EP0563954A1 - Verfahren zum Plattenpolieren und Vorrichtung dafür - Google Patents

Verfahren zum Plattenpolieren und Vorrichtung dafür Download PDF

Info

Publication number
EP0563954A1
EP0563954A1 EP93105411A EP93105411A EP0563954A1 EP 0563954 A1 EP0563954 A1 EP 0563954A1 EP 93105411 A EP93105411 A EP 93105411A EP 93105411 A EP93105411 A EP 93105411A EP 0563954 A1 EP0563954 A1 EP 0563954A1
Authority
EP
European Patent Office
Prior art keywords
polishing
plate
polished
gate frame
polishing member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP93105411A
Other languages
English (en)
French (fr)
Other versions
EP0563954B1 (de
Inventor
Kazuo Yoshihara
Tadamasa Jojima
Nobuo Yoshihara
Masateru Kamon
Yoshito Yoshihara
Yasuhiro Sawada
Kazuo Morishita
Tamaki Kurano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KANSAI PLANT INDUSTRY Co Ltd
Original Assignee
KANSAI PLANT INDUSTRY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KANSAI PLANT INDUSTRY Co Ltd filed Critical KANSAI PLANT INDUSTRY Co Ltd
Publication of EP0563954A1 publication Critical patent/EP0563954A1/de
Application granted granted Critical
Publication of EP0563954B1 publication Critical patent/EP0563954B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B24B41/047—Grinding heads for working on plane surfaces

