EP0346935A2 - Tintenstrahlaufzeichnungskopf und Verfahren zum Vorbehandeln eines Substrats für einen Aufzeichnungskopf - Google Patents
Tintenstrahlaufzeichnungskopf und Verfahren zum Vorbehandeln eines Substrats für einen Aufzeichnungskopf Download PDFInfo
- Publication number
- EP0346935A2 EP0346935A2 EP89111010A EP89111010A EP0346935A2 EP 0346935 A2 EP0346935 A2 EP 0346935A2 EP 89111010 A EP89111010 A EP 89111010A EP 89111010 A EP89111010 A EP 89111010A EP 0346935 A2 EP0346935 A2 EP 0346935A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- heat
- recording head
- electricity
- process according
- ink jet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims description 13
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000007788 liquid Substances 0.000 claims abstract description 35
- 238000007599 discharging Methods 0.000 claims abstract description 25
- 230000003647 oxidation Effects 0.000 claims abstract description 25
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 25
- 238000000034 method Methods 0.000 claims description 28
- 239000000463 material Substances 0.000 claims description 23
- 230000001590 oxidative effect Effects 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 7
- 239000011810 insulating material Substances 0.000 claims description 6
- 229910052715 tantalum Inorganic materials 0.000 claims description 6
- 229910052749 magnesium Inorganic materials 0.000 claims description 5
- 229910052758 niobium Inorganic materials 0.000 claims description 5
- 238000001771 vacuum deposition Methods 0.000 claims description 5
- 229910052720 vanadium Inorganic materials 0.000 claims description 5
- 229910052725 zinc Inorganic materials 0.000 claims description 5
- 229910052726 zirconium Inorganic materials 0.000 claims description 5
- 238000007743 anodising Methods 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 3
- 238000004544 sputter deposition Methods 0.000 claims description 3
- 238000007740 vapor deposition Methods 0.000 claims description 3
- 239000010410 layer Substances 0.000 claims 5
- 239000011241 protective layer Substances 0.000 claims 4
- 239000004020 conductor Substances 0.000 abstract description 2
- 239000011347 resin Substances 0.000 description 13
- 229920005989 resin Polymers 0.000 description 13
- 238000002360 preparation method Methods 0.000 description 9
- 238000000059 patterning Methods 0.000 description 8
- 229920002120 photoresistant polymer Polymers 0.000 description 8
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 239000007858 starting material Substances 0.000 description 4
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1604—Production of bubble jet print heads of the edge shooter type
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/022—Anodisation on selected surface areas
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
Definitions
- This invention relates to a substrate for ink jet recording head, ink jet recording head having the same and methods for preparing them.
- Ink jet recording method is a recording method which performs recording by discharging an ink (liquid for recording) through discharging opening provided on a recording head and attaching this onto a record overwhelminging medium such as paper, etc., having many advantages such that generation of noise is very small, and also high speed recording is possible and yet no paper for recording of special constitution is required, etc. and various types of recording heads have been developed.
- the recording head of the type which permits heat energy to act on ink, thereby discharging the ink through discharging opening has advantages such as good response to recording signals, easy arrangement of multiple discharging openings at high density.
- the recording head to be used for such recording method has typically a constitution as shown in schematic perspective view of Fig. 1. Specifically, it is provided with a discharging opening 101 provided for forming flying droplets by discharging ink, a liquid channel 102 for supplying ink communicated to said discharging opening, an electricity-heat converting element having a heat generating resistor which is a heat energy generator 104A and provided internally of the liquid channel 102 and electrodes for supplying current to the heat-generating resistor and a liquid chamber 103 for storing ink to be supplied into the liquid channel provided upstream side of the liquid channel, and is also provided with, if necessary, a protective film having the action of enhancing ink resistance of the electricity heat converting element.
- a discharging opening 101 provided for forming flying droplets by discharging ink
- a liquid channel 102 for supplying ink communicated to said discharging opening
- an electricity-heat converting element having a heat generating resistor which is a heat energy generator 104A and
- FIG. 2 shows schematic sectional views of the preparation steps at the position when the recording head is cut at the A - A′portion shown in Fig. 1.
- the layer 251 a part of which becomes finally the heat generating resistor (hereinafter called heat-generating resistance layer) and the layer 252 a part of which becomes electrodes (hereinafter called electrode layer) are formed on a support 253 (steps (a), (b)).
- the electrode layer 252 is subjected to patterning utilizing photolithographic technique by use of photoresist 254 and etching technique, and subsequently, the heat-generating resistance layer 251 is similarly subjected to patterning to form heat-generating resistor and electrodes (steps (c) to (k)).
