EP0713233B1 - Agencement d'un relais avec un adaptateur à fiches et procédé pour la fabrication de cet agencement - Google Patents

Agencement d'un relais avec un adaptateur à fiches et procédé pour la fabrication de cet agencement Download PDF

Info

Publication number
EP0713233B1
EP0713233B1 EP95116492A EP95116492A EP0713233B1 EP 0713233 B1 EP0713233 B1 EP 0713233B1 EP 95116492 A EP95116492 A EP 95116492A EP 95116492 A EP95116492 A EP 95116492A EP 0713233 B1 EP0713233 B1 EP 0713233B1
Authority
EP
European Patent Office
Prior art keywords
base
relay
conductor segments
arrangement according
arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP95116492A
Other languages
German (de)
English (en)
Other versions
EP0713233A3 (fr
EP0713233A2 (fr
Inventor
Horst Hendel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of EP0713233A2 publication Critical patent/EP0713233A2/fr
Publication of EP0713233A3 publication Critical patent/EP0713233A3/fr
Application granted granted Critical
Publication of EP0713233B1 publication Critical patent/EP0713233B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00—Details of electromagnetic relays
    • H01H50/02—Bases; Casings; Covers
    • H01H50/04—Mounting complete relay or separate parts of relay on a base or inside a case
    • H01H50/047—Details concerning mounting a relays
    • H01H50/048—Plug-in mounting or sockets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/6608—Structural association with built-in electrical component with built-in single component
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R31/00—Coupling parts supported only by co-operation with counterpart
    • H01R31/06—Intermediate parts for linking two coupling parts, e.g. adapter
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00—Details of electromagnetic relays
    • H01H50/02—Bases; Casings; Covers
    • H01H50/021—Bases; Casings; Covers structurally combining a relay and an electronic component, e.g. varistor, RC circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/52—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
    • H01R13/5216—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases characterised by the sealing material, e.g. gels or resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/6608—Structural association with built-in electrical component with built-in single component
    • H01R13/6616—Structural association with built-in electrical component with built-in single component with resistor

