EP0501361B1 - Corps d'interconnexion électrique et procédé de sa fabrication - Google Patents

Corps d'interconnexion électrique et procédé de sa fabrication Download PDF

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Publication number
EP0501361B1
EP0501361B1 EP92103028A EP92103028A EP0501361B1 EP 0501361 B1 EP0501361 B1 EP 0501361B1 EP 92103028 A EP92103028 A EP 92103028A EP 92103028 A EP92103028 A EP 92103028A EP 0501361 B1 EP0501361 B1 EP 0501361B1
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EP
European Patent Office
Prior art keywords
electrically conductive
photosensitive resin
apertures
liquid
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP92103028A
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German (de)
English (en)
Other versions
EP0501361A1 (fr
Inventor
Takashi c/o Canon Kabushiki Kaisha Sakaki
Tetsuo c/o Canon Kabushiki Kaisha Yoshizawa
Toyohide c/o CANON KABUSHIKI KAISHA Miyazaki
Hiroshi C/O Canon Kabushiki Kaisha Kondo
Yoshimi c/o Canon Kabushiki Kaisha Terayama
Yuichi c/o Sumitomo Metal Ind. Ltd. Ikegami
Takahiro C/O Sumitomo Metal Ind. Ltd Okabayashi
Kazuo c/o Sumitomo Metal Ind. Ltd Kondo
Yoichi c/o Sumitomo Metal Ind. Ltd Tamura
Yasuo c/o Sumitomo Metal Ind. Ltd Nakatsuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Nippon Steel Corp
Original Assignee
Canon Inc
Sumitomo Metal Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP03053905A external-priority patent/JP3127252B2/ja
Priority claimed from JP6909091A external-priority patent/JPH04282837A/ja
Priority claimed from JP8759791A external-priority patent/JPH04296483A/ja
Priority claimed from JP03091638A external-priority patent/JP3108792B2/ja
Application filed by Canon Inc, Sumitomo Metal Industries Ltd filed Critical Canon Inc
Publication of EP0501361A1 publication Critical patent/EP0501361A1/fr
Application granted granted Critical
Publication of EP0501361B1 publication Critical patent/EP0501361B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/486—Via connections through the substrate with or without pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01025—Manganese [Mn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4981—Utilizing transitory attached element or associated separate material
    • Y10T29/49812—Temporary protective coating, impregnation, or cast layer

Definitions

  • This invention relates to an electrical connecting member for use when electric circuit parts are to be electrically connected together and a method of manufacturing the same.
  • FIG 1 of the accompanying drawings is a schematic view showing the electrical connection of electric circuit parts using such an electrical connecting member.
  • the reference numeral 31 designates an electrical connecting member
  • the reference numerals 32 and 33 denote electric circuit parts to be connected together.
  • the electrical connecting member 31 comprises a plurality of electrically conductive members 34 formed of a metal or an alloy, electrically insulated from one another and provided in a holding member 35 formed of an electrically insulative material, and one end 38 of each electrically conductive member 34 is exposed on the side of one electric circuit part 32 and the other end 39 of each electrically conductive member 34 is exposed on the side of the other electric circuit part 33 ( Figure 1(a)).
  • the connecting portion 36 of said one electric circuit part 32 and one end 38 of each electrically conductive member 34 exposed on the side of the electric circuit part 32 are made into an alloy to thereby join the two together, and the connecting portion 37 of said other electric circuit part 33 and the other end 39 of each electrically conductive member 34 exposed on the side of the electric circuit part 33 are made into an alloy to thereby join the two together and thus, the electric circuit parts 32 and 33 are electrically connected together (Figure 1B).
  • Such an electrical connecting member has the following advantages:
  • a base body 51 comprising a metal sheet such a copper plate is first prepared, and negative-type photosensitive resin 52 is applied onto this base body 51 by a spin coater, and pre-baking is effected at a temperature of about 100°C ( Figure 2A).
  • Light is applied to the photosensitive resin 52 through a photomask (not shown) forming a predetermined pattern, whereafter developing liquid is injected to the photosensitive resin or the photosensitive resin is immersed in developing liquid to thereby effect development.
  • the photosensitive resin 52 remains on the portions exposed to light and the photosensitive resin 52 is removed from the portions not exposed to light by the developing process, whereby a plurality of apertures 53 are formed (Figure 2B).
  • FIG. 3 of the accompanying drawings is a schematic view showing the state of the electroplating step in such a process.
  • the reference numeral 61 designates a plating vessel.
