EP0346935B1 - Tintenstrahlaufzeichnungskopf und Verfahren zum Vorbehandeln eines Substrats für einen Aufzeichnungskopf - Google Patents

Tintenstrahlaufzeichnungskopf und Verfahren zum Vorbehandeln eines Substrats für einen Aufzeichnungskopf Download PDF

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Publication number
EP0346935B1
EP0346935B1 EP89111010A EP89111010A EP0346935B1 EP 0346935 B1 EP0346935 B1 EP 0346935B1 EP 89111010 A EP89111010 A EP 89111010A EP 89111010 A EP89111010 A EP 89111010A EP 0346935 B1 EP0346935 B1 EP 0346935B1
Authority
EP
European Patent Office
Prior art keywords
heat
recording head
ink jet
layer
jet recording
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP89111010A
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English (en)
French (fr)
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EP0346935A3 (de
EP0346935A2 (de
Inventor
Hiroto Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
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Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of EP0346935A2 publication Critical patent/EP0346935A2/de
Publication of EP0346935A3 publication Critical patent/EP0346935A3/de
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Publication of EP0346935B1 publication Critical patent/EP0346935B1/de
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Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B41J2/1604—Production of bubble jet print heads of the edge shooter type
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/022—Anodisation on selected surface areas
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1623—Manufacturing processes bonding and adhesion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1631—Manufacturing processes photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering

Definitions

  • This invention relates to a substrate for ink jet recording head, ink jet recording head having the same and methods for preparing them.
  • Ink jet recording method is a recording method which performs recording by discharging an ink (liquid for recording) through discharging opening provided on a recording head and attaching this onto a recording medium such as paper, etc., having many advantages such that generation of noise is very small, and also high speed recording is possible and yet no paper for recording of special constitution is required, etc. and various types of recording heads have been developed.
  • the recording head of the type which permits heat energy to act on ink, thereby discharging the ink through discharging opening has advantages such as good response to recording signals, easy arrangement of multiple discharging openings at high density.
  • FIG. 2 shows schematic sectional views of the preparation steps at the position when the recording head is cut at the A - A'portion shown in Fig. 1.
  • the layer 251 a part of which becomes finally the heat generating resistor (hereinafter called heat-generating resistance layer) and the layer 252 a part of which becomes electrodes (hereinafter called electrode layer) are formed on a support 253 (steps (a), (b)).
  • the electrode layer 252 is subjected to patterning utilizing photolithographic technique by use of photoresist 254 and etching technique, and subsequently, the heat-generating resistance layer 251 is similarly subjected to patterning to form heat-generating resistor and electrodes (steps (c) to (k)).
  • a photoresist 254 such as photosensitive resin, etc.
  • the photoresist 254 of the product (c) is subjected to pattern exposure (step (d)), followed by developing of the photoresist 254 of the product (d) (step (e)).
  • the photoresist 254 has only unnecessary portions removed in a desired pattern shape.
  • the electrode layer 252 exposed on the product (e) is removed by etching (step (f)), and the remaining resist portion 254′ of the product (f) thus prepared is removed (step (g)).
  • a desired pattern of the electrode layer 252 is formed.
  • the pattern of the heat-generating resistance layer 251 is also formed according to the same steps as in the case of forming the pattern of the electrode layer 252. That is, the pattern of the heat generating resistance layer 251 is formed by lamination of the photoresist 254 ⁇ (step (h)), pattern exposure on the photoresist of the product (h) by use of a photomask (step (i)), developing of the photoresist 254 ⁇ subjected to pattern exposure of the product (i) for removal of unnecessary portions (step (j)) and etching of the exposed heat-generating resistance layer 251 of the product (j) (step (k)). Then, the resist 254 is peeled off (step (l)).
  • a photosensitive resin 256 is laminated (step (n)), followed by exposure (step (o)) and developed (step (p)), to form a wall 256' with the hardened film of the photosensitive resin subjected to patterning ((m) to (p)).
  • This wall constitutes the liquid channel wall which can be filled with a liquid.
  • plastered a ceiling 257 is plastered a ceiling 257, and thereafter discharging opening is formed by cutting (not shown) to complete an ink jet recording head (step (q)).
  • the preparation method which has been used in the prior art comprises many steps, and in addition, it will take long time for a part of the steps, particularly the etching step, and there has been the point to be improved in that much preparation time is required. Also, there has been left room to be improved also from the point that the positional precisions of the individual members are worsened, because the number of patterning is many.
  • the present invention has been accomplished in order to solve the above problems, and its object is to provide an ink jet recording head which can effect shortening of the preparation time and has good positional precisions of the respective members. Another object of the present invention is to provide a method for preparing them.
  • Still another object of the present invention is to provide an ink jet recording head comprising a discharging opening for liquid discharge and an electricity-heat convertor, said electricity-heat convertor having a region formed by oxidation of at least part of an electroconductive material, said region being adapted to generate heat.
  • Still another object of the present invention is to provide a process for preparing a substrate for a recording head having on a support an electricity-heat convertor utilized for liquid discharge, which comprises forming a layer of electroconductive material on said support and oxidizing at least part of the surface region of said layer to form the electrodes and heat-generating resistor portion of said electricity-heat convertor.
  • Still another object of the present invention is to provide a process for preparing a substrate for a recording head having on a support an electricity-heat convertor utilized for liquid discharge, which comprises forming a layer of electroconductive material on said support, oxidizing part of said layer to make it an oxide, and oxidizing at least part of the surface region of residual electroconductive portion to form the electrodes and heat-generating resistor portion of said electricity-heat convertor.
  • Still another object of the present invention is to provide an ink jet recording head comprising a discharging opening provided for forming flying droplets by liquid discharge and an electricity-heat convertor having a heat-generating resistor and a pair of electrodes electrically connected to said heat-generating resistor, said electrodes and said heat-generating resistor being formed of the same material.
  • Fig. 1 is a schematic perspective view of a typical constitution of a recording head for ink jet recording.
  • Fig. 2 shows schematic sectional views of the preparation steps at the position when the recording head is cut at the A - A' portion shown in Fig. 1.
  • Fig. 3 shows schematic sectional views of the preparation steps of a recording head of the present invention.
  • Fig. 4(a) to 4(d) are schematic plan views of the prepared products corresponding to Fig. 3(d), (e), (f) and (i), respectively.
  • Fig. 5 is a sectional view of the completed product corresponding to A - A'in Fig. 7.
  • Fig. 6 is a schematic plan view showing the shape of electrode region and resistance heating region.
  • Fig. 7 is a schematic plan view, partially enlarged, of Fig. 4(d).
