EP0340649A1 - Verfahren zur Formulierung und zum Betrieb eines stromlosen Plattierungsbades zur Abscheidung von im wesentlichen rissfreien Kupferschichten - Google Patents

Verfahren zur Formulierung und zum Betrieb eines stromlosen Plattierungsbades zur Abscheidung von im wesentlichen rissfreien Kupferschichten Download PDF

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Publication number
EP0340649A1
EP0340649A1 EP89107716A EP89107716A EP0340649A1 EP 0340649 A1 EP0340649 A1 EP 0340649A1 EP 89107716 A EP89107716 A EP 89107716A EP 89107716 A EP89107716 A EP 89107716A EP 0340649 A1 EP0340649 A1 EP 0340649A1
Authority
EP
European Patent Office
Prior art keywords
copper
concentration
solution
plating
reducing agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP89107716A
Other languages
English (en)
French (fr)
Other versions
EP0340649B1 (de
Inventor
Rowan Hughes
Milan Paunovic
Rudolph J. Zeblisky
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AMP Akzo Corp
Original Assignee
AMP Akzo Corp
Kollmorgen Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AMP Akzo Corp, Kollmorgen Corp filed Critical AMP Akzo Corp
Publication of EP0340649A1 publication Critical patent/EP0340649A1/de
Application granted granted Critical
Publication of EP0340649B1 publication Critical patent/EP0340649B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
EP89107716A 1988-04-29 1989-04-28 Verfahren zur Formulierung und zum Betrieb eines stromlosen Plattierungsbades zur Abscheidung von im wesentlichen rissfreien Kupferschichten Expired - Lifetime EP0340649B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US18782288A 1988-04-29 1988-04-29
US187822 1988-04-29

Publications (2)

Publication Number Publication Date
EP0340649A1 true EP0340649A1 (de) 1989-11-08
EP0340649B1 EP0340649B1 (de) 1993-02-03

Family

ID=22690615

Family Applications (1)

Application Number Title Priority Date Filing Date
EP89107716A Expired - Lifetime EP0340649B1 (de) 1988-04-29 1989-04-28 Verfahren zur Formulierung und zum Betrieb eines stromlosen Plattierungsbades zur Abscheidung von im wesentlichen rissfreien Kupferschichten

Country Status (8)

Country Link
EP (1) EP0340649B1 (de)
JP (1) JPH07107193B2 (de)
KR (1) KR890016207A (de)
AU (1) AU3304389A (de)
BR (1) BR8901962A (de)
CA (1) CA1331420C (de)
DE (1) DE3914180A1 (de)
GB (2) GB2218714B (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5526458B2 (ja) * 2006-12-06 2014-06-18 上村工業株式会社 無電解金めっき浴及び無電解金めっき方法
WO2012022660A1 (de) 2010-08-17 2012-02-23 Chemetall Gmbh Verfahren zum stromlosen verkupfern von metallischen substraten

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1522048A (fr) * 1966-05-06 1968-04-19 Photocircuits Corp Dépôt non galvanique de métaux
FR2436192A1 (fr) * 1978-09-13 1980-04-11 Kollmorgen Tech Corp Perfectionnement apporte au depot non-galvanique du cuivre
US4632852A (en) * 1984-06-18 1986-12-30 Hitachi, Ltd. Process for electroless copper plating
EP0242745A1 (de) * 1986-04-21 1987-10-28 International Business Machines Corporation Verfahren und Vorrichtung zur Kontrolle des chemischen Zustandes von einem chemischen Metallisierungsbad
EP0265901A2 (de) * 1986-10-31 1988-05-04 Amp-Akzo Corporation Kontrolle stromloser Plattierungsbäder
WO1988003181A1 (en) * 1986-10-31 1988-05-05 Kollmorgen Technologies Corporation Method of consistently producing copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1551275A (de) * 1966-12-19 1968-12-27
ZA775495B (en) * 1976-11-22 1978-07-26 Kollmorgen Tech Corp Method and apparatus for control of electroless plating solutions
US4301196A (en) 1978-09-13 1981-11-17 Kollmorgen Technologies Corp. Electroless copper deposition process having faster plating rates
JPS5627594A (en) * 1979-08-10 1981-03-17 Matsushita Electric Ind Co Ltd Remote controller
JPS6016517B2 (ja) * 1979-12-29 1985-04-25 上村工業株式会社 無電解めつき制御方法
JPS5927379A (ja) * 1982-08-09 1984-02-13 Hitachi Ltd パタ−ン映像信号処理方式
JPH0247550B2 (ja) * 1982-08-23 1990-10-22 Chusho Kigyo Jigyodan Mudenkaidometsukiekinokanrihoho
JPH0239596B2 (ja) * 1983-03-25 1990-09-06 Uemura Kogyo Kk Kagakudometsukinokontorooruhoho

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1522048A (fr) * 1966-05-06 1968-04-19 Photocircuits Corp Dépôt non galvanique de métaux
FR2436192A1 (fr) * 1978-09-13 1980-04-11 Kollmorgen Tech Corp Perfectionnement apporte au depot non-galvanique du cuivre
US4632852A (en) * 1984-06-18 1986-12-30 Hitachi, Ltd. Process for electroless copper plating
EP0242745A1 (de) * 1986-04-21 1987-10-28 International Business Machines Corporation Verfahren und Vorrichtung zur Kontrolle des chemischen Zustandes von einem chemischen Metallisierungsbad
EP0265901A2 (de) * 1986-10-31 1988-05-04 Amp-Akzo Corporation Kontrolle stromloser Plattierungsbäder
WO1988003181A1 (en) * 1986-10-31 1988-05-05 Kollmorgen Technologies Corporation Method of consistently producing copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JOURNAL OF ELECTROCHEMICAL STY, vol. 127, no. 2, February 1980, pages 365-369, Princeton, US; M. PAUNOVIC: "An electrochemical control system for electroless copper bath" *

Also Published As

Publication number Publication date
EP0340649B1 (de) 1993-02-03
GB9220923D0 (en) 1992-11-18
CA1331420C (en) 1994-08-16
DE3914180A1 (de) 1989-11-09
DE3914180C2 (de) 1991-04-18
AU3304389A (en) 1989-11-02
GB8909623D0 (en) 1989-06-14
KR890016207A (ko) 1989-11-28
BR8901962A (pt) 1989-12-05
JPH0270070A (ja) 1990-03-08
GB2218714A (en) 1989-11-22
JPH07107193B2 (ja) 1995-11-15
GB2218714B (en) 1992-10-14

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