EP0108375B1 - Procédé de contrôle de surfaces d'impression gravées à l'aide d'un faisceau électronique - Google Patents
Procédé de contrôle de surfaces d'impression gravées à l'aide d'un faisceau électronique Download PDFInfo
- Publication number
- EP0108375B1 EP0108375B1 EP83110891A EP83110891A EP0108375B1 EP 0108375 B1 EP0108375 B1 EP 0108375B1 EP 83110891 A EP83110891 A EP 83110891A EP 83110891 A EP83110891 A EP 83110891A EP 0108375 B1 EP0108375 B1 EP 0108375B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- electron beam
- engraving
- electron
- checking
- engraved
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
- B41C1/00—Forme preparation
- B41C1/02—Engraving; Heads therefor
- B41C1/04—Engraving; Heads therefor using heads controlled by an electric information signal
- B41C1/05—Heat-generating engraving heads, e.g. laser beam, electron beam
Definitions
- the present invention relates to a method for checking electron beam-engraved printing form surfaces according to the patent claim.
- a separate control beam path is provided, which is directed onto a radiation receiver 19.
- a photoelectric converter is provided as the radiation receiver, which is followed by a display device, from the deflection of which a conclusion can be drawn directly about the state of focus of the electron beam. This signal can then be used to control the intensity of the machining beam.
- DE-A-2 354 323 discloses a method for producing an engraved printing surface and a device for carrying out the method, in which both an ion and an electron beam are proposed for engraving printing plate surfaces.
- the visualization of the engraved printing form surface by means of the electron beam generation system is not addressed there, but without special precautions, the disadvantageous effect of post-engraving when scanning the surface would also occur here.
- Applied Physics Letters, Volume 34, No. 5, March 1, 1975, pages 310-312 also discloses a method for first processing semiconductor surfaces and then checking them with electron microscopy using the same device.
- a liquid metal gallium ion source is used for the maskless doping of semiconductors.
- Such an ion source with low power is indeed suitable for the processing of semiconductor substrates and their electron microscopic examination, but not for the engraving of printing forms, since their performance is far from sufficient to e.g. B. Engrave a complete rotogravure cylinder made of copper, the surface of which should accommodate several newspaper pages, in one go.
- Some of these devices are suitable for the direct optical inspection of engraved surfaces, but not for the engraving of printing form surfaces, since special electron beam generation systems are required for this.
- the invention is based on the object of specifying a method for producing printing forms in which a simpler and more reliable control of the cells produced is possible with an electron beam generation system specially developed for the engraving of printing form surfaces.
- the beam will be reduced to approximately 1 I lm diameter than the mode engraving according to the invention.
- the beam undergoes an x and y deflection in order to scan the cell area to be displayed.
- the secondary electrons generated in this way are detected and used as a video signal to control a monitor.
- a great advantage of the present invention lies in the fact that no special optical control device or a separate electron beam microscope has to be provided, but that the electron beam gun, which is designed for material processing, enables the electron beam microscope operation during engraving pauses in a simple manner due to the present invention becomes.
- Electron beam microscopes are known per se, but electron beam microscopes in turn cannot be used or modified for material processing. With regard to the known electron beam microscopes, reference is made to the book by L. Reimer and G. Pfefferkorn, scanning electron microscopy, Springer Verlag Berlin, Heidelberg, New York 1977, Chapter 1 Introduction, pages 1, 2 and 3, in which, in FIG associated description of the circuitry for the detection of the secondary electrons and the connection of the 4 monitor is given.
- Figure 1 shows a pressure cylinder (1) with engraved cups (2), which have been produced by an electron beam (3).
- Such printing cylinders are used as printing forms in gravure printing, the cups, which have different volumes depending on the tonal value to be printed, are filled with printing ink during the printing process and the printing ink is transferred to the printing substrate during printing.
- FIG. 1 shows in detail the electron optics and the beam path of an electron beam generator, by means of which the invention can be carried out.
- the electron beam (3) goes from a heated cathode (4), which lies in a heating circuit (41), which has a voltage source V k (z. B. 6 volts).
- the beam passes through the Wehnelt cylinder (5) and the anode (6) and comes to a first lens system (7), which is shown in more detail in FIG. 2.
- the Wehnelt cylinder (5) is in the circuit (51) with the voltage source Vw (e.g. 100 volts) and the anode (6) in a circuit (61) with a voltage source Va for the anode voltage (5 to -50 KV ).
- an aperture diaphragm (8) is provided and the beam transmitted by the diaphragm passes through a deflection unit (9) and a second lens system (10) before it hits the engraving cylinder (1).
- the deflection unit (9) serves to move the deflection beam in a row over the wells (2) to be scanned. This scanning movement is carried out simultaneously by the electron beam (11) of a picture tube (12) by means of a second deflection unit (13).
- the corresponding deflection currents are generated in a raster generator (14), and the two deflection booklets (9) and (13) are connected to one another via a unit (15) for varying the magnification.