  • a mesh-like anode 62 is disposed in the lower portion of the plating vessel 61, and a cathode 63 is disposed in the upper portion of the plating vessel in opposed relationship with the anode 62.
  • An intermediate member 64 as shown in Figure 2C is placed on the cathode 63, and plating liquid 65 low in gold concentration is caused to flow at a low speed from below toward above to thereby apply so-called strike plating and coat the surfaces of the recesses 54 with gold, whereafter so-called thickening plating is applied by the use of plating liquid high in gold concentration to thereby fill the recesses 54 and apertures 53 with gold, thus forming electrically conductive members 34.
  • the gold 55 constitutes the electrically conductive members 34 and the photosensitive resin 52 constitutes the holding member 35.
  • the thickness of the photosensitive resin 52 is about 10 ⁇ m
  • the diameter and pitch of the apertures 53 are about 20 ⁇ m and about 40 ⁇ m, respectively
  • the amounts of protrusion of the electrically conductive members 34 on the obverse and reverse are of the order of several ⁇ m.
  • the reliability of the above-described electrical connecting member is achieved by bumps of a uniform shape and uniform height of protrusion being provided.
  • the photosensitive resin 52 becomes liable to flow with the developing liquid or dissolve in the process of leaving the photosensitive resin 52 as it is after the developing step or in the process of curing the photosensitive resin 52 after the developing step. Accordingly, as shown in Figure 4 of the accompanying drawings which shows the state before the formation of the recesses 54 on an enlarged scale, the formed apertures 53 are tapered at 53a or the pattern thereof gets out of shape, and the shape of the apertures 53 becomes irregular. This leads to the problem that in the manufactured electrical connecting member 31, the shape of the electrically conductive members is not stable.
  • the occurrence of the resin-like residue becomes remarkable when the aspect ratio (film thickness/diameter of opening) of the apertures 53 is great, or when the exposure and developing conditions are inappropriate, or when diffracted light and/or reflected light irradiates the portions of the photosensitive resin which should not be exposed to the light.
  • the presence of such resin-like residue has led to the problem that it hampers the exposure of the surface of the metal sheet 51 at the bottom of the apertures 53 and as shown in Figure 5B, the shape of the recesses 54 is made irregular in the process of etching the surface of the metal sheet 51 and as shown in Figure 5C, the shape of bumps is not constant and the electrical characteristic is not stable.
  • the shape (e.g. diameter and amount of protrusion) of the gold bumps becomes non-uniform depending on the gold electroplating conditions, for example, the Reynolds number of liquid flow imparted to the plating liquid, the current density, the amount of a plating liquid additive etc.
  • the amount of plating deposition is greater in the central portion than in the marginal portion under the influence of the current density distribution and therefore, in an electrical connecting member, the amount of protrusion of electrically conductive members present in the central portion becomes greater than the amount of protrusion of electrically conductive members present in the marginal portion and thus, it is not easy to make the diameter of protrusion and the height of protrusion of the electrically conductive members uniform.
  • Figure 6 of the accompanying drawings is a plan view of an electrical connecting member having four electrically conductive members 34
  • Figure 7 of the accompanying drawings is a plan view of an electrical connecting member having seven electrically conductive members 34.
  • FIG. 6 wherein four electrically conductive members 34 are located at the verteces of a lozenge, the amount of protrusion of the two electrically conductive members 34 at the verteces the diagonal of which is shorter is greater than that of the other two electrically conductive members 34.
  • Figure 7 wherein six electrically conductive members 34 are disposed so as to surround an electrically conductive member 34, the central one is greater in the amount of protrusion than the other six ones.
  • Figure 8 of the accompanying drawings is a fragmentary plan view of an electrical connecting member 31 forming a pattern in which a number of rows of seven electrically conductive members 34 each are disposed. In each row, the amount of protrusion is smaller in the marginal portion than in the central portion.
  • the forming methods as described above suffer from such problems as will be described below.
  • the removing step is cumbersome, and when the ground metal layer is removed in its liquid phase, etching liquid remains and this remaining liquid is liable to be mixed with the gold plating liquid to cause a bad shape.
  • the area of contact with the ground metal layer is small and therefore the intimate contact property is deficient and thus, this method is liable to cause a reduction in the strength of the protrusions during boding.
  • the method of repeating the photolithography step and the gold plating method generally requires a long time as the steps, and the alignment in the photolithography step is difficult, and this leads to the problem that the control of the height of the gold plating in each step is difficult.
