DK174111B1 - Elektrisk forbindelseselement samt fremgangsmåde til fremstilling af et sådant - Google Patents

Elektrisk forbindelseselement samt fremgangsmåde til fremstilling af et sådant Download PDF

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Publication number
DK174111B1
DK174111B1 DK199800101A DK10198A DK174111B1 DK 174111 B1 DK174111 B1 DK 174111B1 DK 199800101 A DK199800101 A DK 199800101A DK 10198 A DK10198 A DK 10198A DK 174111 B1 DK174111 B1 DK 174111B1
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DK
Denmark
Prior art keywords
conductor
photoresist
conductor paths
pattern
plastic film
Prior art date
Application number
DK199800101A
Other languages
Danish (da)
English (en)
Other versions
DK10198A (da
Inventor
Jesper Noerregaard
Niels Vagn Pedersen
Original Assignee
Giga As
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Giga As filed Critical Giga As
Priority to DK199800101A priority Critical patent/DK174111B1/da
Priority to AU21502/99A priority patent/AU2150299A/en
Priority to PCT/DK1999/000036 priority patent/WO1999040627A1/en
Priority to EP99901583A priority patent/EP1051749A1/en
Priority to US09/600,797 priority patent/US7212088B1/en
Priority to JP2000530944A priority patent/JP2002503033A/ja
Publication of DK10198A publication Critical patent/DK10198A/da
Application granted granted Critical
Publication of DK174111B1 publication Critical patent/DK174111B1/da

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/04—Fixed joints
    • H01P1/047—Strip line joints
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    • H01L2223/6611—Wire connections
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    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6627—Waveguides, e.g. microstrip line, strip line, coplanar line
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    • H01L2224/4805—Shape
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/01005—Boron [B]
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    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Waveguides (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
DK199800101A 1998-01-26 1998-01-26 Elektrisk forbindelseselement samt fremgangsmåde til fremstilling af et sådant DK174111B1 (da)

Priority Applications (6)

Application Number Priority Date Filing Date Title
DK199800101A DK174111B1 (da) 1998-01-26 1998-01-26 Elektrisk forbindelseselement samt fremgangsmåde til fremstilling af et sådant
AU21502/99A AU2150299A (en) 1998-01-26 1999-01-25 An electrical connecting element and a method of making such an element
PCT/DK1999/000036 WO1999040627A1 (en) 1998-01-26 1999-01-25 An electrical connecting element and a method of making such an element
EP99901583A EP1051749A1 (en) 1998-01-26 1999-01-25 An electrical connecting element and a method of making such an element
US09/600,797 US7212088B1 (en) 1998-01-26 1999-01-25 Electrical connecting element and a method of making such an element
JP2000530944A JP2002503033A (ja) 1998-01-26 1999-01-25 電気的接続要素および電気的接続要素を作る方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DK10198 1998-01-26
DK199800101A DK174111B1 (da) 1998-01-26 1998-01-26 Elektrisk forbindelseselement samt fremgangsmåde til fremstilling af et sådant

Publications (2)

Publication Number Publication Date
DK10198A DK10198A (da) 1999-07-27
DK174111B1 true DK174111B1 (da) 2002-06-24

Family

ID=8089750

Family Applications (1)

Application Number Title Priority Date Filing Date
DK199800101A DK174111B1 (da) 1998-01-26 1998-01-26 Elektrisk forbindelseselement samt fremgangsmåde til fremstilling af et sådant

Country Status (6)

Country Link
US (1) US7212088B1 (enExample)
EP (1) EP1051749A1 (enExample)
JP (1) JP2002503033A (enExample)
AU (1) AU2150299A (enExample)
DK (1) DK174111B1 (enExample)
WO (1) WO1999040627A1 (enExample)

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AU2150299A (en) 1999-08-23
DK10198A (da) 1999-07-27
EP1051749A1 (en) 2000-11-15
US7212088B1 (en) 2007-05-01
WO1999040627A1 (en) 1999-08-12
JP2002503033A (ja) 2002-01-29

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