EP0059787B1 - Vorrichtung zum partiellen Galvanisieren von zu elektrisch leitenden Bändern, Streifen oder dgl. zusammengefassten Teilen im Durchlaufverfahren - Google Patents

Vorrichtung zum partiellen Galvanisieren von zu elektrisch leitenden Bändern, Streifen oder dgl. zusammengefassten Teilen im Durchlaufverfahren Download PDF

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Publication number
EP0059787B1
EP0059787B1 EP81108594A EP81108594A EP0059787B1 EP 0059787 B1 EP0059787 B1 EP 0059787B1 EP 81108594 A EP81108594 A EP 81108594A EP 81108594 A EP81108594 A EP 81108594A EP 0059787 B1 EP0059787 B1 EP 0059787B1
Authority
EP
European Patent Office
Prior art keywords
tape
spray nozzles
nozzles
electrolyte
spray
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
EP81108594A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP0059787A1 (de
Inventor
Heiner Ing.Grad. Bahnsen
Daniel Ing. Grad. Hosten
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to AT81108594T priority Critical patent/ATE27974T1/de
Publication of EP0059787A1 publication Critical patent/EP0059787A1/de
Application granted granted Critical
Publication of EP0059787B1 publication Critical patent/EP0059787B1/de
Expired legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B5/00—Electrostatic spraying apparatus; Spraying apparatus with means for charging the spray electrically; Apparatus for spraying liquids or other fluent materials by other electric means
    • B05B5/08—Plant for applying liquids or other fluent materials to objects
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating

Definitions

  • the invention relates to a device for the partial electroplating of parts combined with a predetermined division into electrically conductive strips, strips or the like.Continuous process, the cathodically connected strip or the like being guided along a plurality of anodically connected spray nozzles made of noble metal, which Seen in the direction of movement of the strip or the like. Arranged one behind the other and directed against the strip or the like in such a way that the electrolyte jet emerging from each individual spray nozzle strikes the region to be galvanized on the strip or the like.
  • Such a device for the partial electroplating of parts combined into electrically conductive strips in a continuous process is known from US-A-4 036 725.
  • the strips are moved on a circular path past radially aligned spray nozzles made of platinum, a radial electrolyte jet being directed from each individual spray nozzle onto the area to be galvanized on the strip.
  • CH-A-621 825 discloses a device for partial electroplating, in which a cathodically connected strip is passed through a masking seal with at least one opening.
  • a spray nozzle sprays the electrolyte solution through the opening or through several openings of the masking seal onto the areas of the strip to be electroplated.
  • the spray nozzle provided with anode metal plates at its spray opening sprays the electrolyte solution continuously or intermittently.
  • the spray nozzle can be provided with a plurality of spray openings, or alternatively a plurality of nozzles can be provided.
  • a similar device for partially electroplating metal strips is known from US-A-4,240,880.
  • the areas to be electroplated are also determined here by corresponding openings in a mask, each of these openings being opposed by an anodically connected spray nozzle made of platinum or platinum-coated titanium.
  • the invention has for its object to improve a generic device for partial electroplating so that a particularly uniform formation of the individual spray jets and thereby bringing the nozzle ends close to the belt or the like., Higher current densities, higher deposition rates and an increase in the bagging speed be made possible.
  • This object is achieved according to the invention in that the distance of the spray nozzles from one another is not equal to the division or not equal to a multiple of the division of the parts combined in the band or the like.
  • the invention is based on the knowledge that, with such a dimensioning of the distance between the spray nozzles, the total expression across all spray nozzles is approximately the same, and thus the strength of the individual spray jets is not subject to any fluctuations. This results in a particularly uniform design of the individual spray jets.
  • the diameter of the nozzles and the distance of the nozzles from the strip or the like are preferably dimensioned such that a current density distribution corresponding to the desired layer thickness distribution is produced between the strip or strip and nozzles.
  • any desired layer thickness distribution can be achieved, so that, for example in the case of knife strips, the areas which are exposed to greater wear than other areas can be provided with a thicker coating.
  • precious metal contacts can be saved considerably in precious metal contacts.
  • a further possibility of a targeted layer ceiling distribution results from the fact that the individual spray nozzles have a smaller diameter than the width of the areas to be galvanized on the strip and that the individual spray nozzles are not only arranged one behind the other in the direction of movement, but also perpendicularly to one another such that the in the order of the first spray nozzle the one (upper) and the last spray nozzle the other (lower) range limit.
  • this can be achieved in a simple manner by displacing the nozzles, which are preferably combined into groups and are used in a common container to form a spray cell, by inclining the container parallel to the belt. By appropriately tilting the spray cell, a more or less wide area on the strip can be partially galvanized. According to this inclination, the belt speed must then be set accordingly in order to achieve a certain layer thickness.
  • the angle between the nozzle axis and the belt plane is set to be less than 90 °, so that the sprayed electrolyte flows off in a preferred direction. This allows the exit speed speed of the electrolyte from the nozzles can be increased. The more this angle deviates from the perpendicular to the strip, the better the flow distribution, so that at least partially sharply delimited areas of the coating result.
  • spray nozzles are arranged on both sides of the strip in a manner known per se which, according to the invention, are at a distance from one another so that the nozzles do not interfere with one another.
  • the electrolyte is sprayed at a very high speed, it is inevitable that the electrolyte is also sprayed onto areas which are not to be galvanized and which may then have to be cleaned again later.
  • at least these areas of the band are covered by at least one mask in a manner known per se. It is expedient here if the mask forms part of the guidance of the band. If, for example, plug strips, plug pins or the like are to be partially galvanized with the aid of masks, it is advantageous that the masks move with the belt or the strips in a speed-compatible manner at least over the length of the spray cell.
  • the spray nozzles arranged at least on one side of the belt are used to form a spray cell in a common container which is designed and held under pressure such that each of the electrolyte jets emerging from the individual spray nozzles has approximately the same strength.
  • a particularly simple construction of a spray cell results in accordance with the invention in that the spray cell consists of a noble metal tube, e.g. Platinum, existing spray nozzles in a tubular container made of corrosion-resistant material, e.g. Titanium are used, which is preferably closed on one side and has a connecting piece for electrolyte liquid on the other side.
  • a preferably concentrically arranged distributor pipe is arranged in the interior of the tubular container, via which the electrolyte is supplied and in which holes are provided in a corresponding distribution on the side facing away from the spray nozzles.
  • Such a container can be easily adjusted with respect to the belt or the like so that the distance of the spray nozzles from the belt and the direction of the spray nozzles to the belt can be changed.
  • the spray direction can be changed in a simple manner in that the container is designed to be pivotable about its longitudinal axis.