  • EP-A- 0 344 720 discloses a method of producing electrical connection members being generic to that of the present invention. After developing a eight sensitive resin to form holes therein, the resin is cured at an elevated temperature.
  • Figures 1A and 1B are schematic views showing an example of the use of an electrical connecting member.
  • Figures 2A - 2E are schematic cross-sectional views showing the steps of a prior-art manufacturing method.
  • Figure 3 is a schematic view showing a state in which the plating process is carried out.
  • Figure 4 is a schematic cross-sectional view showing a part of the manufacturing step for illustrating problems peculiar to the prior-art manufacturing method.
  • Figures 5A - 5C are schematic cross-sectional views showing cases where the prior-art manufacturing method is inconvenient.
  • Figure 6 is a schematic view for illustrating problems in the prior-art manufacturing method.
  • Figure 7 is a schematic view for illustrating problems in the prior-art manufacturing method.
  • Figure 8 is a schematic view for illustrating problems in the prior-art manufacturing method.
  • Figures 9A - 9E are schematic cross-sectional views showing the essential steps of a manufacturing method according to an embodiment of the present invention.
  • Figure 10 is a schematic view showing a developing mode in the embodiment of the present invention.
  • Figures 11A and 11B are fragmentary enlarged cross-sectional views showing the states during the injection of developing liquid and during the stoppage of the injection of the developing liquid, respectively.
  • Figure 12 is a time chart showing the patterns during the injection of the developing liquid and during the stoppage of the injection of the developing liquid, respectively.
  • Figure 13 is a schematic view showing another developing mode used in the embodiment of the present invention.
  • Figure 14 is a fragmentary enlarged cross-sectional view of the surface of a copper plate 1 shown in Figure 13.
  • Figure 15 is a schematic view showing still another developing mode used in the embodiment of the present invention.
  • Figure 16 is a schematic view showing yet still another developing mode used in the embodiment of the present invention.
  • Figure 17 is a schematic view showing a further developing mode used in the embodiment of the present invention.
  • Figure 18 is a graph showing an example of the mode of a heated atmosphere and a negative pressure atmosphere or a negative pressure atmosphere in the manufacturing method according to the embodiment of the present invention.
  • Figure 19 is a graph showing another example of the mode of a negative pressure atmosphere in the manufacturing method according to the embodiment of the present invention.
  • Figure 20 is a graph showing still another example of the mode of a heated atmosphere and a negative pressure atmosphere in the manufacturing method according to the embodiment of the present invention.
  • Figures 21A - 21C are schematic cross-sectional views showing the shape of a gold protrusion formed.
  • Figure 22 is a schematic plan view of electrically conductive members in an electrical connecting member manufactured by a prior-art manufacturing method.
  • Figure 23 is a schematic plan view of electrically conductive members in an electrical connecting member manufactured by a manufacturing method according to the embodiment of the present invention.
  • Figure 24 is a schematic plan view of electrically conductive members in an electrical connecting member manufactured by the prior-art manufacturing method.
  • Figure 25 is a schematic plan view of electrically conductive members in an electrical connecting member manufactured by the manufacturing method according to the embodiment of the present invention.
  • Figure 26 is a schematic plan view of electrically conductive members in an electrical connecting member manufactured by the prior-art manufacturing method.
  • Figure 27 is a schematic plan view of electrically conductive members in an electrical connecting member manufactured by the manufacturing method according to the embodiment of the present invention.
  • FIGS 9A - 9B are schematic cross-sectional views showing the manufacturing steps according to an embodiment of the present invention.
  • Negative type polyimide resin 102 which is photosensitive resin is first applied onto a copper plate 101 which is a base body by a spin coater, and then is pre-baked, whereafter light (not shown) is applied to the polyimide resin 102 through a photomask 103 forming a predetermined pattern ( Figure 9A).
  • the film thickness of the applied polyimide resin 102 is made greater than the desired film thickness of a holding member in an electrical connecting member to be manufactured, with a decrease by the curing and shrinkage of the resin taken into account.
  • developing liquid is injected to the polyimide resin or the polyimide resin is immersed in developing liquid to thereby effect development.
  • FIG 10 is a schematic view showing a developing mode in the present embodiment.
  • the copper plate 101 which is the base body (together with the photosensitive resin 102 exposed to light) is placed on a turn table 210, and developing liquid is intermittently injected to the surface of the copper plate 101 from an injection nozzle 211 for the developing liquid disposed above and in opposed relationship with the turn table 210 while the turn table 210 is continuously rotated at a predetermined speed, whereby development is effected.
