EP0149852A2 - Procédé et dispositif opto-électroniques de contrôle d'un motif de surface d'un objet - Google Patents

Procédé et dispositif opto-électroniques de contrôle d'un motif de surface d'un objet Download PDF

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Publication number
EP0149852A2
EP0149852A2 EP84116418A EP84116418A EP0149852A2 EP 0149852 A2 EP0149852 A2 EP 0149852A2 EP 84116418 A EP84116418 A EP 84116418A EP 84116418 A EP84116418 A EP 84116418A EP 0149852 A2 EP0149852 A2 EP 0149852A2
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EP
European Patent Office
Prior art keywords
image
pixel
line
memory
pixels
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP84116418A
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German (de)
English (en)
Other versions
EP0149852A3 (fr
Inventor
Ludwig Dr. Ing. Pietzsch
Knud Dr. Ing. Overlach
Detlef Dr. Ing. Senger
Walter Dipl. Ing. Breunig
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Pietzsch AG
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Pietzsch AG
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Publication date
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Publication of EP0149852A2 publication Critical patent/EP0149852A2/fr
Publication of EP0149852A3 publication Critical patent/EP0149852A3/fr
Ceased legal-status Critical Current

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/0002Inspection of images, e.g. flaw detection
    • G06T7/0004Industrial image inspection
    • G06T7/001Industrial image inspection using an image reference approach
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • G01N21/95684Patterns showing highly reflecting parts, e.g. metallic elements
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • G01N2021/95638Inspecting patterns on the surface of objects for PCB's
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00Indexing scheme for image analysis or image enhancement
    • G06T2207/30Subject of image; Context of image processing
    • G06T2207/30108Industrial image inspection
    • G06T2207/30141Printed circuit board [PCB]