Definitions

  • the invention relates to the arrangement of a relay with one Terminal pins emerging from the bottom and one below the plug adapter lying on the bottom, the adapter has an insulating base, in which conductor segments of a lead frame in a plane parallel to the bottom side are attached, the conductor segments each having contact recesses for integral contacting, in particular Solder contact, the pins and also each connecting lugs bent in one piece perpendicular to the bottom side exhibit.
  • the invention also relates to a Method for producing such an arrangement.
  • connection elements of relays are provided according to the Purpose designed, either as solder pins for direct soldering of the relay into a printed circuit board or as a flat plug for plug contacting in a socket. Jacks have also been known for a long time, which are soldered into a circuit board using solder pins and on their top sockets for receiving a pluggable Have relays.
  • relays that originally for use on printed circuit boards with solder connections were designed to also be pluggable to be used alongside others pluggable components and relays in boxes with sockets to be able to use.
  • USB-A-4,400,761 the relay, optionally with others Components, on a small circuit board in one Housing, which then internal connections from the circuit board has a socket with plugs.
  • a however, such an arrangement does not only require a complex one Assembly work and a much larger volume than the relay alone, it is also inconvenient for switching larger ones Currents due to the long cable routes over the circuit board to the base.
  • the aim of the present invention is therefore to provide a soldering relay transform into a pluggable arrangement, this arrangement can be achieved with as little assembly effort as possible and has the smallest possible dimensions.
  • Plug connections are used to carry high currents, and a high stability of the combined arrangement should can also cope with high insertion forces.
  • this goal is achieved with an arrangement of a Relay and an adapter of the type mentioned above achieved that the terminal lugs of the adapter as a flat plug are designed so that both the space between the bottom of the relay and the base as well Exit area of the flat plug on the underside of the Base are surrounded by a peripheral wall and that at least the exit area is filled with potting compound.
  • the terminal lugs of the adapter as a flat plug are designed so that both the space between the bottom of the relay and the base as well Exit area of the flat plug on the underside of the Base are surrounded by a peripheral wall and that at least the exit area is filled with potting compound.
  • the base itself is on its towards the relay Top and bottom of each one Surrounded peripheral wall, so that the outlet area of the Flat plug, whose conductor segments are inserted into the base or can be anchored by embedding, by one additional potting not only sealed, but also is stabilized.
  • the entire adapter arrangement with the results in soldered or welded relays thus a uniformly compact new part that is easy to handle and also suitable for operations with high insertion forces is.
  • the peripheral wall of the base can be integrally formed on it be so that it goes to the top as well as the bottom each is trough-shaped. In this case it is expedient that the upper edge of the peripheral wall the lower Edge of a housing cap of the relay overlaps.
  • the gap between relay and base including the overlap gap can also be filled with potting compound be, which gives the whole arrangement extra stability receives. In this case, the relay itself has to be activated beforehand be closed so far that the potting compound is not in the Relay interior can run. But it is also possible to use the peripheral wall to be designed on the base as an extension of a relay cap, so that by potting the base of the base too the gap between the extended relay cap and the Socket is sealed. The space between relay and base is automatically sealed; but he can also in in this case, additionally filled with casting compound for stabilization become.
  • An advantageous method for producing an inventive The arrangement consists in that a lead frame with preformed, conductor segments connected by intermediate webs and also with preformed tabs in one Base - by inserting or embedding - is pre-fixed, that the intermediate webs are then separated out, that further a relay with pins on the base and the Connection pins are integrally connected to the conductor segments, preferably soldered, and that eventually one enclosed by a peripheral wall in the area of the base Cavity is filled with potting compound. It would also be conceivable instead of a one-piece or two-piece lead frame Intermediate bars previously separated conductor segments in the Embed base material, which, however, requires additional effort Holding the individual parts in the injection mold would require.
  • this type of embedding would have the advantage that on finished base no separating processes for intermediate webs required would be and the finished base next to the contact recesses would have no other breakthroughs; then that would be advantageous if, for example, the relay itself on the bottom would not be closed and the flow of Potting compound in the gap to the relay can be prevented should.
  • Relay 1 has a housing with one from above attached housing cap 11 and a the bottom of the Relay-forming base plate 12, through the solder pins 13 exit vertically downwards. Via a channel or rib system 14, the bottom of the relay is sealed with resin.