  • Figure 11A is a fragmentary enlarged view showing the state during the injection of the developing liquid
  • Figure 11B is a fragmentary enlarged view showing the state during the stoppage of the injection of the developing liquid.
  • the developing liquid collects and stagnates in apertures 104 formed by development, but in the injection stopping process of the developing liquid, the developing liquid is discharged out of the apertures 104 with residue by a centrifugal force and development is expedited by the injection of fresh developing liquid.
  • FIG. 12 which is a time chart showing the injection timing of the developing liquid
  • the horizontal axis represents time and the vertical axis represents the injection state and injection stopped state of the developing liquid.
  • the injection time and the injection stoppage time are set as required to thereby effect the injection and the stoppage alternately.
  • Figure 13 is a schematic view showing another developing mode used in the present embodiment
  • Figure 14 is a fragmentary enlarged cross-sectional view of the surface of the copper plate 101.
  • the upper plate 101 is placed on the turn table 210 rotated at a predetermined speed, and the developing liquid is continuously injected from the injection nozzle 211 disposed above and in opposed relationship with the turn table, and an air nozzle 212 is disposed sideways of the turn table 210 in proximity to and in parallelism to the surface of the turn table 210, and air is injected along the surface of the copper plate 101 from the air nozzle 212 with pressure of the order of 0-10 kgf/cm 2 .
  • negative pressure is created in the apertures 104 by the sucking action of air and the developing liquid and developing residue in the apertures 104 are sucked and removed.
  • the developing liquid is continuously or intermittently injected from the injection nozzle 211.
  • Figure 15 is a schematic view showing still another developing mode used in the present embodiment.
  • An air nozzle 213 is somewhat obliquely disposed sideways of the injection nozzle 211 for the developing liquid.
  • the developing liquid is continuously or intermittently injected from the injection nozzle 211 for the developing liquid.
  • FIG 16 is a schematic view showing yet still another developing mode used in the present embodiment.
  • Ultrasonic vibrators 214 of e.g. 20 kHz to 10 MHz as a single or plural kinds of frequencies are attached to the underside of the turn table 210.
  • the turn table 210 and the copper plate 101 are vibrated at a high speed, whereby the circulation of the developing liquid in the apertures is expedited and the removal of residue can be accomplished effectively.
  • the developing liquid is continuously or intermittently injected from the injection nozzle 211 for the developing liquid.
  • FIG 17 is a schematic view showing a further developing mode used in the present embodiment.
  • the turn table 210 is provided so as to face downwardly and the copper plate 101 is fixed to the underside thereof by a fixture, not shown, and an injection nozzle 215 for developing liquid is disposed below and in opposed relationship with the turn table 210.
  • the developing liquid injected into the apertures 104 does not collect in the apertures 104 but can be automatically discharged with residue, and the circulation efficiency of the developing liquid in the apertures 104 is improved.
  • the developing liquid is continuously or intermittently injected from the injection nozzle 215.
  • the polyimide resin 102 remains in the portions exposed to light and the polyimide resin 102 is removed from the portions not exposed to light by the developing process, whereby a plurality of apertures 104 are formed in the polyimide resin 102 ( Figure 9B).
  • the developing liquid infiltrates into the polyimide resin 102, which is thus expanded a little, and the diameter of the apertures 104 formed in the polyimide resin 102 becomes smaller than the predetermined pattern of the photomask 103 and the shape of the formed apertures 104 is not constant.
  • the intermediate member 110 after the developing step is left in a heated and negative pressure atmosphere or in a negative pressure atmosphere for a predetermined time to thereby evaporate the developing liquid which has infiltrated into the polyimide resin 102.
  • Figure 18 shows an example of the atmosphere in this case (a case where the boiling point of the developing liquid is 200°C).
  • the termination of the time for which the intermediate member is left in such an atmosphere can be judged at a point of time whereat the weight of the intermediate member 110 scarcely changes after greatly decreased by the evaporation of the developing liquid.
  • the developing liquid which has infiltrated into the polyimide resin 102 is removed to thereby form a plurality of apertures 104 having a uniform pattern shape having no taper formed ( Figure 9C).
  • the heating temperature is increased to 200-400°C to thereby cure the polyimide resin 102, whereafter the copper plate 101 is immersed in etching liquid to thereby effect the etching of the copper plate 101 and remove the portions of the copper plate 101 which are near the apertures 104 by etching, thereby forming in the copper plate 101 recesses 105 communicating with the apertures 104 ( Figure 9D).
