DK171206B1 - Magasin til fastholdelse af skiveformede emner, navnlig halvlederskiver, ved den vådkemiske overfladebehandling i væskebade - Google Patents

Magasin til fastholdelse af skiveformede emner, navnlig halvlederskiver, ved den vådkemiske overfladebehandling i væskebade Download PDF

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Publication number
DK171206B1
DK171206B1 DK004092A DK4092A DK171206B1 DK 171206 B1 DK171206 B1 DK 171206B1 DK 004092 A DK004092 A DK 004092A DK 4092 A DK4092 A DK 4092A DK 171206 B1 DK171206 B1 DK 171206B1
Authority
DK
Denmark
Prior art keywords
struts
guide
disc
housing
magazine according
Prior art date
Application number
DK004092A
Other languages
Danish (da)
English (en)
Other versions
DK4092D0 (da
DK4092A (da
Inventor
Maximilian Stadler
Guenter Schwab
Peter Romeder
Original Assignee
Wacker Siltronic Halbleitermat
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wacker Siltronic Halbleitermat filed Critical Wacker Siltronic Halbleitermat
Publication of DK4092D0 publication Critical patent/DK4092D0/da
Publication of DK4092A publication Critical patent/DK4092A/da
Application granted granted Critical
Publication of DK171206B1 publication Critical patent/DK171206B1/da

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • ing And Chemical Polishing (AREA)
DK004092A 1991-02-01 1992-01-13 Magasin til fastholdelse af skiveformede emner, navnlig halvlederskiver, ved den vådkemiske overfladebehandling i væskebade DK171206B1 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4103084 1991-02-01
DE4103084A DE4103084A1 (de) 1991-02-01 1991-02-01 Magazin zur halterung von scheibenfoermigen werkstuecken, insbesondere halbleiterscheiben, bei der nasschemischen oberflaechenbehandlung in fluessigkeitsbaedern

Publications (3)

Publication Number Publication Date
DK4092D0 DK4092D0 (da) 1992-01-13
DK4092A DK4092A (da) 1992-08-02
DK171206B1 true DK171206B1 (da) 1996-07-22

Family

ID=6424204

Family Applications (1)

Application Number Title Priority Date Filing Date
DK004092A DK171206B1 (da) 1991-02-01 1992-01-13 Magasin til fastholdelse af skiveformede emner, navnlig halvlederskiver, ved den vådkemiske overfladebehandling i væskebade

Country Status (7)