Definitions

  • the present invention relates to a method and an apparatus for polishing the surface of a plate such as a metal plate and a non-metal plate, particularly suited for polishing of large-sized plates.
  • This method with a buff spinning speed of 3,000rpm is suited for high-speed polishing and as oscillation polishing is feasible, relatively uniform polishing is attained.
  • This method mainly by the use of a felt roll, is good for working environment and polishing uniformity. This is suited for wet polishing but dry polishing is also possible.
  • This method is excellent in specular resolution of lapped specular stainless steel plate, is good for both wet and dry lapping, and is relatively good for working environment at relatively low cost.
  • this method is excellent in corrosion resistance, since a thick passivation film on the surface of a stainless steel is formed.
  • this method enables an improvement of lapping efficiency through automation.
  • This method being of composite nature, i.e. combination of electrolysis, mechanical polishing and chemical polishing, is fast in polishing speed and excellent in uniform polishing, and it enables automation of the polishing process. This is relatively suited for polishing of color stainless steel and pre-etching polishing material. This method is also useful for other than polishing of plate surfaces, being high in polishing speed.
  • Low lapping speed means a low lapping efficiency. Complicated manipulation results in poor producibility.
  • This method is applicable to polishing of specular stainless steel materials but is liable to bring about micro-polishing unevenness. Hence, this method is less suited for polishing of specular color stainless steel materials or pre-etching polishing of specular materials. Since polishing by this method is of local intensive manner, it tends to cause local corrosion such as pitting of the plate to be polished, hence the method is not applicable to plates to be plated, especially those to be gold-plated.
  • This method which has the same defects as described under (c), is also high in equipment cost, is subject to troubles and perfect automation is impossible. It is also high in fraction defective.
  • polishing locus remains as visible color unevenness to thus degrade quality of products.
  • the round buff locus remains because of non-uniform pressing pressures between the central part and the peripheral part of the rotating buff, and therefore, etching unevenness never fails to appear. For this reason, it is necessary to do pre-treatment of removing a chromium oxide layer by dissolution in a dilute solution of ferric chloride.
  • corrosion like pitting occurs to generate innumerable pin holes and color and gloss of plating fade away to thus form plating unevenness.
  • Another object of the present invention is to provide a method and apparatus which is especially suited fo the manufacture of a large-sized specular color stainless steel, specular etched stainless steel and specular gold-plated stainless steel.
  • the present inventors have made an extensive series of studies, and as a result, found that the above objects can be attained by pressing a plate-like polishing member against the surface of a plate to be polished and rotating it via cranks at a given pressure.
  • polishing efficiency can be surprisingly enhanced from four times to six times by employing a pair of polishing members rotating in directions conter to each other.
  • the present invention encompasses, in a first aspect, a method for polishing a plate characterized in that a plate-like polishing member is pressed to the surface of a plate to be polished and is caused to rotate via cranks.
  • the present invention encompasses, in a second aspect, an apparatus for polishing a plate characterized in that a table on which a plate to be polished is placed is set horizontally on a stand, a gate frame is set on the stand to saddle over the table, a polishing head is hung from the gate frame via lifting-lowering means so as to be freely liftable and lowerable, the polishing head is provided with a plate-like polishing member and a rotating means for rotating the polishing member via cranks in a horizontal plane, and the major axis of rotation of the polishing member is taken as the leg span direction of the gate frame.
  • the present invention encompasses, in a third aspect, a method for polishing a plate characterized in that a pair of plate-like polishing members are pressed to the surface of a plate to be polished and are caused to rotate via cranks in directions counter to each other.
  • the present invention encompasses, in a fourth aspect, an apparatus for polishing a plate characterized in that a table on which a plate to be polished is placed is set horizontally on a stand, a gate frame is set on the stand to saddle over the table, a pair of polishing heads are hung from the gate frame via lifting-lowering means so as to be freely liftable and lowerable, the polishing heads are provided with a plate-like polishing members and rotating means for rotating the polishing members via cranks in directions counter to each other in a horizontal plane.
  • the polishing apparatus of the present invention comprises a table 2 placed on a stand 1, a gate frame 3 set thereon via a traveling means, a polishing head 7 hung from the gate frame 3 via an oscillating means 5 and a lifting-lowering means 6 and a polishing member 9 attached to the polishing head 7 via a rotating means 8.
  • Reference numeral 10 is a plate to be polished.
  • the stand 1 is rectangular and has set thereon traveling rails 11 and rack rails 12, two each along its longer edge.
  • the longer edge is called longitudinal direction and the shorter edge is called lateral direction (See Fig. 2.).
  • the table 2 is a surface plate to set the plate to be polished 10 on its topside, and it is set horizontally on the stand 1.
  • the plate to be polished 10 is a large-sized cut plate rectangular in shape.
  • patches 13 having the same thickness as the plate 10 are fixedly secured to the both sides of the plate 10 for ensuring against damage of the polishing member 9 by the edges of the plate.
  • the width of the patches 13 is so determined that the moving range of the polishing member 9 is not beyond the width between the both patches 13.
  • the gate frame 3 is set on the rails 11 provided on the stand 1 astride it sideways and it is driven by the traveling means 4 longitudinally (in the direction perpendicular to the leg span direction.