  • the diameter of the recesses 105 formed at this time is larger than the diameter of the apertures 104 and small than a half of the distance to the outer periphery of the adjacent aperture 104.
  • the intermediate member 110 when removing the developing liquid which has infiltrated into the polyimide resin 102, the intermediate member 110 is left in the heated and negative pressure atmospheres, but alternatively, the intermediate member may be left in a negative pressure atmosphere.
  • Examples of the atmosphere in such a case a case where the boiling point of the developing liquid is 200°C are shown in Figures 19 and 20.
  • Figure 19 represents an example of the normal temperature and negative pressure atmosphere
  • Figure 20 represents an example of the heated and increased pressure atmosphere.
  • "negative pressure" is a pressure below atmospheric pressure.
  • N Re ⁇ 2 / ⁇ , where ⁇ is the number of rotations, ⁇ is the rotation radius, and ⁇ is the coefficient of kinematic viscosity.
  • gold protrusions are formed at locations of 8 mm from the center of the rotational shaft, and gold plating liquid of sulfite line is used as gold plating liquid.
  • FIGS 21A - 21C are cross-sectional views showing the shape of a gold protrusion formed.
  • the reference numeral 102 designates photoresist which provides a holding member, and an opening 104 to be gold-lated is provided by the photoresist 102 of a predetermined pattern, and a gold protrusion 106 is formed in the opening 104.
  • d indicates the diameter of the opening 104.
  • Figure 21 The shape of the formed gold protrusion can be classified into three kinds as shown in Figure 21.
  • Figure 21A shows an ideal shape forming an upwardly convex shape, and such a shape will hereinafter be referred to as A.
  • Figure 21B shows a bad shape having a depression formed in the central portion of the protrusion, and such a shape will hereinafter be referred to as B.
  • Figure 21C shows a bad shape having a lateral expanse formed toward the marginal portion of the protrusion, and such a shape will hereinafter be referred to as C.
  • the photoresist 102 was patternized so that the diameter d of the openings 104 might be 10 ⁇ m, 15 ⁇ m, 30 ⁇ m, 50 ⁇ m, 80 ⁇ m and 100 ⁇ m, and gold protrusions 106 were formed relative to the openings 104 with the Reynolds number (N Re ) of the plating liquid as 0, 10, 30, 50, 100 and 200.
  • N Re Reynolds number
  • 30 ppm of Tl was added to the plating liquid, and a quantity of electricity of 25 C/cm 2 was imparted with the current density as 4 mA/cm 2 .
  • the formed gold protrusions 106 were observed by means of a scanning type electronic microscope. The result of this observation is shown in Table 1 below.
  • the shape of type A becomes null in all ranges of the Reynolds number 0 to 450 and the diameter of the openings of 10 ⁇ m to 200 ⁇ m in Table 1, and the bad shapes of types B and C are created. Accordingly, from Table 1 and 2, it is seen that it is preferable that the diameter d of the openings be equal to or greater than 10 ⁇ m and equal to or less than 150 ⁇ m, the Reynolds number N Re of the plating liquid be a laminar flow equal to or greater than 50 and equal to or less than 450 and the current density be equal to or greater than 1 mA/cm 2 and equal to or less than 5 mA/cm 2 .
  • the quantity of Tl added to the plating liquid was varied to 0 ppm, 10 ppm, 30 ppm, 60 ppm, 90 ppm, 100 ppm, 500 ppm and 1,000 ppm to thereby form gold protrusions.
  • the result is shown in table 3 below. Quantity of Tl added (ppm) 0 10 30 60 90 100 500 1,000 C C A A A A B B
  • the temperature of the plating liquid is kept at room temperature (0 - 40°C) and the flow velocity of the plating liquid and the current density are varied in conformity with the growth of plating. Not all of these conditions need be satisfied, but depending on the number and arrangement pattern of electrically conductive members in an electrical connecting member to be manufactured, the uniformization of the amount of protrusion of that electrically conductive members can be realized by a single condition or a combination of any conditions.
  • plan view shapes of the electrically conductive members in the prior-art example and the present embodiment of case (1) are schematically shown in Figures 22 and 23, respectively.
  • the amount of - protrusion of the electrically conductive members differs between the central portion and the marginal portion, while in the present embodiment in Figure 23, electrically conductive members uniform in the amount of protrusion are formed over the whole area.
  • electrically conductive members uniform in the amount of protrusion are formed over the whole area.