  • the adapter 2 comprises a base 20 with a base plate 21, on one of which runs all around, up and down protruding peripheral wall 22 is formed. So forms the peripheral wall 22 a cavity 23 open to the underside, in which a lead frame 24 with several preformed conductor segments 25 and bent down flat tabs 26 inserted becomes.
  • Each conductor segment 25 has at least one Soldering recess 27 for inserting and soldering a connector pin 13 from relay 1 or from an additional component, and each conductor segment 25 is also integral with a flat connector 26 connected.
  • These flat plugs can have different widths, depending on whether they are for Carrying load current or only for carrying a smaller one Coil current are required.
  • All conductor segments are in the assembly state shown in FIG. 1 still over intermediate webs 28 to the one-piece Punching grid 24 connected, which is the only part in the Socket 20 is inserted.
  • the tabs 26 each inserted into pockets with holding ribs 29 on both sides grasp the tabs and pre-fix them.
  • the base 20 has chambers 30 open to the top to accommodate additional components, such as resistors 3, for example for extinguishing the relay coil to serve.
  • the base 20 is first made with the one-piece Stamped grid 24 equipped, so the tabs 26 can be pre-fixed on the holding ribs 29 mentioned.
  • This state is in Figure 2 in a perspective view shown from below.
  • the intermediate webs 28 can now be separated.
  • recesses 32 are provided in the base plate 21.
  • the base is now equipped with the resistors 3 by these inserted into the chambers 30 and their connecting wires inserted into associated soldering recesses 27 via depressions 34 become.
  • a base equipped in this way is shown in FIG. 3.
  • Relay 1 is now placed on this base from above, the pins 13 in corresponding solder recesses 27 of the associated conductor segments inserted become. These pins 13 and the lead wires 31st are then soldered with their conductor segments. After that becomes the cavity 23 formed on the underside of the base filled with potting compound.
  • This potting compound also penetrates the Gap between the bottom plate 12 of the relay and the Base one.
  • the upper edge 33 the circumferential wall of the base engages around the housing cap 11, is now the gap formed between the two also sealed by the sealing compound.
  • the open-topped chambers 30 are not or only partially in this process filled with potting compound as the air cannot escape. This avoids that the resistors 3 completely embedded and exposed to unwanted voltages. In this way, the arrangement forms a stable in itself new component, as shown in Figure 4.
  • the Potting the cavity 23 are at the bottom of the base
  • the tabs in the base are so stabilized that they are also able to absorb large insertion forces.
  • Figures 5 and 6 show a slightly modified embodiment.
  • the relay 1 is without a housing cap 11 only equipped with its bottom plate 12.
  • the Housing cap 11 of the relay down an extension in Shape of a collar 15.
  • the base 40 is only one in this embodiment
  • Base plate 41 is formed without a circumferential peripheral wall, and by overmolding a lead frame 24, which at this example as well with preformed conductor segments 25 and tabs 26 is designed as in the previous one Example.
  • This lead frame 24 is therefore initially during assembly overmolded with plastic around the rimless base 40 to win.
  • the board segments by removing the intermediate webs 28 as in the previous Example isolated from each other.
  • Figure shows this condition 5.
  • the base plate 41 is constructed exactly as the previously described base plate 21, for example provided with chambers 30 for receiving the resistors 3.
  • the relay 1 without Cap placed on the base 40, and as before, the Pins 13 and the leads 31 soldered.
  • This one The state is shown in Figure 6.
  • the housing cap 11 is now inserted, the collar 15 surrounds the base and in turn on the underside forms a cavity which is filled with potting compound.
  • FIG. 7 Here becomes a relay 1, as in Figure 1 with a housing cap and a base plate is closed with an adapter connected, the from a base plate, not shown, and there is a lead frame 44.
  • the base plate is essentially designed as the base plate 41 in Figure 5, wherein the lead frame is preferably embedded.
  • the single ones Conductor segments 45 are preferably after embedding freely separated, as also described with reference to FIG. 5 is. However, it would also be conceivable to cut it free beforehand Embedding the individual parts. Unlike the previous ones Exemplary embodiments are those with the conductor segments 45 connected tab 46 but not perpendicular from the Bottom side down, but perpendicular from the bottom side bent upwards along the outside of relay 1.
  • the lead frame 44 embedded in the material of the base plate, if possible without overhang on the bottom side.
  • Resistors 3 or other components in chambers the base plate is positioned and relay 1 is attached.
  • a frame is now used Cuff 47, which is only indicated by dashed lines, over the tabs on the side of the housing cap 11 postponed, and only up to the bottom of the relay.
  • the pins 13 and the lead wires 31 easily accessible in the recesses of the conductor segments, see above that the soldering is also done by dipping in a solder bath can be.
  • sleeve 47 a cap closed on one side from the top of the relay (with corresponding openings for the flat plug) or to slide open from the bottom of the adapter and shed. It should also be noted that the invention not to a certain way of contacting the relay pins is limited. In the examples described a soldered connection, this could but also, for example, through a gentle welding process be replaced.