  • the traveling means 4 comprises running wheels 14 to the legs of the gate frame 3 to be freely rotatable and running gears 15 and a driver 18 for driving the running gears 15, and further an anti-lifting mechanism 16 and an anti-sideway oscillation mechanism 17.
  • the running wheels 14 support the gate frame 3 and run on the traveling rails 11.
  • the running gears 15 are in mesh with rack rails 12 and the gate frame 3 is driven by a driver 18.
  • the driver 18 comprises drive gears 42 at both ends of a drive shaft 41 provided between the legs of the gate frame 3, said drive gears 42 being in mesh with running gears 15.
  • the drive shaft 41 is connected with a reducer 45 at its central portion through a pair of reduction gears 43, 44, to the reducer 45 is connected a drive moter 47 through a drive chain 46.
  • the anti-lifting mechanism 16 and the anti-sideway oscillation mechanism 17 comprise an anti-lifting roller 19 and anti-sideway oscillation roller 20, respectively, the former attached to the underside of the stand 1 rotatably prevents lifting of the gate frame 3 off the traveling rails 11 and the latter rotatable in contact with the sides of the traveling rails 11 prevents sideway oscillation of the gate frame 3.
  • the both anti-lifting mechanism and anti-sideway oscillation mechanism prevent unevenness of the polished surface.
  • the oscillating means 5 holds an oscillating plate 22 freely oscillatable by a pair of (left and right) oscillating guide members 21 and has the oscillating cylinder 23 connected with the oscillating plate 22.
  • the lifting-lowering means 6 comprises a lifting-lowering cylinder 24 and a pressure-adjusting mechanism 25 and has the polishing head 7 hung therefrom freely liftable and lowerable.
  • the lifting-lowering cylinder 24 lifts and lowers the polishing head 7 as its piston rod moves in or out.
  • the pressure adjusting mechanism 25 has inserted, freely liftable and lowerable, a hanging rod 28, from which the polishing head 7 is hung, through a guide cylinder 27 set erect on the oscillating plate 22, and also comprises a compression spring 30 set between an adjusting nut 29 screwed onto the upper end portion of the hanging rod 28 and the bottom of the guide cylinder 27 and is so arranged that the polishing pressure with which the lifting-lowering cylinder 24 presses the polishing surface of the polishing member 9 against the compression spring 30 is adjusted to a proper level by means of an adjusting nut 29.
  • the polishing head 7 is made by disposing a supporting beam 31 hung from the oscillating plate 22 via the lifting-lowering means 6 between a pair of (left and right) lifting-lowering guide members 32 attached to both legs of the gate frame 3, hanging a rotary plate 33 from the supporting beam 31 via the rotating means 8 and fixedly securing a polishing member accommodating plate 35 to the underside of the rotary plate 33 via a cushion member 34 such as rubber.
  • the rotating means 8 comprises a main crank 36 and two auxiliary cranks 37 arranged in a row with the main crank 36 at the center between the supporting beam 31 of the polishing head 7 and the rotary plate 33, and a drive motor 38 mounted on the supporting bean 31.
  • the main crank 36 has its upper end connected with the drive motor 38 and its lower end connected rotatably with the rotary plate 33.
  • the auxiliary crank 37 has its upper and lower ends rotatably connected with the supporting beam 31 and the rotary plate 33 respectively.
  • both auxiliary cranks 37 also rotate via the rotary plate 33, and thus, the rotary plate 33 rotates.
  • the major axis of the locus of rotation of the rotary plate 33 is sideways (along the leg span of the gate frame 3).
  • the drive motor 38 causes the main crank 36 to rotate at a rate of 50 ⁇ 600 rpm. If the rotation speed is less than 50 rpm., no sufficient polishing effect is attainable, while, if it is more than 600 rpm., the structure is bound to be too complicated.
  • the polishing member 9 is made of grindstone, scotch grite, buff or the like in rectangular plate shape is removably attached to the underside of the polishing member accommodating plate 35 of the polishing head 7 and is made to rotate with the rotary plate 33.
  • the width of the polishing member 9 (in the leg span direction of the gate frame 3) is set to be larger than that of the plate 10 to be polished, which enables uniform polishing.
  • the polishing member 9 shown in Fig. 1 is a buff set in a buff case 39 and the polishing surface has formed therein a plurality of U-sectioned grooves 40 for storing an abrasive liquor as shown in Figs. 4 and 5 inclined in the direction of rotation.
  • These U-sectioned grooves 40 are for scraping and retaining the abrasive liquor including the abrasive impregnated in the polishing surface and thereby preventing scattering of the abrasive liquor off the polishing surface and at the same time enabling gradual release of the stored abrasive liquor for enhancing the polishing efficiency.
  • the plate 10 is an object to be polished such as a metal plate of stainless steel, brass and aluminum as well as a non-metal plate of glass, plastics and the like.
  • the plate 10 shown in Fig. 2 is a large-sized rectangular cut plate which is set horizontally on the topside of the table 2, and is fixed in place with its sides retained by the patches 13.
  • the polishing surface of the polishing member 9 is impregnated with the abrasive liquor containing the abrasive and then, with the polishing member 9 being pressed against the surface of the plate 10 at a predetermined pressure by lowering the polishing head 7 by means of the lifting-lowering cylinder 24, the polishing member 9 is rotated in a horizontal plane by the drive motor 38 via the cranks 36 and 37.
  • 0.5 ⁇ 1.5 kg/cm2 is proper for the aforementioned predetermined pressure and pre-adjustment is made by changing the tightening of the adjusting nut 29 of the pressure adjusting mechanism 25.
  • the rotational speed of the drive motor 38 is controlled in the range of 100 ⁇ 450 rotations by means of vector inverter control and the radius of rotation for each crank 36 and 37 is adjusted to approximately 50 ⁇ 100 mm.
  • the polishing head 7 is oscillated sideways by the oscillating cylinder 23 and at the same time the gate frame 3 is driven longitudinally by the driver 18.