  • the ink jet recording head to which the present invention is suitably applied is an ink jet recording head having a discharging opening 101 serving as discharging opening means provided for forming flying droplets by discharging a liquid as represented by ink, a liquid path a liquid channel 102 for supplying the liquid to the discharging opening 101, a liquid chamber 103 for storing the liquid to be supplied to the liquid channel 102 provided upstream thereof, a heat-generating resistor which is a heat energy source for forming flying dorplets by discharging the liquid and is provided corresponding to the liquid channel 102, and at least a pair of electrodes electrically connected to the heat-generating resistor on a substrate 5 (Fig.3), forming an electricity-heat converter 104A with a pair of electrodes and the heat-generating resistor, the substrate comprising one material selected for the above heat-generating resistor and electrodes and the same
  • Such ink jet recording head can be prepared according to, for example, the steps of:
  • Fig. 4(a) to (d) show schematic plan views of the prepared products corresponding to Fig. 3(d), (e), (f) and (i), respectively. That is, Fig. 4(a) shows the state when the step shown in Fig. 3(d) is practiced, Fig. 4(b) that shown in Fig. 3(e), Fig. 4(c) that shown in Fig. 3(f) and Fig. 4(d) that shown in Fig. 3(i).
  • a material which can become both the heat generating resistor and electrodes is formed into a film ((a)).
  • the material those which exhibit heat resistance and electroconductivity after film formation, and can be anodically oxidized can be utilized.
  • Ta, V, Nb, Zr, Mg, Zn, Ni, Gd, Co, etc. may be employed.
  • the thickness of the film formed (film of the starting material) 4 should be preferably made about 500 to 20000 ⁇ .
  • the film forming method may be determined depending on the material and, for example, the vacuum deposition method generally known in the art such as sputtering, vacuum vapor deposition, etc. may be preferably utilized.
  • the film 4 except for the portions which become the heat-generating resistor and electrodes are covered with a resist 7.
  • the lithographic technique known in the art may be utilized ((b) to (d)).
  • the film at the portion not covered with the resist 7 is converted to an insulating material by the anodic oxidation method (e), and thereafter, the resist 7 is peeled off.
  • the treating solution to be used in this case there may be included aqueous solutions of boric acid, tartaric acid, malonic acid, phosphoric acid, etc. These aqueous solutions may be preferably used particularly for anodic oxidation of Ta film.
  • the photosensitive resin 8 of dry film, etc. is wholly laminated (g). Thereafter, partial exposure and developing are practiced to effect patterning of the photosensitive resin 8 to form a pattern of the cured layer of the photosensitive regin ((h) - (i)).
  • the cured layer defines the liquid channel and the discharging opening.
  • a material which can be finely patterned after lamination can be utilized, including photosensitive resins.
  • a schematic plan view of the product completed up to this step is shown in Fig. 4(d), and a sectional view (sectional view corresponding to A - A′ in Fig. 7) of the completed product for reference in Fig. 5.
  • the dashed portion in Fig. 4 shows the portion converted to insulating material by anodic oxidation, and the dotted portion the portion where the photosensitive composition is provided.
  • a ceiling 6 of glass, etc. is plastered (adhered) to form the liquid channel, etc.
  • an electrolyte solution (treating solution) containing an electrolyte is introduced into the liquid chamber and the liquid channel and again anodic oxidation is practiced ((k) the portion to be anodically oxidized is not shown).
  • the first anodic oxidation should preferably convert the portion to be anodically oxidized completely to an insulating material, while the second anodic oxidation should be effected so that adequate electroconductivity may remain at the portion to be anodically oxidized.
  • the respective anodic oxidations are required to be practiced corresponding to these requirements.
  • the ink jet recording head completed as described above is formed of the heat-generating resistor and electrodes by use of the same material as the starting material, but the heat-generating resistor is essentially thinner than the portion other than that, namely electrodes, to be greater in resistance value.
  • tantalum (Ta) as the starting material film on the support is to be specifically described below.
  • the support having the cured film of photosensitive resin provided on Ta film with a thickness of 1000 ⁇ was subjected to anodic oxidation treatment by use of 1% by weight of an aqueous phosphoric acid solution as the treating solution at a current density of 10mA/cm2 for a treatment time of 120 sec.
  • anodic oxidation treatment by use of 1% by weight of an aqueous phosphoric acid solution as the treating solution at a current density of 10mA/cm2 for a treatment time of 120 sec.
  • the Ta film in contact with the treating solution was oxidized substantially completely in its thickness direction to be converted into an insulating material (Fig. 3, step (e)).
  • the second anodic oxidation only of the heater region becomes unnecessary.
  • the shapes of the electrode region and the heat-generating resistor region may be any desired ones as shown in the schematic plan view in Fig. 6.
  • 601 is the electrode region and 602 the heat-generating resistor region.
  • the pattern formed of the cured film of the photosensitive resin may have the liquid channel formed corresponding to the heat-generating resistor portion. Therefore, the cured film of the photosensitive resin may be also provided in the region 401 in Fig. 7.
  • Fig. 7 is a schematic plan view, partially enlarged, of Fig. 4(d).
  • the substrate under the state where the electrode region and the heat-generating resistor portion region are formed by anodic oxidation may be previously formed, and the liquid channel, etc. may be formed thereof to prepare a recording head.
  • the gaps between the respective heat-generating resistance elements are not necessarily required to be anodically oxidized, but unnecessary portions may be removed by etching, and the electrode region and the heat-generating portion forming the heat-generating resistance elements can be also anodically oxidized, if desired, to form heat-generating resistance elements.
  • the ink jet recording head can be prepared by two patterning steps and one film forming step, the number of steps can be shortened to a great extent. Also, according to the present invention, patterning is possible only by anodic oxidation without utilizing etching step, and in addition to the above reason, preparation time can be also effected in this respect. Further, according to the present invention, the location positional precisions of the respective members can be improved.
  • the upper surface of the heat-generating-resistance element (substrate upper surface) has little unevenness, peeling of the respective members, etc. will occur with difficulty, whereby a recording head enriched in durability can be provided.
  • the preparation order of the recording head the constitution of the recording head can be changed as desired as a matter of course.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)