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Claims (18)

  1. Agencement d'un relais (1), comportant des broches (13) de connexion sortant d'un côté de fond, et d'un adaptateur (2) à fiches situé en dessous du côté de fond, l'adaptateur comportant un socle (20; 40) isolant, dans lequel des segments (25; 45) conducteurs d'un grillage (24; 44) estampé sont fixés dans un plan parallèle au côté de fond, les segments conducteurs comportant respectivement des évidements (27) de brasage pour la mise en contact par liaison de matière, notamment pour la mise en contact par brasage, des broches (13) de connexion, et comportant en outre des talons (26; 46) de connexion recourbés chacun d'un seul tenant perpendiculairement au côté de fond, caractérisé en ce que les talons de connexion de l'adaptateur sont réalisés sous la forme de fiches (26; 46) plates, en ce que tant l'espace intermédiaire entre le côté de fond du relais (1) et le socle (20; 40) que la région (23) de sortie des fiches plates sur le dessous du socle (20 ; 40) sont entourés par une paroi (22 ; 15) périphérique, et en ce qu'au moins la région (23) de sortie est remplie de masse de scellement.
  2. Agencement suivant la revendication 1, caractérisé en ce que les segments (25) conducteurs sont respectivement positionnés dans le socle (20) par fixation par emboítement, et sont immobilisés et stabilisés par la masse de scellement.
  3. Agencement suivant la revendication 2, caractérisé en ce que les segments (25) conducteurs ou encore les fiches (26) plates reliées à ces segments sont positionnés sur le dessous du socle (20) au moyen de nervures (29) de maintien solidairement formées.
  4. Agencement suivant la revendication 1, caractérisé en ce que les segments (25 ; 45) conducteurs sont partiellement incorporés dans le matériau isolant du socle (40).
  5. Agencement suivant l'une des revendications 1 à 4, caractérisé en ce que la paroi (22) périphérique est formée sur le socle (20).
  6. Agencement suivant la revendication 5, caractérisé en ce que la paroi (22) périphérique recouvre par son bord (33), dans la région du dessus du socle, un capuchon (11) de boítier du relais (1).
  7. Agencement suivant l'une des revendications 1 à 4, caractérisé en ce que la paroi (15) périphérique est réalisée solidairement sous forme de collet (15) d'un capuchon (11) de boítier du relais (1).
  8. Agencement suivant l'une des revendications 1 à 7, caractérisé en ce qu'au moins un composant (3) supplémentaire est disposé dans le socle (20; 40) isolant, et est relié par l'intermédiaire de fils (31) de connexion aux segments (25 ; 45) conducteurs, notamment par brasage.
  9. Agencement suivant la revendication 8, caractérisé en ce que le socle (20; 40) comporte au moins une chambre (30) formée dans ce socle pour recevoir le composant (3).
  10. Agencement suivant l'une des revendications 1 à 4, caractérisé en ce que les fiches (46) plates sont respectivement recourbées perpendiculairement vers le haut à partir du plan du socle et s'étendent, le long d'un ou plusieurs côtés extérieurs du relais (1), jusque au-delà du dessus du relais, de sorte que ce dessus forme un côté de connexion enfichable de l'agencement.
  11. Agencement suivant la revendication 10, caractérisé en ce que les fiches (46) plates recourbées vers le haut sont entourées, au moins dans la région du socle, par une manchette (47) en forme de cadre, emmanchée sur le relais, manchette qui forme la paroi périphérique dans la région du socle et qui, sur le côté de fond du socle, forme avec ce dernier une région (48) d'étanchéité en forme de cuve, remplie de masse de scellement.