  • the oscillating stroke of the oscillating cylinder 23 is controlled in a range of 100 ⁇ 200 mm by inverter control and at the same time the oscillating cycle is adjusted to 6 ⁇ 30 strokes per minute. It is then preferred to adjust the traveling speed of the gate frame 3 to approximately 1 ⁇ 5 m per minute. Then, the surface of the plate 10 is polished by the polishing member 9 under proper conditions.
  • the polishing member 9 Since the polishing member 9 is rotary driven via cranks, the pressure at which the polishing member 9 is pressed against the plate 10 is uniformly distributed over the entire surface to be polished and since, at the same time, the polishing member 9 is oscillated together with the polishing head 7, the simultaneous oscillation effect enables precise and uniform mirror polishing of the surface of large-sized plate 10.
  • the gate frame 3 was driven longitudinally but in other examples in which the plate 10 is a band plate coiled, it is also possible to uncoil the plate 10 and feed it longitudinally instead of having the gate frame 3 travel. Then, continuous polishing is feasible and results in marked improvement of the producibility.
  • the plate to be polished is placed horizontally on the table, then, the polishing head is lowered by the lifting-lowering means so that the polishing member is pressed to the surface of the plate with a predetermined pressure, the polishing member is rotated via cranks in the horizontal plane by the rotating means to thereby polish the plate.
  • the polishing member is also required to be large but if the large polishing member is driven to rotate in a simple circular pattern, the polishing effect fails to be distributed uniformly all over the surface to be polished due to the pressure concentrated at the central portion, and the uniform specular polishing is infeasible.
  • the pressure at which the polishing member is caused via cranks to be pressed at the uniform pressure against all over the surface to be polished so that the entire surface is specular polished precisely and uniformly even if the plate to be polished is quite large.
  • the polishing apparatus comprises a table 2 placed on a stand 1, a gate frame 3 set thereon via a traveling means 4, a pair of polishing heads 7, each being hung from the gate frame 3 via an oscillating means 5 and a lifting-lowering means 6 and a polishing member 9 attached to the polishing head 7 via a rotating means 8.
  • Reference numeral 10 is a plate to be polished.
  • Each of the polishing members 9 shown in Fig. 1 is a buff set in a buff case 39 and the polishing surface has formed therein a plurality of U-sectioned grooves 40 for storing an abrasive liquor as shown in Figs. 7 to 9 inclined in the direction of rotation and abrasive liquor supply holes 48.
  • These U-sectioned grooves 40 and the supply holes 48 are for scraping and retaining the abrasive liquor including the abrasive impregnated in the polishing surface and thereby preventing scattering of the abrasive liquor off the polishing surface and at the same time enabling gradual release of the stored abrasive liquor for enhancing the polishing efficiency.
  • the polishing surfaces of the polishing members 9 are impregnated with the abrasive liquor containing the abrasive and then, with the polishing members 9 being pressed against the surface of the plate 10 at predetermined pressures by lowering the polishing heads 7 by means of the lifting-lowering cylinders 24, the polishing members 9 are rotated in directions counter to each other in a horizontal plane by the drive motors 38 via the cranks 36 and 37.
  • polishing time for example, the apparatus shown in Fig. 2 takes 12 minutes, while the apparatus shown in Fig. 6 takes only 2 minutes, i.e., it can be reduced to 1/6, and thus productivity increases surprisingly. Further, when the polishing members 9 are caused to oscillate in the lateral direction, polishing is conducted more efficiently because of an oscillation effect added.
  • Example 2 The same procedure as in Example 1 was conducted except that an apparatus shown in Figs. 1, 6 to 9 was employed in place of that shown Figs. 1 to 5, and that a pair of polishing members are caused to rotate in directions counter to each other.
  • the polishing time was reduced to 2 minutes, approximately 1/5 as compared with Example 1.
  • Example 2 The same procedure as in Example 2 was conducted except that an apparatus shown in Figs. 1, 6 to 9 was employed in place of that shown Figs. 1 to 5, and that a pair of polishing members are caused to rotate in directions counter to each other.
  • the polishing time was 3 min. ⁇ twice grindstone grinding and 3 min. of buff polishing, and thus reduced to approximately 1/6 as compared with Example 2.
  • Coloring conditions Coloring chemical...Sulfuric acid 450 g/l, chromic acid anhydride 250 g/l (according to the inco-color method) Liquor temperature..80°C Treating process....Degreasing--Rinse--Oxidation development--Recovery--Rinse--Hard-film treatment--Rinse--Finish rinse--Drying
  • the specular stainless steel plates prepared by the conventional methods used brought about polishing unevenness and the resultant coloring unevenness affected the quality of products.
  • the color stainless steels obtained by this Application Example 1 were, however, almost completely free of coloring unevenness, the difference being clearly distinguishable even by the naked eyes.
  • Etching conditions Etching chemical...Ferric chloride solution (46 ⁇ Be') containing 0.5% HCl. Liquor temperature...40 °C Treating process...Screen printing--Drying--High pressure shower etching (10 min.) --Rinse--Caustic soda film removal --Rinse--Neutralization with nitric acid--Rinse
  • the specular stainless steel plate polished by any of the conventional methods was not suited for etching since the oxide film resulting from the use of the compound abrasive comprising an abrasive and an oxidative chemical was subject to unevenness in thickness, etching unevenness was resulted if etching was carried out without complicated pretreatment of the substrate, and in consequence, satisfactory products could not be obtained.
  • the etching stainless steel plates obtained in this Application Example 2 are, however, almost free of etching unevenness with the oxide film finished uniformly in polishing, hence a uniformly etched products were obtainable without any special pretreatment.
  • polishing is effected locally and intensively because the buffing surface is small. That results in local heating to approximately 100 °C, which gives rise to local corrosion such as pitting caused by nitric acid contained in the abrasives.
  • the present invention has the following numerous advantages:

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
EP19930105411 1992-04-02 1993-04-01 Verfahren zum Plattenpolieren und Vorrichtung dafür Expired - Lifetime EP0563954B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP110769/92 1992-04-02
JP4110769A JP2724427B2 (ja) 1992-04-02 1992-04-02 平板の研摩方法及びその装置

Publications (2)

Publication Number Publication Date
EP0563954A1 true EP0563954A1 (de) 1993-10-06
EP0563954B1 EP0563954B1 (de) 1997-08-27

Family

ID=14544122

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19930105411 Expired - Lifetime EP0563954B1 (de) 1992-04-02 1993-04-01 Verfahren zum Plattenpolieren und Vorrichtung dafür

Country Status (6)

Country Link
EP (1) EP0563954B1 (de)
JP (1) JP2724427B2 (de)
CN (1) CN1077406A (de)
CA (1) CA2093046A1 (de)
DE (1) DE69313333T2 (de)
TW (1) TW223601B (de)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0803329A2 (de) * 1996-04-25 1997-10-29 Fujikoshi Kikai Kogyo Kabushiki Kaisha Poliermaschine
US7175508B2 (en) 2003-06-03 2007-02-13 Nikon Corporation Polishing apparatus, method of manufacturing semiconductor device using the same, and semiconductor device manufactured by this method
CN103949964A (zh) * 2014-03-31 2014-07-30 广东尚高科技有限公司 一种自动油漆抛光机
CN105856035A (zh) * 2016-05-20 2016-08-17 王恒标 钢材表面杂屑磨除装置
CN110539219A (zh) * 2019-09-17 2019-12-06 大同新成新材料股份有限公司 用于打磨碳纤维制品的平面磨床
CN116900909A (zh) * 2023-09-08 2023-10-20 华能太原东山燃机热电有限责任公司 一种光伏电缆端头抛光装置