- FIG. 2 shows the electron beam generating system and the beam path for the various operating modes, engraving and microscope operation in more detailed form, the actual electron beam generating system comprising the cathode, Wehnelt and anode and the deflection coils being omitted for the sake of clarity.
- the first lens system (7) which brings about a first reduction, consists of two lenses (71) and (72), and a further lens (73) is provided inside the lens (71) for the engraving mode.
- three operating cases are explained on the basis of the drawn beam paths (30), (31) and (32), namely beam path (30), engraving of a large cell, beam path (31), engraving of a small cell and beam path (32), microscope operation.
- the lens system (71), (72) and (73) forms a variable reduction stage, the radiation source shown schematically being reduced 12 times when the lens is maximally tightened and 3 times when the lens (73) is not tightened.
- the aperture diaphragm 8 is dimensioned such that an angle ao of 0.08 rd is given, which results in an opening error disk of 25 ⁇ m in diameter.
- the lens (10) makes a 4-fold reduction, and the lens (101) serves to focus and defocus the beam, thereby producing cells.
- a processing effect occurs when the beam is focused, but not when the beam is defocused.
- the beam path (30) is set for engraving large cells, the beam having a diameter of approximately 100 ⁇ m at the point of impact and having a beam current in the processing spot of 50 mA.
- the beam path (31) is used to produce small cells.
- the beam has a diameter of about 20 ⁇ m at the point of impact and the current in the spot is 3 mA.
- the tonal value-dependent variation of the cell size is carried out by varying the tension of the dynamic lens (73).
- the deflection system (9) shown in FIG. 1 generates a beam entrainment for cylinder rotation, so that the beam always hits the same point when the cylinder is rotating.
- an acceleration voltage of 50 KV is used, and the beam emerging from the cathode has a current of approximately 50 mA.
- the dynamic lens (73) is switched off.
- the static lens (71) is more excited and the reduction in the radiation source is approximately 250.
- the lens (10) remains almost unchanged and the dynamic focus lens (101) is switched off.
- the probe diameter on the cylinder surface is 1 to 1.5 ⁇ m.
- the deflection system (9) shown in FIG. 1 is used to generate the scanning grid in accordance with the line and image frequency of the picture tube (12).
- the scanned field is approximately 1 mm 2 .
- a secondary electron detector (16) is provided for microscope operation, which is also pivoted in like the aperture (8 ') during microscope operation.
- the image of the well on the picture tube appears as if the wells were illuminated from the side, since the detector (16) is directed from one side towards the wells of the printing form surface and the electrons, which are on the inside of the detector opposite the Wells are reflected, give a better yield on the detector (16).
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Manufacturing & Machinery (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
- Electron Beam Exposure (AREA)
- Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Claims (1)
- Procédé de contrôle de surfaces d'impression gravées à l'aide d'un faisceau électronique et réalisées à l'aide d'un système générateur de faisceaux électroniques; la gravure et le contrôle sont effectués avec le même système générateur de faisceaux électroniques, qui comporte un premier étage de réduction (71, 72, 73) et un second étage de réduction (10, 101) avec chacun une lentille dynamique (73 ou 101) disposée respectivement à l'intérieur d'une lentille statique (71, 10), ainsi qu'un diaphragme d'ouverture (8) disposé entre les deux systèmes de réduction, procédé caractérisé en ce que:- des cavités en forme de coupelles (2) sont gravées sur la surface d'impression (1) pendant le fonctionnement en gravure, etle générateur de faisceaux d'électrons est, d'une façon connue, exploité en tant que microscope électronique de trame lors du fonctionnement en contrôle pour contrôler les coupelles gravées; en ce que le faisceau d'électrons (30, 31) est commuté sur le fonctionnement en microscope en ce qui concerne son intensité et ses paramètres de déviation, en ce que dans les deux systèmes de réduction, les lentilles dynamiques (73 et 101) sont mises hors circuit et au lieu du diaphragme d'ouverture (8) utilisé lors du fonctionnement en gravure, un plus petit diaphragme d'ouverture (8') est introduit et la zone des coupelles à reproduire est balayée; un signal vidéo pour commander un tube cathodique (12) d'un récepteur de contrôle est obtenu au moyen d'un multiplicateur d'électrons secondaires (16) à partir des électrons secondaires produits par le faisceau, et ce signal est appliqué au tube cathodique (12) qui, en ce qui concerne la déviation du faisceau est synchronisé avec le générateur de faisceaux d'électrons, pour visualiser les coupelles (2).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT83110891T ATE49534T1 (de) | 1982-11-04 | 1983-11-02 | Verfahren zur kontrolle von elektronenstrahlgravierten druckformoberflaechen. |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3240653 | 1982-11-04 | ||