- a photoresist 254 such as photosensitive resin, etc.
- the photoresist 254 of the product (c) is subjected to pattern exposure (step (d)), followed by developing of the photoresist 254 of the product (d) (step (e)).
- the photoresist 254 has only unnecessary portions removed in a desired pattern shape.
- the electrode layer 252 exposed on the product (e) is removed by etching (step (f)), and the remaining resist portion 254′ of the product (f) thus prepared is removed (step (g)).
- a desired pattern of the electrode layer 252 is formed.
- the pattern of the heat-generating resistance layer 251 is also formed according to the same steps as in the case of forming the pattern of the electrode layer 252. That is, the pattern of the heat generating resistance layer 251 is formed by lamination of the photoresist 254 ⁇ (step (h)), pattern exposure on the photoresist of the product (h) by use of a photomask (step (i)), developing of the photoresist 254 ⁇ subjected to pattern exposure of the product (i) for removal of unnecessary portions (step (j)) and etching of the exposed heat-generating resistance layer 251 of the product (j) (step (k)). Then, the resist 254 is peeled off (step (l)).
- a photosensitive resin 256 is laminated (step (n)), followed by exposure (step (o)) and developed (step (p)), to form a wall 256′ with the hardened film of the photosensitive resin subjected to patterning ((m) to (p)).
- This wall constitutes the liquid channel wall which can be filled with a liquid.
- plastered a ceiling 257 is plastered a ceiling 257, and thereafter discharging opening is formed by cutting (not shown) to complete an ink jet recording head (step (q)).
- the preparation method which has been used in the prior art comprises many steps, and in addition, it will take long time for a part of the steps, particularly the etching step, and there has been the point to be improved in that much preparation time is required. Also, there has been left room to be improved also from the point that the positional precisions of the individual members are worsened, because the number of patterning is many.
- the present invention has been accomplished in order to solve the above problems, and its object is to provide a substrate for ink jet recording head which can effect shortening of the preparation time and has good positional precisions of the respective members, and an ink jet recording head having it. Another object of the present invention is to provide methods for preparing them.
- Still another object of the present invention is to provide an ink jet recording head comprising a discharging opening for liquid discharge and an electricity-heat convertor, said electricity-heat convertor having a region formed by oxidation of at least part of an electroconductive material, said region being adapted to generate heat.
- Still another object of the present invention is to provide a process for preparing a substrate for a recording head having on a support an electricity-heat convertor utilized for liquid discharge, which comprises forming a layer of electroconductive material on said support and oxidizing at least part of the surface region of said layer to form the electrodes and heat-generating resistor portion of said electricity-heat convertor.
- Still another object of the present invention is to provide a process for preparing a substrate for a recording head having on a support an electricity-heat convertor utilized for liquid discharge, which comprises forming a layer of electroconductive material on said support, oxidizing part of said layer to make it an oxide, and oxidizing at least part of the surface region of residual electroconductive portion to form the electrodes and heat-generating resistor portion of said electricity-heat convertor.
- Still another object of the present invention is to provide an ink jet recording head comprising a discharging opening provided for forming flying droplets by liquid discharge and an electricity-heat convertor having a heat-generating resistor and a pair of electrodes electrically connected to said heat-generating resistor, said electrodes and said heat-generating resistor being formed of the same material.
- Still another object of the present invention is to provide a process for preparing an ink jet recording head which comprises steps of
- the ink jet recording head to which the present invention is suitably applied is an ink jet recording head having a discharging opening 1 provided for forming flying droplets by discharging a liquid as represented by ink, a liquid channel 2 for supplying the liquid to the discharging opening 1, a liquid chamber 3 for storing the liquid to be supplied to the liquid channel 2 provided upstream thereof, a heat-generating resistor which is a heat energy source for forming flying dorplets by discharging the liquid and is provided corresponding to the liquid channel 2, and at least a pair of electrodes electrically connected to the heat-generating resistor on a substrate 5, forming an electricity-heat converter 4A with a pair of electrodes and the heat-generating resistor, the substrate comprising one material selected for the above heat-generating resistor and electrodes and the same material which has been oxidized. Also, the methods for preparing such substrate and recording head are
- Such ink jet recording head can be prepared according to, for example, the steps of:
- Fig. 4(a) to (d) show schematic plan views of the prepared products corresponding to Fig. 3(d), (e), (f) and (i), respectively. That is, Fig. 4(a) shows the state when the step shown in Fig. 3(d) is practiced, Fig. 4(b) that shown in Fig. 3(e), Fig. 4(c) that shown in Fig. 3(f) and Fig. 4(d) that shown in Fig. 3(i).
- a material which can become both the heat generating resistor and electrodes is formed into a film ((a)).