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103921207B (zh) * 2013-01-10 2017-12-05 新源蓝宝石科技（深圳）有限公司 精磨抛光机
CN105171537B (zh) * 2015-09-30 2019-03-01 厦门理工学院 可抑制光学元件中频误差的超声振动抛光磨头装置
CN105500203B (zh) * 2016-01-07 2018-05-04 韩金桥 磨削设备磨头升降柔性控制装置
CN105619227A (zh) * 2016-03-08 2016-06-01 孝感市步集电子商务有限公司 具有观察口的建筑用板材抛光装置及其使用方法
CN105666302A (zh) * 2016-03-08 2016-06-15 厦门市优家品日用品有限公司 具有保护功能的建筑用板材抛光设备及其使用方法
CN106181749B (zh) * 2016-08-18 2018-02-27 肇庆市森美金属有限公司 一种液压回转研磨机
CN106625181B (zh) * 2016-12-27 2019-03-05 安徽工程大学 一种板材抛光装置
CN106737159B (zh) * 2016-12-30 2018-10-19 江苏天马通用设备有限公司 和纹机
CN107322381A (zh) * 2017-08-31 2017-11-07 淄博职业学院 一种大尺寸陶瓷圆锥筒端面磨削装置
CN108098464B (zh) * 2018-02-05 2020-01-14 天津市职业大学 一种木材磨抛方法
CN108481166A (zh) * 2018-05-29 2018-09-04 碳星智能装备（深圳）有限公司 一种多工位三轴联动数控抛光设备
KR102027934B1 (ko) * 2018-06-14 2019-10-02 홍기수 벽돌제작용 파렛트 철판의 연마장치
CN111069992B (zh) * 2019-12-30 2020-11-20 徐州蓝联诚制造有限公司 一种金属板材加工用打磨机床
CN111617938B (zh) * 2020-06-15 2021-05-18 诸暨易阳环保科技有限公司 一种半圆环工件的自动涂漆设备
KR102426223B1 (ko) * 2020-07-29 2022-07-29 주식회사 포스코 강판 연마장치
CN112757152A (zh) * 2020-12-31 2021-05-07 福建省将乐县长兴电子有限公司 一种晶片研磨装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1491103A (en) * 1919-07-08 1924-04-22 Pratt & Whitney Co Method of and machine for making gauges and other articles
DE680641C (de) * 1936-04-10 1939-09-02 Marbriere De Paris Sa Soc Flaechenschleif- und Poliervorrichtung fuer harte Werkstoffe verschiedener Haerte, insbesondere fuer Gestein
DE3433009A1 (de) * 1984-09-07 1986-03-20 Siemens AG, 1000 Berlin und 8000 München Einrichtung zum flachlaeppen oder flachschleifen von werkstuecken
WO1989003279A1 (en) * 1987-10-13 1989-04-20 Extrude Hone Corporation Orbital table for machine tools

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5719232Y2 (de) * 1977-03-18 1982-04-22

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1491103A (en) * 1919-07-08 1924-04-22 Pratt & Whitney Co Method of and machine for making gauges and other articles
DE680641C (de) * 1936-04-10 1939-09-02 Marbriere De Paris Sa Soc Flaechenschleif- und Poliervorrichtung fuer harte Werkstoffe verschiedener Haerte, insbesondere fuer Gestein
DE3433009A1 (de) * 1984-09-07 1986-03-20 Siemens AG, 1000 Berlin und 8000 München Einrichtung zum flachlaeppen oder flachschleifen von werkstuecken
WO1989003279A1 (en) * 1987-10-13 1989-04-20 Extrude Hone Corporation Orbital table for machine tools

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 11, no. 344 (M-640)11 November 1987 & JP-A-62 124 866 ( HITACHI LTD ) 6 June 1987 *
PATENT ABSTRACTS OF JAPAN vol. 7, no. 116 (M-216)20 May 1983 & JP-A-58 034 757 ( SHIKISHIMA CHIPTON KK ) 1 March 1983 *