DE19823240653 DE3240653A1 (de) | 1982-11-04 | 1982-11-04 | Verfahren zur kontrolle von mittels elektronenstrahlgravierten druckformoberflaechen |
Publications (3)
Publication Number | Publication Date |
---|---|
EP0108375A2 EP0108375A2 (fr) | 1984-05-16 |
EP0108375A3 EP0108375A3 (en) | 1987-04-01 |
EP0108375B1 true EP0108375B1 (fr) | 1990-01-17 |
Family
ID=6177236
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP83110891A Expired - Lifetime EP0108375B1 (fr) | 1982-11-04 | 1983-11-02 | Procédé de contrôle de surfaces d'impression gravées à l'aide d'un faisceau électronique |
Country Status (6)
Country | Link |
---|---|
US (1) | US4549067A (fr) |
EP (1) | EP0108375B1 (fr) |
JP (2) | JPS5998848A (fr) |
AT (1) | ATE49534T1 (fr) |
DE (2) | DE3240653A1 (fr) |
SU (1) | SU1240347A3 (fr) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AT386297B (de) * | 1985-09-11 | 1988-07-25 | Ims Ionen Mikrofab Syst | Ionenstrahlgeraet und verfahren zur ausfuehrung von aenderungen, insbes. reparaturen an substraten unter verwendung eines ionenstrahlgeraetes |
AT392857B (de) * | 1987-07-13 | 1991-06-25 | Ims Ionen Mikrofab Syst | Vorrichtung und verfahren zur inspektion einer maske |
DE4031547A1 (de) * | 1990-10-05 | 1992-04-09 | Hell Rudolf Dr Ing Gmbh | Verfahren und vorrichtung zur herstellung von texturwalzen |
US5515182A (en) * | 1992-08-31 | 1996-05-07 | Howtek, Inc. | Rotary scanner |
DE19840926B4 (de) * | 1998-09-08 | 2013-07-11 | Hell Gravure Systems Gmbh & Co. Kg | Anordnung zur Materialbearbeitung mittels Laserstrahlen und deren Verwendung |
JP4178741B2 (ja) | 2000-11-02 | 2008-11-12 | 株式会社日立製作所 | 荷電粒子線装置および試料作製装置 |
DE102006032303B4 (de) * | 2006-07-11 | 2010-08-19 | Ellcie Maintenance Gmbh | Oberflächenbearbeitungsvorrichtung |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE55965C (de) * | AKTIENGESELLSCHAFT „FABRIK LEIPZIGER MUSIKWERKE", VORM. PAUL EHRLICH & Co. in Gohlis bei Leipzig | Antriebvorrichtung für mechanische Musikwerke | ||
DE1119428B (de) * | 1958-08-30 | 1961-12-14 | Zeiss Carl Fa | Einrichtung zur Objektbeobachtung in Geraeten zur Materialbearbeitung mittels Ladungstraegerstrahl |
NL268860A (fr) * | 1959-04-17 | |||
DE1299498B (de) * | 1964-07-24 | 1969-07-17 | Steigerwald Strahltech | Vorrichtung zur UEberwachung des Strahlauftreffbereichs in Korpuskularstrahl-Bearbeitungsgeraeten |
US3404254A (en) * | 1965-02-26 | 1968-10-01 | Minnesota Mining & Mfg | Method and apparatus for engraving a generally cross-sectionally circular shaped body by a corpuscular beam |
GB1410518A (en) * | 1972-10-30 | 1975-10-15 | Crosfield Electronics Ltd | Preparation of printing surfaces |
JPS532599B2 (fr) * | 1972-10-30 | 1978-01-30 | ||
US4041311A (en) * | 1976-07-12 | 1977-08-09 | Iowa State University Research Foundation, Inc. | Scanning electron microscope with color image display |
JPS57132657A (en) * | 1981-02-06 | 1982-08-17 | Akashi Seisakusho Co Ltd | Inclined moving body tube type scanning electron microscope and its similar apparatus |
JPS57135172A (en) * | 1981-02-13 | 1982-08-20 | Hell Rudolf Dr Ing Gmbh | Electron beam-working method |
-
1982
- 1982-11-04 DE DE19823240653 patent/DE3240653A1/de not_active Withdrawn
-
1983
- 1983-11-02 DE DE8383110891T patent/DE3381109D1/de not_active Expired - Lifetime
- 1983-11-02 EP EP83110891A patent/EP0108375B1/fr not_active Expired - Lifetime
- 1983-11-02 AT AT83110891T patent/ATE49534T1/de not_active IP Right Cessation
- 1983-11-03 SU SU833663179A patent/SU1240347A3/ru active
- 1983-11-03 US US06/548,518 patent/US4549067A/en not_active Expired - Lifetime
- 1983-11-04 JP JP58206069A patent/JPS5998848A/ja active Pending
-
1992
- 1992-11-02 JP JP1992075919U patent/JPH088102Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
SU1240347A3 (ru) | 1986-06-23 |
EP0108375A2 (fr) | 1984-05-16 |
JPH067933U (ja) | 1994-02-01 |
EP0108375A3 (en) | 1987-04-01 |
JPH088102Y2 (ja) | 1996-03-06 |
DE3381109D1 (de) | 1990-02-22 |
JPS5998848A (ja) | 1984-06-07 |
US4549067A (en) | 1985-10-22 |
DE3240653A1 (de) | 1984-05-10 |
ATE49534T1 (de) | 1990-02-15 |
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