EP0263244B1 - Vorrichtung zum elektronischen Prüfen von Leiterplatten mit Kontaktpunkten in extrem feinem Raster (1/20 bis 1/10 Zoll) - Google Patents

Vorrichtung zum elektronischen Prüfen von Leiterplatten mit Kontaktpunkten in extrem feinem Raster (1/20 bis 1/10 Zoll) Download PDF

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Publication number
EP0263244B1
EP0263244B1 EP87109884A EP87109884A EP0263244B1 EP 0263244 B1 EP0263244 B1 EP 0263244B1 EP 87109884 A EP87109884 A EP 87109884A EP 87109884 A EP87109884 A EP 87109884A EP 0263244 B1 EP0263244 B1 EP 0263244B1
Authority
EP
European Patent Office
Prior art keywords
contact
spring
compression springs
contact panel
test
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP87109884A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP0263244A1 (de
Inventor
Hubert Dipl.-Phys. Driller
Paul Mang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mania Elektronik Automatisation Entwicklung und Geraetebau GmbH
Original Assignee
Mania Elektronik Automatisation Entwicklung und Geraetebau GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=6309148&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=EP0263244(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Mania Elektronik Automatisation Entwicklung und Geraetebau GmbH filed Critical Mania Elektronik Automatisation Entwicklung und Geraetebau GmbH
Priority to AT87109884T priority Critical patent/ATE63169T1/de
Priority to EP90116283A priority patent/EP0406919B1/de
Publication of EP0263244A1 publication Critical patent/EP0263244A1/de
Application granted granted Critical
Publication of EP0263244B1 publication Critical patent/EP0263244B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/11—End pieces or tapping pieces for wires, supported by the wire and for facilitating electrical connection to some other wire, terminal or conductive member
    • H01R11/18—End pieces terminating in a probe
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/082—Integration of non-optical monitoring devices, i.e. using non-optical inspection means, e.g. electrical means, mechanical means or X-rays