- the material those which exhibit heat resistance and electroconductivity after film formation, and can be anodically oxidized can be utilized.
- Ta, V, Nb, Zr, Mg, Zn, Ni, Gd, Co, etc. may be employed.
- the thickness of the film formed (film of the starting material) 4 should be preferably made about 500 to 20000 ⁇ .
- the film forming method may be determined depending on the material and, for example, the vacuum deposition method generally known in the art such as sputtering, vacuum vapor deposition, etc. may be preferably utilized.
- the film 4 except for the portions which become the heat-generating resistor and electrodes are covered with a resist 7.
- the lithographic technique known in the art may be utilized ((b) to (d)).
- the film at the portion not covered with the resist 7 is converted to an insulating material by the anodic oxidation method (e), and thereafter, the resist 7 is peeled off.
- the treating solution to be used in this case there may be included aqueous solutions of boric acid, tartaric acid, malonic acid, phosphoric acid, etc. These aqueous solutions may be preferably used particularly for anodic oxidation of Ta film.
- the photosensitive resin 8 of dry film, etc. is wholly laminated (g). Thereafter, partial exposure and developing are practiced to effect patterning of the photosensitive resin 8 to form a pattern of the cured layer of the photosensitive regin ((h) - (i)).
- the cured layer defines the liquid channel and the discharging opening.
- a material which can be finely patterned after lamination can be utilized, including photosensitive resins.
- a schematic plan view of the product completed up to this step is shown in Fig. 4(d), and a sectional view (sectional view corresponding to A - A′ in Fig. 7) of the completed product for reference in Fig. 5.
- the dashed portion in Fig. 4 shows the portion converted to insulating material by anodic oxidation, and the dotted portion the portion where the photosensitive composition is provided.
- a ceiling 6 of glass, etc. is plastered (adhered) to form the liquid channel, etc.
- an electrolyte solution (treating solution) containing an electrolyte is introduced into the liquid chamber and the liquid channel and again anodic oxidation is practiced ((k) the portion to be anodically oxidized is not shown).
- the first anodic oxidation should preferably convert the portion to be anodically oxidized completely to an insulating material, while the second anodic oxidation should be effected so that adequate electroconductivity may remain at the portion to be anodically oxidized.
- the respective anodic oxidations are required to be practiced corresponding to these requirements.
- the ink jet recording head completed as described above is formed of the heat-generating resistor and electrodes by use of the same material as the starting material, but the heat-generating resistor is essentially thinner than the portion other than that, namely electrodes, to be greater in resistance value.
- tantalum (Ta) as the starting material film on the support is to be specifically described below.
- the support having the cured film of photosensitive resin provided on Ta film with a thickness of 1000 ⁇ was subjected to anodic oxidation treatment by use of 1% by weight of an aqueous phosphoric acid solution as the treating solution at a current density of 10mA/cm2 for a treatment time of 120 sec.
- anodic oxidation treatment by use of 1% by weight of an aqueous phosphoric acid solution as the treating solution at a current density of 10mA/cm2 for a treatment time of 120 sec.
- the Ta film in contact with the treating solution was oxidized substantially completely in its thickness direction to be converted into an insulating material (Fig. 3, step (e)).
- the second anodic oxidation only of the heater region becomes unnecessary.
- the shapes of the electrode region and the heat-generating resistor region may be any desired ones as shown in the schematic plan view in Fig. 6.
- 601 is the electrode region and 602 the heat-generating resistor region.
- the pattern formed of the cured film of the photosensitive resin may have the liquid channel formed corresponding to the heat-generating resistor portion. Therefore, the cured film of the photosensitive resin may be also provided in the region 401 in Fig. 4(d).
- Fig. 7 is a schematic plan view, partially enlarged, of Fig. 4(d).
- the substrate under the state where the electrode region and the heat-generating resistor portion region are formed by anodic oxidation may be previously formed, and the liquid channel, etc. may be formed thereof to prepare a recording head.
- the gaps between the respective heat-generating resistance elements are not necessarily required to be anodically oxidized, but unnecessary portions may be removed by etching, and the electrode region and the heat-generating portion forming the heat-generating resistance elements can be also anodically oxidized, if desired, to form heat-generating resistance elements.
- the ink jet recording head can be prepared by two patterning steps and one film forming step, the number of steps can be shortened to a great extent. Also, according to the present invention, patterning is possible only by anodic oxidation without utilizing etching step, and in addition to the above reason, preparation time can be also effected in this respect. Further, according to the present invention, the location positional precisions of the respective members can be improved.