  12. Procédé de fabrication d'un agencement suivant l'une des revendications 1 à 11, caractérisé
    en ce qu'un grillage (24; 44) estampé, pourvu de segments (25; 45) conducteurs préformés solidarisés par des nervures (28) intermédiaires et de fiches (26; 46) plates également préformées est préalablement immobilisé dans un socle (20 ; 40),
    en ce que les nervures (28) intermédiaires sont ensuite détachées, en ce qu'un relais (1) pourvu de broches (13) de connexion est en outre posé sur le socle (20 ; 40), et les broches de connexion sont reliées aux segments (25 ; 45) conducteurs par liaison de matière, notamment par brasage,
    et en ce que, enfin, une cavité (23 ; 48), entourée par une paroi (22 ; 15 ; 47) périphérique dans la région du socle, est remplie de masse de scellement.
  13. Procédé suivant la revendication 12, caractérisé en ce que l'immobilisation préalable du grillage (24) estampé s'effectue par emboítement de parties des segments (25) conducteurs ou encore des fiches (26) plates dans des poches préformées ou encore entre des nervures (29) préformées du socle (20).
  14. Procédé suivant la revendication 12, caractérisé en ce que l'immobilisation préalable du grillage (24) estampé s'effectue par une incorporation partielle dans la matière isolante du socle (40).
  15. Procédé suivant l'une des revendications 12 à 14, caractérisé en ce que, lorsqu'on utilise un relais (1) pourvu d'un capuchon (11) de boítier, une paroi (22) périphérique formée sur le socle (20) est emboítée en recouvrement sur le bord inférieur du capuchon (11) de boítier, et en ce que, par le scellement de la cavité (12) dans la région du socle (20), la fente entre la paroi (22) périphérique et le capuchon (11) de boítier est également rendue étanche.
  16. Procédé suivant l'une des revendications 12 à 14, caractérisé
    en ce qu'un relais (1) sans capuchon de boítier est assemblé au socle (40),
    en ce qu'on emboíte ensuite sur l'agencement un capuchon (11) de boítier d'une hauteur telle qu'il entoure le relais (1) et, par un collet (15) solidairement formé, le socle (40), et qu'il forme dans la région du socle, en tant que paroi périphérique, la cavité qui est ensuite remplie de masse de scellement.
  17. Procédé suivant l'une des revendications 12 à 14, caractérisé
    en ce qu'un relais (1) entouré par un boítier est assemblé à un adaptateur comportant un socle et un grillage (44) estampé, adaptateur qui comporte des fiches (46) plates recourbées vers le haut suivant la revendication 10,
    en ce que, en enfilant une manchette (47) en forme de cadre, les fiches (46) plates sont ensuite immobilisées sur la périphérie du relais,
    en ce que les broches (13) de connexion du relais sont ensuite assemblées aux segments (45) conducteurs du grillage (44) estampé,
    et en ce que, enfin, une cavité (48) formée par la manchette (47) dans la région du socle est remplie de masse de scellement.
  18. Procédé suivant la revendication 17, caractérisé en ce que la manchette (47), avant l'assemblage par liaison de matière des broches (13) de connexion, n'est enfilée que jusqu'au dessous du relais, et n'est déplacée en saillie par rapport au dessous du socle qu'après l'opération d'assemblage, afin de former la cavité (48) en forme de cuve destinée à recevoir la masse de scellement.
EP95116492A 1994-10-24 1995-10-19 Agencement d'un relais avec un adaptateur à fiches et procédé pour la fabrication de cet agencement Expired - Lifetime EP0713233B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4437954 1994-10-24
DE4437954A DE4437954C1 (de) 1994-10-24 1994-10-24 Anordnung eines Relais mit einem Steckadapter und Verfahren zur Herstellung dieser Anordnung

