DK174111B1 - Elektrisk forbindelseselement samt fremgangsmåde til fremstilling af et sådant - Google Patents

Elektrisk forbindelseselement samt fremgangsmåde til fremstilling af et sådant Download PDF

Info

Publication number
DK174111B1
DK174111B1 DK199800101A DK10198A DK174111B1 DK 174111 B1 DK174111 B1 DK 174111B1 DK 199800101 A DK199800101 A DK 199800101A DK 10198 A DK10198 A DK 10198A DK 174111 B1 DK174111 B1 DK 174111B1
Authority
DK
Denmark
Prior art keywords
conductor
photoresist
conductor paths
pattern
plastic film
Prior art date
Application number
DK199800101A
Other languages
Danish (da)
English (en)
Other versions
DK10198A (da
Inventor
Jesper Noerregaard
Niels Vagn Pedersen
Original Assignee
Giga As
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Giga As filed Critical Giga As
Priority to DK199800101A priority Critical patent/DK174111B1/da
Priority to US09/600,797 priority patent/US7212088B1/en
Priority to JP2000530944A priority patent/JP2002503033A/ja
Priority to AU21502/99A priority patent/AU2150299A/en
Priority to EP99901583A priority patent/EP1051749A1/en
Priority to PCT/DK1999/000036 priority patent/WO1999040627A1/en
Publication of DK10198A publication Critical patent/DK10198A/da
Application granted granted Critical
Publication of DK174111B1 publication Critical patent/DK174111B1/da

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/04—Fixed joints
    • H01P1/047—Strip line joints
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/077—Connecting of TAB connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/203—Electrical connections
    • H10W44/206—Wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/203—Electrical connections
    • H10W44/216—Waveguides, e.g. strip lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/203—Electrical connections
    • H10W44/223—Differential pair signal lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]

Landscapes

  • Waveguides (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
DK199800101A 1998-01-26 1998-01-26 Elektrisk forbindelseselement samt fremgangsmåde til fremstilling af et sådant DK174111B1 (da)

Priority Applications (6)

Application Number Priority Date Filing Date Title
DK199800101A DK174111B1 (da) 1998-01-26 1998-01-26 Elektrisk forbindelseselement samt fremgangsmåde til fremstilling af et sådant
US09/600,797 US7212088B1 (en) 1998-01-26 1999-01-25 Electrical connecting element and a method of making such an element
JP2000530944A JP2002503033A (ja) 1998-01-26 1999-01-25 電気的接続要素および電気的接続要素を作る方法
AU21502/99A AU2150299A (en) 1998-01-26 1999-01-25 An electrical connecting element and a method of making such an element
EP99901583A EP1051749A1 (en) 1998-01-26 1999-01-25 An electrical connecting element and a method of making such an element
PCT/DK1999/000036 WO1999040627A1 (en) 1998-01-26 1999-01-25 An electrical connecting element and a method of making such an element

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DK10198 1998-01-26
DK199800101A DK174111B1 (da) 1998-01-26 1998-01-26 Elektrisk forbindelseselement samt fremgangsmåde til fremstilling af et sådant

Publications (2)

Publication Number Publication Date
DK10198A DK10198A (da) 1999-07-27
DK174111B1 true DK174111B1 (da) 2002-06-24

Family

ID=8089750

Family Applications (1)

Application Number Title Priority Date Filing Date
DK199800101A DK174111B1 (da) 1998-01-26 1998-01-26 Elektrisk forbindelseselement samt fremgangsmåde til fremstilling af et sådant

Country Status (6)