Definitions

  • the invention relates to a device for the electronic testing of printed circuit boards according to the preamble of claim 1 and independent claim 2.
  • DE-PS 33 40 180 describes a contact field arrangement for computer-controlled printed circuit board testers in a 1/10 inch contact point grid.
  • the contact field is divided into contact field sections, each of which is releasably supported against a base plate by means of longer support struts.
  • the space thus created is used to accommodate these contact field sections associated electronic components are used, which are connected via a plug connection to the two-dimensional control circuit on the base plate.
  • These "contact field modules” components are identical to each other and interchangeable with respect to the respective places on the base plate. This concept creates a printed circuit board tester that, despite a very large contact field in the basic concept (for example 256 contacts each in the X and Y directions) can be operated with little electronics and can be easily retrofitted.
  • the basic aim of the present invention is to implement this concept even with a contact point grid of 1/20 inch and below. It is possible to use a so-called “reduction adapter” (DE-PS 33 40 179) which up to 64,000 contact points of the 1/10 output grid of this contact field arrangement for all approximately 64,000 contact points in the X and Y direction of the contact field on a grid of Reduce 1/20 inch, but only at the price of a 50% reduction in the maximum allowable PCB dimensions in both directions.
  • RE-PS 33 40 179 which up to 64,000 contact points of the 1/10 output grid of this contact field arrangement for all approximately 64,000 contact points in the X and Y direction of the contact field on a grid of Reduce 1/20 inch, but only at the price of a 50% reduction in the maximum allowable PCB dimensions in both directions.
  • Such an active basic grid results from the fact that the resilient part of the contact pins is moved into the basic grid of the circuit board tester, which is done in the form that short small test pins are provided in the form of sleeves, one end of which is a contact tip and the other end is one Has inner cone, which is supported by a spring arranged in the sleeve and serves to receive one end of the rigid test pin.
  • the active basic grid according to DE-GM 85 34 841 there are therefore many short “test pins with inner cone” corresponding to the number of contact points provided in a suitable housing above the actual basic grid of the circuit board tester.
  • FR-A-959460 shows the construction of a contact plug, in which a contact pin is inserted into a conically wound contact spring which is arranged in a blind hole of a plug body and at its beginning and end with the aid of screws in the blind hole is fixed.
  • Such termination techniques are only economically viable with a few and also relatively large contact plugs.
  • the spring contact field body from ceramic or plastic is particularly advantageous insofar as manufacturing techniques can be used which allow a particular dimensional accuracy.
  • the manufacture of the spring contact field body is particularly facilitated by the fact that it is made up of smaller sections that can be arranged or joined together.
  • the compression springs can have adjacent turns of maximum diameter in their end regions.
  • all adjacent turns of the compression springs can be mechanically connected to one another, which is done, for example, by electrodeposition of a metal on the compression springs, which are usually made of spring steel. As a result, the adjacent turns of the compression spring will "grow together". Covering the end sections of the compression springs with a special contact material - possibly also by galvanic deposition - can contribute to a considerable reduction in the contact resistance.
  • the spring contact field body receiving or guiding the compression springs in bores is made up of smaller segments which can be joined together in a grid, it has proven to be particularly advantageous to apply them to a supporting part which is designed as a nail board-like plug and is used to derive the applied pressure and accordingly in PCB tester is supported.
  • this connector is relatively large in relation to the segments of the spring contact field body which can be joined in a grid, it can ensure good cohesion between the individual segments.
  • Figure 1 is an overview of the basic structure of a - but not fully shown - PCB testing device, which is constructed according to the present invention.
  • Figure 2 is a side or plan view of a so-called driver plate with the nail board connector arranged at the upper end, which is supported on mounting rails.
  • 3 shows a partial enlargement of the contact according to the invention between the driver plate (the test electronics) and the rigid test pins; and 4a, b, c different alternatives of the design of the compression springs in the spring contact field body.
  • Fig. 1 the arrangement and support of the individual components is shown in a basic representation, which together form the contact field 2 with the individual, for example up to about 265,000 contact field points 4, the test pins 6 with the to be tested Wiring carrier / circuit board 8 are connectable.
  • each nail board-like contact field connector 10 rests at its two front ends on supporting parts 14 which are formed by upright arranged plates which derive the very considerable contact pressure on the frame 16 of the circuit board tester: Because when testing circuit boards 8 To generate a reliable contact, a contact pressure of approx. 1.23N (125 p) must be generated per contact 4, with a maximum of 256,000 contacts mentioned, the total force is 0.31.106N, which corresponds to a weight of approx. 32 t, that must be derived via these support members 14.
  • These contact pins 18 of the contact field connector 10 continue inside the same in lines 20, each of which is connected to a connection point 22 on the printed circuit of the driver board 12 and thus the electrical connection to the electronic components 24 (only one is shown) on the driver board 12 manufactures that are part of the test circuit of the circuit board tester.
  • Each of the contact pins 18 projects into a bore 25 of a spring contact field body 26, which contains a contact spring 28 made of electrically conductive material and essentially fills this bore 25.
  • the spring contact body 26 consists of numerous strips, each with a row of holes therein (according to the arrangement of the contact pins), but it is obvious that they are not strip-shaped bodies with only one row Bores 25 must act, but it is equally possible to provide several or many rows of holes in a correspondingly larger spring contact field body 26, since the size of the subdivision of these spring contact field bodies is itself only dependent on the cheapest manufacture of such bodies: At the moment However, because of the more precise manufacturability, such bodies are preferred as strips with only one row of bores, these strips being able to be arranged in the longitudinal direction (FIG.
  • the strips are about 50 mm high and 1.27 mm wide.
  • the holes in it have a diameter of approx. 0.8 mm and the distance from hole to hole is 1.27 mm according to the pitch of the contact points.
  • the spring contact field body 26 is plugged onto the nail board-like contact field connector 10.
  • a specially designed compression spring 28 is used, which completely fills this bore, that is, the turns of the compression spring are in the resilient part of the same directly against the walls of the bore, so that despite the confined spaces compression springs with the largest possible diameter can be used.
  • the front ends 30, 31 of the compression springs 28, which are only shown in principle in FIG. 3, are in a special way for direct contact with the contact pin 18 of the nail board-like Contact field connector 10 and the rigid test pin 6 configured.
  • the compression spring 28 is wound at both end ends, ie outwards from the resilient part 32, which has turns which are spaced apart from one another, with turns which lie in the longitudinal direction and which taper in diameter to form an inner cone in the winding direction of the spring and then widen again .
  • an inner cone 34 for receiving the tips of the contact pin 18 or the test pin 6 is formed on both ends of this compression spring.
  • These compression springs 28, which are wound from a spring steel can preferably be coated with a suitable contact material by means of galvanic deposition, the windings lying against one another being able to “grow together” at the front ends.
  • FIG. 4b An alternative form of contacting can be seen from FIG. 4b.
  • the compression spring is designed identically in its upper area for engagement with the test pin 6, that is to say it has an inner cone 34 which has been wound as described above, while the opposite end is wound with a pin 36 which tapers like a pin, the individual windings 33 of which in turn abut one another.
  • This pin-like approach protrudes into, for example, a conical or cup-shaped depression in the contact field connector 10, this depression being a
  • An alternative to the contact pins 18 described above can be seen.
  • FIG. 4c shows a further alternative embodiment of the compression spring: that end of the compression spring 28 which faces the contact field plug or the driver plate is provided with a tongue part 42 which extends in the longitudinal direction of the compression spring and which extends directly to the associated contact point on the surface the driver plate 12 extends.
  • the contact field plug only has to be provided with appropriately positioned thin bores 44 through which these contact tongues 42 are inserted when the contact field is being set up.
  • the end of the compression spring 28 facing the test pin 6 is also wound in this case such that an inner cone 34 is formed from turns of the compression spring lying against one another in the longitudinal direction.
  • test pins 6 which are rigid in the longitudinal direction
  • contact points designed as compression springs (spiral springs) can also be used just as well in circuit board testers which are provided with a hard-wired contact point grid, that is to say have no contact field modules, which are identical to each other and in relation to the respective places on the Base plate are interchangeable.
  • the present invention is particularly valuable with this last-mentioned concept, since it, like the present invention, essentially aims to greatly reduce the costs incurred for contacting the circuit board / wiring carrier to be tested.
  • connection point 24 electr.
  • Components 26 spring contact field body 28 contact spring / compression spring 30 front ends of the compression spring 31 front ends of the compression spring 32 resilient part of the compression spring 33 turns of the compression spring 34 inner cone 36 pen-like approach 42 tongue part 44 holes