Publications (3)

Publication Number Publication Date
EP0713233A2 EP0713233A2 (fr) 1996-05-22
EP0713233A3 EP0713233A3 (fr) 1998-03-04
EP0713233B1 true EP0713233B1 (fr) 1999-09-29

Family

ID=6531555

Family Applications (1)

Application Number Title Priority Date Filing Date
EP95116492A Expired - Lifetime EP0713233B1 (fr) 1994-10-24 1995-10-19 Agencement d'un relais avec un adaptateur à fiches et procédé pour la fabrication de cet agencement

Country Status (4)

Country Link
US (1) US5579211A (fr)
EP (1) EP0713233B1 (fr)
JP (1) JPH08255543A (fr)
DE (2) DE4437954C1 (fr)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19707709C1 (de) * 1997-02-26 1998-04-16 Siemens Ag Leiterplatte für elektrische Schaltungen und Verfahren zur Herstellung einer solchen Leiterplatte, sowie Anordnung einer Leiterplatte auf einem Stecksockel
DE19813530A1 (de) * 1998-03-26 1999-10-07 Siemens Ag Schallreduziertes Relais
DE19940347B4 (de) * 1999-08-25 2006-06-08 Siemens Ag Elektrische Verbindungsvorrichtung zum Aufsetzen auf Anschlußstifte eines elektrischen Bausteins
DE19956498C2 (de) * 1999-11-24 2002-08-14 Tyco Electronics Logistics Ag Anordnung eines Relais mit einem Adaptersockel
TWI243636B (en) * 2004-06-10 2005-11-11 Delta Electronics Inc Assembling structure of electronic apparatus and assembling method therefor
DE102004032737B3 (de) * 2004-07-07 2006-01-12 Tyco Electronics Amp Gmbh Relais, insbesondere für Steckmontage, und Verfahren zu dessen Herstellung
JP2007123314A (ja) * 2005-10-25 2007-05-17 Yazaki Corp リレーモジュール及び電装ユニット
CA2880493A1 (fr) * 2012-08-21 2014-02-27 Yazaki Corporation Dispositif de composant electronique, structure de connexion entre le dispositif de composant electronique et raccord de terminal et boite de connexion electrique comportant le dispositif de composant electronique
WO2014142246A1 (fr) 2013-03-14 2014-09-18 矢崎総業株式会社 Structure d'assemblage de composant électronique et boîtier de jonction
US9159514B2 (en) * 2013-11-18 2015-10-13 Tyco Electronics Corporation Relay connector assembly for a relay system
CN104112627A (zh) * 2014-07-21 2014-10-22 赵士立 一种电柜箱电路接触器
JP6413553B2 (ja) * 2014-09-26 2018-10-31 富士電機株式会社 パワー半導体モジュール装置
CN106128858B (zh) * 2016-08-24 2018-01-30 宁波汇洲电器有限公司 一种静音电磁继电器及其组装方法
FR3062948B1 (fr) * 2017-02-16 2020-12-11 Electricite De France Ensemble constitue d'un relais et d'un adaptateur

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3714515A (en) * 1971-09-20 1973-01-30 Gen Electric Housing assembly of modular construction for solid state relays with plural external terminals
US3809965A (en) * 1973-03-26 1974-05-07 Square D Co Solid state relay and timer housing means
US3949276A (en) * 1974-02-15 1976-04-06 Elmeg Elektro-Mechanik Gmbh Plug-in type relay
DE2618317C2 (de) * 1976-04-27 1982-09-30 Brown, Boveri & Cie Ag, 6800 Mannheim Adapter zur Verbindung elektromagnetischer Schaltgeräte mit gedruckten Leiterplatten
DE2810511C2 (de) * 1978-03-10 1984-06-07 Siemens AG, 1000 Berlin und 8000 München Adapter für ein elektrisches Bauelement, insbesondere für ein Relais, und Verfahren zu dessen Herstellung
JPS5797347U (fr) * 1980-12-05 1982-06-15
US4361371A (en) * 1980-12-08 1982-11-30 Amf Incorporated Packaging of solid state relay
CA1171441A (fr) * 1981-06-12 1984-07-24 Rodney Hayden Relais compact
DE3425312A1 (de) * 1984-07-10 1986-01-16 Stribel GmbH, 7443 Frickenhausen Elektromagnetisches relais