Claims (19)

  1. Tintenstrahlaufzeichnungskopf, mit:
    - einer Ausstoßöffnungseinrichtung (101) zum Erzeugen eines Tintenausstoßes; und
    - einem Strom-Wärme-Wandler, mit einem Wärmeerzeugungswiderstand (602) für die Wärmeerzeugung und Elektroden (601) für die Zufuhr elektrischer Energie zum Wärmeerzeugungswiderstand,
       dadurch gekennzeichnet, daß
    - die Elektroden (601) und der Wärmeerzeugungswiderstand (602) aus der gleichen Schicht (4) eines stromleitenden Materials gebildet sind und einen übrigbleibenden stromleitenden Bereich außerhalb eines Abschnittes (301) der Schicht (4) aufbauen, der in ein Isoliermaterial umgewandelt ist.
  2. Tintenstrahlaufzeichnungskopf nach Anspruch 1, dadurch gekennzeichnet, daß der Tintenstrahlaufzeichnungskopf eine Vielzahl von Wärmeerzeugungswiderständen für die für den Tintenausstoß angewendete Wärmeerzeugung aufweist, wobei jedes der zahlreichen Paare der Elektroden (601) jedem aus der Vielzahl von Wärmeerzeugungswiderständen entspricht.
  3. Tintenstrahlaufzeichnungskopf nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß der/die Wärmeerzeugungswiderstand/Wärmeerzeugungswiderstände (602) durch Oxidieren eines Teils des verbleibenden stromleitenden Bereichs der Schicht (4) ausgebildet ist/sind.
  4. Tintenstrahlaufzeichnungskopf nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, daß der Abschnitt (301) des Isoliermaterials durch anodische Oxidation des stromleitenden Materials gebildet ist.
  5. Tintenstrahlaufzeichnungskopf nach Anspruch 1, dadurch gekennzeichnet, daß der Widerstandswert des Wärmeerzeugungswiderstands größer als der der Elektroden ist.
  6. Tintenstrahlaufzeichnungskopf nach Anspruch 5, dadurch gekennzeichnet, daß der Widerstandswert des Wärmeerzeugungswiderstandes ein Widerstandswert pro Längeneinheit ist, und zwar von einer mit dem Wärmeerzeugungswiderstand (602) elektrisch verbundenen Elektrode (601) in Richtung zur anderen Elektrode (601).
  7. Tintenstrahlaufzeichnungskopf nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß das stromleitende Material aus je einer Gruppe ausgewählt ist, die aus Ta, V, Nb, Zr, Mg, Zn, Ni, Gd und Co besteht.
  8. Tintenstrahlaufzeichnungskopf nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß eine Schutzschicht (255) ferner auf zumindest einen Teil des Strom-Wärme-Wandlers vorgesehen ist.
  9. Tintenstrahlaufzeichnungskopf nach einem der Ansprüche 1 bis 8, dadurch gekennzeichnet, daß ferner ein Flüssigkeitspfad und eine Ausstoßöffnung entsprechend dem Strom-Wärme-Wandler vorgesehen sind.
  10. Verfahren zur Herstellung eines Substrates für einen Aufzeichnungskopf, der auf einer Unterlage (5) einen für den Tintenausstoß verwendeten Strom-Wärme-Wandler aufweist, mit den folgenden Schritten:
    Bildung einer Schicht (4) aus stromleitendem Material auf der Unterlage (5); und
    Oxidieren eines Abschnittes (301) der Schicht (4), um ihn in Isoliermaterial umzuwandeln, wobei ein übrigbleibender stromleitender Bereich der Schicht außerhalb des Abschnitts (301) einen Wärmeerzeugungswiderstandsabschnitt (602) und einen Elektrodenabschnitt (601) des Strom-Wärme-Wandlers bildet.
  11. Verfahren nach Anspruch 10, dadurch gekennzeichnet, daß das Verfahren ferner folgenden Schritt aufweist:
    - Oxidieren von zumindest einem Teil des übrigbleibenden stromleitenden Bereichs der Schicht (4), um den Wärmeerzeugungswiderstandsabschnitt (602) des Strom-Wärme-Wandlers zu bilden, wobei der Elektrodenabschnitt (601) des Strom-Wärme-Wandlers aus einem nicht oxidierten Teil des übrigbleibenden stromleitenden Bereichs gebildet wird.
  12. Verfahren nach Anspruch 10 oder 11, dadurch gekennzeichnet, daß die Oxidation eine anodische Oxidation ist.
  13. Verfahren nach Anspruch 10 oder 11, dadurch gekennzeichnet, daß das stromleitende Material aus einer Gruppe ausgewählt ist, die aus Ta, V, Nb, Zr, Mg, Zn, Ni, Gd und Co besteht.
  14. Verfahren nach Anspruch 10 oder 11, dadurch gekennzeichnet, daß das stromleitende Material durch Vakuumablagerung gebildet wird.
  15. Verfahren nach Anspruch 14, dadurch gekennzeichnet, daß die Vakuumablagerung Sputtern oder Dampfablagerung ist.
  16. Verfahren nach Anspruch 10, dadurch gekennzeichnet, daß das Isoliermaterial unter Anwendung von photolithographischer Technik gebildet wird.
  17. Verfahren nach Anspruch 11, dadurch gekennzeichnet, daß zumindest ein Teil des übrigbleibenden stromleitenden Bereichs der Schicht (4) unter Anwendung photolithographischer Technik gebildet wird.
  18. Verfahren nach Anspruch 10 oder 11, dadurch gekennzeichnet, daß auf zumindest einem Teil des Strom-Wärme-Wandlers ferner eine Schutzschicht vorgesehen ist.
  19. Verfahren nach Anspruch 10, dadurch gekennzeichnet, daß nach dem Oxidieren des Abschnittes (301) der Schicht (4) und vor dem Oxidieren von zumindest einem Teil des übrigbleibenden stromleitenden Bereichs der Schicht (4) die folgenden Schritte durchgeführt werden:
    - Laminieren einer lichtempfindlichen Verbindung (8);
    - Teilweises Entfernen der lichtempfindlichen Verbindung (8), um zumindest einen Abschnitt (8') zu bilden, der eine Ausstoßöffnung (101) und Wandelemente bildet, und Belichten von zumindest einem Teil des übriggebliebenen stromleitenden Bereichs der Schicht (4), woraus der Wärmeerzeugungswiderstand (602) entsteht; und
    - Abdrucken einer Oberplatte (6), um einen Flüssigkeitspfad (102) zu bilden.
EP89111010A 1988-06-17 1989-06-16 Tintenstrahlaufzeichnungskopf und Verfahren zum Vorbehandeln eines Substrats für einen Aufzeichnungskopf Expired - Lifetime EP0346935B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP148173/88 1988-06-17
JP14817388 1988-06-17