  • FIG. 1 shows, the parts 1 to be coated are combined to form a conductive tape 2.
  • the tape 2 is usually wound on a roll and is drawn off by an unwinder, not shown in the drawing, and runs into the electroplating system. It travels through a number of pretreatment stations in a manner known per se and then finally runs into the actual electroplating cell 4, the principle of which is shown in FIG.
  • the tape 2 is drawn into the plating cell 4 in the direction of the arrow 3.
  • a pair of contact rollers 5 are provided for contacting the belt 2, which also serve as a guide.
  • the band 2 is guided along a row of nozzles 7, which are inserted in a tubular container 8 designed as a spray cell. As indicated by an arrow 9, electrolyte is pumped into the tubular container 8, which then exits through the nozzles 7.
  • the nozzles 7 are directed against the area B to be coated, the diameter d of the nozzles 7 and the distance a from the strip 2 being matched to one another such that the current density distribution corresponds approximately to the desired layer thickness distribution (FIG. 2).
  • FIG. 2 shows, on an enlarged scale, the arrangement of the nozzles 7 in relation to the area B to be galvanized of the parts 1 on the strip 2.
  • the nozzle 7 is directed approximately perpendicularly towards the strip 2. This is expedient if, as shown in FIG. 2, the area B of the part 1 to be coated is curved is. If this is not the case, it may be advantageous that the angle a between the nozzle axis 10 and the ribbon plane is made smaller than 90 the 0th This adjustment of the angle can be carried out in a simple manner in such a way that the tubular container 8 is correspondingly rotated about its longitudinal axis 11.
  • the nozzles 7 used in the tubular container 8 are preferably arranged at the same distance D from one another, but the distance D is not equal to a multiple of the distance t of the components combined in the band 2.
  • the area of the strip 2 that is not to be galvanized can be covered. This can be done, for example, by means of corresponding masks 12 and 13, which are pressed elastically against the band 2.
  • the belt consists of individual parts e.g. There is contact pins that are more or less free, so there is a risk that these parts 1 are bent and damaged.
  • the masks 12 and 13 move according to FIG. 1 with the belt in a speed-compatible manner. This can be accomplished in a simple manner if circumferential belts are used as masks 12 and 13, as are also used, for example, in a device described in DE-OS 2 928 904.
  • partially galvanizing parts combined into strips, such as pin combs or the like, and also circuit boards.
  • FIGS. 3 and 4 show an embodiment with two spray cells, contact pins 14 being combined into a band to be galvanized at the lower free end, from both sides.
  • tubular containers 8 and 8 'with spray nozzles 7 and 7' are provided on both sides of the belt and are directed against the area to be plated on the contact pins 14.
  • the arrangement and configuration of the nozzles 7 and 7 ' essentially corresponds to the configuration according to FIG. 1, but in this case the opposing nozzles 7 and 7' are offset from one another so that the electrolyte jets emerging from the individual nozzles 7 and 7 ' do not influence each other.
  • the two tubular containers 8 and 8 ' are arranged within an electrolyte trough 15, as shown in FIG. 4.
  • the lower end of a contact pin 14 is to be galvanized in such a way that the distribution of the layer 26 shown in FIG. 5 is produced, such a uniform layer thickness distribution can only be achieved if the diameter d of the individual nozzles 7 is significantly smaller than the area to be galvanized B of the connector pin 14 and if the nozzles 7A to 7N are also offset transversely to the direction of movement of the strip, in total by an amount c.
  • This can be achieved in a simple manner in the spray cells according to FIGS. 1 and 3 in that the container or containers 8 are inclined parallel to the belt by the amount c, so that, for example, the first spray nozzle 7A in the order, the upper and the last spray nozzle 7N detected the lower range limit.
  • the amount c is chosen exaggerated. As already mentioned at the beginning, any desired layer thickness distribution can be achieved in this way.
  • FIG. 6 shows an advantageous embodiment of a spray cell, in particular for partial gold plating.
  • the cell consists of a tube 16 made of corrosion-resistant material, e.g. Titanium, in which tubes 17 made of precious metal, for example platinum, serving as nozzles 7 are used.
  • the tube 16 is provided with corresponding bores into which the tubes 17 are inserted, for example by pressing.
  • a plug 18 made of corrosion-resistant material, for. B. plastic inserted, which seals the tube 16 tightly.
  • the other end of the tube 16 has a connecting piece 19 for connection to an electrolyte supply, as indicated by an arrow 20.
  • a distributor tube 21 is arranged inside the tube 16, preferably concentrically to the latter, one end of which is pushed over a molded part 22 of the stopper and the other end of which is centered in a corresponding bore 23 of the connecting piece 19 is.
  • the distributor tube 21 is provided on the side facing away from the tube 17 with openings in the form of bores 24, through which the electrolyte exits and pours around the distributor tube 21 on both sides before it reaches the tube 17 and exits there.
  • the spray cells shown in FIGS. 1, 3 and 4 are preferably also designed in the same way as the spray cell according to FIG. 6. Such a cell can be inserted into a simple holder which allows rotation about its longitudinal axis 25 as well as adjustment of a certain one Inclined position C parallel to the strip for setting a defined coating width B and also setting an optimum distance for the galvanization of the nozzle ends from the areas to be galvanized is permitted.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
EP81108594A 1981-03-05 1981-10-20 Vorrichtung zum partiellen Galvanisieren von zu elektrisch leitenden Bändern, Streifen oder dgl. zusammengefassten Teilen im Durchlaufverfahren Expired EP0059787B1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AT81108594T ATE27974T1 (de) 1981-03-05 1981-10-20 Vorrichtung zum partiellen galvanisieren von zu elektrisch leitenden baendern, streifen oder dgl. zusammengefassten teilen im durchlaufverfahren.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3108358A DE3108358C2 (de) 1981-03-05 1981-03-05 Vorrichtung zum partiellen Galvanisieren von zu elektrisch leitenden Bändern, Streifen oder dgl. zusammengefaßten Teilen im Durchlaufverfahren
DE3108358 1981-03-05