Also Published As

Publication number Publication date
EP0713233A3 (fr) 1998-03-04
EP0713233A2 (fr) 1996-05-22
DE4437954C1 (de) 1996-02-08
JPH08255543A (ja) 1996-10-01
US5579211A (en) 1996-11-26
DE59506944D1 (de) 1999-11-04

Similar Documents

Publication Publication Date Title
DE102017220054B4 (de) Elektrischer Steckverbinder für Leiterplatten und Herstellungsverfahren desselben
DE3940880C2 (fr)
EP0634888B1 (fr) Unité enfichable, en particulier module de relais pour véhicules automobiles
DE69909311T2 (de) Zweiteiliger mikroelektronischer stecker und methode
DE19841232C2 (de) Buchsenkontakt für elektrische Stecker
EP0713233B1 (fr) Agencement d'un relais avec un adaptateur à fiches et procédé pour la fabrication de cet agencement
DE10035893C2 (de) Verbindungssteckersystem
DE2259358A1 (de) Kontakt zum aufnehmen eines kontaktstiftes
DE4210979C2 (de) Wasserdichtes Gehäuse
DE3435822C2 (de) Klinkensteckbuchse mit eingebetteten Kontaktelementen
DE4312776C2 (de) Fassung für elektrische Betriebsmittel
DE10121654A1 (de) Kästchenförmiger Kontakt mit Beanspruchungsbegrenzung
DE19632821C2 (de) Verdrahtungsplatte für elektrische Verbindungen
EP1199913A2 (fr) Méthode de fabrication d'unités comprenant une feuille de circuit et un boítier de support
DE4310369C2 (de) Kontaktsatz für einen Steckverbinder
EP0495778B1 (fr) Connecteur de filtrage
DE2835963A1 (de) Elektromagnetisches relais
DE2723201A1 (de) Elektrisches bauelement mit winkeladapter und verfahren zu dessen herstellung
DE10109584C2 (de) Elektronische Schaltungsvorrichtung
DE102004019613B4 (de) Verbinder und Verfahren zum Ausbilden desselben
DE102007033942A1 (de) Elektrische Klemme
EP0123872A1 (fr) Barrière à diode Zéner
DE3428595A1 (de) Elektromagnetisches relais
DE4441281C2 (de) Steckverbinder
EP3382812A1 (fr) Fiche à broches de contact et procédé de fabrication d'une fiche à broches de contact

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): DE FR GB IT

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

AK Designated contracting states

Kind code of ref document: A3

Designated state(s): DE FR GB IT

17P Request for examination filed

Effective date: 19980320

GRAG Despatch of communication of intention to grant

Free format text: ORIGINAL CODE: EPIDOS AGRA

GRAG Despatch of communication of intention to grant

Free format text: ORIGINAL CODE: EPIDOS AGRA

GRAH Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOS IGRA

17Q First examination report despatched

Effective date: 19990316

GRAH Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOS IGRA

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): DE FR GB IT

REF Corresponds to:

Ref document number: 59506944

Country of ref document: DE

Date of ref document: 19991104

ET Fr: translation filed
ITF It: translation for a ep patent filed

Owner name: STUDIO JAUMANN P. & C. S.N.C.

GBT Gb: translation of ep patent filed (gb section 77(6)(a)/1977)

Effective date: 19991202

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed
PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20001030

Year of fee payment: 6

REG Reference to a national code

Ref country code: GB

Ref legal event code: 732E

REG Reference to a national code

Ref country code: GB

Ref legal event code: IF02

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20020702

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20030915

Year of fee payment: 9

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20031003

Year of fee payment: 9

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20041019

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20041019

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20050630

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES;WARNING: LAPSES OF ITALIAN PATENTS WITH EFFECTIVE DATE BEFORE 2007 MAY HAVE OCCURRED AT ANY TIME BEFORE 2007. THE CORRECT EFFECTIVE DATE MAY BE DIFFERENT FROM THE ONE RECORDED.

Effective date: 20051019