Country Link
US (1) US7212088B1 (https=)
EP (1) EP1051749A1 (https=)
JP (1) JP2002503033A (https=)
AU (1) AU2150299A (https=)
DK (1) DK174111B1 (https=)
WO (1) WO1999040627A1 (https=)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2799887A1 (fr) * 1999-10-07 2001-04-20 Cit Alcatel Connexions de modules multi-puces hyperfrequence par transfert automatique sur bande
SE517455C2 (sv) 1999-12-15 2002-06-11 Ericsson Telefon Ab L M Effekttransistormodul, effektförstärkare samt förfarande för framställning därav
SE517852C2 (sv) * 1999-12-15 2002-07-23 Ericsson Telefon Ab L M Effekttransistormodul, effektförstärkare samt förfarande vid framställning därav
US6677832B1 (en) 2000-10-27 2004-01-13 Lucent Technologies Inc. Connector for differential-mode transmission line providing virtual ground
GB2378045A (en) * 2001-07-25 2003-01-29 Marconi Caswell Ltd Electrical connection with flexible coplanar transmission line
US8847696B2 (en) 2002-03-18 2014-09-30 Qualcomm Incorporated Flexible interconnect cable having signal trace pairs and ground layer pairs disposed on opposite sides of a flexible dielectric
US7336139B2 (en) * 2002-03-18 2008-02-26 Applied Micro Circuits Corporation Flexible interconnect cable with grounded coplanar waveguide
US7888957B2 (en) * 2008-10-06 2011-02-15 Cascade Microtech, Inc. Probing apparatus with impedance optimized interface
JP2010135722A (ja) * 2008-11-05 2010-06-17 Toshiba Corp 半導体装置
US8410806B2 (en) 2008-11-21 2013-04-02 Cascade Microtech, Inc. Replaceable coupon for a probing apparatus
EP2366270A4 (en) * 2008-12-02 2013-04-10 Univ Arizona METHOD FOR PRODUCING A FLEXIBLE SUBSTRATE DEPARTMENT AND FLEXIBLE SUBSTRATE APPEARANCE THEREFOR
US9601530B2 (en) 2008-12-02 2017-03-21 Arizona Board Of Regents, A Body Corporated Of The State Of Arizona, Acting For And On Behalf Of Arizona State University Dual active layer semiconductor device and method of manufacturing the same
US9991311B2 (en) 2008-12-02 2018-06-05 Arizona Board Of Regents On Behalf Of Arizona State University Dual active layer semiconductor device and method of manufacturing the same
US9721825B2 (en) 2008-12-02 2017-08-01 Arizona Board Of Regents, A Body Corporate Of The State Of Arizona, Acting For And On Behalf Of Arizona State University Method of providing a flexible semiconductor device and flexible semiconductor device thereof
JP5287390B2 (ja) * 2009-03-16 2013-09-11 ソニー株式会社 半導体装置、伝送システム、半導体装置の製造方法及び伝送システムの製造方法
TW201117262A (en) 2009-05-29 2011-05-16 Univ Arizona Method of providing a flexible semiconductor device at high temperatures and flexible semiconductor device thereof
WO2012021196A2 (en) 2010-05-21 2012-02-16 Arizona Board Of Regents, For And On Behalf Of Arizona State University Method for manufacturing electronic devices and electronic devices thereof
WO2012021197A2 (en) 2010-05-21 2012-02-16 Arizona Board Of Regents, For And On Behalf Of Arizona State University Method of manufacturing electronic devices on both sides of a carrier substrate and electronic devices thereof
US8290319B2 (en) * 2010-08-25 2012-10-16 Oracle America, Inc. Optical communication in a ramp-stack chip package
US8373280B2 (en) 2010-09-01 2013-02-12 Oracle America, Inc. Manufacturing fixture for a ramp-stack chip package using solder for coupling a ramp component
US8283766B2 (en) 2010-09-02 2012-10-09 Oracle America, Inc Ramp-stack chip package with static bends
US8772920B2 (en) 2011-07-13 2014-07-08 Oracle International Corporation Interconnection and assembly of three-dimensional chip packages
JP5861868B2 (ja) * 2011-11-04 2016-02-16 ソニー株式会社 電子回路および電子回路の製造方法
US9082632B2 (en) 2012-05-10 2015-07-14 Oracle International Corporation Ramp-stack chip package with variable chip spacing
JP5542231B1 (ja) * 2013-04-09 2014-07-09 太陽誘電株式会社 多層回路基板
US9590288B2 (en) 2013-04-09 2017-03-07 Taiyo Yuden Co., Ltd. Multilayer circuit substrate
US10381224B2 (en) 2014-01-23 2019-08-13 Arizona Board Of Regents On Behalf Of Arizona State University Method of providing an electronic device and electronic device thereof
WO2017034644A2 (en) 2015-06-09 2017-03-02 ARIZONA BOARD OF REGENTS a body corporate for THE STATE OF ARIZONA for and on behalf of ARIZONA STATE UNIVERSITY Method of providing an electronic device and electronic device thereof
WO2015156891A2 (en) 2014-01-23 2015-10-15 Arizona Board Of Regents, Acting For And On Behalf Of Arizona State University Method of providing a flexible semiconductor device and flexible semiconductor device thereof
KR102466741B1 (ko) 2014-05-13 2022-11-15 아리조나 보드 오브 리젠츠 온 비하프 오브 아리조나 스테이트 유니버시티 전자 디바이스를 제공하는 방법
US10446582B2 (en) 2014-12-22 2019-10-15 Arizona Board Of Regents On Behalf Of Arizona State University Method of providing an imaging system and imaging system thereof
US9741742B2 (en) 2014-12-22 2017-08-22 Arizona Board Of Regents, A Body Corporate Of The State Of Arizona, Acting For And On Behalf Of Arizona State University Deformable electronic device and methods of providing and using deformable electronic device
US20170085243A1 (en) * 2015-09-21 2017-03-23 Intel Corporation Impedance matching interconnect
US10784215B2 (en) * 2018-11-15 2020-09-22 Steradian Semiconductors Private Limited Millimeter wave integrated circuit and system with a low loss package transition