Definitions

  • the invention relates to a method for optoelectronic testing of a surface pattern on an object, in particular a printed circuit board, the surface pattern being recorded line by line and the recorded image elements being compared with corresponding image elements of a reference image after processing.
  • Printed circuit boards have been and are currently being checked visually for defects, deviations or the like. It is completely dependent on the reliability of the person checking it. Smallest errors that occur with increasing density of the printed circuit board to. Like. Can lead to malfunctions on printed circuit boards are difficult to recognize visually. In addition, the visual inspection is time consuming.
  • the printed circuit boards are absolutely checked using pattern-specific test criteria with the aid of an analog signal preparation and connected error detection circuits, the error messages of which their outputs are taken over by an error management, which these with local coordinates of the distance measurement Link the system of an XY table and store it in a memory until the circuit board to be tested has run through completely, and which can then be used to move the circuit board in such a way that the errors can be seen via a viewing device.
  • the invention has for its object to provide a method and a device that work according to the comparison method and quickly and reliably detect errors to the extent of a few.
  • a method provides that a microcheck is carried out by subjecting the image elements recorded line by line to a sequence of image operations pixel by pixel and comparing the respective result with the corresponding recorded image point as it occurs in the image and that at the same time a macro test is carried out by combining the recorded pixels in image fields and reducing them to a single image information characteristic of the image field in question, whereupon each image information is compared with the characteristic image information of the corresponding reference image field and / or using predetermined ones geometric criteria is checked.
  • a microcheck and a macrocheck are therefore carried out side by side in real time, the microcheck not making a conventional comparison with a reference image requiring a very high storage capacity, but rather a comparison of the processed pixel with the actual pixel distance and dimension errors of the smallest dimensions up to a few ⁇ m can be detected. Large-scale errors that are not recorded in the micro test are found in the macro test.
  • micro test it is preferred to work in such a way that at the B ildoperationen in micro test image point for each pixel as a function of the surrounding pixels in the two neighboring rows and in the same line will be gradually set or cleared.
  • the characteristic image information in the macro check is advantageously obtained by majority vote.
  • the procedure is advantageously such that the image operations comprise a sequence of dilations and the same number of erosions of each pixel depending on the pixels surrounding it, the sequence "dilations before erosions" for checking the distance between the individual conductor tracks or the like and the sequence "Erosions before dilations can be used to check the dimensions of conductor tracks of the like.
  • a device for opto-electronic checking of a surface pattern on an object in particular a printed circuit board, with a recording camera for line-by-line recording of the object, an XY table for supporting the object, which allows the object to be moved relative to the recording camera, and an image processing device,
  • the image processing device comprises a micro-test unit and a macro-test unit connected in parallel therewith which receive output signals of the recording camera converted as inputs into digital signals.
  • the micro-inspection unit preferably contains a number of image processing units connected in series in two groups connected in parallel, each image processing unit of the one group being designed for dilation with subsequent erosion of each pixel for distance testing and each image processing unit of the second group for erosion with subsequent dilation for dimension testing, also a comparison module, in which the difference is formed from the processed output signals of the image processing units and the unchanged, recorded image signals, and finally has an image cleaning unit for processing the difference signals from the comparison module.
  • each image processing unit has three pixel environment memories each for one of three adjacent lines, of which the first three image points in a previous line, the second three image points in a current line with the image point to be processed in the The middle and the third stores three pixels in a successor line, and that each pixel environment memory has three outputs which are led to a link memory in which an image operation "delete” or "set” on the pixel to be processed depending on the eight surrounding pixels " is performed.
  • each B ildver- processing unit comprises a delay module for delaying the received unmodified image signal by a period of time which is required for the pixel processing.
  • a first line memory is connected upstream of the second pixel - environment memory, which transfers the pixels of a line to the second pixel environment memory with a delay
  • a second line memory is connected upstream of the first image memory, which memory lines by one pixel transfers two clocks delayed to the first pixel surrounding memory.
  • a computer can take care of the overall error detection and management. Further advantageous embodiments of the invention are accordingly protected in the subclaims.
  • micro errors can generally be divided into micro errors and macro errors.
  • micro-errors are in the following understood such errors, the dimensions of which are smaller than the minimum permitted width of conductor tracks and the minimum permitted distance between them.
  • Macro errors are understood to mean all larger errors than the micro errors.
  • the permissible dimensions for minimum widths for conductor tracks and minimum distances between them are of the same order of magnitude, namely in practice between 501m and 100 ⁇ m.
  • S min , a min , e max , b max can be understood directly from FIG. 1 and are therefore not explained in more detail.
  • S min , a min of 80 ⁇ m; e max , b max of 20% should be recorded.
  • Fig. 2 shows an arrangement with a movable table 2, on which a circuit board 3 to be tested lies.
  • a CCD camera Charge Coupled Device
  • the table can be moved on the crossbar 4 in the ⁇ Y direction.
  • a conventional video camera could also be used.
  • an illumination device 6 is arranged, which can be moved on the crossbar 4 with the camera.
  • the CCD recording camera records a line 7 on the circuit board as it passes under it in the Y direction.
  • the exposure time of the recording camera is clocked and is a maximum of 200 ⁇ s with 5 to 10 ⁇ resolution and 50 mm / s feed of the table in the Y direction.
  • the CCD camera has a sensor line with a total of 1024 semiconductor sensors, which are exposed simultaneously during the exposure time and pass the video signals serially to an output.
  • the data rate per sensor is 10MHz pulsed for approx. 100 ⁇ s.
  • 8 indicates the scanning paths which are scanned by the CCD camera, it becoming clear that an X movement takes place at the end of such a scanning path.
  • the cross member 4 can also be moved in the ⁇ Y direction.
  • the recording camera 5 can also be used be stationary and the table 2 can be moved in a controlled manner in both the X and Y directions.
