DE19508025 1995-03-07

Publications (3)

Publication Number Publication Date
EP0731365A2 EP0731365A2 (fr) 1996-09-11
EP0731365A3 EP0731365A3 (fr) 1997-07-30
EP0731365B1 true EP0731365B1 (fr) 1998-12-23

Family

ID=7755910

Family Applications (1)

Application Number Title Priority Date Filing Date
EP96102068A Expired - Lifetime EP0731365B1 (fr) 1995-03-07 1996-02-13 Méthode de fabrication d'un dispositif électro-optique

Country Status (2)

Country Link
EP (1) EP0731365B1 (fr)
DE (2) DE19508025A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19644758A1 (de) * 1996-10-29 1998-04-30 Sel Alcatel Ag Zentrieranordnung zum Positionieren von mikrostrukturierten Körpern
SE508068C2 (sv) * 1996-12-19 1998-08-24 Ericsson Telefon Ab L M Mikroreplikering i metall
DE19721721B4 (de) * 1997-05-23 2007-08-30 Robert Bosch Gmbh Verfahren zur Herstellung thermooptischer Schaltelemente
DE19738589A1 (de) * 1997-09-03 1998-12-03 Siemens Ag Leiterplatte mit einem isoleirenden Trägersubstrat und einer Leiterbahnstruktur
DE10147876B4 (de) * 2001-09-28 2005-05-25 Siemens Ag In Leiterplatten einzubettende optische Leiter
DE102008040882A1 (de) * 2008-07-31 2010-02-04 Robert Bosch Gmbh Verfahren zum Heißprägen mindestens einer Leiterbahn auf ein Substrat, Substrat mit mindestens einer Leiterbahn sowie Prägestempel

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5093883A (en) * 1991-04-26 1992-03-03 Hoechst Celanese Corp. Nonlinear optically responsive polymeric waveguides
DE4206328A1 (de) * 1992-02-29 1993-09-02 Sel Alcatel Ag Verfahren zur herstellung optoelektronischer bauelemente

Also Published As

Publication number Publication date
DE59601021D1 (de) 1999-02-04
DE19508025A1 (de) 1996-09-12
EP0731365A3 (fr) 1997-07-30
EP0731365A2 (fr) 1996-09-11

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