  • a uniform amount of plating deposition of gold can be achieved simply by adjusting the temperature of the plating liquid.
  • plan view shapes of the electrically conductive members in the prior-art example and the present embodiment of case (2) are schematically shown in Figures 24 and 25, respectively.
  • few electrically conductive members are formed, while in the present embodiment in Figure 25, electrically conductive members uniform in the amount of protrusion are formed over the whole area.
  • electrically conductive members uniform in the amount of protrusion are formed over the whole area.
  • a uniform amount of plating deposition of gold can be achieved by adjusting the temperature of the plating liquid and the flow velocity of the plating liquid.
  • FIG. 26 and 27 The plan view shapes of the electrically conductive members in the prior-art example and the present embodiment of case (3) are shown in Figures 26 and 27, respectively.
  • two electrically conductive members each differ in the amount of protrusion
  • all of four electrically conductive members are uniform in the amount of protrusion.
  • a uniform amount of plating deposition of gold can be achieved by adjusting the kind of the plating liquid, the temperature of the plating liquid, the flow velocity of the plating liquid and the current density.
  • the temperature of the plating liquid was 23°C, but a similar effect was obtained when the temperature of the plating liquid was 0°C to 40°C.
  • the amount of protrusion of the seven electrically conductive members could also be made uniform by effecting similar adjustment by the manufacturing method of the present embodiment.
  • the apertures 104 and recesses 105 are filled with gold 106 by electroplating (Figure 9D).
  • the recesses 105 and apertures 104 are filled with gold 106 until bumps are formed.
  • the copper plate 101 is dissolved and removed by the use of etching liquid which etches copper but does not etch gold and polyimide resin, thereby manufacturing an electrical connecting member 31 ( Figure 2E).
  • the gold 106 constitutes the electrically conductive members 34 ( Figure 2E) and the polyimide resin 102 constitutes the holding member 35 ( Figure 2E).
  • the polyimide resin 102 is used as photosensitive resin which provides the holding member, but use may also be made of any other photosensitive resin such as epoxy resin or silicone resin.
  • the copper plate 101 is used as the base body, whereas this is not restrictive, but other metal or an alloy can also be used. However, since in the final step, only the base body is selectively removed by etching, it is necessary to make the material of the electrically conductive members 34 and the material of the base body different from each other.
  • photosensitive resin such as polyimide resin is used as the holding member, whereas this is not restrictive, but use may be made of any photosensitive resin.
  • photosensitive resin such as polyimide resin
  • one or more of inorganic materials, metal materials and alloy materials in a desired form of powder, fiber, a plate-like body, a bar-like body, a spherical body or the like may be dispersed and contained in photosensitive resin.
  • metal material and alloy material contained mention may be made of Au, Ag, Cu, Al, Be, Ca, Mg, Mo, Fe, Ni, Co, Mn, W, Cr, Nb, Zr, Ti, Ta, Zn, Sn, Pb-Sn, etc.
  • ceramics such as SiO 2 , B 2 O 3 , Al 2 O 3 , Na 2 O, K 2 O, CaO, ZnO, BaO, PbO, Sb 2 O 3 , As 2 O 3 , La 2 O 3 , ZrO 2 , P 2 O 5 , TiO 2 , MgO, SiC, BeO, BP, BN, AlN, B 4 C, TaC, TiB 2 , CrB 2 , TiN, Si 3 N 4 and Ta 2 O 5 , diamond, glass, carbon, boron, etc.
  • gold is used as the material of the electrically conductive members 106, but instead of gold, use may be made of a metallic simple substance such as Cu, Ag, Be, Ca, Mg, Mo, Ni, W, Fe, Ti, In, Ta, Zn, Al, Sn or Pb-Sn, or an alloy of these.
  • the cross-sectional shape of the electrically conductive members 106 can be circular, square or other shapes, but to avoid the excessive concentration of stress, rounded shapes are desirable.
  • the electrically conductive members 106 need not be vertically disposed in the holding member, but may be oblique from one surface side of the holding member to the other surface side of the holding member.
  • the manufacturing method of the present embodiment can expedite the circulation of the developing liquid in the apertures and effectively remove the residue in the apertures and thus, can uniformize the shape of the apertures and the exposed shape of the surface of the base body exposed in the apertures and can achieve the uniformization of the shape of the recesses formed in the base body and further the shape of the electrically conductive members, thereby achieving excellent effects such as the stabilization of the characteristic and the improved yield of product.