  • FIG. 3 the partial plan view of the surface of the printed circuit board 3 shows how the receiving arrangement according to FIG. 2 is used.
  • an image field is shown divided into 8 by 8 squares, each 5 by 5 ⁇ m.
  • a 5 by 5 ⁇ m square corresponds to a pixel.
  • the vertical arrangement of 1024 pixels is recorded with the recording camera 5 at an exposure time.
  • the image field with the 8 by 8 squares has a dimension of 40 by 40 ⁇ m.
  • the width of a micro-track 8 consequently corresponds to 5 times 1024 squares, each with a length of 5 ⁇ , ie 5120 ⁇ m. From Fig. 3 it can be seen that the X movement of the recording camera according to Fig.
  • FIG. 4 shows a functional basic diagram of a device for opto-electronic testing of a printed circuit board or another flat structure which is provided with a pattern to be tested.
  • the receiving arrangement shown in FIG. 2 is represented by a box 20 in FIG. 4.
  • Image or video signals recorded with the recording arrangement 20 are simultaneously fed to a micro test unit 22 and a macro test unit 24, both of which are framed by dashed boxes in FIG. 4.
  • a micro test of the picture elements with a size of 5 by 5 ⁇ m according to FIG. 3 takes place picture by picture in the micro test unit, this being indicated by a box 25.
  • a box 25 Here be reitenprüf- simultaneously in a Abstandsprüfech 26 and B in a unit 28 distance error and width respectively.
  • the resulting residual image is "cleaned" in an image cleaning unit 30, that is to say it is checked whether it represents a "real” error or has only arisen from process-related deviations without the distances or widths deviating from the corresponding target values by the allowable amount.
  • the single image signal which is reduced for a 40 by 40 ⁇ m image field, is subjected to a macro test, which is indicated by a box 31.
  • a direct comparison with corresponding reference image information is made in a comparator 32, and information about errors of the order of magnitude of greater than 100 ⁇ m is thereby obtained.
  • the image information obtained can optionally be subjected to a so-called "geometry test" in a geometry test unit 34, with geometric criteria relating to the course (e.g. the gradient course, the straightness or the like) being used to check the correct geometric course of a conductor track. If no reliable information about the error has been obtained in the units 26, 28 of the micro test unit 22, a corresponding signal from the units 26, 28 can be entered into the geometry test unit 34 via a signal flow line 36.
  • control unit 38 The final results from the micro-test unit 22 and the macro-test unit 24 are subjected to a common overall fault detection 40, e.g. in the form of a computer, with a downstream output / display unit 42.
  • a common overall fault detection 40 e.g. in the form of a computer
  • FIG. 5 shows a more detailed diagram as FIG. 4, from which already the ge f ursetechnische concept für.Einraum for optoelectronic testing of a circuit board or other surface pattern appearing.
  • the CCD camera 5 outputs video control signals and video binary signals to a video bus controller 10, which is connected via digital video buses to the downstream components of the micro-test unit 22 and the macro-test unit 24 and the computer 40.
  • This computer is in turn connected to a data bus 15, which is responsible for the coordination of the error processing, the error marking in the image, the error summary, the: data transfer and the operator communication.
  • an interface 11 is installed such that data bus is connected as well as the camera 5 and the video bus controller 10 to the.
  • a TV camera 12 with a monitor 13 can be provided.
  • a TV display 14 can be connected to the video bus control 10.
  • the distance test unit 26 and the dimension test unit 28 are connected to the video bus via digital video buses. control 10 connected.
  • Each unit 26, 28 contains 8 image processing units 23, which are connected in series and are all constructed in the same way as explained below with reference to FIG. 8. These image processing units each deliver an output signal to a multiplexer 27. This is shown again in detail in FIG. 6 for the sake of greater clarity.
  • Each multiplexer 27 has an input 29 from the computer 40, via which the selection of the image operations is fed.
  • difference image signals are generated from the image signals received from the image processing units 23, from the processed image signals V z and the unchanged, recorded image signals V orig (see FIG. 8).
  • These difference image signals are each fed to an identically constructed image cleaning unit 30, in which, in addition to image cleaning, image evaluation, calculation and transfer of the error coordinates X, Y take place, as indicated in FIG. 5.
  • the video signals coming from the video bus control 10 are fed to a coarse screen unit 33, which interacts with a temporary memory 35 for n-1 scan paths.
  • the coarse grid unit 33 is connected to a macro memory 37 for processing a plurality of scan paths.
  • a reference memory 39 which is connected to a reference image manager 390 with a connected mass memory 391 for reference circuit boards on the data bus, contains corresponding reference image information.
  • the output signals from the macro memory 37 from the reference memory 39 are examined in a module which combines the comparison unit 32 and the geometry test unit 34. This is followed by a macro evaluation unit 38 for calculating and transferring error coordinates to the computer 40.
  • a monitor / operator unit 401 a setting memory 402 for circuit board data such as shapes and tolerances, a software module 403 for error algorithms and a working memory 404 are connected to the data bus.
  • FIG. 8 The structure of a processing unit 23 is explained in detail below with reference to FIG. 8. In order to facilitate understanding, however, it should be explained in advance with reference to FIG. 7 how to work with an image processing unit according to FIG. 8.
  • Each image processing unit 23 successively receives line-by-line digitized video signals for a previous line a, a current line b and a successor line c.
  • One pixel in the current line b is to be processed, namely the pixel 4b according to FIG. 7. Then all the pixels surrounding it 3a, 4a, 5a in the predecessor line a, the points 3b, 5b adjacent to it in the same line and the pixels 3c, 4c, 5a located in the successor line are used for consideration.
  • Pixel 4b is processed by subjecting it to dilation or erosion.
  • “Dilate" means that an image area of a certain brightness is broadened in that the pixel to be processed is set to the same brightness if at least one of its neighbors has this brightness.
  • Electrodemi ' means that an image area of a certain brightness can be shrunk by removing (deleting) the pixel to be processed from this brightness area if at least one of its neighbors does not have the certain brightness.
  • the actual recognition is only made possible by comparing the image recognized in a fermature or overture with the associated original image. Due process the result in an F is ermature and an overture not necessarily the same even with correct dimensions. In the case of the difference image generated for comparison, which should disappear if the dimensions are correct, remnants remain. This is the reason that image cleaning must be applied to every difference image obtained.
  • the image cleaning unit 30 must be able to distinguish between "false" difference images - there is no error - and "real" difference images.