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EP0346935A2 EP0346935A2 (de) 1989-12-20
EP0346935A3 EP0346935A3 (de) 1991-04-03
EP0346935B1 true EP0346935B1 (de) 1995-09-06

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EP (1) EP0346935B1 (de)
JP (1) JP2744472B2 (de)
DE (1) DE68924101T2 (de)
ES (1) ES2076174T3 (de)

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US5448273A (en) * 1993-06-22 1995-09-05 Xerox Corporation Thermal ink jet printhead protective layers

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JPH0643128B2 (ja) * 1983-02-05 1994-06-08 キヤノン株式会社 インクジェットヘッド
JPS59146861A (ja) * 1983-02-14 1984-08-22 Canon Inc インクジェットヘッド
US4535343A (en) * 1983-10-31 1985-08-13 Hewlett-Packard Company Thermal ink jet printhead with self-passivating elements
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JPS61260604A (ja) * 1985-05-14 1986-11-18 三菱電機株式会社 サ−マルヘツド
US4860033A (en) * 1987-02-04 1989-08-22 Canon Kabushiki Kaisha Base plate having an oxidation film and an insulating film for ink jet recording head and ink jet recording head using said base plate

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Publication number Publication date
DE68924101T2 (de) 1996-02-29
JP2744472B2 (ja) 1998-04-28
JPH0278556A (ja) 1990-03-19
EP0346935A3 (de) 1991-04-03
DE68924101D1 (de) 1995-10-12
EP0346935A2 (de) 1989-12-20
ES2076174T3 (es) 1995-11-01

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