  • the manufacturing method of the present embodiment leaves the intermediate member after the developing step in a heated atmosphere and a negative pressure atmosphere or in a negative pressure atmosphere for a predetermined time, and heats and cure it after evaporation-removing the developing liquid which has infiltrated into photosensitive resin and therefore, can form a number of apertures each forming a predetermined shape in the photosensitive resin, thus manufacturing an electrical connecting member in which the shape of all electrically conductive members is uniform.
  • the manufacturing method of the present embodiment achieves excellent effects such as the capability of manufacturing an electrical connecting member having electrically conductive members provided therein at high density, and the possibility of high-density connection of electric circuit parts.
  • a bad shape resulting from a depression in the central portion of each protrusion or the lateral expanse toward the marginal portion of each protrusion can be avoided and thus, there can be formed gold protrusions of a very good shape.
  • the temperature of the plating liquid, the flow velocity of the plating liquid and the current density are adjusted in the electroplating step and therefore, there can be manufactured an electrical connecting member in which the influence of the current density distribution is prevented and which has a plurality of electrically conductive members having equal amounts of protrusion provided over the whole area, and as a result, there can be achieved an excellent effect such as the capability of greatly improving the manufacturing efficiency.
  • an electrical connecting member capable of connecting electric circuit parts together well and a method of manufacturing the same.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Electrical Connectors (AREA)

Claims (11)

  1. Procédé de fabrication d'un élément de connexion électrique possédant un élément de retenue réalisé en un matériau électriquement isolant, et une pluralité d'éléments électriquement conducteurs disposés dans ledit élément de retenue dans un état mutuellement isolé, une extrémité de chacun desdits éléments conducteurs étant exposée sur une surface dudit élément de retenue et l'autre extrémité de chacun desdits éléments électriquement conducteurs étant exposée sur l'autre surface dudit élément de retenue, ledit procédé comprenant les étapes suivantes :
    a) apport d'une résine photosensible (102) qui dispose ledit élément de retenue sur un élément de base (101) ;
    b) application de lumière à ladite résine photosensible à travers un photomasque formant un motif prédéterminé pour ainsi exposer ladite résine photosensible à la lumière ;
    c) développement de ladite résine photosensible avec un liquide de développement pour former une pluralité d'ouvertures (104) dans ladite résine photosensible, pour exposer ledit élément de base formant ainsi un élément intermédiaire (110) ;
    d) laisser ledit élément intermédiaire ayant ladite résine photosensible à travers laquelle ledit élément de base a été exposé dans
    une atmosphère chauffée et une atmosphère de pression négative pendant un temps prédéterminé ou
    dans une atmosphère de pression négative pendant un temps prédéterminé pour ainsi évaporer le liquide de développement qui a été infiltré dans ladite résine photosensible jusqu'à ce que le poids dudit élément intermédiaire varie à peine après évaporation dudit liquide de développement ;
    e) cuisson de la résine photosensible ;
    f) gravure des parties exposées dudit élément de base pour ainsi former des évidements (105) communiquant avec lesdites ouvertures ;
    g) remplissage desdites ouvertures et desdits évidements avec un matériau électriquement conducteur (106) qui constitue lesdits éléments électriquement conducteurs ; et
    h) élimination des parties restantes dudit élément de base.
  2. Procédé selon la revendication 1, dans lequel lesdits éléments électriquement conducteurs constituent des parties de connexion électrique devant être connectées aux parties de connexion de parties de circuit électrique, et lesdites parties de connexion et lesdites parties de connexion électrique étant réunies métallurgiquement.
  3. Procédé selon la revendication 1, dans lequel une configuration de câblage est formée sur l'une ou chacune des surfaces dudit élément de retenue.
  4. Procédé selon la revendication 1, dans lequel l'étape de remplissage desdites ouvertures et desdits évidements avec ledit matériau électriquement conducteur est l'étape de dépôt électrolytique dudit matériau électriquement conducteur avec le diamètre desdites ouvertures étant égal à ou supérieur à 10 µm et égal à ou inférieur à 150 µm, le nombre de Reynolds de l'écoulement de liquide conféré au liquide de revêtement étant un écoulement laminaire égal à ou supérieur à 50 et égal à ou inférieur à 450, et la densité de courant conférée entre deux électrodes étant égale à ou supérieure à 1 mA/cm2 et égale à ou inférieure à 5 mA/cm2.