Country Link
US (1) US5236548A (ko)
EP (1) EP0497104B1 (ko)
JP (1) JPH0821570B2 (ko)
KR (1) KR960002997B1 (ko)
DE (2) DE4103084A1 (ko)
DK (1) DK171206B1 (ko)
FI (1) FI920390A (ko)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4305748A1 (de) * 1993-02-25 1994-09-01 Leybold Ag Vorrichtung zum Beschichten und/oder Ätzen von Substraten in einer Vakuumkammer
US5362353A (en) * 1993-02-26 1994-11-08 Lsi Logic Corporation Faraday cage for barrel-style plasma etchers
US5340437A (en) * 1993-10-08 1994-08-23 Memc Electronic Materials, Inc. Process and apparatus for etching semiconductor wafers
US6041938A (en) * 1996-08-29 2000-03-28 Scp Global Technologies Compliant process cassette
JP3111928B2 (ja) * 1997-05-14 2000-11-27 日本電気株式会社 金属膜の研磨方法
DE19856468C1 (de) * 1998-11-30 2000-06-15 Sico Jena Gmbh Quarzschmelze Verfahren zur Herstellung einer Haltevorrichtung für Halbleiterscheiben
US6099645A (en) * 1999-07-09 2000-08-08 Union Oil Company Of California Vertical semiconductor wafer carrier with slats
KR20010100613A (ko) * 2000-05-04 2001-11-14 마이클 디. 오브라이언 반도체패키지용 매거진
US7040209B2 (en) * 2001-09-27 2006-05-09 Mikronite Technologies, Inc. Tool fixtures for use in rotational processing
KR100675627B1 (ko) * 2002-10-10 2007-02-01 엘지.필립스 엘시디 주식회사 기판 수납용 카세트
JP4509501B2 (ja) * 2003-07-31 2010-07-21 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 円板状部材のエッチング方法及び装置
US20090242126A1 (en) * 2008-03-31 2009-10-01 Memc Electronic Materials, Inc. Edge etching apparatus for etching the edge of a silicon wafer
KR101104016B1 (ko) * 2008-11-04 2012-01-06 주식회사 엘지실트론 웨이퍼 처리 장치 및 이에 사용되는 배럴과, 웨이퍼 처리 방법
US8735261B2 (en) * 2008-11-19 2014-05-27 Memc Electronic Materials, Inc. Method and system for stripping the edge of a semiconductor wafer
US8853054B2 (en) 2012-03-06 2014-10-07 Sunedison Semiconductor Limited Method of manufacturing silicon-on-insulator wafers
CN115881596B (zh) * 2023-03-08 2023-05-05 四川上特科技有限公司 一种晶圆承载框及晶圆分片装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1915714C3 (de) * 1969-03-27 1975-07-10 Robert Bosch Gmbh, 7000 Stuttgart Vorrichtung zum Xtzen von Halbleiterscheiben mit einem mit Ätzflüssigkeit gefüllten Gefäß und einem in die Ätzflüssigkeit eingetauchten, mit waagrechter Achse rotierenden Ätzkorb
US3727620A (en) * 1970-03-18 1973-04-17 Fluoroware Of California Inc Rinsing and drying device
US3808065A (en) * 1972-02-28 1974-04-30 Rca Corp Method of polishing sapphire and spinel
US3977926A (en) * 1974-12-20 1976-08-31 Western Electric Company, Inc. Methods for treating articles
DE2526052C2 (de) * 1975-06-11 1983-04-21 Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH, 8263 Burghausen Verfahren zum Reinigen polierter Halbleiterscheiben
JPS5339872A (en) * 1976-09-24 1978-04-12 Hitachi Ltd Etching method of wafers
JPS5437581A (en) * 1977-08-30 1979-03-20 Nec Corp Wafer etching device
JPS58166726A (ja) * 1982-03-29 1983-10-01 Shin Etsu Handotai Co Ltd ウエ−ハエツチング装置
DD220859A1 (de) * 1984-01-26 1985-04-10 Akad Wissenschaften Ddr Vorrichtung zum aetzen von scheibenfoermigen objekten
JPS62134936A (ja) * 1985-12-05 1987-06-18 アニコン・インコ−ポレ−テツド 腐食耐性をもつたウエ−フア−・ボ−ト及びその製造法
US4841906A (en) * 1986-11-12 1989-06-27 Heraeus Amersil, Inc. Mass transferable semiconductor substrate processing and handling full shell carrier (boat)
JPH02113331U (ko) * 1989-02-27 1990-09-11
US5054418A (en) * 1989-05-23 1991-10-08 Union Oil Company Of California Cage boat having removable slats

Also Published As

Publication number Publication date
KR960002997B1 (ko) 1996-03-02
KR920017183A (ko) 1992-09-26
EP0497104B1 (de) 1995-04-05
DE4103084C2 (ko) 1993-01-07
EP0497104A1 (de) 1992-08-05
DE4103084A1 (de) 1992-08-13
JPH0821570B2 (ja) 1996-03-04
FI920390A0 (fi) 1992-01-29
DK4092D0 (da) 1992-01-13
FI920390A (fi) 1992-08-02
DE59201798D1 (de) 1995-05-11
US5236548A (en) 1993-08-17
JPH04323825A (ja) 1992-11-13
DK4092A (da) 1992-08-02

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Legal Events

Date Code Title Description
B1 Patent granted (law 1993)
PBP Patent lapsed