  • a classification criterion can be used for example, that the residual image point in the amount exceeds R estject contiguously in two axis directions a certain limit (for example, greater than two pixels in two Achsenrichtuhgen). In this case there is a real error.
  • an image processing unit 23 The structure of an image processing unit 23 is shown below in detail, with which an image operation can be carried out at each pixel as explained above.
  • the image processing unit 23 has three inputs 50, 51, 52 for an unchanged digital video signal V Orig , a video signal V to be processed in each case and a clock signal "Clock".
  • the video signal V Orig is delayed via a delay module 49 in accordance with the processing time of the signal V z .
  • the video signal V Z to be processed is fed to a first line memory 54. This is given by a clock address driven by a clock by an address counter 55, which receives the clock signal 52 as an input signal and counts from 0 to 1023 according to the number of signals per sensor line of the CCD camera.
  • the first line memory 54 thus shifts the image signals corresponding to an image line with 1024 pixels in the manner of a shift register, but delayed by one line clock.
  • the output of the line memory 54 is connected to the input of a second line memory 56, which is also addressed by the address counter 55 and consequently in turn delays the received image signals by one line cycle, thus providing a total of two delays compared to the current values V z a total of three pixel environment memories 57,58,59 are provided.
  • the first pixel surrounding memory 57 is connected to the second line memory 56 and stores three pixel surrounding points of the twice delayed line, ie the precursor line a.
  • the second pixel surrounding memory is connected to the first line memory 54 and stores three adjacent pixels in the current line b.
  • the third pixel environment memory 59 which is directly connected to the input 51, ie is fed to the current signal V z , stores three adjacent pixels in the successor line c.
  • All three pixel surrounding memories 57, 58, 59 are connected with three outputs corresponding to the three stored pixels to a latch memory 60, in which the explained image operation is carried out at the central point 4b, ie a signal is set or deleted.
  • the resulting output value is sent via a buffer 61 to the next image processing unit 23 or to the multiplexer 27 according to FIG. 6 for further image processing. handed over to V and V orig .
  • the described micro-test (examination of picture elements with a size of 5 by 5 ⁇ m) and a macro-test (examination of picture fields with a size of 40 by 40 ⁇ m) can be carried out side by side with comparatively high speed.
  • a computer is not necessary for image processing; it may be sufficient to supply the results of the macro test and the micro test to an X / Y coordinate display or registration. Interconnection with a computer in the manner described is useful for managing and processing the errors.
  • the procedure described in the following is for quick locating, i.e. with image throughput frequency or approximately 10 MHz pixel frequency, from fluctuations in width of any structures that are normally line-like, in particular such image structures as are used on printed circuit boards or printed circuits for electronic devices.
  • gray value or "gray image” in no way corresponds to any brightness values of the original image. These terms were chosen only because one of the possible ways of displaying lines of the same distance of the binary image contour on a data display device is the use of different gray values.
  • each binary pixel is marked by a number between 0 and 8.
  • the value of the number indicates the distance to the contour, i.e. 0 means "edge point", while 8 marks the greatest distance to the edge.
  • step (2) the "gray image” is reduced to its “ridge lines".
  • the “contour lines” are processed one after the other from the outside in. With each pass, a part of the points of the processed "contour line” is deleted, which is irrelevant for further processing.
  • the result is a single solid line (Fig. 12).
  • the gray values of the line points of the ridge line are a measure of the distance between the point and the outer contour, approximately in the direction of the perpendicular from the outer contour to the image point.
  • FIG. 11 shows the output image on which FIGS. 9 and 10 are based in a binary representation, with each image point here also being represented by a point.
  • FIG. 12 shows the "ridge line", which with its gray values is now subjected to further processing in accordance with step (3).
  • the resulting "ridge lines" are scanned point by point according to FIG. 12 and changes in the inscribed gray values and thus the widths of the objects or structures to be checked are examined.
  • the ridge lines are divided into sections below Splits.
  • a line segment runs from a starting point (open line end) or a branching point (meeting point of several lines) to another starting point or branching point. All line segments are examined separately; the connection to other line sections is unimportant.
  • the line is scanned point by point, the difference between the gray values of two successive points is formed. If the difference is 0, the line is called “continuous” at these points. If the difference is not '0, it is called “discontinuous"'. Due to the length of continuous or discontinuous line segments, the maximum deviation from the initial value and the cumulative differences, part of the line and thus the associated segment of the object may be marked as defective.
  • the criteria according to which it is decided whether a piece is faulty or not can vary from DUT to DUT and must be specified in each case.
  • the example according to FIG. 11 which involves conductor tracks and pads, can be processed with the aim of determining impermissibly large fluctuations in the width of the pads.
  • Fig. 13 shows as an example that the variations in width are not acceptable. According to FIG. 13, this is made clear to the user by widening the ridge line.
  • the compressed recordings are combined in a scan memory 114 to form a complete scan.
  • the scan memory 14 has two identical areas which alternatively collect the compressed data or offer data for further processing. Due to this Z wischenpuff proceedings the subsequent LUT operations are independent of the time pattern of the recording and scanning direction.
  • the conversion of the binary image information into a gray image by a first LUT operator 116 begins.
  • the image information is read by a total of i LUT operators before being passed on to the first LUT operator 116 .
  • the gray values for determining the "contour lines" are determined.
  • the number of gray values (contour lines) depends on the width of the objects to be processed.
  • the number i depends on this of the LUT operators, ie sequential processing can be exited after i operators.
  • the gray value image thus generated is stored in a scroll memory (118). Additional LUT operators access this area via a memory management 119 and reduce the pseudo-gray image to lines of maximum gray values.
  • This processing requires n LUT operators, of which the first n-1 is designated 120 and the last 121.
  • the main purpose of the scroll memory 118 is to track the gray value lines in order to mark impermissible fluctuations. In order to be able to trace these lines by means of an image tracking and evaluation device 122, the scroll memory 118 must cover as large an image section as possible.
  • the coordinates and the sizes of the marked areas are determined in module 123 and transferred to a higher-level computer for further processing.