Publications (2)

Publication Number Publication Date
EP0059787A1 EP0059787A1 (de) 1982-09-15
EP0059787B1 true EP0059787B1 (de) 1987-06-24

Family

ID=6126410

Family Applications (1)

Application Number Title Priority Date Filing Date
EP81108594A Expired EP0059787B1 (de) 1981-03-05 1981-10-20 Vorrichtung zum partiellen Galvanisieren von zu elektrisch leitenden Bändern, Streifen oder dgl. zusammengefassten Teilen im Durchlaufverfahren

Country Status (5)

Country Link
US (1) US4427520A (enrdf_load_stackoverflow)
EP (1) EP0059787B1 (enrdf_load_stackoverflow)
JP (1) JPS57161084A (enrdf_load_stackoverflow)
AT (1) ATE27974T1 (enrdf_load_stackoverflow)
DE (2) DE3108358C2 (enrdf_load_stackoverflow)

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DE3148788C2 (de) * 1981-12-09 1986-08-21 Siemens AG, 1000 Berlin und 8000 München Wäßriges Bad und Verfahren zum galvanischen Abscheiden von glänzenden und rißfreien Palladiumschichten sowie Verfahren zur Herstellung des Bades
DE3339328A1 (de) * 1982-11-01 1984-05-10 Omi International Corp., 48089 Warren, Mich. Anodenstruktur fuer eine plattierungszelle
JPS6082700A (ja) * 1983-10-07 1985-05-10 Kawasaki Steel Corp ラジアルセル型めつき槽におけるカウンタ−フロ−装置
JPS61250191A (ja) * 1985-04-26 1986-11-07 Electroplating Eng Of Japan Co コネクタ端子のブラシメツキ方法
JPH07116636B2 (ja) * 1986-09-26 1995-12-13 川崎製鉄株式会社 ラジアル型めつきセル
US4911810A (en) * 1988-06-21 1990-03-27 Brown University Modular sputtering apparatus
DE4116643C2 (de) * 1991-05-22 1994-06-09 Klaus Joergens Verfahren zum anodischen oder kathodischen Elektrolackieren von Band- oder Profilmaterial
US5242562A (en) * 1992-05-27 1993-09-07 Gould Inc. Method and apparatus for forming printed circuits
US5658441A (en) * 1995-12-18 1997-08-19 Cfc, Inc. Conveyorized spray plating machine
DE19758513C2 (de) * 1997-02-06 2000-07-13 Schempp & Decker Praezisionste Vorrichtung zum selektiven galvanischen Beschichten von elektrischen Kontaktelementen
EP1081252A1 (en) * 1999-09-02 2001-03-07 Enthone-OMI (Benelux) B.V. Selective plating method
DE10205586B4 (de) * 2002-02-09 2007-07-05 Degussa Galvanotechnik Gmbh Verfahren und Vorrichtung zur galvanischen Beschichtung von Endlosmaterial
JP5009972B2 (ja) * 2009-12-21 2012-08-29 日立オートモティブシステムズ株式会社 コネクタの製造方法
US9523155B2 (en) 2012-12-12 2016-12-20 Novellus Systems, Inc. Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating
US10094034B2 (en) 2015-08-28 2018-10-09 Lam Research Corporation Edge flow element for electroplating apparatus
US10233556B2 (en) 2010-07-02 2019-03-19 Lam Research Corporation Dynamic modulation of cross flow manifold during electroplating
US9624592B2 (en) 2010-07-02 2017-04-18 Novellus Systems, Inc. Cross flow manifold for electroplating apparatus
US9449808B2 (en) 2013-05-29 2016-09-20 Novellus Systems, Inc. Apparatus for advanced packaging applications
US10364505B2 (en) 2016-05-24 2019-07-30 Lam Research Corporation Dynamic modulation of cross flow manifold during elecroplating
US11001934B2 (en) 2017-08-21 2021-05-11 Lam Research Corporation Methods and apparatus for flow isolation and focusing during electroplating
US10781527B2 (en) 2017-09-18 2020-09-22 Lam Research Corporation Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating
CN107937932A (zh) * 2017-12-12 2018-04-20 西安泰金工业电化学技术有限公司 一种生箔机组水洗喷淋装置
TWI831852B (zh) * 2019-10-24 2024-02-11 香港商亞洲電鍍器材有限公司 流體輸送系統及電鍍工件的方法
CN110846695A (zh) * 2019-12-06 2020-02-28 昆山一鼎工业科技有限公司 局部区域表面处理装置及其表面处理方法

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US4036725A (en) * 1975-11-21 1977-07-19 National Semiconductor Corporation Wheel selective jet plating system

Also Published As

Publication number Publication date
DE3108358C2 (de) 1985-08-29
ATE27974T1 (de) 1987-07-15
JPS57161084A (en) 1982-10-04
EP0059787A1 (de) 1982-09-15
JPH024678B2 (enrdf_load_stackoverflow) 1990-01-30
US4427520A (en) 1984-01-24
DE3108358A1 (de) 1982-09-16
DE3176278D1 (en) 1987-07-30

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