JPH0510365Y2 - - Google Patents
Info
- Publication number
- JPH0510365Y2 JPH0510365Y2 JP8910588U JP8910588U JPH0510365Y2 JP H0510365 Y2 JPH0510365 Y2 JP H0510365Y2 JP 8910588 U JP8910588 U JP 8910588U JP 8910588 U JP8910588 U JP 8910588U JP H0510365 Y2 JPH0510365 Y2 JP H0510365Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- bumps
- electrode
- hardness
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 15
- 238000007747 plating Methods 0.000 description 16
- 238000000034 method Methods 0.000 description 12
- 230000007423 decrease Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8910588U JPH0510365Y2 (fr) | 1988-07-05 | 1988-07-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8910588U JPH0510365Y2 (fr) | 1988-07-05 | 1988-07-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0211337U JPH0211337U (fr) | 1990-01-24 |
| JPH0510365Y2 true JPH0510365Y2 (fr) | 1993-03-15 |
Family
ID=31313659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8910588U Expired - Lifetime JPH0510365Y2 (fr) | 1988-07-05 | 1988-07-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0510365Y2 (fr) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7052444B2 (ja) * | 2018-03-15 | 2022-04-12 | 住友大阪セメント株式会社 | 光変調器、及び光伝送装置 |
-
1988
- 1988-07-05 JP JP8910588U patent/JPH0510365Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0211337U (fr) | 1990-01-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5311404A (en) | Electrical interconnection substrate with both wire bond and solder contacts | |
| US5337466A (en) | Method of making a multilayer printed wiring board | |
| JP2004119728A (ja) | 回路装置の製造方法 | |
| JP2004119726A (ja) | 回路装置の製造方法 | |
| US5965944A (en) | Printed circuit boards for mounting a semiconductor integrated circuit die | |
| JP2004119727A (ja) | 回路装置の製造方法 | |
| JP2003007922A (ja) | 回路装置の製造方法 | |
| JPH0432541B2 (fr) | ||
| US7045393B2 (en) | Method for manufacturing circuit devices | |
| JPH0510365Y2 (fr) | ||
| JPH0357617B2 (fr) | ||
| US5024734A (en) | Solder pad/circuit trace interface and a method for generating the same | |
| JPH07326853A (ja) | プリント配線板のボールバンプ形成方法 | |
| JP2760360B2 (ja) | はんだバンプとその製造方法 | |
| KR19990005679A (ko) | 플립칩 실장용 패키지의 제조방법 | |
| JP3897250B2 (ja) | 半導体パッケージ用基板とその製造方法 | |
| JP4161463B2 (ja) | チップキャリアの製造方法 | |
| JP4090151B2 (ja) | パッケージ基板 | |
| JPH11168279A (ja) | 多層回路基板及びその製造方法 | |
| JP4033090B2 (ja) | 半導体装置用テープキャリアの製造方法 | |
| JP2001148393A (ja) | バンプの形成方法、半導体装置及びその製造方法、回路基板並びに電子機器 | |
| JP2674786B2 (ja) | Ｉｃの実装方法および実装装置 | |
| JP3562074B2 (ja) | 半導体パッケージ用樹脂フレーム及び半導体パッケージの製造方法 | |
| JP3883497B2 (ja) | 半導体パッケージの製造方法 | |
| JPH0883799A (ja) | はんだバンプの形成方法 |