EP0613581A1 - Masses de remplissage durcissantes - Google Patents

Masses de remplissage durcissantes

Info

Publication number
EP0613581A1
EP0613581A1 EP92922502A EP92922502A EP0613581A1 EP 0613581 A1 EP0613581 A1 EP 0613581A1 EP 92922502 A EP92922502 A EP 92922502A EP 92922502 A EP92922502 A EP 92922502A EP 0613581 A1 EP0613581 A1 EP 0613581A1
Authority
EP
European Patent Office
Prior art keywords
epoxy resin
weight
epoxy
compounds according
potting compounds
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP92922502A
Other languages
German (de)
English (en)
Inventor
Werner Pfander
Irene Jennrich
Kristian Leo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of EP0613581A1 publication Critical patent/EP0613581A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/306—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Definitions

  • Potting compounds for filling joints or cavities are widely used in technology.
  • the casting compounds are exposed to higher temperatures after the casting. This is e.g. in the case of water-cooled generators, in which the space between the windings and the housing is filled with a heat-conducting casting compound. The heat generated is quickly dissipated to the surrounding coolant and overheating is avoided. Potting compounds with a corresponding property profile are also required for ignition coils, diodes and semiconductors, including layer hybrids.
  • reaction resins for example phenol-formaldehyde resins, unsaturated polyester resins, epoxy resins, silicone resins or polyurethanes, which generally contain fillers for physical and economic reasons, are used for this purpose. Potting compounds that can withstand high loads must fulfill a number of properties:
  • the potting compounds known hitherto have deficiencies with respect to one or more of the parameters mentioned, and therefore do not show an overall satisfactory property profile.
  • the potting compounds according to the invention avoid the disadvantages of the prior art. They are highly flowable at the usual processing temperatures of about 60 to 80 ° C. and therefore also fill cavities with a complicated geometry and areas that are difficult to access. You can use many months, for example up to 12 months, 'be stored without loss of quality practical. The curing times correspond to the requirements for efficient production.
  • the hardened casting compounds dissipate the resulting heat quickly and reliably, so that a stable, steady-state temperature is established. Their coefficient of thermal expansion is low, so that no pressures arise which are unacceptable for normally designed apparatus, machines or devices.
  • the hardened casting compounds are also able to cope with long-lasting high thermal loads with temperatures of, for example, 200 ° C. and more and show a clearly reduced tendency to form cracks during shock-like cooling. The combination of high heat resistance and extensive resistance to crack formation are particularly characteristic of the new casting compounds.
  • component (1) which may be present in the casting compounds, epoxy resins of bisphenol A (2,2-bis (4 '-hydroxyphenyl) propane), of bisphenol F (bis-) (4-hydroxyphenyl) methane) or cycl oal i phati see epoxy resins, for example those of the formula
  • Their epoxy equivalence is expediently 100 to 250.
  • the molecular weight of the resins is generally> 250, it is expediently between 275 and 1,500. So that the resins give a product with a sufficiently high molecular weight when hardened, their epoxy functionality should be at least 1.2, expediently 1, 5 to 2.5 epoxy groups per molecule. Since the resins are not chemically uniform substances, the stated functionalities as well as the molecular weights are statistical averages. Suitable epoxy resins are readily available commercially. Their proportion in the casting compounds is expediently 5 to 30% by weight.
  • an important feature of the potting compounds according to the invention is their content of an elastomer-modified epoxy resin (2), suitably with an epoxy equivalence from 180 to 400, preferably from 220 to 320.
  • Rubber-modified epoxy resins are used.
  • Resins modified by elastic silicone are preferably used, such as are known, for example, from DE-PS 36 34 084.
  • This document describes reactive resins, including epoxy resins, in which three-dimensionally crosslinked polyorganosi 1 oxane rubbers with particle sizes of 0.01 to 50 ⁇ m are embedded, which have reactive groups on their surface, for example amino, carboxy or carboxylic acid anhydride groups , have and -. - React chemically with the reactive resin before or during further processing.
  • the content of silicone rubber can vary within wide limits, it is generally between 20 and 50% by weight, based on component (2).
  • component (1) and (2) depends, among other things. on the task to be solved in each case, the resin selected and in particular its functionality and the elastomer content of component (2). It can easily be determined by preliminary tests. Depending on the required property profile of the casting compounds, component (1) can be used to a subordinate extent or can even be omitted entirely.
  • the hardeners used are the substances customary for this purpose with functionality on epoxy-reactive groups> 1, e.g. Polyamines and polycarboxylic acids or their anhydrides. Suitable hardeners are, for example, dicarboxylic anhydrides, such as phthalic anhydride.
  • the hardener is expediently used in approximately stoichiometric amounts, but an excess or deficit of, for example, up to 20 equiv.% Does not significantly influence the properties of the casting compound.
  • the filler is generally used in amounts of 40 to 75% by weight, advantageously from 50 to 65% by weight. When used in water-cooled generators, potting compounds with a proportion of filler between 55 and 60% by weight have proven particularly useful.
  • the usual inorganic substances, such as quartz sand or powder, talc, chalk, aluminum oxide or aluminum hydroxide, are used individually or in a mixture with one another.
  • An aluminum hydroxide, for example, which has previously been partially dewatered, is particularly suitable, expediently by heating to temperatures of 240 to 260 ° C. for 15 to 20 hours.
  • the fillers are generally used in grain sizes from 0.5 to 700 ⁇ m.
  • the type and amount of the filler and its particle size distribution influence not only the flow behavior during processing, but also the properties of the hardened casting compound, for example the heat 1 viability or toughness, a desired property which counteracts the formation of cracks.
  • the optimum parameters of the filler for a given application taking into account the organic components used, can be easily determined by preliminary tests.
  • the casting compounds according to the invention can consist of components (1) to (4), but they can also be others. Components included. Thus, by using one of the conventional accelerators, the time required for the casting compound to harden can be shortened.
  • the substances customary for this purpose for example imidazole or tertiary amine, are used in amounts which are expediently between 0.1 and 0.5% by weight, based on the sum of components (1) to (4).
  • the casting compound can also be colored for 1 s by incorporating a coloring inorganic or organic substance, as a pigment, color paste or solution.
  • the coloring substance is optionally added in amounts which are usually between 0.1 and 2.5% by weight, based on the sum of components (1) to (4).
  • the new casting compounds are produced in the usual way by intimately mixing the components, e.g. in one of the common compulsory mixers. They are again used in the usual way for filling cavities, i.e. they are generally poured or injected into the cavities to displace the air. The curing takes place by heating, if necessary to different temperature levels. Depending on the resin, hardener and accelerator, it generally takes up to 8 hours. The temperatures are advantageously between 90 and 180 ° C.
  • the casting compounds according to the invention generally have a viscosity of about 2,000 to about 10,000 mPa.s at 60 ° C.
  • the resulting hardened molding material shows that following property picture:
  • the casting compounds were cured and showed the following properties:
  • test specimens were quickly heated to 120 ° C. and cooled to -40 ° C. in a shock-like manner.
  • the test specimens from the casting compositions of Examples 1 and 2 showed no crack formation even after 5 passes, while the test specimen according to Example 3 already showed cracks after the first pass even if it was heated to only 60 ° C.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