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Operations Research (AREA)
  • Power Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
EP87109884A 1986-09-08 1987-07-08 Vorrichtung zum elektronischen Prüfen von Leiterplatten mit Kontaktpunkten in extrem feinem Raster (1/20 bis 1/10 Zoll) Expired - Lifetime EP0263244B1 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AT87109884T ATE63169T1 (de) 1986-09-08 1987-07-08 Vorrichtung zum elektronischen pruefen von leiterplatten mit kontaktpunkten in extrem feinem raster (1/20 bis 1/10 zoll).
EP90116283A EP0406919B1 (de) 1986-09-08 1987-07-08 Vorrichtung zum elektronischen Prüfen von Leiterplatten mit Kontaktpunkten in extrem feinem Raster (1/20 bis 1/10 Zoll)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3630548 1986-09-08
DE19863630548 DE3630548A1 (de) 1986-09-08 1986-09-08 Vorrichtung zum elektronischen pruefen von leiterplatten mit kontaktpunkten im 1/20 zoll-raster

Related Child Applications (3)

Application Number Title Priority Date Filing Date
EP90116283A Division EP0406919B1 (de) 1986-09-08 1987-07-08 Vorrichtung zum elektronischen Prüfen von Leiterplatten mit Kontaktpunkten in extrem feinem Raster (1/20 bis 1/10 Zoll)
EP90116283A Division-Into EP0406919B1 (de) 1986-09-08 1987-07-08 Vorrichtung zum elektronischen Prüfen von Leiterplatten mit Kontaktpunkten in extrem feinem Raster (1/20 bis 1/10 Zoll)
EP90116283.4 Division-Into 1987-07-08

Publications (2)

Publication Number Publication Date
EP0263244A1 EP0263244A1 (de) 1988-04-13
EP0263244B1 true EP0263244B1 (de) 1991-05-02

Family

ID=6309148

Family Applications (2)

Application Number Title Priority Date Filing Date
EP90116283A Expired - Lifetime EP0406919B1 (de) 1986-09-08 1987-07-08 Vorrichtung zum elektronischen Prüfen von Leiterplatten mit Kontaktpunkten in extrem feinem Raster (1/20 bis 1/10 Zoll)
EP87109884A Expired - Lifetime EP0263244B1 (de) 1986-09-08 1987-07-08 Vorrichtung zum elektronischen Prüfen von Leiterplatten mit Kontaktpunkten in extrem feinem Raster (1/20 bis 1/10 Zoll)

Family Applications Before (1)

Application Number Title Priority Date Filing Date
EP90116283A Expired - Lifetime EP0406919B1 (de) 1986-09-08 1987-07-08 Vorrichtung zum elektronischen Prüfen von Leiterplatten mit Kontaktpunkten in extrem feinem Raster (1/20 bis 1/10 Zoll)

Country Status (7)

Country Link
US (2) US4851765A (ja)
EP (2) EP0406919B1 (ja)
JP (1) JPS6370174A (ja)
AT (2) ATE172306T1 (ja)
CA (1) CA1289678C (ja)
DE (3) DE3630548A1 (ja)
ES (2) ES2121743T3 (ja)

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Also Published As

Publication number Publication date
US4952872A (en) 1990-08-28
ATE172306T1 (de) 1998-10-15
ES2021640B3 (es) 1991-11-16
ATE63169T1 (de) 1991-05-15
ES2121743T3 (es) 1998-12-16
DE3630548A1 (de) 1988-03-10
DE3752227D1 (de) 1998-11-19
JPS6370174A (ja) 1988-03-30
EP0406919B1 (de) 1998-10-14
EP0263244A1 (de) 1988-04-13
EP0406919A2 (de) 1991-01-09
CA1289678C (en) 1991-09-24
EP0406919A3 (en) 1991-06-12
DE3769741D1 (de) 1991-06-06
US4851765A (en) 1989-07-25

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