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0803329A2 (de) * 1996-04-25 1997-10-29 Fujikoshi Kikai Kogyo Kabushiki Kaisha Poliermaschine
EP0803329A3 (de) * 1996-04-25 1998-04-15 Fujikoshi Kikai Kogyo Kabushiki Kaisha Poliermaschine
US7175508B2 (en) 2003-06-03 2007-02-13 Nikon Corporation Polishing apparatus, method of manufacturing semiconductor device using the same, and semiconductor device manufactured by this method
CN103949964A (zh) * 2014-03-31 2014-07-30 广东尚高科技有限公司 一种自动油漆抛光机
CN105856035A (zh) * 2016-05-20 2016-08-17 王恒标 钢材表面杂屑磨除装置
CN105856035B (zh) * 2016-05-20 2018-02-06 王恒标 钢材表面杂屑磨除装置
CN110539219A (zh) * 2019-09-17 2019-12-06 大同新成新材料股份有限公司 用于打磨碳纤维制品的平面磨床
CN110539219B (zh) * 2019-09-17 2024-04-09 大同新成新材料股份有限公司 用于打磨碳纤维制品的平面磨床
CN116900909A (zh) * 2023-09-08 2023-10-20 华能太原东山燃机热电有限责任公司 一种光伏电缆端头抛光装置
CN116900909B (zh) * 2023-09-08 2024-02-02 华能太原东山燃机热电有限责任公司 一种光伏电缆端头抛光装置

Also Published As

Publication number Publication date
EP0563954B1 (de) 1997-08-27
DE69313333T2 (de) 1998-03-26
CA2093046A1 (en) 1993-10-03
JP2724427B2 (ja) 1998-03-09
DE69313333D1 (de) 1997-10-02
JPH05277914A (ja) 1993-10-26
TW223601B (de) 1994-05-11
CN1077406A (zh) 1993-10-20

Similar Documents

Publication Publication Date Title
EP0563954B1 (de) Verfahren zum Plattenpolieren und Vorrichtung dafür
EP1046514B1 (de) Verfahren zur Herstellung eines Aluminiumträgers für lithographische Druckplatten
EP3396009B1 (de) Plattiertes stahlblech mit feiner und ebener plattierungsstruktur und herstellungsverfahren für ein plattiertes stahlblech
JPS6082680A (ja) 金属ウエブの表面処理装置
US4294673A (en) Method of mirror-finishing a cylindrical workpiece
CN212552973U (zh) 用于精加工不锈钢丝材的电解精抛光装置
CN211681305U (zh) 一种彩钢板加工去毛刺装置
JPH06262511A (ja) 平板の研摩方法及びその装置
CN214922907U (zh) 一种铝板切割用打磨工装
EP0323505A1 (de) Kathodische oberflächenbehandlung zur bildung von metallischen folien oder bändern.
WO1998029205A1 (en) Brushing process for corrosion and oxidation resistance
CN212635382U (zh) 一种铍铜棒料的表面预处理装置
CN112720257A (zh) 一种板材磨削复合的磨削设备
CN216859161U (zh) 一种铜带平整度缺陷改善设备
CN217097189U (zh) 一种钢板件抛光机用的送料装置
US3040608A (en) Reciprocating surface-finishing mechanism and method
CN213439098U (zh) 一种适用不同形状金属制品抛光工艺的固定装置
CN108526911A (zh) 一种复合式去除氧化皮设备及去除方法
CN217167784U (zh) 一种板材加工用砂光机打磨机
CN217371829U (zh) 一种用于浮法玻璃生产中的过渡辊打磨装置
CN220330940U (zh) 一种钢带开平去锈去氧化皮设备及开平机
US3026219A (en) Brushing method and apparatus
JP2001341063A (ja) 平面研磨装置
CN210335375U (zh) 超薄仪表玻璃成型抛光机
CN1044503A (zh) 铜质带材电镀锡铈合金生产工艺及其流水线

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): DE FR GB IT

17P Request for examination filed

Effective date: 19940406

17Q First examination report despatched

Effective date: 19950814

GRAG Despatch of communication of intention to grant

Free format text: ORIGINAL CODE: EPIDOS AGRA

GRAH Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOS IGRA

GRAH Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOS IGRA

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): DE FR GB IT

ITF It: translation for a ep patent filed

Owner name: JACOBACCI & PERANI S.P.A.

REF Corresponds to:

Ref document number: 69313333

Country of ref document: DE

Date of ref document: 19971002

ET Fr: translation filed
PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed
PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20000324

Year of fee payment: 8

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20000417

Year of fee payment: 8

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20000628

Year of fee payment: 8

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20010401

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: THE PATENT HAS BEEN ANNULLED BY A DECISION OF A NATIONAL AUTHORITY

Effective date: 20010430

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20010401

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20020201

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20050401