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EP84116418A 1983-12-30 1984-12-28 Procédé et dispositif opto-électroniques de contrôle d'un motif de surface d'un objet Ceased EP0149852A3 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3347645 1983-12-30
DE3347645A DE3347645C1 (de) 1983-12-30 1983-12-30 Verfahren und Einrichtung zum opto-elektronischen Pruefen eines Flaechenmusters an einem Objekt

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EP0149852A2 true EP0149852A2 (fr) 1985-07-31
EP0149852A3 EP0149852A3 (fr) 1985-08-28

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US (1) US4692943A (fr)
EP (1) EP0149852A3 (fr)
JP (1) JPS60215286A (fr)
DE (1) DE3347645C1 (fr)
IL (1) IL73947A (fr)

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EP0222079A2 (fr) * 1985-11-12 1987-05-20 MANIA Elektronik Automatisation Entwicklung und Gerätebau GmbH Méthode pour tester optiquement des cartes à circuits imprimés
EP0477037A2 (fr) * 1990-09-21 1992-03-25 Canon Kabushiki Kaisha Appareil pour l'évaluation d'épreuves
EP0485192A2 (fr) * 1990-11-07 1992-05-13 Gec-Marconi (Holdings) Limited Système de sécurité
EP0493657A2 (fr) * 1990-12-31 1992-07-08 Beltronics, Inc. Procédé et dispositif pour déterminer des défauts de fabrication dans des composants à l'état solide

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JPH0737892B2 (ja) * 1988-01-12 1995-04-26 大日本スクリーン製造株式会社 パターン欠陥検査方法
US5018212A (en) * 1988-03-25 1991-05-21 Texas Instruments Incorporated Defect area consolidation for pattern inspector
US4908702A (en) * 1988-04-29 1990-03-13 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Real-time image difference detection using a polarization rotation spacial light modulator
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JPH03188358A (ja) * 1989-12-19 1991-08-16 Hajime Sangyo Kk 物体の表面検査装置
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EP0435660B1 (fr) * 1989-12-29 1997-06-04 Canon Kabushiki Kaisha Méthode de traitement d'image pour l'évaluation d'objets, et appareil d'inspection mettant en oeuvre cette méthode
JPH03210679A (ja) * 1990-01-12 1991-09-13 Hiyuutec:Kk パターンマッチング方法および装置
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JPH0469777A (ja) * 1990-07-10 1992-03-04 Dainippon Screen Mfg Co Ltd プリント基板のパターン検査装置
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DE3347645C1 (de) 1985-10-10
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IL73947A0 (en) 1985-03-31
EP0149852A3 (fr) 1985-08-28
US4692943A (en) 1987-09-08

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