  5. Procédé selon la revendication 4, dans lequel l'étape de remplissage desdites ouvertures et desdits évidements avec ledit matériau électriquement conducteur est l'étape de dépôt électrolytique dudit matériau électriquement conducteur par l'utilisation de liquide de revêtement ayant 30 ppm à 100 ppm de Tl ou 30 ppm à 500 ppm de As ajouté en tant qu'additif à celui-ci.
  6. Procédé selon la revendication 1, dans lequel l'étape de remplissage desdites ouvertures et desdits évidements avec ledit matériau électriquement conducteur est une étape qui satisfait au moins à l'une de la condition que le liquide de revêtement soit entre 0°C et 40°C, de la condition que la vitesse d'écoulement du liquide de revêtement soit rendue variable conformément à la croissance dudit matériau électriquement conducteur par le liquide de revêtement, et de la condition que la densité de courant du liquide de refroidissement soit rendue variable en conformité avec la croissance dudit matériau électriquement conducteur par dépôt.
  7. Procédé selon la revendication 1, dans lequel l'étape c) et l'étape d) comportent :
    une injection intermittente de liquide de développement à la surface de ladite résine photosensible tout en entraínant en rotation ladite résine photosensible pour ainsi former une pluralité d'ouvertures à travers lesquelles la surface dudit élément de base est découverte.
  8. Procédé selon la revendication 1, dans lequel l'étape c) et l'étape d) comportent :
    l'injection de liquide de développement et de gaz à la surface de ladite résine photosensible à la fois ou en alternance pour ainsi former une pluralité d'ouvertures à travers lesquelles la surface dudit élément de base est découverte.
  9. Procédé selon la revendication 1, dans lequel l'étape c) et l'étape d) comportent :
    la propagation d'une onde ultrasonique à travers ladite résine photosensible tout en injectant le liquide de développement à la surface de ladite résine photosensible, formant ainsi une pluralité d'ouvertures à travers lesquelles ledit élément de base est découvert.
  10. Procédé selon la revendication 9, dans lequel ladite onde ultrasonique est égale à ou supérieure à 20 KHz et égale à ou inférieure à 10 MHz.
  11. Procédé selon la revendication 9, dans lequel ladite résine photosensible exposée a sa surface tournée vers le bas et le liquide de développement est injecté depuis le dessous de ladite résine photosensible.
EP92103028A 1991-02-25 1992-02-24 Corps d'interconnexion électrique et procédé de sa fabrication Expired - Lifetime EP0501361B1 (fr)

Applications Claiming Priority (12)

Application Number Priority Date Filing Date Title
JP53905/91 1991-02-25
JP5390591 1991-02-25
JP03053905A JP3127252B2 (ja) 1991-02-25 1991-02-25 電気的接続部材の製造方法
JP6909091 1991-03-09
JP69090/91 1991-03-09
JP6909091A JPH04282837A (ja) 1991-03-09 1991-03-09 金突起の形成方法
JP8759791 1991-03-26
JP8759791A JPH04296483A (ja) 1991-03-26 1991-03-26 電気的接続部材の製造方法
JP87597/91 1991-03-26
JP91638/91 1991-03-28
JP9163891 1991-03-28
JP03091638A JP3108792B2 (ja) 1991-03-28 1991-03-28 電気的接続部材の製造方法

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EP0501361A1 EP0501361A1 (fr) 1992-09-02
EP0501361B1 true EP0501361B1 (fr) 2002-05-15

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KR0146063B1 (ko) * 1995-03-28 1998-08-01 문정환 반도체 패키지 및 그 제조방법
JPH10163211A (ja) * 1996-12-02 1998-06-19 Fujitsu Ltd バンプ形成用板部材の製造方法及びバンプ形成方法
JP2002204531A (ja) 2000-10-31 2002-07-19 Canon Inc 交流連系装置およびその制御方法
JP2002233045A (ja) 2001-02-02 2002-08-16 Canon Inc 太陽光発電システムの地絡検出のための装置及び方法
US6623912B1 (en) 2001-05-30 2003-09-23 Taiwan Semiconductor Manufacturing Company Method to form the ring shape contact to cathode on wafer edge for electroplating in the bump process when using the negative type dry film photoresist
JP5553504B2 (ja) 2008-12-26 2014-07-16 キヤノン株式会社 半導体装置の製造方法及び半導体装置
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Also Published As

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DE69232606D1 (de) 2002-06-20
DE69232606T2 (de) 2004-08-05
US5323535A (en) 1994-06-28
EP0501361A1 (fr) 1992-09-02

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