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3777365A (en) * 1972-03-06 1973-12-11 Honeywell Inf Systems Circuit chips having beam leads attached by film strip process
US4600907A (en) * 1985-03-07 1986-07-15 Tektronix, Inc. Coplanar microstrap waveguide interconnector and method of interconnection
US5256996A (en) * 1987-10-06 1993-10-26 The Board Of Trustees Of The Leland Stanford, Junior University Integrated coplanar strip nonlinear transmission line
US4806892A (en) 1987-11-09 1989-02-21 Trw Inc. Inclined RF connecting strip
US4862120A (en) * 1988-02-29 1989-08-29 Canadian Patents And Development Limited/Societe Canadienne Des Brevets Et D'exploitation Limitee Wideband stripline to microstrip transition
US5182631A (en) * 1988-04-15 1993-01-26 Nippon Telegraph And Telephone Corporation Film carrier for RF IC
JP2787955B2 (ja) 1989-09-01 1998-08-20 住友ベークライト株式会社 フレキシブルプリント回路板の製造方法
US5065124A (en) 1990-09-04 1991-11-12 Watkins-Johnson Company DC-40 GHz module interface
JP2653583B2 (ja) 1991-09-17 1997-09-17 住友ベークライト株式会社 表面にポリアミック酸層を有するポリイミドフィルム及びこれを用いたフレキシブル印刷回路用基板
JPH06334410A (ja) 1993-05-24 1994-12-02 Japan Aviation Electron Ind Ltd フレキシブル配線基板
DE69434104T2 (de) * 1993-08-09 2005-11-03 Nippon Telegraph And Telephone Corp. Optoelektronische Hybridintegrationsplattform und optisches Sub-Modul
US5753968A (en) * 1996-08-05 1998-05-19 Itt Industries, Inc. Low loss ridged microstrip line for monolithic microwave integrated circuit (MMIC) applications
US5825084A (en) * 1996-08-22 1998-10-20 Express Packaging Systems, Inc. Single-core two-side substrate with u-strip and co-planar signal traces, and power and ground planes through split-wrap-around (SWA) or split-via-connections (SVC) for packaging IC devices

Also Published As

Publication number Publication date
WO1999040627A1 (en) 1999-08-12
DK10198A (da) 1999-07-27
US7212088B1 (en) 2007-05-01
EP1051749A1 (en) 2000-11-15
AU2150299A (en) 1999-08-23
JP2002503033A (ja) 2002-01-29

Similar Documents

Publication Publication Date Title
DK174111B1 (da) Elektrisk forbindelseselement samt fremgangsmåde til fremstilling af et sådant
US6172305B1 (en) Multilayer circuit board
US6528732B1 (en) Circuit device board, semiconductor component, and method of making the same
US7663064B2 (en) High-speed flex printed circuit and method of manufacturing
JP6996976B2 (ja) プリント回路基板のための高速インターコネクト
US8707554B2 (en) Method of manufacturing multilayer wiring substrate
KR20040080921A (ko) 회로 기판 장치 및 그 제조 방법
KR19980018124A (ko) 평면 재분배 구조체 및 그의 제조 방법
US20110155438A1 (en) Multilayer Wiring Substrate
US7033457B2 (en) Method of attaching optical waveguide component to printed circuit board
CN117355937A (zh) 基板及其制备方法、集成无源器件、电子装置
US20250260154A1 (en) Antenna-on-package system
KR100385976B1 (ko) 회로기판 및 그 제조방법
US8280204B2 (en) Optical wiring board and manufacturing method thereof
CN115866936B (zh) 一种采用厚薄膜工艺实现多层电路板的方法
JP7700481B2 (ja) 配線基板の製造方法
JP2024033031A (ja) 多層配線基板および多層配線基板の製造方法
WO2023092454A1 (zh) 柔性衬底上制作导通孔以及导通孔的填充方法
KR100493090B1 (ko) 배선접속장치 및 그 제조방법
JP6193750B2 (ja) 配線基板、半導体モジュール、及び配線基板の製造方法
JP2023056567A (ja) 多層配線基板、その製造方法及びその設計方法
KR100634214B1 (ko) 초고주파 통신회로에서의 와이어 본딩 방법
CN121419651A (zh) 玻璃基板及其制备方法和芯片封装结构
CN118783078A (zh) 天线基板及电子装置
JP2024157822A (ja) 電子部品及びその製造方法

Legal Events

Date Code Title Description
B1 Patent granted (law 1993)
PBP Patent lapsed