- the upper surface of the heat-generating resistance element (substrate upper surface) has little unevenness, peeling of the respective members, etc. will occur with difficulty, whereby a recording head enriched in durability can be provided.
- the preparation order of the recording head, the constitution of the recording head can be changed as desired as a matter of course.
- An ink jet recording head comprises a discharging opening for liquid discharge and an electricity-heat convertor.
- the electricity-heat convertor has a region formed by oxidation of at least part of an electro-conductive material, and the region is adpated to generate heat.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP148173/88 | 1988-06-17 | ||
JP14817388 | 1988-06-17 |
Publications (3)
Publication Number | Publication Date |
---|---|
EP0346935A2 true EP0346935A2 (de) | 1989-12-20 |
EP0346935A3 EP0346935A3 (de) | 1991-04-03 |
EP0346935B1 EP0346935B1 (de) | 1995-09-06 |
Family
ID=15446881
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP89111010A Expired - Lifetime EP0346935B1 (de) | 1988-06-17 | 1989-06-16 | Tintenstrahlaufzeichnungskopf und Verfahren zum Vorbehandeln eines Substrats für einen Aufzeichnungskopf |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0346935B1 (de) |
JP (1) | JP2744472B2 (de) |
DE (1) | DE68924101T2 (de) |
ES (1) | ES2076174T3 (de) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0609860A2 (de) * | 1993-02-03 | 1994-08-10 | Canon Kabushiki Kaisha | Herstellungsverfahren für einen Tintenstrahlaufzeichnungskopf |
US5448273A (en) * | 1993-06-22 | 1995-09-05 | Xerox Corporation | Thermal ink jet printhead protective layers |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3403643A1 (de) * | 1983-02-05 | 1984-08-09 | Canon K.K., Tokio/Tokyo | Fluessigkeitsstrahl-aufzeichnungskopf |
EP0140611A2 (de) * | 1983-10-31 | 1985-05-08 | Hewlett-Packard Company | Thermischer Tintenstrahl-Druckkopf |
EP0286204A1 (de) * | 1987-02-04 | 1988-10-12 | Canon Kabushiki Kaisha | Grundplatte für Tintenstrahlaufzeichnungskopf |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5582680A (en) * | 1978-12-19 | 1980-06-21 | Matsushita Electric Ind Co Ltd | Manufacture of thermal head |
JPS59146861A (ja) * | 1983-02-14 | 1984-08-22 | Canon Inc | インクジェットヘッド |
JPS61124109A (ja) * | 1984-11-20 | 1986-06-11 | 三菱電機株式会社 | サ−マルヘツドの製造方法 |
JPS61260604A (ja) * | 1985-05-14 | 1986-11-18 | 三菱電機株式会社 | サ−マルヘツド |
-
1989
- 1989-06-15 JP JP1150576A patent/JP2744472B2/ja not_active Expired - Fee Related
- 1989-06-16 ES ES89111010T patent/ES2076174T3/es not_active Expired - Lifetime
- 1989-06-16 EP EP89111010A patent/EP0346935B1/de not_active Expired - Lifetime
- 1989-06-16 DE DE68924101T patent/DE68924101T2/de not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3403643A1 (de) * | 1983-02-05 | 1984-08-09 | Canon K.K., Tokio/Tokyo | Fluessigkeitsstrahl-aufzeichnungskopf |
EP0140611A2 (de) * | 1983-10-31 | 1985-05-08 | Hewlett-Packard Company | Thermischer Tintenstrahl-Druckkopf |
EP0286204A1 (de) * | 1987-02-04 | 1988-10-12 | Canon Kabushiki Kaisha | Grundplatte für Tintenstrahlaufzeichnungskopf |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0609860A2 (de) * | 1993-02-03 | 1994-08-10 | Canon Kabushiki Kaisha | Herstellungsverfahren für einen Tintenstrahlaufzeichnungskopf |
EP0609860A3 (en) * | 1993-02-03 | 1995-08-16 | Canon Kk | Method of manufacturing ink jet recording head. |
CN1080645C (zh) * | 1993-02-03 | 2002-03-13 | 佳能株式会社 | 喷墨记录头的制造方法 |
US5448273A (en) * | 1993-06-22 | 1995-09-05 | Xerox Corporation | Thermal ink jet printhead protective layers |
Also Published As
Publication number | Publication date |
---|---|
DE68924101T2 (de) | 1996-02-29 |
EP0346935A3 (de) | 1991-04-03 |
ES2076174T3 (es) | 1995-11-01 |
JP2744472B2 (ja) | 1998-04-28 |
JPH0278556A (ja) | 1990-03-19 |
DE68924101D1 (de) | 1995-10-12 |
EP0346935B1 (de) | 1995-09-06 |
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