La présente invention concerne des masses de remplissage présentant des propriétés de traitement et d'utilisation avantageuses. Ces masses contiennent une résine époxyde modifiée par un élastomère dont le poids équivalent d'époxyde peut aller de 180 à 400, un durcisseur époxyde et une matière de charge, ainsi que, le cas échéant, une résine époxyde dont le poids équivalent peut aller de 100 à 250, et, éventuellement, un accélérateur et/ou un colorant. L'invention concerne en outre l'utilisation de ces masses pour le remplissage d'espaces creux.
EP92922502A 1991-11-22 1992-10-23 Masses de remplissage durcissantes Withdrawn EP0613581A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19914138411 DE4138411C2 (de) 1991-11-22 1991-11-22 Härtende Vergußmassen
DE4138411 1991-11-22
PCT/DE1992/000889 WO1993010540A1 (fr) 1991-11-22 1992-10-23 Masses de remplissage durcissantes

Publications (1)

Publication Number Publication Date
EP0613581A1 true EP0613581A1 (fr) 1994-09-07

Family

ID=6445342

Family Applications (1)

Application Number Title Priority Date Filing Date
EP92922502A Withdrawn EP0613581A1 (fr) 1991-11-22 1992-10-23 Masses de remplissage durcissantes

Country Status (4)

Country Link
EP (1) EP0613581A1 (fr)
JP (1) JPH07501093A (fr)
DE (1) DE4138411C2 (fr)
WO (1) WO1993010540A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW430685B (en) * 1996-07-30 2001-04-21 Nippon Kayaku Kk Epoxy resin liquid composition for semiconductor encapsulation
DE10057111C1 (de) 2000-11-16 2002-04-11 Bosch Gmbh Robert Wärmeleitfähige Vergußmasse
DE10131116A1 (de) * 2001-06-28 2003-01-23 Siemens Linear Motor Systems G Vergossenes Motorteil für einen Elektromotor und Verfahren zu seiner Herstellung
JP7244177B2 (ja) * 2018-11-12 2023-03-22 株式会社ダイセル 硬化性組成物

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55137125A (en) * 1979-04-12 1980-10-25 Nippon Soda Co Ltd Production of polybutadiene-modified epoxy resin
DE3229558C2 (de) * 1982-08-07 1984-11-08 Robert Bosch Gmbh, 7000 Stuttgart Imprägniervergußmasse für elektrische Bauteile
US4529755A (en) * 1982-10-23 1985-07-16 Denki Kagaku Kogyo Kabushiki Kaisha Epoxy resin composition for encapsulating semiconductor
JPS6064483A (ja) * 1983-09-20 1985-04-13 Toshiba Corp 樹脂封止型発光装置
US4518631A (en) * 1983-11-14 1985-05-21 Dow Corning Corporation Thixotropic curable coating compositions
US4665111A (en) * 1984-10-12 1987-05-12 Siemens Aktiengesellschaft Casting compound for electrical and electronic components and modules
JPS61192720A (ja) * 1985-02-22 1986-08-27 Nippon Oil Co Ltd 積層板用樹脂組成物
DE3634084A1 (de) * 1986-10-07 1988-04-21 Hanse Chemie Gmbh Modifiziertes reaktionsharz, verfahren zu seiner herstellung und seine verwendung
JPS63273624A (ja) * 1987-05-01 1988-11-10 Ube Ind Ltd エポキシ樹脂組成物
JPH01113454A (ja) * 1987-10-26 1989-05-02 Matsushita Electric Works Ltd エポキシ樹脂組成物の製法
EP0370531B1 (fr) * 1988-11-25 1997-08-27 Kanegafuchi Chemical Industry Co., Ltd. Composition réticulable du type à deux composants comprenant une résine époxy et un polymère élastomérique contenant du silicium
DE3913488C2 (de) * 1989-04-25 1994-02-03 Bosch Gmbh Robert Vergußmasse für elektrische und elektronische Bauteile

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO9310540A1 *

Also Published As

Publication number Publication date
DE4138411A1 (de) 1993-05-27
DE4138411C2 (de) 1995-01-26
WO1993010540A1 (fr) 1993-05-27
JPH07501093A (ja) 1995-02-02

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